EP1089938A1 - Free-standing and aligned carbon nanotubes and synthesis thereof - Google Patents

Free-standing and aligned carbon nanotubes and synthesis thereof

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Publication number
EP1089938A1
EP1089938A1 EP99928735A EP99928735A EP1089938A1 EP 1089938 A1 EP1089938 A1 EP 1089938A1 EP 99928735 A EP99928735 A EP 99928735A EP 99928735 A EP99928735 A EP 99928735A EP 1089938 A1 EP1089938 A1 EP 1089938A1
Authority
EP
European Patent Office
Prior art keywords
substrate
carbon nanotubes
product
nanotubes
substantially aligned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99928735A
Other languages
German (de)
English (en)
French (fr)
Inventor
Zhifeng Ren
Zhongping Huang
Jui H. Wang
Dezhi Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Research Foundation of State University of New York
Original Assignee
Research Foundation of State University of New York
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research Foundation of State University of New York filed Critical Research Foundation of State University of New York
Publication of EP1089938A1 publication Critical patent/EP1089938A1/en
Withdrawn legal-status Critical Current

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    • B82NANOTECHNOLOGY
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    • B82B3/00Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • BPERFORMING OPERATIONS; TRANSPORTING
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Definitions

  • the present invention relates to a product with a substrate having one or more carbon nanotubes. a method of producing that product, and devices utilizing the product.
  • Li discusses the growth of aligned carbon nanotubes on mesoporous silica containing iron nanoparticles via thermal decomposition of acetylene gas in nitrogen gas at temperatures above 700°C.
  • the substrate is prepared by a sol-gel process from tetraethoxysilane hydrolysis in iron nitrate aqueous solution. The gel is then calcined 10 hours at 450°C at 10 "2 Torr.
  • a silica network with relatively uniform pores is obtained with iron oxide nanoparticles embedded in the pores.
  • the iron oxide nanoparticles are then reduced at 550°C in 180 Torr of flowing (9% H 2 / N 2 (1 10 cm J / min) for 5 hours to obtain iron nanoparticles.
  • nanotubes are grown in a gas environment of a mixture of 9% acetylene in nitrogen at 700°C. Aligned nanotube growth is along the axial direction of the pores. Only the nanotubes which grow out of the vertical pores are aligned. Nanotubes which grow from the iron particles on the surface and in the dispersed, inclined pores are random and non-oriented. In this method, nanotube alignment is limited to the constraint of the vertically aligned pores. Further, the density and diameter of aligned carbon nanotubes is respectively limited in direct proportion to the amount and size of the iron nanoparticles and the diameter of the pores.
  • a temperature of at least 700°C is required to decompose acetylene and induce carbon nanotube growth.
  • this high temperature requirement limits substrate selection.
  • a glass substrate is unsuited for use in this method due to its low strain point temperature.
  • a glass produced by Corning Incorporated (Corning, New York) has the highest known flat panel display glass deformation or strain point temperature of 666°C.
  • a commercially available flat panel display glass has a strain point temperature between 500°C and 590°C.
  • glass substrates deform and inhibit aligned carbon nanotube growth. Accordingly, any substrate suitable for use with this method must have a melting point or strain point temperature above 700°C.
  • Terrones et al. "Controlled Production of Aligned-Nanotube Bundles, " Nature, 388: 52-55 (1997) (“Terrones”) disclose a method for laser induced growth of nanotube bundles aligned on a substrate under high temperature conditions.
  • a thin film of cobalt is deposited on a silica plate by laser ablation and thereafter etched with a single laser pulse to create linear nanotracks.
  • 2-amino-4,6-dichloro-s-triazine is then disposed onto the silica plate in the presence of argon gas within a two stage oven. The first oven is heated to 1 ,000°C and then allowed to cool to room temperature. The second oven is heated to and maintained at 950°C.
  • nanotubes grow along the edges of the eroded nanotracks, growth only occurs on the substrate bottom surface and in a non- vertical fashion. Carbon nanotubes do not grow on a similarly prepared substrate top surface which indicates nanotube growth according to this method is gravity dependent. Again, for the reasons discussed above, substrate selection for this method is limited to a substrate having either a strain point or melting point temperature above 1.000°C. Further, nanotube density is directly limited to the number of nanotracks etched into the substrate surface.
  • the present invention relates to a product which has a substrate and either (1) a plurality of substantially aligned carbon nanotubes of a density greater than 10 4 nanotubes per square millimeter of substrate, (2) a plurality of substantially aligned carbon nanotubes of a density no greater than 10 nanotubes per square millimeter of a substrate. (3) one or more carbon nanotubes. wherein the substrate has a strain point or melting point temperature between about 300°C and 700°C. (4) a plurality of substantially aligned carbon nanotubes originating and extending outwardly from the substrate outer surface, or (5) one or more free-standing carbon nanotubes originating and extending outwardlv from the substrate outer surface.
  • Carbon nanotubes are synthesized by plasma-enhanced hot filament chemical vapor deposition of a carbon source gas in a reduced pressure environment in the presence of a catalyst gas at temperatures as low as between 300°C and 3000°C in a volume ratio range of carbon source gas to catalyst gas from 1 : 2 to 1 : 10. Growth of large arrays of well-aligned carbon nanotubes having a diameter between 4 to 500 nm occur on a substrate coated with a thin metal catalyst film. Free-standing carbon nanotubes are grown on metal catalyst nano-dots disposed on the substrate.
  • the present invention provides a method of forming aligned, vertically or otherwise, carbon nanotubes at temperatures below 700°C. Further, products made in accordance with this method provide a substrate which has carbon nanotubes vertically aligned on the substrate surface. Further, a product made in accordance with the method of the present invention includes a substrate having individual, free-standing carbon nanotubes. Still further, a product made in accordance with the method of the present invention includes a substrate having one or more individual, free-standing carbon nanotubes disposed on the substrate surface. Products of the present invention are useful in electrochemical applications as well as in electron emission, structural composite, material storage, and microelectrode applications.
  • Figures 1A-B are scanned images showing alignment of carbon nanotubes grown on a large-area of polycrystalline Ni substrates.
  • Figure 2 is a scanned image of a scanning electron microscope micrograph of showing carbon nanotubes grown at a higher plasma intensity under the conditions listed in Table 1(b).
  • Figure 3 is a scanned image showing carbon nanotubes with higher aspect ratios synthesized with a higher plasma intensity than that used for the carbon nanotubes shown in Figure 2.
  • Figure 4 is a scanned image showing a cluster of carbon nanotubes scraped off a Ni substrate directly onto a Cu TEM grid, with the insert showing a cross-section image from a portion of a single multi-walled carbon nanotube structure.
  • Figures 5A-B are scanned images showing carbon nanotubes aligned substantially perpendicular to a substrate over large areas growth conditions as listed in Table 2.
  • Figure 5B is an enlarged view of Figure 5A along a peeled edge to show carbon nanotube diameters, length, straightness. and uniformity .
  • Figures 6A-C are scanned images showing scanning electron microscope surface morphology of the nickel catalyst layers.
  • Figure 6A illustrates the effects of NP ⁇ 3 plasma etching for 3 minutes.
  • Figure 6B illustrates the effects of N 2 plasma etching for 3 minutes.
  • Figure 6C shows an as-sputtered smooth catalyst surface.
  • Figures 7A-B are scanned images showing carbon nanotubes grown under the conditions listed in Table 2.
  • Figure 7B is an enlarged view of Figure 7A to show- carbon nanotube diameters and distributions.
  • Figure 8A is a scanned image showing thinner carbon nanotubes grown on thinner (15 nm) nickel-coated glass under the conditions listed in Table 2.
  • Figure 8B is a scanned image showing carbon nanotube with approximately 20 nm diameters grown under the conditions listed in Table 2.
  • Figures 9A-B are scanned images showing the interior and wall structures of a typical thin carbon nanotubes, wherein Figure 9A is a cross-section view and Figure 9B is a plan view.
  • Figure 10 is a scanned image showing the large area growth of well- aligned carbon nanotubes on glass.
  • Figure 1 1 is a scanned image showing well-aligned carbon nanotubes on silicon.
  • Figure 12 is a scanned image showing very short carbon nanotubes grown on silicon for only 2 minutes.
  • Figure 13 is a scanned image showing open ended carbon nanotubes etched bv HNO 3 for 1 minute.
  • Figure 14 is a scanned image showing carbon nanotubes subjected to Ar ion sputtering.
  • Figure 15 is a scanned image showing a side view of well-aligned carbon nanotubes grown at an angle with respect to the substrate.
  • Figure 16 is a scanned image showing a top view of the carbon nanotubes of Figure 15.
  • Figure 17A is a scanned image showing grown carbon nanotubes at the edge of a metal pad.
  • Figure 17B is a scanned image showing a region similar to Figure 17A in which the carbon nanotubes are broken.
  • Figures 18A-F are a series of scanned images displaying various viewing angles of carbon nanotube obelisks grown from a patterned array of catalyst nano-dots.
  • Figure 18 A is a perspective view of a plurality of patterned arrays.
  • Figure 18B is a top view of the patterned arrays of Figure 18A at a reduced magnification.
  • Figure 18C is a perspective view of one patterned array.
  • Figure 18D is a top view of one patterned array.
  • Figure 18E is a perspective view at an increased magnification of the patterned array of Figure 18C.
  • Figure 18F is a perspective view of spaced-apart carbon nanotube obelisks.
  • Figure 19 is a scanned image showing an elevation view of a carbon nanotube obelisk.
  • Figure 20 is a partial, top view of a field emission display apparatus of the present invention.
  • Figure 21 is a perspective view of a probe for a scanning electron microscope of the present invention.
  • Figure 22 is a schematic illustrating an example of a scanning electron microscope of the present invention.
  • Figure 23 is a schematic drawing illustrating an example of the basic construction of a battery of the present invention.
  • Figure 24 is a schematic drawing illustrating a fuel cell of the present invention.
  • Figure 25 is a schematic drawing illustrating an electromagnetic interference shield disposed between an electromagnetic interference source and an electronic component.
  • Figure 26 is a schematic drawing illustrating a microelectrode of the present invention.
  • the present invention relates to a product which includes a substrate and one or more hollow core carbon nanotubes originating from a surface of the substrate.
  • the product has more than one carbon nanotube.
  • the carbon nanotubes are well- aligned and may lie on or extend either perpendicularly or non-perpendicularly from the substrate surface.
  • Embodiments of the product of the present invention include the substrate and either (1) a plurality of substantially aligned carbon nanotubes of a density greater than 10 nanotubes per square millimeter of substrate, (2) a plurality of substantially aligned carbon nanotubes of a density no greater than 10 ⁇ nanotubes per square millimeter of a substrate, (3) one or more carbon nanotubes, wherein the substrate has a strain point or melting point temperature between about 300°C and 700°C. (4) a plurality of substantially aligned carbon nanotubes originating and extending outwardly from the substrate outer surface, or (5) one or more free-standing carbon nanotubes originating and extending outwardly from the substrate outer surface.
  • carbon nanotubes of the present invention are substantially concentric tubules.
  • the nanotubes have diameters ranging from 4 to 500 nm and lengths up to 50 ⁇ m.
  • carbon nanotubes which are longer than 20 ⁇ m have a diameter of at least 50 nm to maintain alignment.
  • the carbon nanotubes can be either free-standing nanotube obelisks which have a sharp, tapered carbon tip or a large array of well-aligned nanotubes which have a cap distally located from the substrate.
  • the large arrays of carbon nanotubes have densities of 10 6 to 10 nanotubes per square millimeter of substrate.
  • the cap comprises a catalyst metal or metal alloy material of iron, cobalt, nickel, or an alloy of iron, cobalt, or nickel.
  • the catalyst material and its role is discussed further below .
  • the tips and caps are removed to reveal open-ended carbon nanotubes.
  • suitable substrates include glass, silica, quartz, silicon, platinum, iron, cobalt, nickel, an alloy of iron, cobalt, or nickel, a ceramic, or a combination thereof.
  • Particularly useful substrates are glass panels and silicon wafers. It is important to recognize that the most important property of the substrate is that the substrate strain point and/or melting point temperatures are above the temperature of carbon nanotube growth. With the present invention, the substrate must have strain point and/or melting point temperatures of at least about 300°C. As disclosed in Li. substrates utilized in the prior art must have strain point and/or melting point temperatures in excess of 700°C.
  • a product of the present invention and the substrate therein have a strain point or melting point temperature between 300°C and 700°C.
  • Such substrates include flat panel display glass substrates, which have strain point and/or melting point temperatures of 666°C and below, may be utilized.
  • Certain ceramics, such as LaAlO 3 . AI O 3 . and ZrO . YSZ. and SrTiO 3 have melting point temperatures of about 3000°C and are useful as substrates utilized in high temperature environments.
  • carbon nanotubes are uniquely grown on a surface of a substrate by providing the substrate in a reduced pressure environment containing a carbon source gas and a catalyst gas and exposing the substrate to a plasma under conditions effective to cause formation and growth of one or more carbon nanotubes on the substrate.
  • PE-HF-CVD plasma-enhanced hot filament chemical vapor deposition
  • the present invention is also directed to products which have carbon nanotubes originating and extending outwardly from an outer surface of the substrate.
  • the substrates Prior to growing the carbon nanotubes by PE-HF-CVD. the substrates are placed into a deposition chamber at a reduced pressure ( ⁇ 6 x 10 " Torr ) and coated with the catalyst metal or metal alloys discussed above. Either a metal catalyst film of at least about 15 nm thick or one or more metal catalyst nano-dots of about 150A thick is deposited onto the substrate.
  • the catalyst film is deposited by radio frequency magnetron sputtering.
  • the catalyst nano-dots are deposited by electron beam evaporation, thermal evaporation, or magnetron sputtering. Surprisingly, the resultingly grown carbon nanotube diameters are directly related to the thickness of the catalyst film.
  • the diameter of the carbon nanotubes can be controlled. Although nano-dot thickness can have a like effect on resulting nanotube diameter, the thickness is less controlling as the film.
  • the coated substrates are placed into a reduced pressure CVD chamber containing a carbon source gas and a catalyst gas and are then exposed to a plasma under conditions effective to cause formation and growth of one or more carbon nanotubes on the substrate surface.
  • the CVD chamber has a pressure between about 0.1 to about 100 Torr, preferably about 1 to about 20 Torr. Because carbon nanotube growth is induced by plasma enhanced chemical vapor deposition of the carbon source gas.
  • the heated environment of the CVD chamber can be maintained at a temperature between about 300°C and about 3000°C.
  • various substrates having relatively low strain point or melting point temperatures as low as about 300°C may utilized in the present invention.
  • carbon nanotubes growth may occur at very high temperatures and is only constrained by the melting point temperature of the selected substrate.
  • the upper temperature limit of carbon nanotube growth is estimated to be about 3000°C. which corresponds to the highest known ceramic substrate melting point temperature, as discussed above.
  • the growth time depends on the requirement of nanotube length. Normally, it is between 1 - 10 minutes, which yields a length of 0.1 - 20 ⁇ m. Growth durations can extend up to 5 hours depending on the desired carbon nanotube lengths.
  • the carbon source and catalyst gases flow through the CVD chamber with a volume ratio of carbon source gas to catalyst gas ranging from 1 : 2 to 1 : 10 at a maintained pressure between about 0.1 to about 100 Torr at a temperature between about 300°C to 3000°C.
  • the carbon source gas may be selected from saturated or unsaturated linear, branched, or cyclic carbon and hydrogen compounds having up to six carbon atoms which are gases at the deposition pressure. For example, very pure (99.99% purity) acetylene, ethylene, and benzene, preferably acetylene, may be utilized as the carbon source gas of the present invention.
  • the catalyst gas is ammonia (99.99% purity) at CVD temperatures below 700°C. At CVD temperatures above 700°C.
  • the catalyst gas may be ammonia, nitrogen (99.99% purity), or a combination thereof.
  • Ammonia is the preferred catalyst gas of the present invention.
  • the carbon source and catalyst gases are introduced into the CVD chamber simultaneously or the catalyst gas is introduced prior to the carbon source gas.
  • Carbon nanotubes are synthesized with the diameter, length, site density, and growing angle controlled. Plasma intensity may be varied to determine the nanotube aspect ratios for diameter and length, and range of both site and height distributions.
  • Vertical or non-vertical growth of the carbon nanotubes is independent of the substrate surface topography and can be controlled by the angle placement of the substrate in the CVD chamber with respect to the orientation of the electric field of the plasma generator.
  • These lower temperature growth conditions are suitable for electron emission applications, such as cold-cathode flat panel displays which require the carbon nanotube emitters to be grown substantially perpendicular to a glass substrate surface.
  • carbon nanotubes grown at the lower temperatures have more wall defects or discontinuations. These discontinuations provide a diffusion path to the nanotube core. Should there be a desire to manufacture carbon nanotubes with limited defects, higher growth temperatures may be utilized.
  • the growth mechanism of aligned carbon nanotubes is ascribed in the literature to be a constraint of either the pores in mesoporous silica or the laser etched tracks in silica.
  • the alignment of the carbon nanotubes cannot be due to pores or etched tracks since there are no pores or etched tracks in the glass substrates, as shown in Figures 5A-B. 10, 15, 17A-B. and 18C, E, and F. Rather, alignment is due to a nanotube nucleation process catalyzed by the catalyst gas (e.g.. ammonia) and the catalyst layer or nano-dot (e.g., nickel).
  • the catalyst gas e.g. ammonia
  • the catalyst layer or nano-dot e.g., nickel
  • the cap With the growth of the carbon nanotubes. the cap is maintained at the distal end of each carbon nanotube.
  • the alignment and thickness of the carbon nanotubes may be determined by the orientation and size respectively of the initial catalytic centers. If desired, the catalyst metal caps can be removed by subjecting the carbon nanotubes to either HNO 3 solution etching or Ar ion sputtering to open the distal ends.
  • a single carbon nanotube or patterns with controlled site density is desired, which can be accomplished by selective deposition of the catalyst nano-dots.
  • the carbon nanotubes grown from the metal catalyst nano-dots are obelisks which have tapered, sharp carbon tips and have rounded base diameters approximately the same as the nano-dots.
  • the nanotube height depends on the growth time and nano-dot thickness.
  • the tips can be removed as well to provide an open ended nanotube by placing the nanotubes in a reaction chamber and exposing the nanotubes to oxygen and heat at about 400°C for about 0.5 hour.
  • a filling can be placed within the carbon nanotubes through the open ends or through the structural discontinuations.
  • fillings such as hydrogen, lithium ions, bismuth, lead telluride. bismuth tritelluride. or a pharmacological agent, to name only a few. may be inserted into the nanotube core by electrochemical or physical methods.
  • the open ends of the carbon nanotubes can be enclosed or sealed by magnetron sputtering or electrochemical deposition of an enclosing material, such as a metal.
  • a conventional flat panel display or field emission display 100 has a baseplate 102. a spaced-apart phosphor coated faceplate 104, and an electron emitter array 106 positioned on the baseplate 102 for emitting electrons to impinge upon and thereby illuminate the phosphor coating.
  • the baseplate 102, the faceplate 104 and the emitter array 106 are disposed in a vacuum environment.
  • the emitter 106 which is operably connected to an electron generating source, has a sharp tip 108, known as a Spindt tip, to emit electrons.
  • these emitters 106 have certain drawbacks because they have a relatively short wear life, have a low emission density due to the limits of existing lithography technology, and are relatively expensive.
  • Products of the present invention comprising large arrays of well-aligned carbon nanotubes as shown in. for example.
  • Figures 1. 2, 5, 7. 10, 1 1, and 18B can be used to replace the base plate/emitter array combination 102 and 106. Since the carbon nanotubes can be produced highly aligned and perpendicular to the substrate, field emission displays can be fabricated utilizing such arrays as emitters. Further, as discussed in Schmid et al.. "Carbon Nanotubes Are Coherent Electron Sources.” Appl. Phvs. Lett., 70(20):2679- 2680 (1997)("Schmid"), Collins et al., "A Simple And Robust Electron Beam Source From Carbon Nanotubes," Appl. Ph s. Lett..
  • a scanning electron microscope 200 of the present invention comprises a vacuum chamber 202 capable of receiving a specimen 204.
  • an electron source 206 for producing electrons a probe 208 which is operably positioned within the vacuum chamber 202 for emitting and directing the electrons toward and scanning the specimen 204.
  • a detector 210 operably positioned within the vacuum chamber 202 for collecting radiation issuing from the specimen 204 as a result of scanning by the probe 208 to produce an output signal
  • a display screen 212 operably connected to the detector 210 to receive the output signal and resulting display an image of the area of the specimen 204 scanned by the probe 208. Referring to Figures 1 -5B.
  • the probe 208 is a product of the present invention having a substrate and either (1 ) a plurality of substantially aligned carbon nanotubes of a density greater than 10 4 nanotubes per square millimeter of substrate; (2) a plurality of substantially aligned carbon nanotubes of a density no greater than 10 " nanotubes per square millimeter of a substrate; (3) one or more carbon nanotubes, wherein the substrate has a strain point or melting point temperature between about 300°C and 700°C; (4) a plurality of substantially aligned carbon nanotubes originating and extending outwardly from an outer surface of the substrate; or (5) one or more free-standing carbon nanotubes originating and extending outwardly from an outer surface of the substrate.
  • the probe 208 is a product of the present invention comprising a substrate 214 having an outer surface 216 and one free-standing carbon nanotube 218 originating and extending from the outer surface 216 of the substrate 214.
  • a single, free-standing carbon nanotube 218 originating and extending from an outer surface 216 of a substrate 214 is operably connected to the electron source 206.
  • the substrate 214 is selected from an electrically conductive material, which is connectable to the electron source.
  • the specimen 204 is positioned within the vacuum chamber 202. and the chamber 202 is evacuated.
  • the microscope 200 scans the specimen 204 with a fine probe of electrons emitting from the probe 208.
  • the electrons are produced from the electron source 206.
  • the electron source 206 which can be a field-emission electron source (not shown) and suitable accelerating electrodes (not shown), such as an electron gun (not shown).
  • Electrons that are transmitted through the specimen 204 are collected by the detector 210 to provide the output signal.
  • the detector 210 can comprise a phosphor screen (not shown) with a photomultiplier (not shown) for detecting light from the screen. This output signal is used to modulate the beam of the display screen 212.
  • a cathode ray tube which is scanned in synchronism with the probe 208, so as to cause the display screen 212 to display a pattern which depends on the structure of the scanned portion of the specimen 204.
  • secondary radiation e.g. electrons or x-rays
  • emitted from the specimen 204 as a result of bombardment by the electrons of the probe 208. may be detected to provide the output signal.
  • the electron fine probe or carbon nanotube 218 must be very fine, such as to illuminate only a small region of the specimen 204. in order to enable small features of the specimen 204 to be examined.
  • Production of a fine probe of electrons requires an electron source 206 having a very small electron-emitting area such as, for example, a field-emission electron source.
  • Magnets 220 can be operably disposed in the vacuum chamber 202 to focus or alter the emitted electron probe.
  • Carbon nanotubes produced in accordance with the present invention are such electron emitters.
  • the products of the present invention can also be utilized to form alkali metal ion batteries, such as, lithium batteries.
  • the battery 300 comprises an anode 302, a cathode 304.
  • the product has a plurality of substantially aligned carbon nanotubes of a density greater than 10 nanotubes per square millimeter of substrate: (2) a plurality of substantially aligned carbon nanotubes of a density
  • the substrate comprises an electrically conductive material
  • the carbon nanotubes have at least one diffusion path to the hollow core of the nanotubes.
  • Gao et al "Electrochemcial Intercalation of Single-walled Carbon Nanotubes with Lithium," Chem. Phvs. Lett., (in press)
  • Gao also reports that lithium can be reversibly intercalated from the nanotubes in the range of 100- 400 mAh/g.
  • lithium ions may be intercalated into the carbon nanotubes of the anode 302 by charging the battery 300.
  • the carbon nanotubes of the product may have open ends to provide the metal diffusion path, as shown in Figure 13.
  • the carbon nanotubes have high structural defect or discontinuation densities in the walls.
  • carbon nanotubes grown at low growth temperatures (e.g.. 300°C to 400°C) by PE-HF-CVD have such structural discontinuations. These structural discontinuations provide high active surface areas and numerous diffusion paths to the nanotube core for metal diffusion. It is not necessary for the carbon nanotubes having discontinuations to be open-ended, since most metal diffusion occurs through the discontinuations.
  • the cathode 304 functions to assist conduction for collecting current
  • the anode 302 functions as the host material for the lithium ions.
  • the battery 300 of the present invention has a high capacity and a long life cycle.
  • the cathode 304 comprises the product of the present invention having intercalated lithium ions, a higher collecting ability can be attained. As a result. the utilization of the cathode 304 can be increased to produce a high-capacity lithium battery 300.
  • Products of the present invention having carbon nanotubes substantially- aligned and oriented substantially perpendicular with respect to the substrate are preferred.
  • the electrolyte 308 can permeate the nanotubes much easier. This results in the battery 300 being capable of rapid charge and discharge.
  • the anode 302. lithium can be deposited on the carbon nanotubes surfaces and intercalated into the nanotubes. thereby preventing the growth of dendritic lithium metal deposition and resulting in the battery 300 having a higher capacity.
  • the products of the present invention are used as an anode 302 for intercalating and deintercalating lithium ions, a high-capacity anode 302 is formed.
  • the anode 302 and the cathode 304 are disposed in the electrolyte 308 held in a housing 310 opposite to each other through the insulator 306.
  • the insulator 306 is provided for preventing internal shorts due to contact between the anode 302 and the cathode 304.
  • the anode 302 and the cathode 304 respectively can comprise the products shown in Figures 1-19.
  • An anode terminal 312 and a cathode terminal 314 are electrically connected to the respective product substrates comprising the anode 302 and the cathode 304.
  • the anode terminal 312 and the cathode terminal 314 may be utilized for at least a portion of the housing 310.
  • the carbon nanotubes serve as the collecting electrodes of the anode 302 and the cathode 304.
  • the nanotubes function to efficiently supply a current to be consumed by electrode reaction during charge and discharge or to collect the current generated by the electrode reaction.
  • the insulator 306 functions to prevent internal shorts between the anode 302 and the cathode 304, and can function to hold the electrolyte 308.
  • the insulator 306 must have pores which permit movement of lithium ions, and must be insoluble and stable in the electrolyte 306.
  • materials which may be used for the insulator 306 include glass, polyolefins, such as polypropylene and polyethylene, fluororesins. and materials having a micropore and nonwoven fabric structure. A metal oxide film having micropores and a resin film compounded with a metal oxide can also be used.
  • An electrolyte solution is prepared by dissolving the electrolyte 308 in a solvent.
  • electrolytes 308 include acids, such as H 2 SO 4 . HC1.. and HNO 3 . salts comprising lithium ions and Lewis acid ions (BF 4 ⁇ PF 6 " . ClO 4 " , CF 3 SO 3 " . and BPhf). and salt mixtures thereof. Salts comprising cations such as sodium ion. calcium ion . and tetraalkylammonium ion, and the Lewis acid ions can also be used. These salts can be sufficiently dehydrated and deoxidized by heating under reduced pressure.
  • solvents which are useful for the electrolyte 308 include acetonitrile. benzonitrile. propylenecarbonate. ethylenecarbonate, dimethylcarbonate. diethylcarbonate, dimethylformamide. tetrahydrofuran. nitrobenzene, dichloroethane. diethoxyethane. 1.2-dimethoxyethane. chlorobenzene. gamma -butyrolactone, dioxolan, sulfolan. nitromethane. 2-methyltetrahydrofuran. 3-propylsydnone, sulfurdioxide, phosphorylchloride, thionylchloride, sulfurylchloride. and solvent mixtures thereof.
  • solvents can be dehydrated by activated alumina, molecular sieves, phosphorus pentaoxide. or calcium chloride. Some of the solvents are also subjected to removal of impurities and dehydrated by distillation in coexistence with an alkali metal in an inert gas.
  • the electrolyte 308 can be formed into a gel.
  • Polymers which absorb the solvent of the electroly te 308 and swell may be used as a gelling agent.
  • such polymers include poly(ethyleneoxide), poly(vinylalcohol), polyacrylamide. and the like.
  • a fuel cell is a device for directly converting the chemical energy of a fuel into electrical energy.
  • fuel cell devices such as fuel cells, fuel cell groups or stacks, and fuel cell power plants which use hydrogen as the fuel for the respective fuel cell device.
  • an exothermic chemical reaction takes place in these fuel cell devices between hydrogen and an oxidant. for example, oxygen, resulting in the formation of water as the reaction product and the desired generation of electricity.
  • the incidental release of thermal energy exhibited as sensible heat is typically removed from the fuel cell.
  • hydrogen and the oxidant are consumed by the fuel cell.
  • hydrogen and the oxidant must be replenished at their respective consumption rates.
  • hydrogen is stored in tanks or similar containers in its liquid or gaseous state in its pure form or in combination with inert substances.
  • containers are generally relatively large and heavy, and problematic when storage space and/or payload weight are limited.
  • a fuel cell 400 of the present invention comprises a housing 402, two gas diffusion electrodes, an anode 404 and a cathode 406. positioned within the housing 402 and respectively forming an anode side 408 and a cathode side 410, an electrolyte impregnated matrix or ion exchange membrane 409 positioned between and in electrical contact with the electrodes 404 and 406. an external circuit 412 electrically and operably connecting the anode 404 to the cathode 406 and a hydrogen storage unit 414 comprising products 416 of the present invention positioned within an enclosure 418 which is operably connected to the anode side 408.
  • a catalyst layer is disposed on the electrolyte-facing surfaces of the respective electrodes 404 and 406.
  • hydrogen gas is fed to the back side of the anode 404.
  • oxygen gas is fed to the back side of the cathode 406.
  • the respective gases diffuse through the electrodes 404 and 406 and react at the catalyst sites to yield electrical energy, heat, and moisture.
  • the hydrogen storage unit 414 comprises the enclosure 418 and products 416 of the present invention having a substrate and either ( 1 ) a plurality of substantially aligned carbon nanotubes of a density greater than 10 4 nanotubes per square millimeter of substrate; (2) a plurality of substantially aligned carbon nanotubes of a density no greater than 10 " nanotubes per square millimeter of a substrate; (3) one or more carbon nanotubes.
  • the substrate has a strain point or melting point temperature between about 300°C and 700°C: (4) a plurality of substantially aligned carbon nanotubes originating and extending outwardly from an outer surface of the substrate; or (5) one or more free-standing carbon nanotubes originating and extending outwardly from an outer surface of the substrate.
  • the carbon nanotubes have a hollow core and at least one diffusion path into the core.
  • the product 416 has plurality of substantially aligned carbon nanotubes of a density greater than 10 4 nanotubes per square millimeter of substrate with a high discontinuation density in the nanotube structure to provide a plurality of diffusion paths. Further, the carbon nanotubes of this product 416 can have an open end distal from the substrate.
  • Single- walled carbon nanotubes of the present invention which have a diameter of 1 nm. These nanotubes form bundles and are strong hydrogen gas absorbers.
  • Hydrogen can be introduced into the carbon nanotube hollow core by placing the product 416 in a high pressure chamber (not shown) and introducing hydrogen gas at relatively high pressures into the chamber to diffuse hydrogen across the diffusion paths into the carbon nanotubes. Also, hydrogen can be diffused into the nanotubes electropotentially or electrochemically. Further, heated products 416 can be placed into a hydrogen rich environment and allowed to cool, thereby drawing hydrogen into the nanotubes. Because the light-weight carbon nanotubes of the present invention have relatively large cores and surface areas, large amounts of hydrogen can be stored therein.
  • the products of the present invention can also be utilized to form composites with other dissimilar materials.
  • Suitable dissimilar materials include metals, ceramics, glasses, polymers, graphite, and mixtures thereof.
  • Such composites are prepared by coating the products of the present invention with these dissimilar materials in solid particulate form or in liquid form.
  • a variety of polymers, including thermoplastics and resins, can be utilized to form composites with the products of the present invention.
  • Such polymers include, for example, polyamides, polyesters, polyethers, polyphenylenes. polysulfones, polyurethanes. or epoxy resins.
  • the composite contains an inorganic material, e.g., a ceramic material or a glass.
  • a high-temperature copper oxide superconductor ceramic materials such as BiSrCaCuO (BSCCO). TlBaCaCuO (TBCCO).
  • Bi 2 Sr 2 CaCu 2 O8 (Bi-2212), Bi 2 Sr2Ca 2 Cu 3 ⁇ i 0 (Bi-2223).
  • Tl 2 Ba 2 CuO 6 Tl- 2201).
  • Tl 2 Ba 2 CaCu 2 O 8 (Tl-2212).
  • Tl 2 Ba 2 Ca2 Ca 2 Cu3O 10 Tl-2223).
  • These ceramics are deposited on the products of the present invention by magnetron sputtering, laser ablation, thermal spraying, electron beam evaporation, etc. to coat the substantially perpendicular, aligned carbon nanotubes an form a high temperature superconducting material.
  • HTSC high-temperature copper oxide superconductor
  • a high temperature superconductor comprises a product having a substantially non-electrically conductive substrate and either (1) a plurality of substantially aligned carbon nanotubes of a density greater than 10 4 nanotubes per square millimeter of substrate; (2) a plurality of substantially aligned carbon nanotubes of a density no greater than 10 " nanotubes per square millimeter of a substrate; (3) one or more carbon nanotubes.
  • the substrate has a strain point or melting point temperature between about 300°C and 700°C; (4) a plurality of substantially aligned carbon nanotubes originating and extending outwardly from an outer surface of the substrate: or (5) one or more free-standing carbon nanotubes originating and extending outwardly from an outer surface of the substrate, a high-temperature copper oxide superconductor material in admixture with the product, and at least two spaced apart terminals connectable to an electric circuit, whereby the product and the high-temperature copper oxide superconductor material admixture are subjectable to an electric current.
  • the composite includes a metal. Suitable metals include aluminum, magnesium, lead, zinc, copper, tungsten, titanium, niobium, hafnium, vanadium, and alloys thereof.
  • an electromagnetic interference (EMI) shield 500 is formed from a product of the present invention comprising a substrate and either (1 ) a plurality of substantially aligned carbon nanotubes of a density greater than 10 nanotubes per square millimeter of substrate: (2) a plurality of substantially aligned carbon nanotubes of a density no greater than 10" nanotubes per square millimeter of a substrate; (3) one or more carbon nanotubes, wherein the substrate has a strain point or melting point temperature between about 300°C and 700°C; (4) a plurality of substantially aligned carbon nanotubes originating and extending outwardly from an outer surface of the substrate; or (5) one or more free- standing carbon nanotubes originating and extending outwardly from an outer surface of the substrate and a dissimilar material in admixture with the product.
  • EMI electromagnetic interference
  • the dissimilar material comprises a polymer, graphite, or a combination thereof .
  • Such polymers are thermoplastics and resins and can include, for example, polyamides, polyesters, polyethers, polyphenylenes, polysulfones, polyurethanes. or epoxy resins.
  • the electromagnetic interference shield 500 is operationally positioned with respect to either an electromagnetic source 502 or an electronic component 504.
  • the composite can be used as an EMI shielding material in the construction of gaskets, housings for electronic components, including components within computers, conducting cables, and shielded rooms.
  • EMI emission sources 502. and other applications known in the art.
  • an EMI shield 500 is particularly useful in high temperature environments.
  • the EMI shield 500 of the present invention is interposed between the electronic device 504 and the electromagnetic radiation source 502. Interference of the device 504 by the radiation source 502 is thereby substantially reduced or eliminated.
  • a shielded electronic component 504 for resisting EMI generated by the electromagnetic source 502 has an electronic component 504 and a EMI shield 500 of the present invention operatively positioned with respect to the component 504.
  • a shielded electromagnetic emission source 502 has an EMI emitting source 502 and EMI shield 500 of the present invention operatively positioned with respect to the source 502. Still, the products of the present invention can as well be utilized to form a microelectrode 600, as shown in figure 26 and discussed in Stulik et al., "Microelectrodes: Definitions, Characterization and Hints For Their Use," IUPAC Commission. 5: Document No. 550/61/97 (1999), incorporated herein by reference.
  • the microelectrode 600 comprises a product having a substantially non-electrically conductive substrate 602 and either (1 ) a plurality of substantially aligned carbon nanotubes 604 of a density greater than 10 nanotubes per square millimeter of substrate: (2) a plurality of substantially aligned carbon nanotubes 604 of a density no greater than 10 " nanotubes per square millimeter of a substrate: (3) one or more carbon nanotubes 604.
  • the substrate 602 has a strain point or melting point temperature between about 300°C and 700°C; (4) a plurality of substantially aligned carbon nanotubes 604 originating and extending outwardly from an outer surface of the substrate 602; or (5) one or more free-standing carbon nanotubes 604 originating and extending outwardly from an outer surface 606 of the substrate 602 and at least one electrically conductive microfiber 608 operably connected to at least one carbon nanotube 604 of the product, wherein the at least one carbon nanotube 604 is operably and electrically connectable to an electric circuit.
  • Particularly well suited for use as an electrode or an array of electrodes are carbon nanotubes having open ends, as shown in Figure 13.
  • the carbon nanotubes are grown on a non-electrically conductive substrate, such as glass, quartz, or a ceramic.
  • the carbon nanotubes are operably and electrically connectable to an electric circuit with electrically conductive microfibers. such as, platinum or carbon microfibers. attached to the nanotubes.
  • Example 1 Polished polycrystalline and single-crystal Ni substrates were placed into a chemical vapor deposition (CVD) chamber, and the pressure was reduced to ⁇ 6 x 10 "6 Torr. Acetylene gas (99.99 % purity) and ammonia gas (99.99 % purity) were introduced into the chamber at a total flow rate of 120-200 standard cm J per minute (seem) and at a maintained working pressure of 1-20 Torr under the conditions listed in Table 1. After stabilizing the working pressure, a tungsten filament coil powered by a DC source (a 0- 500 V DC. 3 A power supply. Advanced Energy MDX 1.5K-magnetron drive) and a plasma-generator were energized to generate heat and plasma at a temperature below 666°C to induce carbon nanotube growth.
  • CVD chemical vapor deposition
  • Samples of the carbon nanotubes were examined by scanning electron microscopy (SEM. Hitachi S-4000) to measure tube lengths, diameters, site distributions, alignment, density and uniformity. High-resolution transmission electron microscopy (TEM) was used to determine the microstructure of individual tubes. Further, the samples were also examined by x-ray diffraction. Raman spectroscopy, and x-ray photoemission spectroscopy to study the structure, crystallinity. composition, and central core and tube wall structures.
  • SEM scanning electron microscopy
  • TEM transmission electron microscopy
  • Figure 1 A is a scanned image of an SEM micrograph showing the alignment of carbon nanotubes on polycrystalline nickel grown under the conditions described in Table 1(A).
  • the carbon nanotubes are oriented perpendicular to the substrate surface and are quite uniform in height.
  • the carbon nanotubes do not grow well along the Ni grain boundaries, shown by the two empty tracks running from upper left and from upper right down to bottom. This is probably due to the fact that grain boundaries do not have enough available nickel as a catalyst.
  • Figure IB is a higher magnification image of an area within a single nickel grain.
  • nanotube distribution uniformity within this grain is reasonably good.
  • carbon nanotube density is about 10 nanotubes/mm .
  • Figure 2 is a scanned image of an SEM micrograph showing carbon nanotubes grown on polycrystalline nickel at a higher plasma intensity under the conditions listed in Table 1(B). Most of the nanotube diameters are smaller ( ⁇ 250 nm), and their distribution is narrower, ranging from 200 to 300 nm. With increased plasma intensity, the density increased to 4 x 10 6 nanotube/mm 2 . about 4 times higher than that shown in Figure 1 . The increase of plasma intensity apparently reduces the catalytic nickel particle size, which leads to both thinner carbon nanotubes and improved nanotube uniformity.
  • Figure 3 is a scanned image of an SEM micrograph showing carbon nanotubes grown under the conditions listed in Table 1(C). These carbon nanotubes were synthesized at a higher plasma intensity than that used for the carbon nanotubes of Figure 2. In order to keep the substrates at low temperature, the filament current was reduced from 9 to 6 amperes. As shown in Figure 3. the carbon nanotubes are at least 10 ⁇ m long, and the diameters are ⁇ 100 nm. By increasing plasma intensity, two structural changes are readily observed. First, there is a substantial decrease in the average tube diameters from ⁇ 250 nm. as shown in Figure 2, to ⁇ 100 nm, as shown in Figure 3. Second, the tube lengths increase dramatically.
  • This image is typical to those reported elsewhere demonstrating a carbon nanotube structure. Nevertheless, the insert to Figure 4, a high-resolution image of a portion of a typical carbon nanotube structure, is more convincing.
  • the width of this tube is ⁇ 30 nm and represents a highly defected multi-walled structure with a hollow core.
  • the core diameter is about 20 nm and the wall thickness is about 5-10 nm.
  • the fringes on each side of the tube identify individual cylindrical graphitic layers.
  • This particular carbon nanotube is a structure with approximately 15 walls of graphitized carbon. Both the angular bend in the structure and the appearance of carbon walls running across the diameter of the nanotube demonstrate structural defects suggestive of twisting of the nanotube structure. As can be seen at the structural defects, non- continuous walls intersect one another.
  • Example 2 Substrate Preparation Display glass having a strain point temperature of 666°C was cut into 10 x
  • Catalyst layered substrates were placed to a CVD chamber, which was pumped down below 6 x 10 "6 Torr. As soon as the chamber pressure reached 6 x 10 "6 Torr, acetylene and ammonia gases were introduced into the chamber to maintain a working pressure of 1 - 20 Torr during carbon nanotube growth.
  • the total flow rate of acetylene and ammonia gases was 120 - 200 seem with a volume ratio of acetylene to ammonia varying from 1 : 2 to 1 : 10.
  • the power to the tungsten filament coil and to the plasma-generator, as described in Example 1. were energized to generate heat and plasma at a temperature below 666°C to induce carbon nanotube growth under the conditions listed in Table 2.
  • Carbon nanotube samples were examined in the manner described in Example 1. In particular, scanning electron microscopy was used to investigate the effect of various growth conditions on the morphology of carbon nanotubes grown on nickel-coated display glass. As described in Table 2(A). NH 3 was introduced during the first 5 minutes without introducing C 2 H 2 . During this time, the catalyst layer was plasma etched to reduce its thickness to less than 40 nm. After these initial 5 minutes, C 2 H 2 was introduced. Immediately, a color change occurred as a result of the growth of carbon nanotubes. The growth period lasted only 10 minutes. Referring to Figures 5A-B.
  • FIG. 6A and 6B the surfaces of the nickel layer after the initial NH 3 or N plasma etching are essentially the same.
  • the plasma etching conditions are respectively listed in Table 2(B) and 2(C).
  • Figure 6C shows the as-sputtered smooth nickel surface.
  • both NH 3 and N 2 plasma etching roughen the nickel surface, the roughing of the nickel surface is not responsible for the nucleation and growth of carbon nanotubes.
  • the sequence of gas introduction is reversed, that is. when C 2 H 2 is introduced first, 5 minutes later, followed by NH 3 , no growth of carbon nanotubes is observed, only amorphous carbon is formed on the nickel surface.
  • the amorphous carbon layer forms in the first 5 minutes and C 2 H 2 plasma covered the nickel surface to inhibit the catalytic role of nickel so that there is no growth of carbon nanotubes.
  • carbon nanotubes grow only when catalyst gas (NH 3 ) is introduced first followed by the carbon source gas (C 2 H2) or both the carbon source and catalyst gases (C 2 H 2 and NH3. respectively) are introduced simultaneously.
  • NH 3 plays a crucial catalytic role together with the nickel layer to promote the growth of the carbon nanotubes.
  • the catalytic role of NH 3 is further confirmed by the fact that there is no carbon nanotube growth when NH 3 was replaced by N 2 gas at temperatures below 700°C with other conditions unchanged.
  • carbon nanotubes do grow when NFL, is replaced by N 2 at temperatures above 700°C utilizing PE-HF-CVD.
  • carbon nanotubes have been grown in accordance with this method with diameters as large as 500 nm. This experiment clearly shows that as the catalyst layer thickness is reduced, the diameters of the resultingly grown carbon nanotubes are likewise reduced.
  • the catalytic role of nickel is also clearly indicated by the nickel cap on the tip of each nanotube.
  • one carbon nanotube. as indicated by an arrow in Figure 7B. does not have a nickel cap. Due to the absence of a cap on the identified nanotube. it may be concluded that the carbon nanotubes are empty with a very thin wall. In support of this conclusion, another carbon nanotube is viewable behind the capless one through its wall. Surprisingly, the nanotubes have a central core which is larger than reported values in literature. These large carbon nanotubes may be useful for applications such as storage of gases, such as PL. and as microelectrodes.
  • FIG. 9A shows a cross-sectional view of a typical thinner carbon nanotube.
  • This carbon nanotube is a multi-walled central hollow tube with an outside diameter of nearly 30 nm. The fringes on each side of the tube represent individual cylindrical graphitic layers. This particular carbon nanotube has approximately 15 walls of graphitized carbon.
  • a glass substrate was prepared as in Example 2 with a 10-40 nm thick nickel catalyst layer having an as-sputtered smooth surface, as shown in Figure 6C.
  • Carbon nanotubes were grown by PE-HF-CVD for about 10 minutes as in Examples 1 and 2. except the acetylene and ammonia volume ratio was 1 :2 to 1 :4.
  • Figure 10 shows a large area growth of substantially vertically aligned carbon nanotubes. The length of the carbon nanotubes is up to 50 ⁇ m. The diameters are estimated to be in the range of 100 - 150 nm (See Figure 14).
  • Single crystal, p-type boron doped 9.5 ⁇ -cm (100) silicon substrates were prepared as in Example 2 with a 10-40 nm thick nickel catalyst layer having an as- sputtered smooth surface, as shown in Figure 6C.
  • Carbon nanotubes were grown by PE- HF-CVD as in Examples 1 and 2. except the acetylene to ammonia volume ratio was 1 :2 to 1 :4.
  • Figures 1 1 and 12 show carbon nanotubes which were grown for 5 and 2 minutes, respectively. Referring to Figure 1 1. substantially perpendicular carbon nanotube alignment is clearly shown.
  • a nickel cap. which acts as a catalyst to sustain growth, is also discernible at the top of each carbon nanotube.
  • Early stage carbon nanotube growth is shown Figure 12. since the growth was stopped at 2 minutes. The shortest nanotubes are about 0.1 ⁇ m.
  • Example 5 Carbon nanotubes were grown as in Example 3.
  • the catalyst metal caps were thereafter removed by H O 3 solution etching and Ar ion sputtering.
  • Figures 13 and 14 show the SEM image of the nanotubes after removal of the nickel caps by HNO 3 solution etching and Ar ion sputtering, respectivel .
  • the solution etching by HNO 3 only took about one minute, and the removal of nickel caps is complete.
  • the ends of the carbon nanotubes are open after etching. Morphologically, there was no observable damage by the HNO 3 etching.
  • Figure 14 all the nanotubes were bent by the Ar ion sputtering, and the nickel caps were not completely removed.
  • various fillings i.e. hydrogen, lithium ions, bismuth, lead telluride, bismuth tritelluride, a pharmacological agent, etc.
  • various fillings i.e. hydrogen, lithium ions, bismuth, lead telluride, bismuth tritelluride, a pharmacological agent, etc.
  • the open ends can be sealed by electrochemical deposition of a metal onto the carbon nanotubes.
  • Carbon nanotubes were grown as in Example 3. except the substrates were placed in the CVD chamber at differing angles with respect to the plasma generator. Although the carbon nanotubes grew substantially aligned with one another, the alignment was independent of substrate surface topography. Figures 15 and 16 show the SEM image taken from side and top on a sample sit tilted at a certain angle during growth. It is observed that carbon nanotube alignment is not perpendicular to the substrate surface, but rather is angled with respect to the substrate. The tilt direction is closely related to the direction of the electrical field which generates the plasma. This technique may be utilized to grow aligned carbon nanotubes at any angle with respect to the substrate, including nanotubes lying in a plane. Example 7
  • a catalyst layer of nickel was deposited on a p-type boron doped 9.5 ⁇ -cm (100) silicon substrate by electron beam lithography and metal evaporation.
  • a bilayer electron-beam resist (5% 100 molecular weight polymethylmethacralate) was capped by 2% 950 molecular weight polymethylmethacralate that was patterned with a JEOL J6400 SEM converted for lithography.
  • the resist was developed in a solution of methyl isobutyl ketone and isopropyl alcohol (3: 1). Thereafter.
  • 150A of nickel was deposited by electron beam evaporation.
  • a catalyst layer i.e. a large. ⁇ 0.25 mm " nickel pad or one or more nano-dots) remained after resist/metal liftoff in acetone.
  • Carbon nanotubes were grown by PE-HF-CVD as in the process in Example 2, except growth was performed at a pressure of 1-10 Torr with an acetylene to ammonia volume mixture of 1 :4 at a total flow rate of 200 seem for about 5 minutes.
  • FIGs 17A-B scanned images of SEM micrographs show carbon nanotubes grown on the silicon substrate in the region of the edge of the nickel pad.
  • absence of nanotube growth in the foreground demonstrates selective growth on the nickel catalyst film and not on the silicon substrate.
  • Figure 17B shows these nanotubes after being mechanically broken using tweezers.
  • the tubes break somewhere along the tube and not at the interface between the nickel and silicon. This observation is different that that of nickel-on-glass nanotube growth, where the nanotubes broke cleanly at the nickel-glass interface, as shown in Figure 5A.
  • Nickel catalyst nano-dot patterns were deposited on a p-type boron doped 9.5 ⁇ -cm (100) silicon substrate by electron beam lithography and metal evaporation as in Example 7.
  • Carbon nanotubes were grown by PE-HF-CVD as in the process in Example 7. except the growth temperature was between 300°C and 666°C and only a single, free-standing carbon nanotube grew on each nickel nano-dot. Thereafter, carbon samples were examined by SEM. TEM. XPS. etc. techniques as discussed above.
  • Figure 18 is a series of SEM micrographs illustrating the growth of single, multiwall carbon nanotube obelisks on respective nickel catalyst nano-dots.
  • the catalyst nano-dots are shown in arrays of -100 nm catalyst nano-dots.
  • the site and spacing are precisely controlled.
  • Figures 18A. 18C. 18E, and 18F are perspective views of the nanotubes.
  • Figures 18B and 18D are top views of the nanotubes.
  • Figures 18A and 18B demonstrate selective growth of the nanotubes on the several repeated array patterns.
  • the nanotubes accurately reflect the spacing and periodicity of the lithographically patterned catalyst nano-dots.
  • Figures 18C and 18D reflect higher magnification and sho the repeated array pattern where the nanotubes are spaced either 2 ⁇ m apart (left portion of array) or 1 ⁇ m apart (right portion of array).
  • the sharp, tapered tips of the nanotubes shown in Figures 18E. 18F. and 19 are unique to carbon nanotubes grown on nano-dots under the instant conditions. Notably, such nanotubes do not have a cap of the catalyst material.
  • the nano-dots are spaced 5 ⁇ m apart.
  • the non-uniformity of height (0.1 to 5 ⁇ m) is apparently not related to the spatial position. Rather, it is believed to be due to non- uniform electron beam lithography and electron beam evaporation of the catalyst nano- dots onto the substrate. With precise control of the electron beam lithography, all carbon nanotubes should be substantially uniform in height. Nanotube length is dependent upon the growth time and the thickness of the nano-dot.
  • nanotube diameter depends upon the diameter of the nano-dot. It can be observed that although the heights vary, the diameters are generally uniform at -150 nm.
  • STM scanning tunneling microscope
  • AFM atomic force microscope
  • Well-defined spacing of multiple carbon nanotubes with multi-electron beam lithography can improve the patterning ability by 10 4 - 10 6 times.

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Families Citing this family (364)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346189B1 (en) * 1998-08-14 2002-02-12 The Board Of Trustees Of The Leland Stanford Junior University Carbon nanotube structures made using catalyst islands
US6232706B1 (en) * 1998-11-12 2001-05-15 The Board Of Trustees Of The Leland Stanford Junior University Self-oriented bundles of carbon nanotubes and method of making same
US20110125412A1 (en) * 1998-12-17 2011-05-26 Hach Company Remote monitoring of carbon nanotube sensor
US7454295B2 (en) 1998-12-17 2008-11-18 The Watereye Corporation Anti-terrorism water quality monitoring system
US8958917B2 (en) * 1998-12-17 2015-02-17 Hach Company Method and system for remote monitoring of fluid quality and treatment
US9056783B2 (en) * 1998-12-17 2015-06-16 Hach Company System for monitoring discharges into a waste water collection system
AU764152B2 (en) * 1999-04-16 2003-08-14 Commonwealth Scientific And Industrial Research Organisation Multilayer carbon nanotube films
AUPP976499A0 (en) 1999-04-16 1999-05-06 Commonwealth Scientific And Industrial Research Organisation Multilayer carbon nanotube films
KR100335383B1 (ko) * 1999-04-21 2002-05-06 진 장 탄소 나노튜브의 제조방법
AUPQ065099A0 (en) 1999-05-28 1999-06-24 Commonwealth Scientific And Industrial Research Organisation Substrate-supported aligned carbon nanotube films
AUPQ064999A0 (en) 1999-05-28 1999-06-24 Commonwealth Scientific And Industrial Research Organisation Patterned carbon nanotube films
US7132161B2 (en) * 1999-06-14 2006-11-07 Energy Science Laboratories, Inc. Fiber adhesive material
US6913075B1 (en) * 1999-06-14 2005-07-05 Energy Science Laboratories, Inc. Dendritic fiber material
US20040009353A1 (en) * 1999-06-14 2004-01-15 Knowles Timothy R. PCM/aligned fiber composite thermal interface
AUPQ304199A0 (en) 1999-09-23 1999-10-21 Commonwealth Scientific And Industrial Research Organisation Patterned carbon nanotubes
JP3595233B2 (ja) 2000-02-16 2004-12-02 株式会社ノリタケカンパニーリミテド 電子放出源及びその製造方法
EP1129990A1 (en) * 2000-02-25 2001-09-05 Lucent Technologies Inc. Process for controlled growth of carbon nanotubes
KR100360470B1 (ko) * 2000-03-15 2002-11-09 삼성에스디아이 주식회사 저압-dc-열화학증착법을 이용한 탄소나노튜브 수직배향증착 방법
US6495116B1 (en) * 2000-04-10 2002-12-17 Lockheed Martin Corporation Net shape manufacturing using carbon nanotubes
TW525314B (en) * 2000-09-29 2003-03-21 Sony Corp Fuel cell and method for preparation thereof
CA2424969C (en) 2000-10-06 2008-05-27 Fullerene International Corporation Double-walled carbon nanotubes and methods for production and application
WO2002047104A1 (en) * 2000-12-08 2002-06-13 Lightlab Ab A field emitting cathode and a light source using a field emitting cathode
CA2434086A1 (en) * 2001-01-16 2002-07-18 Showa Denko K.K. Catalyst composition for cell, gas diffusion layer, and fuel cell comprising the same
JP3912583B2 (ja) * 2001-03-14 2007-05-09 三菱瓦斯化学株式会社 配向性カーボンナノチューブ膜の製造方法
CA2442310A1 (en) 2001-03-26 2002-10-03 Eikos, Inc. Coatings containing carbon nanotubes
AU2002254368B2 (en) 2001-03-26 2007-07-19 Eikos, Inc. Carbon nanotubes in structures and repair compositions
WO2002099824A2 (en) * 2001-04-16 2002-12-12 Zornes David A Nanotube deposition on adsorbents in water maker heat pump
US6699525B2 (en) * 2001-04-16 2004-03-02 The Board Of Trustees Of Western Michigan University Method of forming carbon nanotubes and apparatus therefor
KR100420787B1 (ko) * 2001-04-30 2004-03-02 한국과학기술원 탄소 분자체 및 그의 제조 방법
DE10123876A1 (de) * 2001-05-16 2002-11-28 Infineon Technologies Ag Nanoröhren-Anordnung und Verfahren zum Herstellen einer Nanoröhren-Anordnung
US7157068B2 (en) 2001-05-21 2007-01-02 The Trustees Of Boston College Varied morphology carbon nanotubes and method for their manufacture
US6762237B2 (en) 2001-06-08 2004-07-13 Eikos, Inc. Nanocomposite dielectrics
AU2002367711A1 (en) * 2001-06-14 2003-10-20 Hyperion Catalysis International, Inc. Field emission devices using modified carbon nanotubes
US6911767B2 (en) 2001-06-14 2005-06-28 Hyperion Catalysis International, Inc. Field emission devices using ion bombarded carbon nanotubes
US7341498B2 (en) 2001-06-14 2008-03-11 Hyperion Catalysis International, Inc. Method of irradiating field emission cathode having nanotubes
JP3622147B2 (ja) 2001-06-19 2005-02-23 独立行政法人産業技術総合研究所 柱状ピン止め中心を有する超伝導薄膜及びその製造方法
JP3713561B2 (ja) 2001-06-26 2005-11-09 独立行政法人科学技術振興機構 有機液体による高配向整列カーボンナノチューブの合成方法及びその合成装置
US7259410B2 (en) * 2001-07-25 2007-08-21 Nantero, Inc. Devices having horizontally-disposed nanofabric articles and methods of making the same
US7566478B2 (en) * 2001-07-25 2009-07-28 Nantero, Inc. Methods of making carbon nanotube films, layers, fabrics, ribbons, elements and articles
US6919592B2 (en) 2001-07-25 2005-07-19 Nantero, Inc. Electromechanical memory array using nanotube ribbons and method for making same
US6706402B2 (en) 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US6924538B2 (en) * 2001-07-25 2005-08-02 Nantero, Inc. Devices having vertically-disposed nanofabric articles and methods of making the same
US7563711B1 (en) * 2001-07-25 2009-07-21 Nantero, Inc. Method of forming a carbon nanotube-based contact to semiconductor
US6835591B2 (en) * 2001-07-25 2004-12-28 Nantero, Inc. Methods of nanotube films and articles
WO2003011755A1 (en) * 2001-07-27 2003-02-13 University Of Surrey Production of carbon nanotubes
JP3710436B2 (ja) 2001-09-10 2005-10-26 キヤノン株式会社 電子放出素子、電子源及び画像表示装置の製造方法
JP3768937B2 (ja) 2001-09-10 2006-04-19 キヤノン株式会社 電子放出素子、電子源及び画像表示装置の製造方法
JP3725063B2 (ja) * 2001-09-25 2005-12-07 株式会社国際基盤材料研究所 カーボンナノチューブの製造方法
AU2002327980B2 (en) * 2001-10-01 2008-02-21 Rosseter Holdings Ltd Short carbon nanotubes
WO2003043934A1 (en) * 2001-11-20 2003-05-30 Wm. Marsh Rice University Coated fullerenes, composites and dielectrics made therefrom
US7820132B2 (en) * 2001-12-14 2010-10-26 Alliance For Sustainable Energy, Llc Hot wire production of single-wall and multi-wall carbon nanotubes
KR100480663B1 (ko) * 2001-12-21 2005-04-06 한국화학연구원 변형된 유도결합형 플라즈마 화학기상증착법에 의한탄소나노튜브의 합성방법
JP3962862B2 (ja) * 2002-02-27 2007-08-22 日立造船株式会社 カーボンナノチューブを用いた導電性材料およびその製造方法
KR100454420B1 (ko) * 2002-04-12 2004-10-26 박정희 탄소나노튜브의 제조방법
KR20030081838A (ko) * 2002-04-13 2003-10-22 실리콘 디스플레이 (주) 금속기판 위의 탄소나노팁 제조 방법
US20030198588A1 (en) * 2002-04-17 2003-10-23 Showa Denko K.K. Vapor grown carbon fiber and method for producing the same
US7335395B2 (en) * 2002-04-23 2008-02-26 Nantero, Inc. Methods of using pre-formed nanotubes to make carbon nanotube films, layers, fabrics, ribbons, elements and articles
EP1578599A4 (en) * 2002-08-01 2008-07-02 Oregon State METHOD FOR SYNTHETIZING NANOSTRUCTURES AT FIXED PLACES
US7175494B1 (en) 2002-08-22 2007-02-13 Cdream Corporation Forming carbon nanotubes at lower temperatures suitable for an electron-emitting device
US20040037972A1 (en) * 2002-08-22 2004-02-26 Kang Simon Patterned granulized catalyst layer suitable for electron-emitting device, and associated fabrication method
KR100461966B1 (ko) * 2002-09-25 2004-12-17 한국과학기술연구원 탄소나노튜브 전극, 이를 이용한 전기이중층축전기 및 그 제조방법
US20040072994A1 (en) * 2002-10-15 2004-04-15 Herr Daniel J.C. Nanostructures including controllably positioned and aligned synthetic nanotubes, and related methods
US7035308B1 (en) 2002-10-28 2006-04-25 Science Applications International Corporation Method and system for countering laser technology
US20040197638A1 (en) * 2002-10-31 2004-10-07 Mcelrath Kenneth O Fuel cell electrode comprising carbon nanotubes
US7002609B2 (en) * 2002-11-07 2006-02-21 Brother International Corporation Nano-structure based system and method for charging a photoconductive surface
US7253014B2 (en) * 2002-11-19 2007-08-07 William Marsh Rice University Fabrication of light emitting film coated fullerenes and their application for in-vivo light emission
DE60334723D1 (de) * 2002-11-19 2010-12-09 Univ Rice William M Feldeffektransistor mit funktionalisierter Kohlenstoffnanoröhre und dessen Herstellungsfervahren
CN1290763C (zh) * 2002-11-29 2006-12-20 清华大学 一种生产碳纳米管的方法
WO2004050939A2 (en) * 2002-12-04 2004-06-17 Dana Corporation Plasma-assisted melting
KR100502821B1 (ko) * 2002-12-26 2005-07-22 이호영 구리산화물 또는 구리 나노와이어로 이루어진 전자방출팁의 저온 형성 방법 및 이 방법에 의해 제조된 전자방출팁을 포함하는 디스플레이 장치 또는 광원
KR20040059300A (ko) * 2002-12-28 2004-07-05 학교법인 포항공과대학교 자성체/나노소재 이종접합 나노구조체 및 그 제조방법
CN1720345A (zh) * 2003-01-13 2006-01-11 南泰若股份有限公司 利用薄金属层制造碳纳米管薄膜、层、织品、条带、元件及物品之方法
US7858185B2 (en) * 2003-09-08 2010-12-28 Nantero, Inc. High purity nanotube fabrics and films
US8937575B2 (en) 2009-07-31 2015-01-20 Nantero Inc. Microstrip antenna elements and arrays comprising a shaped nanotube fabric layer and integrated two terminal nanotube select devices
US7560136B2 (en) * 2003-01-13 2009-07-14 Nantero, Inc. Methods of using thin metal layers to make carbon nanotube films, layers, fabrics, ribbons, elements and articles
US9574290B2 (en) 2003-01-13 2017-02-21 Nantero Inc. Methods for arranging nanotube elements within nanotube fabrics and films
US8920619B2 (en) 2003-03-19 2014-12-30 Hach Company Carbon nanotube sensor
US20040182600A1 (en) 2003-03-20 2004-09-23 Fujitsu Limited Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof
KR100982419B1 (ko) * 2003-05-01 2010-09-15 삼성전자주식회사 탄소나노튜브를 이용한 반도체 소자의 배선 형성 방법 및이 방법에 의해 제조된 반도체 소자
EP1623203A4 (en) 2003-05-14 2010-11-24 Nantero Inc DETECTION PLATFORM USING NON-HORIZONTAL NANOTUBULAR ELEMENT
US20050272856A1 (en) * 2003-07-08 2005-12-08 Cooper Christopher H Carbon nanotube containing materials and articles containing such materials for altering electromagnetic radiation
US20060018966A1 (en) * 2003-07-22 2006-01-26 Lin Victor S Antimicrobial mesoporous silica nanoparticles
US7563451B2 (en) 2003-07-22 2009-07-21 Iowa State University Research Foundation, Inc. Capped mesoporous silicates
US20080131655A1 (en) * 2006-03-21 2008-06-05 Barbara Wacker Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
US7416993B2 (en) * 2003-09-08 2008-08-26 Nantero, Inc. Patterned nanowire articles on a substrate and methods of making the same
US20050112450A1 (en) * 2003-09-08 2005-05-26 Intematix Corporation Low platinum fuel cell catalysts and method for preparing the same
US7375369B2 (en) * 2003-09-08 2008-05-20 Nantero, Inc. Spin-coatable liquid for formation of high purity nanotube films
US7351444B2 (en) 2003-09-08 2008-04-01 Intematix Corporation Low platinum fuel cell catalysts and method for preparing the same
US8211593B2 (en) * 2003-09-08 2012-07-03 Intematix Corporation Low platinum fuel cells, catalysts, and method for preparing the same
US6987071B1 (en) * 2003-11-21 2006-01-17 Nanosolar, Inc. Solvent vapor infiltration of organic materials into nanostructures
KR100561856B1 (ko) * 2004-01-07 2006-03-16 삼성에스디아이 주식회사 촉매 담체용 짧은 탄소나노튜브, 상기 탄소나노튜브를 이용한 탄소나노튜브 담지 촉매 및 이를 채용한 연료전지
KR100708540B1 (ko) * 2004-02-09 2007-04-18 (주)케이에이치 케미컬 Y-분지형 탄소나노튜브의 제조
TW200526824A (en) * 2004-02-11 2005-08-16 Ind Tech Res Inst Manufacturing method of silicon nanowire
JP4834957B2 (ja) * 2004-02-27 2011-12-14 住友電気工業株式会社 触媒構造体およびこれを用いたカーボンナノチューブの製造方法
CN1960943B (zh) 2004-04-19 2013-01-02 独立行政法人科学技术振兴机构 碳类精细结构物群、碳类精细结构物聚集物、其利用以及其制造方法
US7709880B2 (en) * 2004-06-09 2010-05-04 Nantero, Inc. Field effect devices having a gate controlled via a nanotube switching element
US20060001350A1 (en) * 2004-06-30 2006-01-05 Hitachi High-Technologies Corporation Field emission electron gun and electron beam apparatus using the same
WO2006011655A1 (ja) * 2004-07-27 2006-02-02 National Institute Of Advanced Industrial Scienceand Technology 単層カーボンナノチューブおよび配向単層カーボンナノチューブ・バルク構造体ならびにそれらの製造方法・装置および用途
KR100746586B1 (ko) * 2004-08-18 2007-08-08 한국과학기술원 헬리콘 플라즈마를 이용한 카본 나노튜브 표면에 철을 코팅 및 임플란트하는 방법
JP4752216B2 (ja) * 2004-08-26 2011-08-17 トヨタ自動車株式会社 チューブ型燃料電池用膜電極複合体
US8471238B2 (en) * 2004-09-16 2013-06-25 Nantero Inc. Light emitters using nanotubes and methods of making same
TWI348169B (en) 2004-09-21 2011-09-01 Nantero Inc Resistive elements using carbon nanotubes
US20060083927A1 (en) * 2004-10-15 2006-04-20 Zyvex Corporation Thermal interface incorporating nanotubes
US20100147657A1 (en) * 2004-11-02 2010-06-17 Nantero, Inc. Nanotube esd protective devices and corresponding nonvolatile and volatile nanotube switches
US7567414B2 (en) * 2004-11-02 2009-07-28 Nantero, Inc. Nanotube ESD protective devices and corresponding nonvolatile and volatile nanotube switches
US7897294B2 (en) * 2004-11-08 2011-03-01 Quantumsphere, Inc. Nano-material catalyst device
US20100233577A1 (en) * 2004-11-08 2010-09-16 Carpenter R Douglas Nano-material catalyst device
WO2006060149A2 (en) * 2004-11-10 2006-06-08 The Regents Of The University Of California Actively switchable nano-structured adhesive
CA2590684A1 (en) 2004-12-16 2006-06-22 Nantero, Inc. Aqueous carbon nanotube applicator liquids and methods for producing applicator liquids thereof
FR2880198B1 (fr) * 2004-12-23 2007-07-06 Commissariat Energie Atomique Electrode nanostructuree pour microbatterie
FR2880197B1 (fr) * 2004-12-23 2007-02-02 Commissariat Energie Atomique Electrolyte structure pour microbatterie
US8808856B2 (en) 2005-01-05 2014-08-19 Pureron Japan Co., Ltd. Apparatus and method for producing carbon film using plasma CVD and carbon film
KR101342356B1 (ko) * 2005-01-05 2013-12-16 가부시키가이샤 퓨아론 쟈판 플라스마 cvd를 이용한 탄소 막 생성 방법과 탄소 막
JP4917758B2 (ja) * 2005-04-13 2012-04-18 株式会社ピュアロンジャパン カーボン金属ナノツリーおよびその製造方法
US20060177659A1 (en) * 2005-02-09 2006-08-10 National Pingtung University Of Science & Technology Powder containing carbon nanotube or carbon nanofiber and process for preparing the same
CA2500766A1 (en) * 2005-03-14 2006-09-14 National Research Council Of Canada Method and apparatus for the continuous production and functionalization of single-walled carbon nanotubes using a high frequency induction plasma torch
US9287356B2 (en) * 2005-05-09 2016-03-15 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US8941094B2 (en) 2010-09-02 2015-01-27 Nantero Inc. Methods for adjusting the conductivity range of a nanotube fabric layer
CN1854733A (zh) * 2005-04-21 2006-11-01 清华大学 测量碳纳米管生长速度的方法
US8013363B2 (en) * 2005-05-09 2011-09-06 Nantero, Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US9911743B2 (en) 2005-05-09 2018-03-06 Nantero, Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US8183665B2 (en) * 2005-11-15 2012-05-22 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US7782650B2 (en) * 2005-05-09 2010-08-24 Nantero, Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US7479654B2 (en) * 2005-05-09 2009-01-20 Nantero, Inc. Memory arrays using nanotube articles with reprogrammable resistance
US9196615B2 (en) * 2005-05-09 2015-11-24 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US7835170B2 (en) * 2005-05-09 2010-11-16 Nantero, Inc. Memory elements and cross point switches and arrays of same using nonvolatile nanotube blocks
US7781862B2 (en) * 2005-05-09 2010-08-24 Nantero, Inc. Two-terminal nanotube devices and systems and methods of making same
US8217490B2 (en) * 2005-05-09 2012-07-10 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US8513768B2 (en) * 2005-05-09 2013-08-20 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
GB0509499D0 (en) * 2005-05-11 2005-06-15 Univ Surrey Use of thermal barrier for low temperature growth of nanostructures using top-down heating approach
US7598127B2 (en) 2005-05-12 2009-10-06 Nantero, Inc. Nanotube fuse structure
TWI264271B (en) * 2005-05-13 2006-10-11 Delta Electronics Inc Heat sink
US7767616B2 (en) * 2005-05-26 2010-08-03 Uchicago Argonne, Llc Aligned carbon nanotube with electro-catalytic activity for oxygen reduction reaction
US7915122B2 (en) * 2005-06-08 2011-03-29 Nantero, Inc. Self-aligned cell integration scheme
US7439731B2 (en) 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US7538040B2 (en) * 2005-06-30 2009-05-26 Nantero, Inc. Techniques for precision pattern transfer of carbon nanotubes from photo mask to wafers
US7736616B2 (en) * 2005-07-14 2010-06-15 Colorado School Of Mines Membrane separation of feed and growth environments in carbon nanostructure growth
US7645482B2 (en) * 2005-08-04 2010-01-12 The Regents Of The University Of California Method to make and use long single-walled carbon nanotubes as electrical conductors
EP1928587A2 (en) * 2005-08-24 2008-06-11 The Regents of the University of California Membranes for nanometer-scale mass fast transport
CA2621924A1 (en) 2005-09-06 2007-03-06 Nantero, Inc. Carbon nanotubes for the selective transfer of heat from electronics
EP1922743A4 (en) * 2005-09-06 2008-10-29 Nantero Inc METHOD AND SYSTEM FOR USING NANOTUBE TISSUES AS OHMIC HEATING ELEMENTS FOR MEMORIES AND OTHER APPLICATIONS
US8366999B2 (en) * 2005-09-06 2013-02-05 Nantero Inc. Nanotube fabric-based sensor systems and methods of making same
US8252405B2 (en) * 2005-10-27 2012-08-28 The Board Of Trustees Of The Leland Stanford Junior University Single-walled carbon nanotubes and methods of preparation thereof
AT504807A1 (de) * 2005-11-18 2008-08-15 Electrovac Ag Leuchtschirm
JP2009518646A (ja) * 2005-12-05 2009-05-07 セルドン テクノロジーズ,インコーポレイテッド ナノチューブを使用してエネルギー粒子を発生させる方法、及びその物品
JP5004070B2 (ja) * 2005-12-06 2012-08-22 国立大学法人 名古屋工業大学 リチウムイオン貯蔵体及びリチウムイオン貯蔵方法
TW200730436A (en) 2005-12-19 2007-08-16 Advanced Tech Materials Production of carbon nanotubes
WO2007075680A2 (en) * 2005-12-19 2007-07-05 University Of Vermont And State Agricultural College System and method for delivering a desired material to a cell
US7544523B2 (en) * 2005-12-23 2009-06-09 Fei Company Method of fabricating nanodevices
JP2007212006A (ja) * 2006-02-07 2007-08-23 Nissan Motor Co Ltd 触媒燃焼器の燃焼状態検知装置
US8124503B2 (en) * 2006-03-03 2012-02-28 William Marsh Rice University Carbon nanotube diameter selection by pretreatment of metal catalysts on surfaces
JP5108240B2 (ja) 2006-03-20 2012-12-26 トヨタ自動車株式会社 燃料電池及び燃料電池の製造方法
US20070224459A1 (en) * 2006-03-24 2007-09-27 Hsieh Meng C Magnetic recording medium including carbon nanotubes
JP5287237B2 (ja) * 2006-03-24 2013-09-11 富士通株式会社 炭素系繊維のデバイス構造およびその製造方法
WO2007110899A1 (ja) * 2006-03-24 2007-10-04 Fujitsu Limited 炭素系繊維のデバイス構造およびその製造方法
US20100117764A1 (en) * 2006-04-17 2010-05-13 Board Of Regents, The University Of Texas System Assisted selective growth of highly dense and vertically aligned carbon nanotubes
US8647644B1 (en) 2006-04-19 2014-02-11 Iowa State University Research Foundation, Inc. Methods of using capped mesoporous silicates
EP2024283A2 (en) * 2006-05-19 2009-02-18 Massachusetts Institute of Technology Continuous process for the production of nanostructures including nanotubes
US8337979B2 (en) 2006-05-19 2012-12-25 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
US7393699B2 (en) 2006-06-12 2008-07-01 Tran Bao Q NANO-electronics
JP4979296B2 (ja) * 2006-08-02 2012-07-18 富士通株式会社 カーボンナノチューブの製造方法
CN101121791B (zh) * 2006-08-09 2010-12-08 清华大学 碳纳米管/聚合物复合材料的制备方法
US7931838B2 (en) * 2006-08-31 2011-04-26 Virginia Tech Intellectual Properties, Inc. Method for making oriented single-walled carbon nanotube/polymer nano-composite membranes
US20110255212A1 (en) * 2006-09-01 2011-10-20 Battelle Memorial Institute Carbon Nanotube Nanocomposites, Methods of Making Carbon Nanotube Nanocomposites, and Devices Comprising the Nanocomposites
GB0617460D0 (en) * 2006-09-05 2006-10-18 Airbus Uk Ltd Method of manufacturing composite material
US8491999B2 (en) 2006-09-14 2013-07-23 Wisconsin Alumni Research Foundation Metal-coated vertically aligned carbon nanofibers
US8617650B2 (en) * 2006-09-28 2013-12-31 The Hong Kong University Of Science And Technology Synthesis of aligned carbon nanotubes on double-sided metallic substrate by chemical vapor depositon
US20080089829A1 (en) * 2006-10-13 2008-04-17 Rensselaer Polytechnic Institute In-situ back-contact formation and site-selective assembly of highly aligned carbon nanotubes
US8130007B2 (en) 2006-10-16 2012-03-06 Formfactor, Inc. Probe card assembly with carbon nanotube probes having a spring mechanism therein
US8354855B2 (en) * 2006-10-16 2013-01-15 Formfactor, Inc. Carbon nanotube columns and methods of making and using carbon nanotube columns as probes
US7820316B2 (en) 2006-10-23 2010-10-26 Toyota Jidosha Kabushiki Kaisha Membrane electrode assembly and fuel cell
US20080135482A1 (en) * 2006-11-27 2008-06-12 Kripal Singh Polyamide nanofiltration membrane useful for the removal of phospholipids
US8158217B2 (en) * 2007-01-03 2012-04-17 Applied Nanostructured Solutions, Llc CNT-infused fiber and method therefor
US9005755B2 (en) 2007-01-03 2015-04-14 Applied Nanostructured Solutions, Llc CNS-infused carbon nanomaterials and process therefor
US8951631B2 (en) 2007-01-03 2015-02-10 Applied Nanostructured Solutions, Llc CNT-infused metal fiber materials and process therefor
US20100279569A1 (en) * 2007-01-03 2010-11-04 Lockheed Martin Corporation Cnt-infused glass fiber materials and process therefor
US8951632B2 (en) 2007-01-03 2015-02-10 Applied Nanostructured Solutions, Llc CNT-infused carbon fiber materials and process therefor
US20120189846A1 (en) * 2007-01-03 2012-07-26 Lockheed Martin Corporation Cnt-infused ceramic fiber materials and process therefor
US7678672B2 (en) * 2007-01-16 2010-03-16 Northrop Grumman Space & Mission Systems Corp. Carbon nanotube fabrication from crystallography oriented catalyst
JP5285223B2 (ja) * 2007-01-24 2013-09-11 株式会社ウイングターフ 炭素クラスター分散液の製造方法及び装置
WO2008102813A1 (ja) * 2007-02-20 2008-08-28 National Institute Of Advanced Industrial Science And Technology カーボンナノチューブからなる梁状体及びその製造方法
US20080238882A1 (en) * 2007-02-21 2008-10-02 Ramesh Sivarajan Symmetric touch screen system with carbon nanotube-based transparent conductive electrode pairs
WO2008105736A2 (en) * 2007-03-01 2008-09-04 Plasmatrix Materials Ab Method, material and apparatus for enhancing dynamic stiffness
WO2008112764A1 (en) 2007-03-12 2008-09-18 Nantero, Inc. Electromagnetic and thermal sensors using carbon nanotubes and methods of making same
WO2008118794A2 (en) 2007-03-23 2008-10-02 Lydall, Inc. Substrate for carrying catalytic particles
CN101276724B (zh) * 2007-03-30 2011-06-22 北京富纳特创新科技有限公司 透射电镜微栅及其制备方法
US8294098B2 (en) * 2007-03-30 2012-10-23 Tsinghua University Transmission electron microscope micro-grid
TW200840888A (en) * 2007-04-04 2008-10-16 Univ Nat Cheng Kung Carbon fiber of high thermal conduction and continuous gaseous growth and its manufacturing method and application
CN101280161B (zh) * 2007-04-06 2013-01-09 清华大学 导电胶带及其制造方法
US9076570B2 (en) * 2007-04-13 2015-07-07 Rochester Institute Of Technology Nano-composite structures, methods of making, and use thereof
WO2009005908A2 (en) 2007-05-22 2009-01-08 Nantero, Inc. Triodes using nanofabric articles and methods of making the same
US7867620B1 (en) * 2007-07-24 2011-01-11 Rockwell Collins, Inc. Composite plate comprising carbon nanotube bundles with high thermal conductivity and method for making the same
US7816031B2 (en) * 2007-08-10 2010-10-19 The Board Of Trustees Of The Leland Stanford Junior University Nanowire battery methods and arrangements
US20090081383A1 (en) * 2007-09-20 2009-03-26 Lockheed Martin Corporation Carbon Nanotube Infused Composites via Plasma Processing
US20090081441A1 (en) * 2007-09-20 2009-03-26 Lockheed Martin Corporation Fiber Tow Comprising Carbon-Nanotube-Infused Fibers
US8498381B2 (en) 2010-10-07 2013-07-30 Moxtek, Inc. Polymer layer on X-ray window
US9305735B2 (en) 2007-09-28 2016-04-05 Brigham Young University Reinforced polymer x-ray window
US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
CN101425584B (zh) * 2007-11-02 2011-05-04 清华大学 燃料电池膜电极及其制备方法
CN101462391B (zh) * 2007-12-21 2013-04-24 清华大学 碳纳米管复合材料的制备方法
CN101480858B (zh) * 2008-01-11 2014-12-10 清华大学 碳纳米管复合材料及其制备方法
US7479590B1 (en) * 2008-01-03 2009-01-20 International Business Machines Corporation Dry adhesives, methods of manufacture thereof and articles comprising the same
US9705136B2 (en) 2008-02-25 2017-07-11 Traverse Technologies Corp. High capacity energy storage
US9431181B2 (en) 2009-02-25 2016-08-30 Catalyst Power Technologies Energy storage devices including silicon and graphite
US9966197B2 (en) 2009-02-25 2018-05-08 Cf Traverse Llc Energy storage devices including support filaments
DE112009000443B4 (de) 2008-02-25 2017-05-11 Ronald Anthony Rojeski Elektroden für wiederaufladbare Batterie mit hoher Kapazität
US10727481B2 (en) 2009-02-25 2020-07-28 Cf Traverse Llc Energy storage devices
US9412998B2 (en) 2009-02-25 2016-08-09 Ronald A. Rojeski Energy storage devices
US11233234B2 (en) 2008-02-25 2022-01-25 Cf Traverse Llc Energy storage devices
US9979017B2 (en) 2009-02-25 2018-05-22 Cf Traverse Llc Energy storage devices
US9941709B2 (en) 2009-02-25 2018-04-10 Cf Traverse Llc Hybrid energy storage device charging
US9917300B2 (en) 2009-02-25 2018-03-13 Cf Traverse Llc Hybrid energy storage devices including surface effect dominant sites
US9349544B2 (en) 2009-02-25 2016-05-24 Ronald A Rojeski Hybrid energy storage devices including support filaments
US10193142B2 (en) 2008-02-25 2019-01-29 Cf Traverse Llc Lithium-ion battery anode including preloaded lithium
US9362549B2 (en) 2011-12-21 2016-06-07 Cpt Ip Holdings, Llc Lithium-ion battery anode including core-shell heterostructure of silicon coated vertically aligned carbon nanofibers
US10056602B2 (en) 2009-02-25 2018-08-21 Cf Traverse Llc Hybrid energy storage device production
US10205166B2 (en) 2008-02-25 2019-02-12 Cf Traverse Llc Energy storage devices including stabilized silicon
CN101556089B (zh) * 2008-04-11 2011-03-30 鸿富锦精密工业(深圳)有限公司 太阳能集热器
CN101559939B (zh) * 2008-04-18 2011-05-04 清华大学 碳纳米管制备方法
US8632879B2 (en) * 2008-04-25 2014-01-21 The University Of Kentucky Research Foundation Lightweight thermal management material for enhancement of through-thickness thermal conductivity
US10358535B2 (en) 2008-04-25 2019-07-23 The University Of Kentucky Research Foundation Thermal interface material
US8133793B2 (en) 2008-05-16 2012-03-13 Sandisk 3D Llc Carbon nano-film reversible resistance-switchable elements and methods of forming the same
WO2009148959A2 (en) * 2008-05-29 2009-12-10 Lawrence Livermore National Security, Llc Membranes with functionalized carbon nanotube pores for selective transport
US8587989B2 (en) 2008-06-20 2013-11-19 Nantero Inc. NRAM arrays with nanotube blocks, nanotube traces, and nanotube planes and methods of making same
US7993524B2 (en) * 2008-06-30 2011-08-09 Nanoasis Technologies, Inc. Membranes with embedded nanotubes for selective permeability
US8569730B2 (en) * 2008-07-08 2013-10-29 Sandisk 3D Llc Carbon-based interface layer for a memory device and methods of forming the same
DE102008032333A1 (de) 2008-07-09 2010-06-10 Drägerwerk AG & Co. KGaA Miniaturisierter nicht-radioaktiver Elektronenemitter
US20100021736A1 (en) * 2008-07-25 2010-01-28 Slinker Keith A Interface-infused nanotube interconnect
WO2010014650A2 (en) * 2008-07-29 2010-02-04 Honda Motor Co., Ltd. Preferential growth of single-walled carbon nanotubes with metallic conductivity
US20100032639A1 (en) * 2008-08-07 2010-02-11 Sandisk 3D Llc Memory cell that includes a carbon-based memory element and methods of forming the same
US8822078B2 (en) 2008-09-29 2014-09-02 Rochester Institute Of Technology Freestanding carbon nanotube paper, methods of its making, and devices containing the same
US20100108976A1 (en) * 2008-10-30 2010-05-06 Sandisk 3D Llc Electronic devices including carbon-based films, and methods of forming such devices
US8835892B2 (en) * 2008-10-30 2014-09-16 Sandisk 3D Llc Electronic devices including carbon nano-tube films having boron nitride-based liners, and methods of forming the same
US8421050B2 (en) * 2008-10-30 2013-04-16 Sandisk 3D Llc Electronic devices including carbon nano-tube films having carbon-based liners, and methods of forming the same
CN101412509B (zh) * 2008-11-17 2010-12-22 杭州电子科技大学 一种纳米碳管团簇粉体及制备方法
US7915637B2 (en) 2008-11-19 2011-03-29 Nantero, Inc. Switching materials comprising mixed nanoscopic particles and carbon nanotubes and method of making and using the same
US20100216023A1 (en) * 2009-01-13 2010-08-26 Di Wei Process for producing carbon nanostructure on a flexible substrate, and energy storage devices comprising flexible carbon nanostructure electrodes
US9406985B2 (en) * 2009-01-13 2016-08-02 Nokia Technologies Oy High efficiency energy conversion and storage systems using carbon nanostructured materials
US20100178568A1 (en) * 2009-01-13 2010-07-15 Nokia Corporation Process for producing carbon nanostructure on a flexible substrate, and energy storage devices comprising flexible carbon nanostructure electrodes
WO2010092786A1 (ja) * 2009-02-10 2010-08-19 日本ゼオン株式会社 カーボンナノチューブ配向集合体生産用基材及びカーボンナノチューブ配向集合体の製造方法
JP5577356B2 (ja) * 2009-02-17 2014-08-20 アプライド ナノストラクチャード ソリューションズ リミテッド ライアビリティー カンパニー カーボン・ナノチューブを繊維上に含んで構成された複合材料
CN102333906B (zh) * 2009-02-27 2015-03-11 应用纳米结构方案公司 使用气体预热法的低温cnt生长
US20100227134A1 (en) 2009-03-03 2010-09-09 Lockheed Martin Corporation Method for the prevention of nanoparticle agglomeration at high temperatures
CN101848564B (zh) * 2009-03-27 2012-06-20 清华大学 加热器件
US8183121B2 (en) * 2009-03-31 2012-05-22 Sandisk 3D Llc Carbon-based films, and methods of forming the same, having dielectric filler material and exhibiting reduced thermal resistance
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
US20100252317A1 (en) * 2009-04-03 2010-10-07 Formfactor, Inc. Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
BRPI1014162A2 (pt) * 2009-04-10 2016-04-26 Applied Nanostructured Sols método e aparelho para uso de um forno vertical para infundir nanotubos de carbono á fibra
JP5629756B2 (ja) * 2009-04-10 2014-11-26 アプライド ナノストラクチャード ソリューションズ リミテッド ライアビリティー カンパニーApplied Nanostructuredsolutions, Llc 連続的に移動する基材上においてカーボン・ナノチューブを製造する装置及び方法
US20100272891A1 (en) * 2009-04-10 2010-10-28 Lockheed Martin Corporation Apparatus and method for the production of carbon nanotubes on a continuously moving substrate
JP2012523677A (ja) * 2009-04-13 2012-10-04 アプライド マテリアルズ インコーポレイテッド 金属化カーボンナノチューブおよびナノファイバを含む複合材料
US8277933B1 (en) * 2009-04-17 2012-10-02 Uab Research Foundation Long fiber thermoplastic thin-walled baseplates for missile applications and methods of manufacture
US8846189B1 (en) * 2009-04-17 2014-09-30 Uab Research Foundation Long fiber thermoplastic thin-walled aeroshells for missile applications and methods of manufacture
US9111658B2 (en) 2009-04-24 2015-08-18 Applied Nanostructured Solutions, Llc CNS-shielded wires
CN102458825A (zh) * 2009-04-24 2012-05-16 应用纳米结构方案公司 基于cnt的信号控制材料
WO2010129234A2 (en) * 2009-04-27 2010-11-11 Lockheed Martin Corporation Cnt-based resistive heating for deicing composite structures
CN101870463A (zh) 2009-04-27 2010-10-27 清华大学 碳纳米管泊松比材料
CN102421704A (zh) * 2009-04-30 2012-04-18 应用纳米结构方案公司 用于碳纳米管合成的紧密接近催化的方法和系统
US20140370380A9 (en) * 2009-05-07 2014-12-18 Yi Cui Core-shell high capacity nanowires for battery electrodes
US20100285358A1 (en) 2009-05-07 2010-11-11 Amprius, Inc. Electrode Including Nanostructures for Rechargeable Cells
US11996550B2 (en) 2009-05-07 2024-05-28 Amprius Technologies, Inc. Template electrode structures for depositing active materials
US8450012B2 (en) 2009-05-27 2013-05-28 Amprius, Inc. Interconnected hollow nanostructures containing high capacity active materials for use in rechargeable batteries
US20100311866A1 (en) * 2009-06-05 2010-12-09 University Of Massachusetts Heirarchial polymer-based nanocomposites for emi shielding
KR101833071B1 (ko) 2009-06-09 2018-02-27 라메쉬 시바라잔 연료 전지내 쌍극판 상의 용액계 나노구조 탄소 재료(ncm) 코팅
US8574673B2 (en) 2009-07-31 2013-11-05 Nantero Inc. Anisotropic nanotube fabric layers and films and methods of forming same
US8128993B2 (en) * 2009-07-31 2012-03-06 Nantero Inc. Anisotropic nanotube fabric layers and films and methods of forming same
US8969225B2 (en) * 2009-08-03 2015-03-03 Applied Nano Structured Soultions, LLC Incorporation of nanoparticles in composite fibers
US8236118B2 (en) * 2009-08-07 2012-08-07 Guardian Industries Corp. Debonding and transfer techniques for hetero-epitaxially grown graphene, and products including the same
US8507797B2 (en) 2009-08-07 2013-08-13 Guardian Industries Corp. Large area deposition and doping of graphene, and products including the same
US10164135B2 (en) * 2009-08-07 2018-12-25 Guardian Glass, LLC Electronic device including graphene-based layer(s), and/or method or making the same
US10167572B2 (en) * 2009-08-07 2019-01-01 Guardian Glass, LLC Large area deposition of graphene via hetero-epitaxial growth, and products including the same
US20110034008A1 (en) * 2009-08-07 2011-02-10 Nantero, Inc. Method for forming a textured surface on a semiconductor substrate using a nanofabric layer
CN101991364B (zh) * 2009-08-14 2013-08-28 清华大学 电烤箱
CN101998706B (zh) * 2009-08-14 2015-07-01 清华大学 碳纳米管织物及应用该碳纳米管织物的发热体
CN102012060B (zh) * 2009-09-08 2012-12-19 清华大学 壁挂式电取暖器
CN102019039B (zh) * 2009-09-11 2013-08-21 清华大学 红外理疗设备
TWI499553B (zh) * 2009-09-14 2015-09-11 Univ Nat Cheng Kung 奈米碳管及其製備方法
US8334017B2 (en) * 2009-09-18 2012-12-18 Applied Materials, Inc. Apparatus and methods for forming energy storage and photovoltaic devices in a linear system
CN102036149A (zh) * 2009-09-30 2011-04-27 清华大学 音圈骨架及具有该音圈骨架的扬声器
US8895950B2 (en) 2009-10-23 2014-11-25 Nantero Inc. Methods for passivating a carbonic nanolayer
US8351239B2 (en) * 2009-10-23 2013-01-08 Nantero Inc. Dynamic sense current supply circuit and associated method for reading and characterizing a resistive memory array
WO2011050331A2 (en) * 2009-10-23 2011-04-28 Nantero, Inc. Method for passivating a carbonic nanolayer
CN102045623B (zh) * 2009-10-23 2014-12-10 清华大学 振动膜、振动膜的制备方法及具有该振动膜的扬声器
DE102009051069A1 (de) * 2009-10-28 2011-05-05 Drägerwerk AG & Co. KGaA Gasdetektor und Verfahren zur Überwachung der Konzentration eines Gases
US20110171469A1 (en) * 2009-11-02 2011-07-14 Applied Nanostructured Solutions, Llc Cnt-infused aramid fiber materials and process therefor
US20110104551A1 (en) * 2009-11-05 2011-05-05 Uchicago Argonne, Llc Nanotube composite anode materials suitable for lithium ion battery applications
CN102056353A (zh) * 2009-11-10 2011-05-11 清华大学 加热器件及其制备方法
BR112012012263A2 (pt) * 2009-11-23 2019-09-24 Applied Nanostructured Sols estruturas marítimas compósitas adaptadas para cnt
US20110123735A1 (en) * 2009-11-23 2011-05-26 Applied Nanostructured Solutions, Llc Cnt-infused fibers in thermoset matrices
CA2775619A1 (en) * 2009-11-23 2011-05-26 Applied Nanostructured Solutions, Llc Ceramic composite materials containing carbon nanotube-infused fiber materials and methods for production thereof
US20110297892A1 (en) * 2009-12-08 2011-12-08 Applied Nanostructured Solutions, Llc Cnt-infused fibers in thermoplastic matrices
EP2513250A4 (en) * 2009-12-14 2015-05-27 Applied Nanostructured Sols FIRE-RESISTANT COMPOSITE MATERIALS AND ARTICLES WITH CARBON NANOTUBES-INFUNDED FIBER MATERIALS
US8274756B2 (en) * 2009-12-15 2012-09-25 HGST Netherlands B.V. Use of carbon nanotubes to form conductive gaskets deployed in sensitive environments
US8808810B2 (en) * 2009-12-15 2014-08-19 Guardian Industries Corp. Large area deposition of graphene on substrates, and products including the same
US8222704B2 (en) * 2009-12-31 2012-07-17 Nantero, Inc. Compact electrical switching devices with nanotube elements, and methods of making same
US9167736B2 (en) * 2010-01-15 2015-10-20 Applied Nanostructured Solutions, Llc CNT-infused fiber as a self shielding wire for enhanced power transmission line
EP2531558B1 (en) * 2010-02-02 2018-08-22 Applied NanoStructured Solutions, LLC Carbon nanotube-infused fiber materials containing parallel-aligned carbon nanotubes, methods for production thereof, and composite materials derived therefrom
KR101709823B1 (ko) 2010-02-12 2017-02-23 난테로 인크. 나노튜브 직물 층 및 필름 내의 밀도, 다공도 및/또는 간극 크기를 제어하는 방법
US20110203632A1 (en) * 2010-02-22 2011-08-25 Rahul Sen Photovoltaic devices using semiconducting nanotube layers
JP5505786B2 (ja) * 2010-03-02 2014-05-28 日新電機株式会社 カーボンナノチューブ構造体製造方法及びそれを利用した電子放出源
JP2013521656A (ja) 2010-03-02 2013-06-10 アプライド ナノストラクチャード ソリューションズ リミテッド ライアビリティー カンパニー カーボン・ナノチューブ浸出電極材料を含む螺旋に巻き付けられた電気機器及びその生産方法並びに生産装置
CA2789664A1 (en) * 2010-03-02 2011-09-09 Applied Nanostructured Solutions, Llc Electrical devices containing carbon nanotube-infused fibers and methods for production thereof
CN102844917B (zh) 2010-03-03 2015-11-25 安普雷斯股份有限公司 用于沉积活性材料的模板电极结构
US9172088B2 (en) 2010-05-24 2015-10-27 Amprius, Inc. Multidimensional electrochemically active structures for battery electrodes
US9780365B2 (en) 2010-03-03 2017-10-03 Amprius, Inc. High-capacity electrodes with active material coatings on multilayered nanostructured templates
US8460747B2 (en) * 2010-03-04 2013-06-11 Guardian Industries Corp. Large-area transparent conductive coatings including alloyed carbon nanotubes and nanowire composites, and methods of making the same
US8604332B2 (en) * 2010-03-04 2013-12-10 Guardian Industries Corp. Electronic devices including transparent conductive coatings including carbon nanotubes and nanowire composites, and methods of making the same
US8518472B2 (en) * 2010-03-04 2013-08-27 Guardian Industries Corp. Large-area transparent conductive coatings including doped carbon nanotubes and nanowire composites, and methods of making the same
US10661304B2 (en) 2010-03-30 2020-05-26 Nantero, Inc. Microfluidic control surfaces using ordered nanotube fabrics
JP6130787B2 (ja) 2010-03-30 2017-05-17 ナンテロ,インク. ネットワーク、ファブリック及びフィルム内にナノスケール要素を配列させるための方法
US8196756B2 (en) 2010-04-02 2012-06-12 NanOasis Asymmetric nanotube containing membranes
US8780526B2 (en) 2010-06-15 2014-07-15 Applied Nanostructured Solutions, Llc Electrical devices containing carbon nanotube-infused fibers and methods for production thereof
US9017854B2 (en) 2010-08-30 2015-04-28 Applied Nanostructured Solutions, Llc Structural energy storage assemblies and methods for production thereof
US8784937B2 (en) 2010-09-14 2014-07-22 Applied Nanostructured Solutions, Llc Glass substrates having carbon nanotubes grown thereon and methods for production thereof
US10069072B2 (en) 2010-09-20 2018-09-04 Nantero, Inc. Nanotube solutions with high concentration and low contamination and methods for purifiying nanotube solutions
US8815341B2 (en) 2010-09-22 2014-08-26 Applied Nanostructured Solutions, Llc Carbon fiber substrates having carbon nanotubes grown thereon and processes for production thereof
CA2782976A1 (en) 2010-09-23 2012-03-29 Applied Nanostructured Solutions, Llc Cnt-infused fiber as a self shielding wire for enhanced power transmission line
US8526574B2 (en) 2010-09-24 2013-09-03 Moxtek, Inc. Capacitor AC power coupling across high DC voltage differential
US8872176B2 (en) 2010-10-06 2014-10-28 Formfactor, Inc. Elastic encapsulated carbon nanotube based electrical contacts
US8608085B2 (en) 2010-10-15 2013-12-17 Nanolab, Inc. Multi-pole switch structure, method of making same, and method of operating same
US9095821B1 (en) 2010-10-26 2015-08-04 Nagare Membranes, Llc Non-reactive process for fixing nanotubes in a membrane in through-passage orientation
WO2012067943A1 (en) 2010-11-15 2012-05-24 Amprius, Inc. Electrolytes for rechargeable batteries
US8804910B1 (en) 2011-01-24 2014-08-12 Moxtek, Inc. Reduced power consumption X-ray source
US8929515B2 (en) 2011-02-23 2015-01-06 Moxtek, Inc. Multiple-size support for X-ray window
US8989354B2 (en) 2011-05-16 2015-03-24 Brigham Young University Carbon composite support structure
US9076628B2 (en) 2011-05-16 2015-07-07 Brigham Young University Variable radius taper x-ray window support structure
US9174412B2 (en) 2011-05-16 2015-11-03 Brigham Young University High strength carbon fiber composite wafers for microfabrication
CN103733388A (zh) 2011-07-01 2014-04-16 安普雷斯股份有限公司 具有增强的黏附特性的模板电极结构
EA019141B1 (ru) * 2011-09-07 2014-01-30 Федеральное Государственное Бюджетное Учреждение "Научно-Производственный Комплекс "Технологический Центр" Миэт" Способ формирования массивов углеродных нанотрубок
JP5717860B2 (ja) * 2011-09-14 2015-05-13 株式会社フジクラ カーボンナノファイバ形成用構造体、カーボンナノファイバ構造体及びその製造方法並びにカーボンナノファイバ電極
KR20130049737A (ko) * 2011-11-04 2013-05-14 제일모직주식회사 이중벽 탄소나노튜브 및 그 제조방법
JP5851804B2 (ja) * 2011-11-09 2016-02-03 東京エレクトロン株式会社 前処理方法、グラフェンの形成方法及びグラフェン製造装置
US9634251B2 (en) 2012-02-27 2017-04-25 Nantero Inc. Nanotube solution treated with molecular additive, nanotube film having enhanced adhesion property, and methods for forming the nanotube solution and the nanotube film
US9085464B2 (en) 2012-03-07 2015-07-21 Applied Nanostructured Solutions, Llc Resistance measurement system and method of using the same
CN103377749B (zh) * 2012-04-25 2016-08-10 北京富纳特创新科技有限公司 电子元件
WO2014020650A1 (ja) 2012-08-02 2014-02-06 トヨタ自動車株式会社 燃料電池用電極並びに燃料電池用電極、膜電極接合体及び燃料電池の製造方法
US9064667B2 (en) * 2012-11-15 2015-06-23 California Institute Of Technology Systems and methods for implementing robust carbon nanotube-based field emitters
WO2014081972A1 (en) 2012-11-21 2014-05-30 California Institute Of Technology Systems and methods for fabricating carbon nanotube-based vacuum electronic devices
US9593019B2 (en) 2013-03-15 2017-03-14 Guardian Industries Corp. Methods for low-temperature graphene precipitation onto glass, and associated articles/devices
US10431354B2 (en) 2013-03-15 2019-10-01 Guardian Glass, LLC Methods for direct production of graphene on dielectric substrates, and associated articles/devices
US9173623B2 (en) 2013-04-19 2015-11-03 Samuel Soonho Lee X-ray tube and receiver inside mouth
US9650732B2 (en) 2013-05-01 2017-05-16 Nantero Inc. Low defect nanotube application solutions and fabrics and methods for making same
JP5768232B2 (ja) * 2013-07-31 2015-08-26 国立大学法人静岡大学 垂直配向したカーボンナノチューブの製造方法
US9053890B2 (en) 2013-08-02 2015-06-09 University Health Network Nanostructure field emission cathode structure and method for making
US10654718B2 (en) 2013-09-20 2020-05-19 Nantero, Inc. Scalable nanotube fabrics and methods for making same
CN104553160B (zh) * 2013-10-24 2018-02-06 中兴通讯股份有限公司 一种显示屏薄膜及其制备方法、节能方法
WO2015175509A1 (en) 2014-05-12 2015-11-19 Amprius, Inc. Structurally controlled deposition of silicon onto nanowires
GB201412656D0 (en) 2014-07-16 2014-08-27 Imp Innovations Ltd Process
US11439708B2 (en) 2014-10-06 2022-09-13 Lawrence Livermore National Security, Llc Nanotube trans-membrane channels mimicking biological porins
US9299430B1 (en) 2015-01-22 2016-03-29 Nantero Inc. Methods for reading and programming 1-R resistive change element arrays
US10145005B2 (en) 2015-08-19 2018-12-04 Guardian Glass, LLC Techniques for low temperature direct graphene growth on glass
US10199633B2 (en) 2015-12-09 2019-02-05 Ut-Battelle, Llc Method of manufacturing high volumetric density electrodes from self-aligning fiber powders
US9941001B2 (en) 2016-06-07 2018-04-10 Nantero, Inc. Circuits for determining the resistive states of resistive change elements
US9934848B2 (en) 2016-06-07 2018-04-03 Nantero, Inc. Methods for determining the resistive states of resistive change elements
CN109715854A (zh) 2016-10-07 2019-05-03 惠普发展公司,有限责任合伙企业 均热板的涂布
US10355206B2 (en) 2017-02-06 2019-07-16 Nantero, Inc. Sealed resistive change elements
WO2019055155A1 (en) 2017-09-15 2019-03-21 Massachusetts Institute Of Technology LOW-RATE MANUFACTURE OF COMPOSITE MATERIAL DEFECTS
JP6960813B2 (ja) 2017-09-20 2021-11-05 東京エレクトロン株式会社 グラフェン構造体の形成方法および形成装置
US10336618B1 (en) * 2018-06-29 2019-07-02 The Florida International University Board Of Trustees Apparatus and method for synthesizing vertically aligned carbon nanotubes
CN109686928B (zh) * 2018-11-21 2021-09-24 电子科技大学 一种应用于二次电池的碳硅复合负极材料的制备方法
EP3975213A1 (en) * 2020-09-28 2022-03-30 Jozef Stefan Institute Method for manufacturing hybrid binder-free electrodes for electrochemical supercapacitors
US11476464B1 (en) 2021-09-10 2022-10-18 The Florida International University Board Of Trustees Coated vertically aligned carbon nanotubes on nickel foam
KR20230055993A (ko) * 2021-10-19 2023-04-26 주식회사 엘지화학 탄소나노튜브 합성장치
WO2023101313A1 (ko) * 2021-12-03 2023-06-08 코오롱인더스트리 주식회사 라디칼 스캐빈저 복합체, 이의 제조방법, 및 이를 포함하는 연료전지

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1435143A (en) 1973-06-16 1976-05-12 Ass Elect Ind Scanning electron microscopes
US5707916A (en) 1984-12-06 1998-01-13 Hyperion Catalysis International, Inc. Carbon fibrils
US5165909A (en) 1984-12-06 1992-11-24 Hyperion Catalysis Int'l., Inc. Carbon fibrils and method for producing same
US4684581A (en) 1986-07-10 1987-08-04 Struthers Ralph C Hydrogen diffusion fuel cell
US4943493A (en) 1989-04-21 1990-07-24 International Fuel Cells Corporation Fuel cell power plant
ZA907803B (en) 1989-09-28 1991-07-31 Hyperion Catalysis Int Electrochemical cells and preparing carbon fibrils
US5185922A (en) 1990-08-17 1993-02-16 Cornell Research Foundation, Inc. Method of making submicrometer microelectrodes
US5229222A (en) 1990-11-14 1993-07-20 Sanyo Electric Co., Ltd. Fuel cell system
US5569635A (en) 1994-05-22 1996-10-29 Hyperion Catalysts, Int'l., Inc. Catalyst supports, supported catalysts and methods of making and using the same
JP2546114B2 (ja) * 1992-12-22 1996-10-23 日本電気株式会社 異物質内包カーボンナノチューブとその製造方法
US5346683A (en) * 1993-03-26 1994-09-13 Gas Research Institute Uncapped and thinned carbon nanotubes and process
JP2546511B2 (ja) 1993-08-26 1996-10-23 日本電気株式会社 フラーレン及びカーボンナノチューブの合成方法
WO1995010481A1 (en) * 1993-10-13 1995-04-20 E.I. Du Pont De Nemours And Company Carbon nanotubes and nested fullerenes supporting transition metals
JP3298735B2 (ja) * 1994-04-28 2002-07-08 科学技術振興事業団 フラーレン複合体
GB9418937D0 (en) * 1994-09-20 1994-11-09 Isis Innovation Opening and filling carbon nanotubes
US5780101A (en) * 1995-02-17 1998-07-14 Arizona Board Of Regents On Behalf Of The University Of Arizona Method for producing encapsulated nanoparticles and carbon nanotubes using catalytic disproportionation of carbon monoxide
JP3352316B2 (ja) 1995-03-17 2002-12-03 キヤノン株式会社 リチウム二次電池、リチウム二次電池用電極およびそれ等の作製方法
WO1997019208A1 (en) * 1995-11-22 1997-05-29 Northwestern University Method of encapsulating a material in a carbon nanotube
US5726524A (en) * 1996-05-31 1998-03-10 Minnesota Mining And Manufacturing Company Field emission device having nanostructured emitters
US5753088A (en) 1997-02-18 1998-05-19 General Motors Corporation Method for making carbon nanotubes
JP3183845B2 (ja) * 1997-03-21 2001-07-09 財団法人ファインセラミックスセンター カーボンナノチューブ及びカーボンナノチューブ膜の製造方法
US6129901A (en) 1997-11-18 2000-10-10 Martin Moskovits Controlled synthesis and metal-filling of aligned carbon nanotubes

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9965821A1 *

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