DE69529426T2 - Versandverpackung für Halbleiterscheibe - Google Patents

Versandverpackung für Halbleiterscheibe

Info

Publication number
DE69529426T2
DE69529426T2 DE69529426T DE69529426T DE69529426T2 DE 69529426 T2 DE69529426 T2 DE 69529426T2 DE 69529426 T DE69529426 T DE 69529426T DE 69529426 T DE69529426 T DE 69529426T DE 69529426 T2 DE69529426 T2 DE 69529426T2
Authority
DE
Germany
Prior art keywords
semiconductor wafer
shipping packaging
shipping
packaging
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69529426T
Other languages
English (en)
Other versions
DE69529426D1 (de
Inventor
David L Nyseth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of DE69529426D1 publication Critical patent/DE69529426D1/de
Application granted granted Critical
Publication of DE69529426T2 publication Critical patent/DE69529426T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packging For Living Organisms, Food Or Medicinal Products That Are Sensitive To Environmental Conditiond (AREA)
DE69529426T 1994-07-15 1995-05-23 Versandverpackung für Halbleiterscheibe Expired - Fee Related DE69529426T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/276,096 US5575394A (en) 1994-07-15 1994-07-15 Wafer shipper and package

Publications (2)

Publication Number Publication Date
DE69529426D1 DE69529426D1 (de) 2003-02-20
DE69529426T2 true DE69529426T2 (de) 2003-10-30

Family

ID=23055147

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69511487T Expired - Fee Related DE69511487T2 (de) 1994-07-15 1995-05-23 Versandverpackung für Halbleiterplättchen
DE69529426T Expired - Fee Related DE69529426T2 (de) 1994-07-15 1995-05-23 Versandverpackung für Halbleiterscheibe

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69511487T Expired - Fee Related DE69511487T2 (de) 1994-07-15 1995-05-23 Versandverpackung für Halbleiterplättchen

Country Status (9)

Country Link
US (2) US5575394A (de)
EP (2) EP0910114B1 (de)
JP (2) JP3179679B2 (de)
KR (1) KR960004168A (de)
CN (2) CN1062233C (de)
DE (2) DE69511487T2 (de)
DK (1) DK0910114T3 (de)
HK (1) HK1025298A1 (de)
SG (2) SG77554A1 (de)

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KR100234359B1 (ko) * 1995-07-20 1999-12-15 윤종용 박스기능을 갖는 웨이퍼 카세트
JPH09107026A (ja) * 1995-10-12 1997-04-22 Shin Etsu Polymer Co Ltd ウェーハ収納容器のウェーハカセット
US5803269A (en) * 1995-10-13 1998-09-08 Empak, Inc. 300mm shipping container
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US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
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JP3280305B2 (ja) * 1998-04-13 2002-05-13 信越半導体株式会社 精密基板輸送容器
JP3370279B2 (ja) * 1998-07-07 2003-01-27 信越ポリマー株式会社 精密基板収納容器
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
CN1080177C (zh) * 1998-09-21 2002-03-06 财团法人工业技术研究院 集成电路晶片承载盘及其制造方法
JP3046010B2 (ja) * 1998-11-12 2000-05-29 沖電気工業株式会社 収納容器および収納方法
DE60044028D1 (de) 1999-07-23 2010-04-29 Ray G Brooks Sicherungssystem für wafer mit integriertem schaltkreis (ic)
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WO2003042073A1 (en) * 2001-11-14 2003-05-22 Entegris, Inc. Wafer support attachment for a semi-conductor wafer transport container
US6920978B2 (en) * 2002-01-31 2005-07-26 3M Innovative Properties Company Tray for transporting multiple types of flat graphic articles
US7175026B2 (en) 2002-05-03 2007-02-13 Maxtor Corporation Memory disk shipping container with improved contaminant control
US20040074808A1 (en) * 2002-07-05 2004-04-22 Entegris, Inc. Fire retardant wafer carrier
DE10239319B4 (de) * 2002-08-27 2007-04-19 Schoeller Wavin Systems Services Gmbh Zweikomponenten Kunstoffbehälter
EP1548820B1 (de) * 2002-09-11 2010-12-15 Shin-Etsu Polymer Co., Ltd. Substratlagerungsbehälter
US20040262187A1 (en) * 2003-06-26 2004-12-30 Applied Materials, Inc. Clean room transportation package for process chamber kit
TWI337160B (en) * 2003-10-09 2011-02-11 Entegris Inc Shipper with tooth design for improved loading
US7252199B2 (en) * 2004-03-26 2007-08-07 Entegris, Inc. Disk cassette system
FR2869452B1 (fr) 2004-04-21 2006-09-08 Alcatel Sa Dispositif pour le transport de substrats sous atmosphere controlee
FR2869451B1 (fr) 2004-04-21 2006-07-21 Alcatel Sa Enveloppe de transport a protection par effet thermophorese
US7240792B2 (en) * 2004-05-29 2007-07-10 Blanco Gmbh + Co Kg Packaging for a sink
CN100577533C (zh) * 2004-07-30 2010-01-06 昭和电工株式会社 磁盘容器
US20060065571A1 (en) * 2004-09-27 2006-03-30 Tim Hsiao Wafer shipping box and wafer transportation method
CN102001482B (zh) * 2004-10-14 2012-12-05 未来儿株式会社 薄板支持容器用盖体
US7607543B2 (en) * 2005-02-27 2009-10-27 Entegris, Inc. Reticle pod with isolation system
JP4584023B2 (ja) * 2005-05-17 2010-11-17 信越ポリマー株式会社 基板収納容器及びその製造方法
US20060283770A1 (en) * 2005-06-03 2006-12-21 Applied Materials, Inc. Transportation fixture and package for substrate rack
CN100431930C (zh) * 2005-08-04 2008-11-12 北京市塑料研究所 用于大直径硅片储存和运输的包装容器
US20110215012A1 (en) * 2006-02-16 2011-09-08 Haggard Clifton C Disk holding device
JP2007328226A (ja) * 2006-06-09 2007-12-20 Shin Etsu Chem Co Ltd ペリクル収納容器及びその製造方法
US9082459B2 (en) * 2007-10-01 2015-07-14 Seagate Technology Llc Media caddy handling
JP4999808B2 (ja) * 2008-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置
KR101133566B1 (ko) * 2009-08-26 2012-04-04 김성태 편광판용 캐리어 박스
CN105225686A (zh) * 2009-11-18 2016-01-06 恩特格林斯公司 通用磁盘装运器
DE102010018668B4 (de) * 2010-04-07 2012-11-15 Curamik Electronics Gmbh Verpackungseinheit für Metall-Keramik-Substrate
CN102593029B (zh) * 2011-01-06 2015-05-06 无锡华润上华科技有限公司 半导体晶圆片的承载装置
JP6214630B2 (ja) * 2012-05-04 2017-10-18 インテグリス・インコーポレーテッド ウェーハを支える交換可能なバックストップ
JP6119287B2 (ja) * 2013-02-14 2017-04-26 株式会社Sumco ウェーハ収納容器梱包用緩衝材
TWM491030U (zh) * 2014-03-14 2014-12-01 Gudeng Prec Ind Co Ltd 晶圓收納盒及其氣密構件
CN103943541A (zh) * 2014-05-04 2014-07-23 上海先进半导体制造股份有限公司 盖板载片盒装置
CN106505021B (zh) * 2015-09-06 2019-05-03 中芯国际集成电路制造（天津）有限公司 晶圆运载箱及其制备方法
CN105329557A (zh) * 2015-11-24 2016-02-17 怀宁县群力汽车配件有限公司 一种新型汽车配件周转箱
KR20190117502A (ko) * 2017-02-27 2019-10-16 미라이얼 가부시키가이샤 기판 수납 용기
CN111354664A (zh) * 2018-12-20 2020-06-30 中芯集成电路（宁波）有限公司 一种晶舟盒及包括该晶舟盒的半导体设备
CN109703876B (zh) * 2018-12-26 2021-02-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 湿出中转器及半导体生产系统
CN112478391B (zh) * 2020-12-18 2022-07-08 洛阳鼎铭光电科技有限公司 一种轻量化硅基片储存装置

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Also Published As

Publication number Publication date
SG77554A1 (en) 2001-01-16
DE69511487T2 (de) 2000-04-13
CN1097003C (zh) 2002-12-25
JPH0846021A (ja) 1996-02-16
CN1242335A (zh) 2000-01-26
DE69529426D1 (de) 2003-02-20
CN1062233C (zh) 2001-02-21
DE69511487D1 (de) 1999-09-23
EP0692816A2 (de) 1996-01-17
SG114477A1 (en) 2005-09-28
EP0910114A3 (de) 1999-11-24
US5642813A (en) 1997-07-01
US5575394A (en) 1996-11-19
KR960004168A (ko) 1996-02-23
DK0910114T3 (da) 2003-05-05
JP2000156401A (ja) 2000-06-06
JP3179679B2 (ja) 2001-06-25
CN1128233A (zh) 1996-08-07
EP0692816B1 (de) 1999-08-18
EP0692816A3 (de) 1996-03-06
EP0910114B1 (de) 2003-01-15
HK1025298A1 (en) 2000-11-10
EP0910114A2 (de) 1999-04-21

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: ENTEGRIS, INC., CHASKA, MINN., US

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee