DK0910114T3 - Waferforsendelse og emballage - Google Patents

Waferforsendelse og emballage

Info

Publication number
DK0910114T3
DK0910114T3 DK99101999T DK99101999T DK0910114T3 DK 0910114 T3 DK0910114 T3 DK 0910114T3 DK 99101999 T DK99101999 T DK 99101999T DK 99101999 T DK99101999 T DK 99101999T DK 0910114 T3 DK0910114 T3 DK 0910114T3
Authority
DK
Denmark
Prior art keywords
packaging
wafer shipping
shipping
wafer
Prior art date
Application number
DK99101999T
Other languages
English (en)
Inventor
David L Nyseth
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Application granted granted Critical
Publication of DK0910114T3 publication Critical patent/DK0910114T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packging For Living Organisms, Food Or Medicinal Products That Are Sensitive To Environmental Conditiond (AREA)
DK99101999T 1994-07-15 1995-05-23 Waferforsendelse og emballage DK0910114T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/276,096 US5575394A (en) 1994-07-15 1994-07-15 Wafer shipper and package

Publications (1)

Publication Number Publication Date
DK0910114T3 true DK0910114T3 (da) 2003-05-05

Family

ID=23055147

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99101999T DK0910114T3 (da) 1994-07-15 1995-05-23 Waferforsendelse og emballage

Country Status (9)

Country Link
US (2) US5575394A (da)
EP (2) EP0692816B1 (da)
JP (2) JP3179679B2 (da)
KR (1) KR960004168A (da)
CN (2) CN1062233C (da)
DE (2) DE69511487T2 (da)
DK (1) DK0910114T3 (da)
HK (1) HK1025298A1 (da)
SG (2) SG114477A1 (da)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5575394A (en) * 1994-07-15 1996-11-19 Fluoroware, Inc. Wafer shipper and package
KR100207446B1 (ko) * 1995-07-08 1999-07-15 윤종용 반도체 제조관리용 카세트, 이의 제조방법 및 카세트 인식장치의 설치방법
KR100234359B1 (ko) * 1995-07-20 1999-12-15 윤종용 박스기능을 갖는 웨이퍼 카세트
JPH09107026A (ja) * 1995-10-12 1997-04-22 Shin Etsu Polymer Co Ltd ウェーハ収納容器のウェーハカセット
US5803269A (en) * 1995-10-13 1998-09-08 Empak, Inc. 300mm shipping container
US5921397A (en) * 1996-12-10 1999-07-13 Empak, Inc. Disk cassette
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
US6474474B2 (en) * 1998-02-06 2002-11-05 Sumitomo Metal Industries, Ltd. Sheet support container
JP3280305B2 (ja) * 1998-04-13 2002-05-13 信越半導体株式会社 精密基板輸送容器
JP3370279B2 (ja) * 1998-07-07 2003-01-27 信越ポリマー株式会社 精密基板収納容器
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
CN1080177C (zh) * 1998-09-21 2002-03-06 财团法人工业技术研究院 集成电路晶片承载盘及其制造方法
JP3046010B2 (ja) * 1998-11-12 2000-05-29 沖電気工業株式会社 収納容器および収納方法
JP4028984B2 (ja) 1999-07-23 2008-01-09 ブルックス、レイ ジー． 保存および出荷用に設計された容器内に保持された集積回路（ｉｃ）ウェーハの保護システム
USD429093S (en) * 1999-10-19 2000-08-08 Master Fasteners Inc. Display container for fastener packages
US6135289A (en) * 1999-12-10 2000-10-24 Master Fasteners Inc. Shipping containing and display case for fastening packages
US6857523B1 (en) * 2000-02-18 2005-02-22 Seiji Yamashita Method and apparatus for reducing contamination in a plastic container
DE10116382C2 (de) * 2001-04-02 2003-08-28 Infineon Technologies Ag Transportbehälter für Wafer
CN1298599C (zh) * 2001-11-14 2007-02-07 诚实公司 用于半导体晶片输送容器的晶片支承件连接
US6920978B2 (en) * 2002-01-31 2005-07-26 3M Innovative Properties Company Tray for transporting multiple types of flat graphic articles
US7175026B2 (en) 2002-05-03 2007-02-13 Maxtor Corporation Memory disk shipping container with improved contaminant control
US20040074808A1 (en) * 2002-07-05 2004-04-22 Entegris, Inc. Fire retardant wafer carrier
DE10239319B4 (de) * 2002-08-27 2007-04-19 Schoeller Wavin Systems Services Gmbh Zweikomponenten Kunstoffbehälter
EP1548820B1 (en) * 2002-09-11 2010-12-15 Shin-Etsu Polymer Co., Ltd. Substrate-storing container
US20040262187A1 (en) * 2003-06-26 2004-12-30 Applied Materials, Inc. Clean room transportation package for process chamber kit
TWI337160B (en) * 2003-10-09 2011-02-11 Entegris Inc Shipper with tooth design for improved loading
US7252199B2 (en) * 2004-03-26 2007-08-07 Entegris, Inc. Disk cassette system
FR2869451B1 (fr) 2004-04-21 2006-07-21 Alcatel Sa Enveloppe de transport a protection par effet thermophorese
FR2869452B1 (fr) * 2004-04-21 2006-09-08 Alcatel Sa Dispositif pour le transport de substrats sous atmosphere controlee
US7240792B2 (en) * 2004-05-29 2007-07-10 Blanco Gmbh + Co Kg Packaging for a sink
WO2006011609A1 (en) * 2004-07-30 2006-02-02 Showa Denko K.K. Magnetic disk case
US20060065571A1 (en) * 2004-09-27 2006-03-30 Tim Hsiao Wafer shipping box and wafer transportation method
CN102001482B (zh) * 2004-10-14 2012-12-05 未来儿株式会社 薄板支持容器用盖体
US7607543B2 (en) * 2005-02-27 2009-10-27 Entegris, Inc. Reticle pod with isolation system
JP4584023B2 (ja) * 2005-05-17 2010-11-17 信越ポリマー株式会社 基板収納容器及びその製造方法
US20060283770A1 (en) * 2005-06-03 2006-12-21 Applied Materials, Inc. Transportation fixture and package for substrate rack
CN100431930C (zh) * 2005-08-04 2008-11-12 北京市塑料研究所 用于大直径硅片储存和运输的包装容器
US20110215012A1 (en) * 2006-02-16 2011-09-08 Haggard Clifton C Disk holding device
JP2007328226A (ja) * 2006-06-09 2007-12-20 Shin Etsu Chem Co Ltd ペリクル収納容器及びその製造方法
US9082459B2 (en) * 2007-10-01 2015-07-14 Seagate Technology Llc Media caddy handling
JP4999808B2 (ja) * 2008-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置
KR101133566B1 (ko) * 2009-08-26 2012-04-04 김성태 편광판용 캐리어 박스
JP5797660B2 (ja) * 2009-11-18 2015-10-21 インテグリス・インコーポレーテッド 汎用ディスク輸送容器、ディスク輸送システム及び方法
DE102010018668B4 (de) * 2010-04-07 2012-11-15 Curamik Electronics Gmbh Verpackungseinheit für Metall-Keramik-Substrate
CN102593029B (zh) * 2011-01-06 2015-05-06 无锡华润上华科技有限公司 半导体晶圆片的承载装置
CN104662650B (zh) * 2012-05-04 2017-12-22 恩特格里斯公司 可更换晶片支撑托架
JP6119287B2 (ja) * 2013-02-14 2017-04-26 株式会社Sumco ウェーハ収納容器梱包用緩衝材
TWM491030U (zh) * 2014-03-14 2014-12-01 Gudeng Prec Ind Co Ltd 晶圓收納盒及其氣密構件
CN103943541A (zh) * 2014-05-04 2014-07-23 上海先进半导体制造股份有限公司 盖板载片盒装置
CN106505021B (zh) * 2015-09-06 2019-05-03 中芯国际集成电路制造（天津）有限公司 晶圆运载箱及其制备方法
CN105329557A (zh) * 2015-11-24 2016-02-17 怀宁县群力汽车配件有限公司 一种新型汽车配件周转箱
US11309200B2 (en) * 2017-02-27 2022-04-19 Miraial Co., Ltd. Substrate storage container
CN111354664A (zh) * 2018-12-20 2020-06-30 中芯集成电路（宁波）有限公司 一种晶舟盒及包括该晶舟盒的半导体设备
CN109703876B (zh) * 2018-12-26 2021-02-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 湿出中转器及半导体生产系统
CN112478391B (zh) * 2020-12-18 2022-07-08 洛阳鼎铭光电科技有限公司 一种轻量化硅基片储存装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3311231A (en) * 1965-10-18 1967-03-28 P O Box Protective packing apparatus, and fastener means, for easily damaged objects
US3416695A (en) * 1966-10-28 1968-12-17 Packaging Corp America Tray construction
DE6913118U (de) * 1969-04-01 1969-08-07 Wacker Chemie Gmbh Verpackung fuer epitaktisch beschichtete halbleiterscheiben
US4043451A (en) * 1976-03-18 1977-08-23 Fluoroware, Inc. Shipping container for silicone semiconductor wafers
US4248346A (en) * 1979-01-29 1981-02-03 Fluoroware, Inc. Shipping container for semiconductor substrate wafers
US4235338A (en) * 1979-04-20 1980-11-25 Owens-Illinois, Inc. Unitary molded container lid and tray for article packaging
US4557382A (en) * 1983-08-17 1985-12-10 Empak Inc. Disk package
US4593819A (en) * 1984-05-29 1986-06-10 Malcolm Will Covered pill tray and support therefor
US4687097A (en) * 1984-12-11 1987-08-18 Empak, Inc. Wafer processing cassette
US4721207A (en) * 1986-04-28 1988-01-26 Tensho Electric Industrial Co., Ltd. Hard disk container
US4934767A (en) * 1986-05-16 1990-06-19 Thermco Systems, Inc. Semiconductor wafer carrier input/output drawer
US4747488A (en) * 1986-12-01 1988-05-31 Shoji Kikuchi Hard disk container
US4940156A (en) * 1989-07-13 1990-07-10 National Semiconductor Corporation Thermoplastic multi-purpose tray with variable compartments
US5207727A (en) * 1990-07-06 1993-05-04 Rapsco Incorporated Can end handling system
DE9011822U1 (de) * 1990-08-14 1991-07-25 Aurotec-System GmbH, 88250 Weingarten Kassette für Präzisionskleinteile
US5253755A (en) * 1991-03-20 1993-10-19 Fluoroware, Inc. Cushioned cover for disk container
US5269430A (en) * 1992-01-28 1993-12-14 Packaging Corporation Of America Individual serving food container with improved housing and closure arrangement
US5273159A (en) * 1992-05-26 1993-12-28 Empak, Inc. Wafer suspension box
US5575394A (en) * 1994-07-15 1996-11-19 Fluoroware, Inc. Wafer shipper and package

Also Published As

Publication number Publication date
CN1242335A (zh) 2000-01-26
CN1097003C (zh) 2002-12-25
KR960004168A (ko) 1996-02-23
DE69511487T2 (de) 2000-04-13
EP0910114A3 (en) 1999-11-24
EP0692816A2 (en) 1996-01-17
US5575394A (en) 1996-11-19
EP0910114A2 (en) 1999-04-21
JP3179679B2 (ja) 2001-06-25
JP2000156401A (ja) 2000-06-06
DE69529426T2 (de) 2003-10-30
DE69529426D1 (de) 2003-02-20
CN1128233A (zh) 1996-08-07
DE69511487D1 (de) 1999-09-23
EP0692816A3 (en) 1996-03-06
EP0692816B1 (en) 1999-08-18
EP0910114B1 (en) 2003-01-15
SG77554A1 (en) 2001-01-16
SG114477A1 (en) 2005-09-28
US5642813A (en) 1997-07-01
CN1062233C (zh) 2001-02-21
HK1025298A1 (en) 2000-11-10
JPH0846021A (ja) 1996-02-16

Similar Documents

Publication Publication Date Title
DK0910114T3 (da) Waferforsendelse og emballage
DK0830297T3 (da) Emballage med dobbelt dæklag og kontrolleret atmosfære
DK0781242T3 (da) Emballage til kød og andre fødevarer
DK0792241T3 (da) Emballage
DE69518188D1 (de) Lichtdichte und physisch geschützte Verpackung
IT1274951B (it) Procedimento ed apparecchio di impacchettamento
DK0792819T3 (da) Bæreindretning og emballage
DE69518935D1 (de) Halbleiterpackung
BR9600856A (pt) Método de empacotamento e pacote
NO975833D0 (no) Halvlederpakke, fremgangsmåte ved pakking av halvledere og innkapsling for bruk ved halvlederpakker
KR960012443A (ko) 반도체 패키지
FR2747108B1 (fr) Emballage gonflable
KR960034436U (ko) 포장 및 운반용 상자
ITMI950774A0 (it) Dispositivo per piegare lembi di piegatura di una confezione e per trasportare la stessa
DE69432168D1 (de) Halbleitergehäuse
KR950025918U (ko) 반도체 제품 포장장치
KR950003685U (ko) 포장 및 운반용상자
DK4193D0 (da) Kartonemballeret forpakning og kartonemne dertil
DK12392D0 (da) Kartonemballeret forpakning og kartonemne dertil
DK91494A (da) Emballage
SE9103340L (sv) Foervarings- och saeljfoerpackning
DK43694A (da) Emballage
DK91691D0 (da) Emballage
KR950021423U (ko) 칩 사이즈 페키지
KR950003681U (ko) 육면체 제품 포장용 완충 장치