DE69120185D1 - Halbleiterlaser - Google Patents

Halbleiterlaser

Info

Publication number
DE69120185D1
DE69120185D1 DE69120185T DE69120185T DE69120185D1 DE 69120185 D1 DE69120185 D1 DE 69120185D1 DE 69120185 T DE69120185 T DE 69120185T DE 69120185 T DE69120185 T DE 69120185T DE 69120185 D1 DE69120185 D1 DE 69120185D1
Authority
DE
Germany
Prior art keywords
semiconductor laser
laser
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69120185T
Other languages
English (en)
Other versions
DE69120185T2 (de
Inventor
Mitsuhiro Matsumoto
Kazuaki Sasaki
Masaki Kondo
Tadashi Takeoka
Hiroshi Nakatsu
Masanori Watanabe
Osamu Yamamoto
Saburo Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25292990A external-priority patent/JPH04130786A/ja
Priority claimed from JP3236646A external-priority patent/JP2981315B2/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE69120185D1 publication Critical patent/DE69120185D1/de
Application granted granted Critical
Publication of DE69120185T2 publication Critical patent/DE69120185T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/16—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
    • H01S5/164—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions comprising semiconductor material with a wider bandgap than the active layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2301/00—Functional characteristics
    • H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202—Cleaving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0281—Coatings made of semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0282—Passivation layers or treatments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1053—Comprising an active region having a varying composition or cross-section in a specific direction
    • H01S5/1064—Comprising an active region having a varying composition or cross-section in a specific direction varying width along the optical axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/204—Strongly index guided structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2211—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on II-VI materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2218—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties
    • H01S5/222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties having a refractive index lower than that of the cladding layers or outer guiding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3201—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures incorporating bulkstrain effects, e.g. strain compensation, strain related to polarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32316—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm comprising only (Al)GaAs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32325—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm red laser based on InGaP
DE69120185T 1990-09-21 1991-09-23 Halbleiterlaser Expired - Fee Related DE69120185T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP25292990A JPH04130786A (ja) 1990-09-21 1990-09-21 半導体レーザ素子及びその製造方法
JP28312590 1990-10-19
JP5905991 1991-03-22
JP3236646A JP2981315B2 (ja) 1990-10-19 1991-09-17 半導体レーザ素子

Publications (2)

Publication Number Publication Date
DE69120185D1 true DE69120185D1 (de) 1996-07-18
DE69120185T2 DE69120185T2 (de) 1997-01-09

Family

ID=27463720

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69120185T Expired - Fee Related DE69120185T2 (de) 1990-09-21 1991-09-23 Halbleiterlaser
DE69132868T Expired - Fee Related DE69132868T2 (de) 1990-09-21 1991-09-23 Halbleiterlaservorrichtung und Herstellungsverfahren

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69132868T Expired - Fee Related DE69132868T2 (de) 1990-09-21 1991-09-23 Halbleiterlaservorrichtung und Herstellungsverfahren

Country Status (3)

Country Link
US (1) US5228047A (de)
EP (2) EP0477033B1 (de)
DE (2) DE69120185T2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413956A (en) * 1992-03-04 1995-05-09 Sharp Kabushiki Kaisha Method for producing a semiconductor laser device
DE4238137A1 (de) * 1992-11-12 1994-05-19 Ant Nachrichtentech Verfahren zur Herstellung von Vorrichtungen mit Bauelementen
US5346855A (en) * 1993-01-19 1994-09-13 At&T Bell Laboratories Method of making an INP-based DFB laser
JPH0878771A (ja) * 1994-09-02 1996-03-22 Sumitomo Electric Ind Ltd 半導体レーザとその製造方法
JP3734849B2 (ja) * 1995-05-08 2006-01-11 三菱電機株式会社 半導体レーザ装置の製造方法
JP2914430B2 (ja) * 1996-01-05 1999-06-28 日本電気株式会社 半導体レーザ素子の製造方法
US5799028A (en) * 1996-07-18 1998-08-25 Sdl, Inc. Passivation and protection of a semiconductor surface
JPH10112566A (ja) * 1996-10-07 1998-04-28 Furukawa Electric Co Ltd:The 半導体レーザ
US6590920B1 (en) 1998-10-08 2003-07-08 Adc Telecommunications, Inc. Semiconductor lasers having single crystal mirror layers grown directly on facet
US6596557B1 (en) * 2000-03-02 2003-07-22 Orchid Lightwave Communications, Inc. Integrated optical devices and methods of making such devices
US6744796B1 (en) * 2000-03-30 2004-06-01 Triquint Technology Holding Co. Passivated optical device and method of forming the same
US6451120B1 (en) 2000-09-21 2002-09-17 Adc Telecommunications, Inc. Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers
JP4033626B2 (ja) * 2000-10-06 2008-01-16 日本オプネクスト株式会社 半導体レーザ装置の製造方法
JP2002164609A (ja) * 2000-11-28 2002-06-07 Sharp Corp 半導体レーザ素子およびその製造方法
EP1219397A1 (de) * 2000-12-27 2002-07-03 Optical Technologies Italia S.p.A. Verfahren und Vorrichtung zum Laden, Entladen und Übertragen von Halbleiterstäben
JP2003204110A (ja) * 2001-11-01 2003-07-18 Furukawa Electric Co Ltd:The 半導体レーザ装置およびこれを用いた半導体レーザモジュール
JP3868286B2 (ja) * 2001-12-21 2007-01-17 シャープ株式会社 フォトマスクおよび半導体レーザ素子の製造方法
GB2439973A (en) * 2006-07-13 2008-01-16 Sharp Kk Modifying the optical properties of a nitride optoelectronic device
TW200835100A (en) * 2007-02-13 2008-08-16 Aurotek Corp Laser diode
CN101796699B (zh) 2007-09-04 2012-12-26 古河电气工业株式会社 半导体激光元件以及半导体激光元件制造方法
DE102007059538B4 (de) * 2007-12-11 2009-08-20 Lumics Gmbh Passivierung einer Resonator-Endfläche eines Halbleiter-Lasers mit einem Halbleiter-Übergitter
WO2014126164A1 (ja) 2013-02-13 2014-08-21 古河電気工業株式会社 半導体光素子、半導体レーザ素子、及びその製造方法、並びに半導体レーザモジュール及び半導体素子の製造方法
JP2019125738A (ja) * 2018-01-18 2019-07-25 シャープ株式会社 半導体レーザ素子、その製造方法および発光装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527474A (en) * 1978-08-19 1980-02-27 Arata Kogyosho:Kk Manufacture of spherical head for use of oiler or the like of diesel engine
JPS5864023A (ja) * 1981-10-14 1983-04-16 Semiconductor Energy Lab Co Ltd プラズマ気相法
US4731792A (en) * 1983-06-29 1988-03-15 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device with decreased light intensity noise
JPS6091692A (ja) * 1983-10-25 1985-05-23 Sharp Corp 半導体レ−ザ装置
JPS61220390A (ja) * 1985-03-26 1986-09-30 Toshiba Corp 半導体レ−ザの端面保護膜形成用治具
GB2195822B (en) * 1986-09-30 1990-01-24 Stc Plc Injection lasers
JPS63308992A (ja) * 1987-06-11 1988-12-16 Nec Corp 光半導体素子の製造方法
JPS6433987A (en) * 1987-07-29 1989-02-03 Nec Corp Semiconductor laser device
JPS6455891A (en) * 1987-08-27 1989-03-02 Seiko Epson Corp Jig for forming end surface protecting film of semiconductor laser
JPH0671121B2 (ja) * 1987-09-04 1994-09-07 シャープ株式会社 半導体レーザ装置
JPH01102982A (ja) * 1987-10-16 1989-04-20 Nec Corp 半導体レーザ装置
JPH01227485A (ja) * 1988-03-07 1989-09-11 Mitsubishi Electric Corp 半導体レーザ装置
JPH0210789A (ja) * 1988-06-28 1990-01-16 Nec Corp 端面コーティング方法
JPH02166775A (ja) * 1988-12-20 1990-06-27 Sumitomo Electric Ind Ltd 発光ダイオード用化合物半導体の製造方法及び発光ダイオード
JPH07109924B2 (ja) * 1989-03-13 1995-11-22 シャープ株式会社 半導体レーザ装置及びその製造方法

Also Published As

Publication number Publication date
EP0697756A3 (de) 1996-07-17
DE69132868T2 (de) 2002-08-01
EP0697756A2 (de) 1996-02-21
EP0477033A2 (de) 1992-03-25
EP0697756B1 (de) 2001-12-12
US5228047A (en) 1993-07-13
DE69120185T2 (de) 1997-01-09
EP0477033B1 (de) 1996-06-12
DE69132868D1 (de) 2002-01-24
EP0477033A3 (en) 1992-07-01

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