DE60320410D1 - Magnetische abschirmstruktur für elektronische schaltungen mit magnetischen materialien - Google Patents

Magnetische abschirmstruktur für elektronische schaltungen mit magnetischen materialien

Info

Publication number
DE60320410D1
DE60320410D1 DE60320410T DE60320410T DE60320410D1 DE 60320410 D1 DE60320410 D1 DE 60320410D1 DE 60320410 T DE60320410 T DE 60320410T DE 60320410 T DE60320410 T DE 60320410T DE 60320410 D1 DE60320410 D1 DE 60320410D1
Authority
DE
Germany
Prior art keywords
magnetic material
magnetic
integrated circuit
electronic circuits
shielding structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60320410T
Other languages
English (en)
Other versions
DE60320410T2 (de
Inventor
Nicholas D Rizzo
Mark A Durlam
Michael J Roll
Kelly Kyler
Jaynal A Molla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Application granted granted Critical
Publication of DE60320410D1 publication Critical patent/DE60320410D1/de
Publication of DE60320410T2 publication Critical patent/DE60320410T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Soft Magnetic Materials (AREA)
  • Semiconductor Memories (AREA)
  • Hard Magnetic Materials (AREA)
DE60320410T 2002-06-28 2003-06-18 Magnetische abschirmstruktur für elektronische schaltungen mit magnetischen materialien Expired - Lifetime DE60320410T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US184536 1998-11-02
US10/184,536 US6936763B2 (en) 2002-06-28 2002-06-28 Magnetic shielding for electronic circuits which include magnetic materials
PCT/US2003/019253 WO2004004435A1 (en) 2002-06-28 2003-06-18 Magnetic shielding for electronic circuits which include magnetic materials

Publications (2)

Publication Number Publication Date
DE60320410D1 true DE60320410D1 (de) 2008-05-29
DE60320410T2 DE60320410T2 (de) 2009-05-07

Family

ID=29779391

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60320410T Expired - Lifetime DE60320410T2 (de) 2002-06-28 2003-06-18 Magnetische abschirmstruktur für elektronische schaltungen mit magnetischen materialien

Country Status (10)

Country Link
US (1) US6936763B2 (de)
EP (1) EP1518451B1 (de)
JP (1) JP2005531928A (de)
KR (1) KR101020388B1 (de)
CN (1) CN100527930C (de)
AT (1) ATE392802T1 (de)
AU (1) AU2003280485A1 (de)
DE (1) DE60320410T2 (de)
TW (1) TWI278277B (de)
WO (1) WO2004004435A1 (de)

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US7057249B2 (en) * 2003-07-02 2006-06-06 Hewlett-Packard Development Company, L.P. Magnetic memory device
US20060063025A1 (en) * 2004-04-07 2006-03-23 Jing-Yi Huang Method and system for making thin metal films
US7105879B2 (en) * 2004-04-20 2006-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. Write line design in MRAM
US7474499B2 (en) * 2005-07-27 2009-01-06 Seagate Technology Llc Shielded enclosure of a disc drive for reducing penetration and influence of stray fields
US7880278B2 (en) 2006-05-16 2011-02-01 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit having stress tuning layer
US7795708B2 (en) * 2006-06-02 2010-09-14 Honeywell International Inc. Multilayer structures for magnetic shielding
US7723819B2 (en) * 2006-09-28 2010-05-25 Intel Corporation Granular magnetic layer with planar insulating layer
US20080157910A1 (en) * 2006-12-29 2008-07-03 Park Chang-Min Amorphous soft magnetic layer for on-die inductively coupled wires
US20080157911A1 (en) * 2006-12-29 2008-07-03 Fajardo Arnel M Soft magnetic layer for on-die inductively coupled wires with high electrical resistance
TWI339432B (en) * 2007-08-13 2011-03-21 Ind Tech Res Inst Magnetic shielding package structure of a magnetic memory device
JP5085487B2 (ja) * 2008-05-07 2012-11-28 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5470602B2 (ja) * 2009-04-01 2014-04-16 ルネサスエレクトロニクス株式会社 磁気記憶装置
JPWO2011046091A1 (ja) * 2009-10-13 2013-03-07 日本電気株式会社 磁性体装置
JP5354376B2 (ja) * 2009-11-27 2013-11-27 大日本印刷株式会社 半導体装置および半導体装置の製造方法
JP4975836B2 (ja) * 2010-02-19 2012-07-11 株式会社東芝 磁気記録ヘッド及びそれを用いた磁気記録再生装置
US8426947B2 (en) * 2010-08-02 2013-04-23 Headway Technologies, Inc. Laminated semiconductor wafer, laminated chip package and method of manufacturing the same
US8415775B2 (en) 2010-11-23 2013-04-09 Honeywell International Inc. Magnetic shielding for multi-chip module packaging
JP5659003B2 (ja) * 2010-12-24 2015-01-28 株式会社フェローテック 接着剤
FR2976765B1 (fr) * 2011-06-20 2015-05-01 Renault Sa Dispositif pour proteger un espace a proximite d'une source magnetique et procede de fabrication d'un tel dispositif
DE102012214677A1 (de) * 2012-08-17 2014-02-20 Hamilton Bonaduz Ag Pipette mit elektromotorisch angetriebenem Kolben und Magnetfeldabschirmung
US9070692B2 (en) 2013-01-12 2015-06-30 Avalanche Technology, Inc. Shields for magnetic memory chip packages
JP2015061057A (ja) 2013-09-20 2015-03-30 株式会社東芝 歪検知素子、圧力センサ、マイクロフォン、血圧センサ及びタッチパネル
US10497506B2 (en) * 2015-12-18 2019-12-03 Texas Instruments Incorporated Methods and apparatus for isolation barrier with integrated magnetics for high power modules
US10923532B2 (en) 2016-03-10 2021-02-16 Toshiba Memory Corporation Magnetic memory device
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US10431732B2 (en) 2017-05-31 2019-10-01 Globalfoundries Singapore Pte. Ltd. Shielded magnetoresistive random access memory devices and methods for fabricating the same
US10347826B1 (en) 2018-01-08 2019-07-09 Globalfoundries Singapore Pte. Ltd. STT-MRAM flip-chip magnetic shielding and method for producing the same
US20190320524A1 (en) * 2018-04-13 2019-10-17 GM Global Technology Operations LLC Pcba with point field detector and magnetic shielding array located on same side of a conductor
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CN100527930C (zh) 2009-08-12
KR101020388B1 (ko) 2011-03-08
TW200409586A (en) 2004-06-01
CN1666585A (zh) 2005-09-07
US6936763B2 (en) 2005-08-30
WO2004004435A1 (en) 2004-01-08
TWI278277B (en) 2007-04-01
US20040000415A1 (en) 2004-01-01
KR20050006303A (ko) 2005-01-15
JP2005531928A (ja) 2005-10-20
EP1518451B1 (de) 2008-04-16
ATE392802T1 (de) 2008-05-15
AU2003280485A1 (en) 2004-01-19

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