ATE472242T1 - Mehrschichtige integrierte schaltungskapselung - Google Patents
Mehrschichtige integrierte schaltungskapselungInfo
- Publication number
- ATE472242T1 ATE472242T1 AT03746044T AT03746044T ATE472242T1 AT E472242 T1 ATE472242 T1 AT E472242T1 AT 03746044 T AT03746044 T AT 03746044T AT 03746044 T AT03746044 T AT 03746044T AT E472242 T1 ATE472242 T1 AT E472242T1
- Authority
- AT
- Austria
- Prior art keywords
- metallic core
- core layer
- layer
- integrated circuit
- conductive region
- Prior art date
Links
- 239000012792 core layer Substances 0.000 abstract 6
- 239000010410 layer Substances 0.000 abstract 4
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/109,792 US6899815B2 (en) | 2002-03-29 | 2002-03-29 | Multi-layer integrated circuit package |
PCT/US2003/008835 WO2003086038A1 (en) | 2002-03-29 | 2003-03-21 | Multi-layer integrated circuit package |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE472242T1 true ATE472242T1 (de) | 2010-07-15 |
Family
ID=28453172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03746044T ATE472242T1 (de) | 2002-03-29 | 2003-03-21 | Mehrschichtige integrierte schaltungskapselung |
Country Status (8)
Country | Link |
---|---|
US (2) | US6899815B2 (de) |
EP (1) | EP1491078B1 (de) |
CN (1) | CN100441074C (de) |
AT (1) | ATE472242T1 (de) |
AU (1) | AU2003225932A1 (de) |
DE (1) | DE60333084D1 (de) |
MY (1) | MY132766A (de) |
WO (1) | WO2003086038A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7368045B2 (en) * | 2005-01-27 | 2008-05-06 | International Business Machines Corporation | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow |
JP5072283B2 (ja) * | 2006-07-31 | 2012-11-14 | 三洋電機株式会社 | 回路基板 |
KR100815361B1 (ko) | 2007-01-31 | 2008-03-19 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
JP2009200338A (ja) * | 2008-02-22 | 2009-09-03 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2011014612A (ja) * | 2009-06-30 | 2011-01-20 | Ibiden Co Ltd | 配線基板及び配線基板の製造方法 |
US8304863B2 (en) * | 2010-02-09 | 2012-11-06 | International Business Machines Corporation | Electromigration immune through-substrate vias |
US8867219B2 (en) * | 2011-01-14 | 2014-10-21 | Harris Corporation | Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices |
KR102103375B1 (ko) | 2013-06-18 | 2020-04-22 | 삼성전자주식회사 | 반도체 패키지 |
DE102014220650A1 (de) * | 2014-10-13 | 2016-04-14 | Heraeus Deutschland GmbH & Co. KG | Optimiertes Leiterbahndesign von metallischen Materialien auf keramischen Substanzen |
US9865527B1 (en) * | 2016-12-22 | 2018-01-09 | Texas Instruments Incorporated | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation |
US9941194B1 (en) | 2017-02-21 | 2018-04-10 | Texas Instruments Incorporated | Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4146440A (en) | 1978-04-03 | 1979-03-27 | Burroughs Corporation | Method for forming an aluminum interconnect structure on an integrated circuit chip |
US5917157A (en) * | 1994-12-12 | 1999-06-29 | Remsburg; Ralph | Multilayer wiring board laminate with enhanced thermal dissipation to dielectric substrate laminate |
US6395582B1 (en) * | 1997-07-14 | 2002-05-28 | Signetics | Methods for forming ground vias in semiconductor packages |
US6159586A (en) | 1997-09-25 | 2000-12-12 | Nitto Denko Corporation | Multilayer wiring substrate and method for producing the same |
US6326555B1 (en) | 1999-02-26 | 2001-12-04 | Fujitsu Limited | Method and structure of z-connected laminated substrate for high density electronic packaging |
US6204089B1 (en) * | 1999-05-14 | 2001-03-20 | Industrial Technology Research Institute | Method for forming flip chip package utilizing cone shaped bumps |
JP3514669B2 (ja) | 1999-06-30 | 2004-03-31 | 三菱樹脂株式会社 | 金属ベースプリント配線板および金属ベース多層プリント配線板並びにその製造方法 |
JP4201436B2 (ja) * | 1999-07-14 | 2008-12-24 | 日東電工株式会社 | 多層配線基板の製造方法 |
US6525921B1 (en) * | 1999-11-12 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
TWI226814B (en) * | 1999-12-16 | 2005-01-11 | Matsushita Electric Ind Co Ltd | A removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board |
JP2001320171A (ja) | 2000-05-08 | 2001-11-16 | Shinko Electric Ind Co Ltd | 多層配線基板及び半導体装置 |
US6585903B1 (en) * | 2000-09-06 | 2003-07-01 | Visteon Global Tech. Inc. | Electrical circuit board and a method for making the same |
-
2002
- 2002-03-29 US US10/109,792 patent/US6899815B2/en not_active Expired - Fee Related
-
2003
- 2003-03-21 AT AT03746044T patent/ATE472242T1/de not_active IP Right Cessation
- 2003-03-21 DE DE60333084T patent/DE60333084D1/de not_active Expired - Lifetime
- 2003-03-21 AU AU2003225932A patent/AU2003225932A1/en not_active Abandoned
- 2003-03-21 EP EP03746044A patent/EP1491078B1/de not_active Expired - Lifetime
- 2003-03-21 WO PCT/US2003/008835 patent/WO2003086038A1/en not_active Application Discontinuation
- 2003-03-21 CN CNB03811318XA patent/CN100441074C/zh not_active Expired - Fee Related
- 2003-03-27 MY MYPI20031130A patent/MY132766A/en unknown
-
2004
- 2004-08-11 US US10/915,803 patent/US7245001B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE60333084D1 (de) | 2010-08-05 |
US6899815B2 (en) | 2005-05-31 |
EP1491078A1 (de) | 2004-12-29 |
CN1653874A (zh) | 2005-08-10 |
US20050009353A1 (en) | 2005-01-13 |
WO2003086038A1 (en) | 2003-10-16 |
US7245001B2 (en) | 2007-07-17 |
MY132766A (en) | 2007-10-31 |
CN100441074C (zh) | 2008-12-03 |
AU2003225932A1 (en) | 2003-10-20 |
US20030184987A1 (en) | 2003-10-02 |
EP1491078B1 (de) | 2010-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200509368A (en) | Circuit module and manufacturing method thereof | |
WO2003035281A3 (en) | Ultrasonic printed circuit board transducer | |
HK1089328A1 (en) | Method for manufacturing an electronic module and an electronic module | |
TW200601926A (en) | Printed circuit board and manufacturing method thereof | |
TW200726334A (en) | Circuit board structure having capacitance array and embedded electronic component and method for fabricating the same | |
TW200742521A (en) | Electronic-part built-in substrate and manufacturing method therefor | |
MY134733A (en) | Formation of an embedded capacitor plane using a thin dielectric | |
TWI268524B (en) | Capacitance material, printed circuit board having the same and manufacturing method thereof, and capacitor structure | |
FI20041525A (fi) | Elektroniikkamoduuli ja menetelmä sen valmistamiseksi | |
ATE472242T1 (de) | Mehrschichtige integrierte schaltungskapselung | |
SG135106A1 (en) | Method and process for embedding electrically conductive elements in a dielectric layer | |
EP1699277A4 (de) | Keramisches mehrschichtsubstrat | |
EP1339270A3 (de) | Verfahren zur Herstellung eines metallkaschierten Laminats für eine Leiterplatte | |
MXPA05011327A (es) | Substrato con varias capas conductoras y metodos para hacer y usar el mismo. | |
TW200610463A (en) | Circuit board and method of manufacturing the same | |
WO2005062803A3 (en) | Printed circuit dielectric foil and embedded capacitors | |
DE50305281D1 (de) | Datenträger mit transponderspule | |
TW200742665A (en) | Substrate of flexible printed circuit board | |
TW200611620A (en) | A manufacturing method of a multi-layer circuit board with embedded passive components | |
CN211240255U (zh) | 一种高频低损耗无胶层fpc | |
ATE332626T1 (de) | Trennplatte zum herstellen von leiterplattenkomponenten | |
TW200611619A (en) | A manufacturing method of a multi-layer circuit board with embedded passive components | |
CN220913895U (zh) | 一种压电陶瓷蜂鸣器 | |
TW200515431A (en) | Embedded capacitor structure of semiconductor package substrate and method for fabricating the same | |
ES2170708A1 (es) | Procedimiento para incrementar la rigidez dielectrica y resistencia de aislamiento entre pistas de placas de circuito impreso. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |