MXPA05011327A - Substrato con varias capas conductoras y metodos para hacer y usar el mismo. - Google Patents
Substrato con varias capas conductoras y metodos para hacer y usar el mismo.Info
- Publication number
- MXPA05011327A MXPA05011327A MXPA05011327A MXPA05011327A MXPA05011327A MX PA05011327 A MXPA05011327 A MX PA05011327A MX PA05011327 A MXPA05011327 A MX PA05011327A MX PA05011327 A MXPA05011327 A MX PA05011327A MX PA05011327 A MXPA05011327 A MX PA05011327A
- Authority
- MX
- Mexico
- Prior art keywords
- substrate
- making
- methods
- same
- conductive layers
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04113—Peripheral electrode pattern in resistive digitisers, i.e. electrodes at the periphery of the resistive sheet are shaped in patterns enhancing linearity of induced field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
Se deposita una capa de un material conductor transparente sobre una superficie de un substrato. Capas adicionales de material conductor se depositan sobre la capa de material conductor transparente o sobre una superficie opuesta del substrato. Las capas son grabadas selectivamente para producir una disposicion de almohadillas para montar componentes electricos y restos conductores formando un circuito electrico.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46443803P | 2003-04-22 | 2003-04-22 | |
US54388304P | 2004-02-12 | 2004-02-12 | |
US10/828,997 US8307549B2 (en) | 2001-11-20 | 2004-04-20 | Method of making an electrical circuit |
PCT/US2004/012297 WO2004095544A2 (en) | 2003-04-22 | 2004-04-21 | Substrate with multiple conductive layers and methods for making and using same |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA05011327A true MXPA05011327A (es) | 2006-03-08 |
Family
ID=33314257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA05011327A MXPA05011327A (es) | 2003-04-22 | 2004-04-21 | Substrato con varias capas conductoras y metodos para hacer y usar el mismo. |
Country Status (10)
Country | Link |
---|---|
US (2) | US8307549B2 (es) |
EP (1) | EP1620786A2 (es) |
JP (1) | JP2006524750A (es) |
KR (1) | KR20060009859A (es) |
AU (1) | AU2004231587A1 (es) |
BR (1) | BRPI0409702A (es) |
CA (1) | CA2522849A1 (es) |
MX (1) | MXPA05011327A (es) |
NZ (1) | NZ543242A (es) |
WO (1) | WO2004095544A2 (es) |
Families Citing this family (17)
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CN1629876A (zh) * | 2003-12-19 | 2005-06-22 | 升达科技股份有限公司 | 分离式触控板模块及具有该分离式触控板模块的电子产品 |
US20080088601A1 (en) * | 2004-05-19 | 2008-04-17 | Tpk Touch Solutions Inc. | Circuit layout on a touch panel |
DE202005020315U1 (de) * | 2005-12-15 | 2006-02-16 | Döppner Bauelemente GmbH & Co. KG | Elektrischer Sockelanschluss |
US8124490B2 (en) | 2006-12-21 | 2012-02-28 | Stats Chippac, Ltd. | Semiconductor device and method of forming passive devices |
TWI428663B (zh) * | 2009-06-12 | 2014-03-01 | Au Optronics Corp | 觸控式液晶顯示面板及液晶顯示面板 |
KR101006291B1 (ko) * | 2009-12-31 | 2011-01-06 | 박종호 | 터치패널용 패드 제조시스템, 그 제조방법 및 터치패널 제조용 패드 |
EP2402481A1 (en) * | 2010-06-29 | 2012-01-04 | Applied Materials, Inc. | Method and system for manufacturing a transparent body for use in a touch panel |
US8623689B2 (en) * | 2010-07-07 | 2014-01-07 | Ineffable Cellular Limited Liability Company | Package process of backside illumination image sensor |
WO2013034181A1 (en) * | 2011-09-07 | 2013-03-14 | Applied Materials, Inc. | Method and system for manufacturing a transparent body for use in a touch panel |
JP5885993B2 (ja) * | 2011-10-17 | 2016-03-16 | 関東化學株式会社 | エッチング液組成物およびエッチング方法 |
JP5920972B2 (ja) * | 2011-12-26 | 2016-05-24 | メック株式会社 | 配線形成方法およびエッチング液 |
JP5826656B2 (ja) * | 2012-02-06 | 2015-12-02 | 日東電工株式会社 | 導電性フィルムロールの製造方法 |
TW201337661A (zh) * | 2012-03-02 | 2013-09-16 | Elan Microelectronics Corp | 觸控板結構及其製造方法 |
JP5894820B2 (ja) * | 2012-03-13 | 2016-03-30 | 日東電工株式会社 | 導電性フィルムロールの製造方法 |
JP5930900B2 (ja) * | 2012-07-24 | 2016-06-08 | 日東電工株式会社 | 導電性フィルムロールの製造方法 |
JP6227114B2 (ja) | 2014-02-27 | 2017-11-08 | 三菱電機株式会社 | 手乾燥装置 |
EP3111817B1 (en) | 2014-02-27 | 2020-11-04 | Mitsubishi Electric Corporation | Hand dryer device |
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JP2004070771A (ja) | 2002-08-08 | 2004-03-04 | Fujitsu Component Ltd | 入力装置 |
JP4124444B2 (ja) | 2003-01-30 | 2008-07-23 | 富士通コンポーネント株式会社 | タッチパネル、それを有する入力装置及び電子機器 |
DE10320548B4 (de) | 2003-05-07 | 2005-02-24 | Schott Ag | Berührungsschalteinrichtung |
JP2005117313A (ja) | 2003-10-07 | 2005-04-28 | Fujitsu Ltd | 圧電素子およびタッチパネル装置 |
-
2004
- 2004-04-20 US US10/828,997 patent/US8307549B2/en not_active Expired - Lifetime
- 2004-04-21 JP JP2006513188A patent/JP2006524750A/ja active Pending
- 2004-04-21 MX MXPA05011327A patent/MXPA05011327A/es unknown
- 2004-04-21 CA CA002522849A patent/CA2522849A1/en not_active Abandoned
- 2004-04-21 WO PCT/US2004/012297 patent/WO2004095544A2/en active Application Filing
- 2004-04-21 NZ NZ543242A patent/NZ543242A/en unknown
- 2004-04-21 BR BRPI0409702-5A patent/BRPI0409702A/pt not_active IP Right Cessation
- 2004-04-21 KR KR1020057020025A patent/KR20060009859A/ko not_active Application Discontinuation
- 2004-04-21 EP EP04760080A patent/EP1620786A2/en not_active Withdrawn
- 2004-04-21 AU AU2004231587A patent/AU2004231587A1/en not_active Abandoned
-
2010
- 2010-04-23 US US12/766,002 patent/US20100218978A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US8307549B2 (en) | 2012-11-13 |
JP2006524750A (ja) | 2006-11-02 |
WO2004095544A3 (en) | 2005-06-30 |
US20100218978A1 (en) | 2010-09-02 |
CA2522849A1 (en) | 2004-11-04 |
AU2004231587A1 (en) | 2004-11-04 |
BRPI0409702A (pt) | 2006-05-02 |
KR20060009859A (ko) | 2006-02-01 |
NZ543242A (en) | 2009-01-31 |
EP1620786A2 (en) | 2006-02-01 |
WO2004095544A2 (en) | 2004-11-04 |
US20050020062A1 (en) | 2005-01-27 |
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