DE69733928T2 - Mikroelektronische kontaktstruktur und herstellungsverfahren dazu - Google Patents
Mikroelektronische kontaktstruktur und herstellungsverfahren dazu Download PDFInfo
- Publication number
- DE69733928T2 DE69733928T2 DE69733928T DE69733928T DE69733928T2 DE 69733928 T2 DE69733928 T2 DE 69733928T2 DE 69733928 T DE69733928 T DE 69733928T DE 69733928 T DE69733928 T DE 69733928T DE 69733928 T2 DE69733928 T2 DE 69733928T2
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- Germany
- Prior art keywords
- manufacturing
- contact structure
- method therefor
- microelectronic contact
- microelectronic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
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- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01045—Rhodium [Rh]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Applications Claiming Priority (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US518996P | 1996-05-17 | 1996-05-17 | |
PCT/US1996/008107 WO1996037332A1 (en) | 1995-05-26 | 1996-05-24 | Fabricating interconnects and tips using sacrificial substrates |
US2086996P | 1996-06-27 | 1996-06-27 | |
US2440596P | 1996-08-22 | 1996-08-22 | |
US2455596P | 1996-08-26 | 1996-08-26 | |
US3069796P | 1996-11-13 | 1996-11-13 | |
US3266696P | 1996-12-13 | 1996-12-13 | |
US3405396P | 1996-12-31 | 1996-12-31 | |
US08/784,862 US6064213A (en) | 1993-11-16 | 1997-01-15 | Wafer-level burn-in and test |
US08/788,740 US5994152A (en) | 1996-02-21 | 1997-01-24 | Fabricating interconnects and tips using sacrificial substrates |
US08/802,054 US6482013B2 (en) | 1993-11-16 | 1997-02-18 | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US81946497A | 1997-03-17 | 1997-03-17 | |
US9230497P | 1997-05-06 | 1997-05-06 | |
PCT/US1997/008271 WO1997044676A1 (en) | 1996-05-17 | 1997-05-15 | Microelectronic contact structure and method of making same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69733928D1 DE69733928D1 (de) | 2005-09-15 |
DE69733928T2 true DE69733928T2 (de) | 2006-06-14 |
Family
ID=40548026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69733928T Expired - Fee Related DE69733928T2 (de) | 1996-05-17 | 1997-05-15 | Mikroelektronische kontaktstruktur und herstellungsverfahren dazu |
Country Status (5)
Country | Link |
---|---|
EP (3) | EP0839322B1 (de) |
JP (5) | JP3759622B2 (de) |
AU (1) | AU3127797A (de) |
DE (1) | DE69733928T2 (de) |
WO (1) | WO1997044676A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010011854A1 (de) * | 2010-03-18 | 2011-09-22 | Epcos Ag | Messkopf für eine verbesserte Kontaktierung |
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US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
JP2000077477A (ja) * | 1998-09-02 | 2000-03-14 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法並びにこれに用いる金属基板 |
US6441315B1 (en) | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
SG75186A1 (en) * | 1998-11-30 | 2000-09-19 | Advantest Corp | Method for producing contact structures |
US6255126B1 (en) | 1998-12-02 | 2001-07-03 | Formfactor, Inc. | Lithographic contact elements |
US6268015B1 (en) * | 1998-12-02 | 2001-07-31 | Formfactor | Method of making and using lithographic contact springs |
JP2002531915A (ja) * | 1998-12-02 | 2002-09-24 | フォームファクター,インコーポレイテッド | リソグラフィ接触要素 |
US7189077B1 (en) | 1999-07-30 | 2007-03-13 | Formfactor, Inc. | Lithographic type microelectronic spring structures with improved contours |
US6780001B2 (en) | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
US6713374B2 (en) | 1999-07-30 | 2004-03-30 | Formfactor, Inc. | Interconnect assemblies and methods |
US6939474B2 (en) | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
US6888362B2 (en) | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
EP1208595A2 (de) * | 1999-07-30 | 2002-05-29 | Formfactor, Inc. | Verbindungsstruktur und methode |
US6827584B2 (en) | 1999-12-28 | 2004-12-07 | Formfactor, Inc. | Interconnect for microelectronic structures with enhanced spring characteristics |
CN100339985C (zh) * | 2000-04-12 | 2007-09-26 | 佛姆法克特股份有限公司 | 成形弹簧以及制造和使用成形弹簧的方法 |
US6640432B1 (en) | 2000-04-12 | 2003-11-04 | Formfactor, Inc. | Method of fabricating shaped springs |
US7458816B1 (en) | 2000-04-12 | 2008-12-02 | Formfactor, Inc. | Shaped spring |
AU2002249841A1 (en) * | 2000-11-09 | 2002-08-19 | Formfactor, Inc. | Lithographic type microelectronic spring structures with improved contours |
US6811406B2 (en) | 2001-04-12 | 2004-11-02 | Formfactor, Inc. | Microelectronic spring with additional protruding member |
JP4812967B2 (ja) * | 2001-05-28 | 2011-11-09 | 株式会社アドバンテスト | プローブカード及びプローブカードの製造方法 |
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GB2388468B (en) * | 2002-02-08 | 2005-05-04 | Microsaic Systems Ltd | Microengineered electrical connectors |
TWI288958B (en) | 2002-03-18 | 2007-10-21 | Nanonexus Inc | A miniaturized contact spring |
US7010854B2 (en) | 2002-04-10 | 2006-03-14 | Formfactor, Inc. | Re-assembly process for MEMS structures |
KR100473584B1 (ko) * | 2002-12-02 | 2005-03-10 | 주식회사 아이씨멤즈 | 외팔보 형태의 프로브 카드 및 그 제조 방법 |
JP2004213923A (ja) * | 2002-12-27 | 2004-07-29 | Anritsu Corp | 接点部材及び該接点部材を用いたマイクロ接点装置 |
JP4592292B2 (ja) * | 2004-01-16 | 2010-12-01 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP2006049498A (ja) * | 2004-08-03 | 2006-02-16 | Shinko Electric Ind Co Ltd | 接続端子の製造方法 |
US6956389B1 (en) | 2004-08-16 | 2005-10-18 | Jem America Corporation | Highly resilient cantilever spring probe for testing ICs |
US7459795B2 (en) * | 2004-08-19 | 2008-12-02 | Formfactor, Inc. | Method to build a wirebond probe card in a many at a time fashion |
KR100912853B1 (ko) * | 2004-12-06 | 2009-08-18 | 도쿠리쓰교세이호징 가가쿠 기주쓰 신코 기코 | 기계적 진동자 및 그 제조 방법 |
JP4797391B2 (ja) | 2005-02-10 | 2011-10-19 | 東京エレクトロン株式会社 | インターポーザの製造方法 |
JP4679274B2 (ja) * | 2005-07-07 | 2011-04-27 | 日本電子材料株式会社 | プローブの製造方法 |
JP4698374B2 (ja) * | 2005-10-05 | 2011-06-08 | 日本電子材料株式会社 | プローブの製造方法 |
JP2008003049A (ja) * | 2006-06-26 | 2008-01-10 | Micronics Japan Co Ltd | プローブ組立体 |
KR100703042B1 (ko) * | 2006-09-08 | 2007-04-09 | (주)에이펙스 | 검사용 프로브 기판 및 그 제조 방법 |
KR100703043B1 (ko) * | 2006-09-21 | 2007-04-09 | (주)에이펙스 | 검사용 프로브 기판 및 그 제조 방법 |
JP4967771B2 (ja) * | 2007-04-11 | 2012-07-04 | オムロン株式会社 | コンタクトおよびコネクタ |
KR100872065B1 (ko) | 2007-06-18 | 2008-12-05 | (주)엠투엔 | 프로브 카드에 사용되는 프로브 |
JP5630947B2 (ja) * | 2008-03-27 | 2014-11-26 | 日本電子材料株式会社 | カンチレバー型プローブ |
KR100996926B1 (ko) | 2008-10-28 | 2010-12-01 | 윌테크놀러지(주) | 프로브 및 프로브 카드의 제조 방법 |
JP2010203890A (ja) * | 2009-03-03 | 2010-09-16 | Tokyo Cathode Laboratory Co Ltd | プローブカード及びプローブカードの製造方法 |
JP2014013184A (ja) * | 2012-07-04 | 2014-01-23 | Micronics Japan Co Ltd | カンチレバー型プローブ集合体とそれを備えるプローブカード又はプローブユニット |
JP2016050860A (ja) | 2014-08-29 | 2016-04-11 | オムロン株式会社 | 検査端子ユニットおよびプローブカードおよび検査端子ユニットの製造方法 |
JP6584816B2 (ja) * | 2015-04-20 | 2019-10-02 | 日置電機株式会社 | プローブユニットおよびプローブユニット製造方法 |
TWI704358B (zh) * | 2019-09-16 | 2020-09-11 | 旺矽科技股份有限公司 | 適用於具有傾斜導電接點之多待測單元的探針模組 |
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US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
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JPH01150862A (ja) * | 1987-12-07 | 1989-06-13 | Mitsubishi Electric Corp | プローブカード |
US5323035A (en) * | 1992-10-13 | 1994-06-21 | Glenn Leedy | Interconnection structure for integrated circuits and method for making same |
DE9004562U1 (de) * | 1989-04-26 | 1990-07-19 | Atg Electronic Gmbh, 6980 Wertheim, De | |
JP3276389B2 (ja) * | 1992-03-06 | 2002-04-22 | 富士通株式会社 | 電圧測定装置 |
DE4231704C1 (de) * | 1992-09-22 | 1993-10-28 | Siemens Ag | Verfahren zur Herstellung einer Meßnadel sowie Meßnadel und deren Verwendung |
JPH06213929A (ja) * | 1993-01-19 | 1994-08-05 | Sharp Corp | 検査装置のプローブヘッドの製造方法および検査装置のプローブヘッド |
JPH06308164A (ja) * | 1993-04-26 | 1994-11-04 | Matsushita Electric Ind Co Ltd | マイクロプローブ及びマルチマイクロプローブ |
JPH0782027B2 (ja) * | 1993-04-30 | 1995-09-06 | フレッシュクエストコーポレーション | テスト用コンタクトピンの製造方法 |
JPH077052A (ja) * | 1993-06-16 | 1995-01-10 | Seiko Epson Corp | 電気特性測定用プローブ |
JP3762444B2 (ja) * | 1993-08-24 | 2006-04-05 | 信昭 鈴木 | 回路基板の検査用プローブとその取付構造 |
US5475318A (en) * | 1993-10-29 | 1995-12-12 | Robert B. Marcus | Microprobe |
WO1996017378A1 (en) | 1994-11-15 | 1996-06-06 | Formfactor, Inc. | Electrical contact structures from flexible wire |
JP3384116B2 (ja) * | 1994-06-29 | 2003-03-10 | 株式会社島津製作所 | 単結晶Si製カンチレバーの製造方法及び走査型プローブ顕微鏡 |
GB2296166B (en) | 1994-11-29 | 1999-07-07 | Plessey Telecomm | Clock synchronisation |
JP3058919B2 (ja) * | 1995-05-26 | 2000-07-04 | フォームファクター,インコーポレイテッド | 犠牲基板を用いた相互接続部及び先端の製造 |
-
1997
- 1997-05-15 DE DE69733928T patent/DE69733928T2/de not_active Expired - Fee Related
- 1997-05-15 EP EP97926534A patent/EP0839322B1/de not_active Expired - Lifetime
- 1997-05-15 WO PCT/US1997/008271 patent/WO1997044676A1/en active IP Right Grant
- 1997-05-15 AU AU31277/97A patent/AU3127797A/en not_active Abandoned
- 1997-05-15 JP JP54255697A patent/JP3759622B2/ja not_active Expired - Fee Related
- 1997-05-15 EP EP09001753A patent/EP2058667A2/de not_active Withdrawn
- 1997-05-15 EP EP04018676A patent/EP1482314B1/de not_active Expired - Lifetime
-
2002
- 2002-12-19 JP JP2002367883A patent/JP4084180B2/ja not_active Expired - Fee Related
-
2007
- 2007-09-20 JP JP2007244528A patent/JP2008014957A/ja active Pending
- 2007-09-20 JP JP2007244529A patent/JP2008046139A/ja active Pending
-
2008
- 2008-08-07 JP JP2008204891A patent/JP2008275646A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010011854A1 (de) * | 2010-03-18 | 2011-09-22 | Epcos Ag | Messkopf für eine verbesserte Kontaktierung |
DE102010011854B4 (de) * | 2010-03-18 | 2018-11-15 | Epcos Ag | Messkopf für eine verbesserte Kontaktierung |
Also Published As
Publication number | Publication date |
---|---|
JP3759622B2 (ja) | 2006-03-29 |
JP2001526772A (ja) | 2001-12-18 |
EP1482314B1 (de) | 2009-11-11 |
JP2008275646A (ja) | 2008-11-13 |
AU3127797A (en) | 1997-12-09 |
EP1482314A1 (de) | 2004-12-01 |
JP2008046139A (ja) | 2008-02-28 |
EP2058667A2 (de) | 2009-05-13 |
JP4084180B2 (ja) | 2008-04-30 |
WO1997044676A1 (en) | 1997-11-27 |
EP0839322A1 (de) | 1998-05-06 |
JP2008014957A (ja) | 2008-01-24 |
DE69733928D1 (de) | 2005-09-15 |
EP0839322B1 (de) | 2005-08-10 |
JP2003232809A (ja) | 2003-08-22 |
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