DE60318122D1 - Tintenstrahldruckkopf und Verfahren zu seiner Herstellung - Google Patents

Tintenstrahldruckkopf und Verfahren zu seiner Herstellung

Info

Publication number
DE60318122D1
DE60318122D1 DE60318122T DE60318122T DE60318122D1 DE 60318122 D1 DE60318122 D1 DE 60318122D1 DE 60318122 T DE60318122 T DE 60318122T DE 60318122 T DE60318122 T DE 60318122T DE 60318122 D1 DE60318122 D1 DE 60318122D1
Authority
DE
Germany
Prior art keywords
making
same
ink jet
jet printhead
printhead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60318122T
Other languages
English (en)
Other versions
DE60318122T2 (de
Inventor
Shinkai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Application granted granted Critical
Publication of DE60318122D1 publication Critical patent/DE60318122D1/de
Publication of DE60318122T2 publication Critical patent/DE60318122T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B41J2002/14217—Multi layer finger type piezoelectric element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B41J2002/14225—Finger type piezoelectric element on only one side of the chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2002/14306—Flow passage between manifold and chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14459—Matrix arrangement of the pressure chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/20—Modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
DE2003618122 2002-09-24 2003-09-24 Tintenstrahldruckkopf und Verfahren zu seiner Herstellung Expired - Lifetime DE60318122T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002277136 2002-09-24
JP2002277136 2002-09-24

Publications (2)

Publication Number Publication Date
DE60318122D1 true DE60318122D1 (de) 2008-01-24
DE60318122T2 DE60318122T2 (de) 2008-12-04

Family

ID=31973236

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2003609996 Expired - Lifetime DE60309996T2 (de) 2002-09-24 2003-09-24 Tintenstrahldruckkopf und Verfahren zu seiner Herstellung
DE2003618122 Expired - Lifetime DE60318122T2 (de) 2002-09-24 2003-09-24 Tintenstrahldruckkopf und Verfahren zu seiner Herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE2003609996 Expired - Lifetime DE60309996T2 (de) 2002-09-24 2003-09-24 Tintenstrahldruckkopf und Verfahren zu seiner Herstellung

Country Status (5)

Country Link
US (2) US7562428B2 (de)
EP (2) EP1403050B1 (de)
JP (1) JP4179121B2 (de)
CN (2) CN2715991Y (de)
DE (2) DE60309996T2 (de)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4182901B2 (ja) * 2004-02-27 2008-11-19 ブラザー工業株式会社 インクジェットヘッド
JP4595418B2 (ja) * 2004-07-16 2010-12-08 ブラザー工業株式会社 インクジェットヘッド
US7249826B2 (en) 2004-09-23 2007-07-31 Fujifilm Dimatix, Inc. Soldering a flexible circuit
US7438395B2 (en) * 2004-09-24 2008-10-21 Brother Kogyo Kabushiki Kaisha Liquid-jetting apparatus and method for producing the same
DE602005016505D1 (de) * 2004-09-24 2009-10-22 Brother Ind Ltd Flüssigkeitsausstossvorrichtung, Verfahren zu ihrer Herstellung, und Tintenstrahldrucker
JP4616609B2 (ja) * 2004-10-05 2011-01-19 ブラザー工業株式会社 インクジェットヘッド
JP4356683B2 (ja) * 2005-01-25 2009-11-04 セイコーエプソン株式会社 デバイス実装構造とデバイス実装方法、液滴吐出ヘッド及びコネクタ並びに半導体装置
US7469994B2 (en) * 2005-01-31 2008-12-30 Brother Kogyo Kabushiki Kaisha Ink-jet head and connecting structure
JP2006205670A (ja) * 2005-01-31 2006-08-10 Brother Ind Ltd インクジェットヘッド
JP5023488B2 (ja) * 2005-03-09 2012-09-12 セイコーエプソン株式会社 デバイス実装構造とデバイス実装方法、液滴吐出ヘッド及び駆動ユニット並びに半導体装置
JP4501752B2 (ja) * 2005-03-30 2010-07-14 ブラザー工業株式会社 基板接合構造の製造方法及びインクジェットヘッドの製造方法
JP4207023B2 (ja) * 2005-06-20 2009-01-14 ブラザー工業株式会社 インクジェットヘッド
US8109612B2 (en) * 2005-08-29 2012-02-07 Fujifilm Corporation Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head
JP2007076327A (ja) * 2005-09-16 2007-03-29 Fujifilm Corp 電気接続構造、液体吐出ヘッド及びその製造方法並びに画像形成装置
JP4655923B2 (ja) 2005-12-26 2011-03-23 ブラザー工業株式会社 インクジェットヘッドの製造方法
EP2006111B1 (de) * 2006-03-29 2014-02-26 Kyocera Corporation Flüssigkeitsaustragsvorrichtung
JP4193890B2 (ja) * 2006-08-17 2008-12-10 ブラザー工業株式会社 インクジェットヘッド
JP4337869B2 (ja) * 2006-12-13 2009-09-30 ブラザー工業株式会社 記録ヘッドの製造方法及び記録ヘッド
JP2008307710A (ja) * 2007-06-12 2008-12-25 Canon Inc インクジェット記録ヘッド、インクジェット記録ヘッドの製造方法およびインクジェット記録ヘッドの実装ツール
JP5003306B2 (ja) * 2007-06-27 2012-08-15 ブラザー工業株式会社 吐出ヘッドおよび吐出ヘッドの製造方法
JP5211631B2 (ja) * 2007-10-16 2013-06-12 ブラザー工業株式会社 液滴吐出装置及びその製造方法
JP5159273B2 (ja) 2007-11-28 2013-03-06 ルネサスエレクトロニクス株式会社 電子装置の製造方法
JP2009226926A (ja) * 2008-02-29 2009-10-08 Seiko Epson Corp 液体吐出方法、液体吐出ヘッド、及び、液体吐出装置
CN103552379B (zh) * 2008-05-22 2015-09-02 富士胶片株式会社 流体喷射装置
JP5146381B2 (ja) * 2009-03-24 2013-02-20 ブラザー工業株式会社 液体吐出装置
JP5631054B2 (ja) * 2010-05-12 2014-11-26 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
WO2012165321A1 (ja) * 2011-05-27 2012-12-06 コニカミノルタホールディングス株式会社 インクジェットヘッドの製造方法、インクジェットヘッド、部材間通電構造の製造方法及び部材間通電構造
JP5922918B2 (ja) * 2011-12-05 2016-05-24 キヤノン株式会社 液体吐出ヘッド用半導体装置、液体吐出ヘッド及び液体吐出装置
US8888254B2 (en) 2012-09-13 2014-11-18 Xerox Corporation High density three-dimensional electrical interconnections
CN104105440B (zh) 2012-10-12 2016-06-22 奥林巴斯株式会社 内窥镜
JP6175798B2 (ja) * 2013-02-25 2017-08-09 ブラザー工業株式会社 液体吐出装置及びフレキシブル配線基板の接続方法
WO2015065320A1 (en) 2013-10-28 2015-05-07 Hewlett-Packard Development Company, L.P. Encapsulating a bonded wire with low profile encapsulation
JP6314519B2 (ja) * 2014-02-10 2018-04-25 セイコーエプソン株式会社 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置
JP6318793B2 (ja) * 2014-04-08 2018-05-09 株式会社リコー 電気−機械変換素子、電気−機械変換素子の製造方法、インクジェット記録ヘッド及びインクジェット記録装置
US9293683B2 (en) * 2014-05-12 2016-03-22 Panasonic Intellectual Property Management Co., Ltd. Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substrate
JP2016083861A (ja) * 2014-10-27 2016-05-19 セイコーエプソン株式会社 液体噴射ヘッドおよび液体噴射装置
WO2016092747A1 (en) * 2014-12-09 2016-06-16 Seiko Epson Corporation Piezoelectric device, liquid ejecting head, manufacturing method of piezoelectric device, and manufacturing method of liquid ejecting head
JP6520233B2 (ja) * 2015-03-06 2019-05-29 セイコーエプソン株式会社 電子デバイスの製造方法、および、電子デバイス
JP2016185605A (ja) * 2015-03-27 2016-10-27 セイコーエプソン株式会社 インクジェットヘッド、及び、インクジェットプリンター
JP6551010B2 (ja) * 2015-07-28 2019-07-31 セイコーエプソン株式会社 圧電デバイス、液体噴射ヘッド、及び圧電デバイスの製造方法
JP6582727B2 (ja) * 2015-08-21 2019-10-02 セイコーエプソン株式会社 接合構造体、圧電デバイス、液体噴射ヘッド、及び接合構造体の製造方法
JP6610117B2 (ja) * 2015-09-18 2019-11-27 コニカミノルタ株式会社 接続構造体、インクジェットヘッド、インクジェットヘッドの製造方法及びインクジェット記録装置
JP6582919B2 (ja) 2015-11-24 2019-10-02 セイコーエプソン株式会社 Ｍｅｍｓデバイス、液体噴射ヘッド、及び、液体噴射装置
JP6707974B2 (ja) 2016-04-27 2020-06-10 セイコーエプソン株式会社 Ｍｅｍｓデバイス、液体噴射ヘッド、及び、液体噴射装置
JP6859706B2 (ja) 2016-12-28 2021-04-14 ブラザー工業株式会社 ヘッドモジュール及び液体吐出装置
CN114603330B (zh) * 2022-03-16 2022-12-13 深圳市普天达智能装备有限公司 一种触控屏双面fpc绑定专用夹持装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05512A (ja) * 1991-06-24 1993-01-08 Seiko Epson Corp インクジエツトヘツドの製造方法
JP2803937B2 (ja) 1992-01-23 1998-09-24 アルプス電気株式会社 インクジェットヘッド
JPH06320721A (ja) 1993-05-10 1994-11-22 Ricoh Co Ltd インクジェットヘッド
JPH0781048A (ja) 1993-09-13 1995-03-28 Brother Ind Ltd インク噴射装置
US5508561A (en) * 1993-11-15 1996-04-16 Nec Corporation Apparatus for forming a double-bump structure used for flip-chip mounting
JPH07156376A (ja) 1993-12-01 1995-06-20 Ricoh Co Ltd インクジェットヘッド及びその製造方法及びその製造方法に使用する導体パタン
JP3134690B2 (ja) 1994-12-02 2001-02-13 セイコーエプソン株式会社 インクジェットヘッド
JP3613302B2 (ja) 1995-07-26 2005-01-26 セイコーエプソン株式会社 インクジェット式記録ヘッド
JP3555638B2 (ja) 1996-04-05 2004-08-18 セイコーエプソン株式会社 インクジェット式記録ヘッド
US6270193B1 (en) * 1996-06-05 2001-08-07 Brother Kogyo Kabushiki Kaisha Ink-jet and ink jet recording apparatus having IC chip attached to head body by resin material
JP2830852B2 (ja) * 1996-08-08 1998-12-02 松下電器産業株式会社 電子部品実装方法
JPH10146974A (ja) * 1996-11-19 1998-06-02 Brother Ind Ltd インクジェットヘッド
JP4117512B2 (ja) 1998-02-26 2008-07-16 富士フイルム株式会社 インクジェット記録装置
JPH11254670A (ja) 1998-03-10 1999-09-21 Nec Corp インクジェットヘッド
JP2000108344A (ja) 1998-10-05 2000-04-18 Ricoh Co Ltd インクジェット記録装置
JP2000127404A (ja) 1998-10-27 2000-05-09 Canon Inc インクジェット記録ヘッド
JP2000135789A (ja) 1998-11-04 2000-05-16 Matsushita Electric Ind Co Ltd インクジェットヘッド及びその製造方法
CN1172800C (zh) * 1998-11-04 2004-10-27 松下电器产业株式会社 喷墨印头及其制造方法
JP2000263781A (ja) 1999-03-18 2000-09-26 Ricoh Co Ltd インクジェット記録装置
JP2001179993A (ja) 1999-12-24 2001-07-03 Ricoh Co Ltd インクジェット記録装置の記録ヘッド製造方法
US6464324B1 (en) 2000-01-31 2002-10-15 Picojet, Inc. Microfluid device and ultrasonic bonding process
JP2001301178A (ja) 2000-04-25 2001-10-30 Konica Corp インクジェットヘッドおよびインクジェットヘッドの製造方法
JP2002248765A (ja) 2000-12-19 2002-09-03 Fuji Xerox Co Ltd インクジェット式記録ヘッドおよびインクジェット式記録装置
JP2002331663A (ja) 2001-03-08 2002-11-19 Seiko Epson Corp インクジェット式記録ヘッド及びインクジェット式記録装置
JP4362996B2 (ja) 2001-08-22 2009-11-11 富士ゼロックス株式会社 格子状配列構造の圧電／電歪アクチュエータ及びその製造方法

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US7766458B2 (en) 2010-08-03
EP1632354A2 (de) 2006-03-08
CN1495020A (zh) 2004-05-12
EP1632354B1 (de) 2007-12-12
EP1403050A1 (de) 2004-03-31
US20040113994A1 (en) 2004-06-17
US20070159511A1 (en) 2007-07-12
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