DE60044028D1 - Sicherungssystem für wafer mit integriertem schaltkreis (ic) - Google Patents

Sicherungssystem für wafer mit integriertem schaltkreis (ic)

Info

Publication number
DE60044028D1
DE60044028D1 DE60044028T DE60044028T DE60044028D1 DE 60044028 D1 DE60044028 D1 DE 60044028D1 DE 60044028 T DE60044028 T DE 60044028T DE 60044028 T DE60044028 T DE 60044028T DE 60044028 D1 DE60044028 D1 DE 60044028D1
Authority
DE
Germany
Prior art keywords
wafer
integrated circuit
securing system
securing
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60044028T
Other languages
English (en)
Inventor
Ray G Brooks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE60044028D1 publication Critical patent/DE60044028D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Buffer Packaging (AREA)
DE60044028T 1999-07-23 2000-07-21 Sicherungssystem für wafer mit integriertem schaltkreis (ic) Expired - Lifetime DE60044028D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14532099P 1999-07-23 1999-07-23
US18607000P 2000-02-29 2000-02-29
PCT/US2000/020024 WO2001007339A1 (en) 1999-07-23 2000-07-21 Protective system for integrated circuit (ic) wafers

Publications (1)

Publication Number Publication Date
DE60044028D1 true DE60044028D1 (de) 2010-04-29

Family

ID=26842854

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60044028T Expired - Lifetime DE60044028D1 (de) 1999-07-23 2000-07-21 Sicherungssystem für wafer mit integriertem schaltkreis (ic)

Country Status (5)

Country Link
US (1) US6286684B1 (de)
EP (1) EP1206399B1 (de)
JP (1) JP4028984B2 (de)
DE (1) DE60044028D1 (de)
WO (1) WO2001007339A1 (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848579B2 (en) * 1999-10-25 2005-02-01 Brian Cleaver Shock absorbing apparatus and method
US6662950B1 (en) 1999-10-25 2003-12-16 Brian R. Cleaver Wafer shipping and storage container
US6550619B2 (en) * 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
US6502700B2 (en) * 2001-01-10 2003-01-07 Outokumpu Oyj Spacer for coiled products
US7040487B2 (en) * 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
US7161092B2 (en) * 2002-04-15 2007-01-09 Visteon Global Technologies, Inc. Apparatus and method for protecting an electronic circuit
US6779662B2 (en) * 2002-07-18 2004-08-24 Polypac, Inc. Moisture resistant coil package
US6752271B2 (en) 2002-07-26 2004-06-22 Honda Motor Co., Ltd. Windshield packaging system using synergistic clamp jaw components
US6886692B2 (en) 2002-07-26 2005-05-03 Alfred E. Mann Institute For Biomedical Engineering At The University Of Southern California Windshield packaging system using corrugated box with horizontally-running flutes
US6789674B2 (en) * 2002-07-26 2004-09-14 Honda Motor Co., Ltd. Windshield packaging system using pressure-regulated clamps
US6988620B2 (en) * 2002-09-06 2006-01-24 E.Pak International, Inc. Container with an adjustable inside dimension that restricts movement of items within the container
US7425362B2 (en) * 2002-09-06 2008-09-16 E.Pak International, Inc. Plastic packaging cushion
US7121405B2 (en) * 2002-11-22 2006-10-17 Taiyo Yuden Co., Ltd. Disc package
TWI286674B (en) * 2002-12-27 2007-09-11 Asml Netherlands Bv Container for a mask, method of transferring lithographic masks therein and method of scanning a mask in a container
US7147107B2 (en) * 2003-03-11 2006-12-12 E.Pak International, Inc. Packaging platform having an adjustable thickness
JPWO2004089784A1 (ja) * 2003-04-10 2006-07-06 アキレス株式会社 ウエハ保護シート
US7041365B2 (en) 2003-05-12 2006-05-09 3M Innovative Properties Company Static dissipative optical construction
US7578392B2 (en) * 2003-06-06 2009-08-25 Convey Incorporated Integrated circuit wafer packaging system and method
US6988621B2 (en) * 2003-06-17 2006-01-24 Illinois Tool Works Inc. Reduced movement wafer box
KR101150405B1 (ko) * 2003-06-17 2012-06-01 일리노이즈 툴 워크스 인코포레이티드 움직임이 줄어든 웨이퍼 박스
JPWO2005026015A1 (ja) * 2003-09-11 2006-11-16 大見　忠弘 スペーサーシート及びそれを用いる板状物の輸送方法
US20050098473A1 (en) * 2003-11-10 2005-05-12 3M Innovative Properties Company Container for containing semiconductor wafers
US7219798B2 (en) * 2004-01-15 2007-05-22 Hannstar Display Corp. Antistatic transport package for LCD cells
US20050210665A1 (en) * 2004-03-25 2005-09-29 Nigg James R Tray for storing and transporting semi-conductor and other microelectronic components
US20060000747A1 (en) * 2004-06-30 2006-01-05 3M Innovative Properties Company Shipping container for integrated circuit wafers
US20060032784A1 (en) * 2004-08-12 2006-02-16 Forsyth Valoris L Foam laminate system for semiconductor wafers
WO2006022707A1 (en) * 2004-08-12 2006-03-02 Illinois Tool Works Inc. Foam laminates system for semiconductor wafers
US7607543B2 (en) * 2005-02-27 2009-10-27 Entegris, Inc. Reticle pod with isolation system
JP4756910B2 (ja) * 2005-05-23 2011-08-24 アトム興産株式会社 微細部品収納容器
JP2006351604A (ja) * 2005-06-13 2006-12-28 Miraial Kk 薄板支持容器
JP4947631B2 (ja) * 2006-07-19 2012-06-06 ミライアル株式会社 クッションシート付ウエハ収納容器
US7932179B2 (en) 2007-07-27 2011-04-26 Micron Technology, Inc. Method for fabricating semiconductor device having backside redistribution layers
TWI320774B (en) * 2007-07-31 2010-02-21 Daxon Technology Inc Lockable storage container for disk-like information media
CN101888957B (zh) * 2007-10-12 2013-01-02 大元半导体包装产业有限公司 带有交错壁结构的晶圆容器
US8212443B2 (en) * 2007-11-14 2012-07-03 Delta Electronics, Inc. Motor and housing thereof
DE202008013468U1 (de) * 2008-10-14 2008-12-18 Christian Senning Verpackungsmaschinen Gmbh & Co. Verpackungen für dünnflächige, scheibenförmige Produkte
US8813964B2 (en) * 2009-08-26 2014-08-26 Texchem Advanced Products Incorporated Sdn. Bhd. Wafer container with recessed latch
US8109390B2 (en) * 2009-08-26 2012-02-07 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with overlapping wall structure
US9321574B2 (en) * 2010-11-30 2016-04-26 Corning Incorporated Packages and methods of packaging glass sheets
US8863956B2 (en) * 2011-01-19 2014-10-21 Ray G. Brooks Packaging system for protection of IC wafers during fabrication, transport and storage
US9224627B2 (en) 2011-02-16 2015-12-29 Texchem Advanced Products Incorporated Sdn Bhd Single and dual stage wafer cushion and wafer separator
US9653331B2 (en) * 2011-02-16 2017-05-16 Texchem Advanced Products Incorporated Sdn. Bhd. Single and dual stage wafer cushion
DE102011013511B4 (de) * 2011-03-10 2017-01-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Plattenmagazin und Vorrichtung zum Abseparieren von plattenförmigen Gegenständen
JP5976307B2 (ja) * 2011-12-06 2016-08-23 アキレス株式会社 ウェーハ保護クッション材の製造方法
US20130341240A1 (en) * 2012-06-26 2013-12-26 Shenzhen China Star Optoelectronics Technology Co, Ltd. Boxes and Trays Used to Hold LCD Panels
US8939289B2 (en) * 2012-12-14 2015-01-27 Shenzhen China Star Optoelectronics Technology Co., Ltd Packing box for liquid crystal display panel and waterproof structure thereof
TW201509767A (zh) * 2013-03-26 2015-03-16 E Pak International Inc 封裝插入件
US9543175B2 (en) 2013-09-25 2017-01-10 International Business Machines Corporation Package assembly for thin wafer shipping and method of use
US10896834B2 (en) 2014-02-25 2021-01-19 Entegris, Inc. Wafer shipper with stacked support rings
EP3231009B1 (de) * 2014-12-08 2021-07-07 Entegris, Inc. Horizontaler substratbehälter mit integrierter eckfeder für substrataufnahme
WO2020008239A1 (en) 2018-07-04 2020-01-09 Bosch Car Multimedia Portugal, S.A. Universal tray for the accommodation and transport of electrostatic discharge sensitive devices based in integral skin foam
CN109292280B (zh) * 2018-09-11 2021-01-26 京东方科技集团股份有限公司 用于装载薄膜的盒和装载薄膜的方法
CN114078730A (zh) 2020-08-12 2022-02-22 大立钰科技有限公司 可伸缩收纳机构以及供该可伸缩收纳机构容置的收纳盒
US20230064383A1 (en) * 2021-08-30 2023-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle enclosure for lithography systems
KR102595526B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
WO2023188147A1 (ja) * 2022-03-30 2023-10-05 アキレス株式会社 半導体ウェーハ搬送容器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4061228A (en) 1976-12-20 1977-12-06 Fluoroware, Inc. Shipping container for substrates
US4339039A (en) * 1980-07-25 1982-07-13 First National Packaging Co., Inc. Impact resistant foam cushioned packages
US4512037A (en) 1982-08-17 1985-04-23 Sports Marketing, Inc. Protective pad assembly
US4799275A (en) 1987-12-07 1989-01-24 Sprague Jr William B Shock-absorbing pillow
US5017260A (en) * 1989-04-12 1991-05-21 Bradford Company Anti-static coated paperboard or similar rigid material
US6428865B1 (en) 1990-02-26 2002-08-06 Ing-Chung Huang Shock-absorbing cushion with a multi-holed and/or grooved surface
US5366079A (en) * 1993-08-19 1994-11-22 Taiwan Semiconductor Manufacturing Company Integrated circuit wafer and retainer element combination
US5575394A (en) 1994-07-15 1996-11-19 Fluoroware, Inc. Wafer shipper and package
US5491013A (en) * 1994-08-31 1996-02-13 Rexam Industries Corp. Static-dissipating adhesive tape
US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
US6012188A (en) 1996-03-13 2000-01-11 Ooltewah Manufacturing Company Selectively deformable cushion
US5724748A (en) 1996-07-24 1998-03-10 Brooks; Ray G. Apparatus for packaging contaminant-sensitive articles and resulting package
US5699916A (en) * 1997-02-03 1997-12-23 Taiwan Semiconductor Manufacturing Company Ltd. Integrated circuit wafer container
JP3062113B2 (ja) * 1997-04-16 2000-07-10 九州日本電気株式会社 ウェハー保管ボックス帯電化によるごみ付着防止機構
US5988393A (en) 1998-06-15 1999-11-23 United Microelectronics Corp. Storage box for semiconductor wafers
JP3046010B2 (ja) * 1998-11-12 2000-05-29 沖電気工業株式会社 収納容器および収納方法

Also Published As

Publication number Publication date
EP1206399A1 (de) 2002-05-22
JP2003505875A (ja) 2003-02-12
US6286684B1 (en) 2001-09-11
EP1206399B1 (de) 2010-03-17
WO2001007339A1 (en) 2001-02-01
EP1206399A4 (de) 2006-06-14
JP4028984B2 (ja) 2008-01-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition