DE69735101T8 - Kontaktspitzenstruktur für mikroelektronische verbindungselemente und herstellungsverfahren dazu - Google Patents

Kontaktspitzenstruktur für mikroelektronische verbindungselemente und herstellungsverfahren dazu Download PDF

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Publication number
DE69735101T8
DE69735101T8 DE69735101T DE69735101T DE69735101T8 DE 69735101 T8 DE69735101 T8 DE 69735101T8 DE 69735101 T DE69735101 T DE 69735101T DE 69735101 T DE69735101 T DE 69735101T DE 69735101 T8 DE69735101 T8 DE 69735101T8
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Prior art keywords
production method
method therefor
connection elements
contact tip
tip structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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DE69735101T
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English (en)
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DE69735101T2 (de
DE69735101D1 (de
Inventor
Y. Igor Orinda KHANDROS
N. Benjamin Danville ELDRIDGE
L. Gaetan Livermore MATHIEU
H. Thomas Livermore DOZIER
A. Sheldon Mountain View TAYLOR
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FormFactor Inc
Original Assignee
FormFactor Inc
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Filing date
Publication date
Priority claimed from PCT/US1996/008107 external-priority patent/WO1996037332A1/en
Priority claimed from US08/784,862 external-priority patent/US6064213A/en
Priority claimed from US08/788,740 external-priority patent/US5994152A/en
Priority claimed from US08/802,054 external-priority patent/US6482013B2/en
Priority claimed from US08/852,152 external-priority patent/US6184053B1/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Application granted granted Critical
Publication of DE69735101D1 publication Critical patent/DE69735101D1/de
Publication of DE69735101T2 publication Critical patent/DE69735101T2/de
Publication of DE69735101T8 publication Critical patent/DE69735101T8/de
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
DE69735101T 1996-05-17 1997-05-15 Kontaktspitzenstruktur für mikroelektronische verbindungselemente und herstellungsverfahren dazu Expired - Fee Related DE69735101T8 (de)

Applications Claiming Priority (27)

Application Number Priority Date Filing Date Title
US518996P 1996-05-17 1996-05-17
US5189P 1996-05-17
PCT/US1996/008107 WO1996037332A1 (en) 1995-05-26 1996-05-24 Fabricating interconnects and tips using sacrificial substrates
WOPCT/US96/08107 1996-05-24
US2086996P 1996-06-27 1996-06-27
US20869P 1996-06-27
US2440596P 1996-08-22 1996-08-22
US24405P 1996-08-22
US2455596P 1996-08-26 1996-08-26
US24555P 1996-08-26
US3069796P 1996-11-13 1996-11-13
US30697P 1996-11-13
US3266696P 1996-12-13 1996-12-13
US32666P 1996-12-13
US3405396P 1996-12-31 1996-12-31
US34053P 1996-12-31
US08/784,862 US6064213A (en) 1993-11-16 1997-01-15 Wafer-level burn-in and test
US784862 1997-01-15
US08/788,740 US5994152A (en) 1996-02-21 1997-01-24 Fabricating interconnects and tips using sacrificial substrates
US788740 1997-01-24
US08/802,054 US6482013B2 (en) 1993-11-16 1997-02-18 Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US802054 1997-02-18
US81946497A 1997-03-17 1997-03-17
US819464 1997-03-17
US08/852,152 US6184053B1 (en) 1993-11-16 1997-05-06 Method of making microelectronic spring contact elements
US852152 1997-05-06
PCT/US1997/008606 WO1997043653A1 (en) 1996-05-17 1997-05-15 Contact tip structures for microelectronic interconnection elements and methods of making same

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JP (1) JP2002509604A (de)
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CN1225724A (zh) 1999-08-11
EP0839321A1 (de) 1998-05-06
WO1997043656A3 (en) 1998-03-12
EP0839321B1 (de) 2006-01-11
EP0898712B1 (de) 2003-08-06
CN1194693A (zh) 1998-09-30
CN1134667C (zh) 2004-01-14
WO1997043653A1 (en) 1997-11-20
EP0839323A1 (de) 1998-05-06
DE69735101T2 (de) 2006-09-21
DE69735101D1 (de) 2006-04-06
CN1197514A (zh) 1998-10-28
CN1272632C (zh) 2006-08-30
WO1997043654A1 (en) 1997-11-20
JP2002509604A (ja) 2002-03-26
CN1145802C (zh) 2004-04-14
EP0898712A2 (de) 1999-03-03
AU3073797A (en) 1997-12-05
EP0839323B1 (de) 2004-08-25
WO1997043656A2 (en) 1997-11-20

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