JP4337869B2 - 記録ヘッドの製造方法及び記録ヘッド - Google Patents
記録ヘッドの製造方法及び記録ヘッド Download PDFInfo
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- JP4337869B2 JP4337869B2 JP2006335633A JP2006335633A JP4337869B2 JP 4337869 B2 JP4337869 B2 JP 4337869B2 JP 2006335633 A JP2006335633 A JP 2006335633A JP 2006335633 A JP2006335633 A JP 2006335633A JP 4337869 B2 JP4337869 B2 JP 4337869B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 229910000679 solder Inorganic materials 0.000 claims description 120
- 229920003002 synthetic resin Polymers 0.000 claims description 98
- 239000000057 synthetic resin Substances 0.000 claims description 98
- 238000000034 method Methods 0.000 claims description 37
- 238000010438 heat treatment Methods 0.000 claims description 30
- 230000008569 process Effects 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 27
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 2
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005621 ferroelectricity Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- AVIYEYCFMVPYST-UHFFFAOYSA-N hexane-1,3-diol Chemical compound CCCC(O)CCO AVIYEYCFMVPYST-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14217—Multi layer finger type piezoelectric element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14225—Finger type piezoelectric element on only one side of the chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2002/14306—Flow passage between manifold and chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
また、ハンダペースト塗布工程においてハンダペースト体を塗布し、加熱工程においてハンダ層を形成することを可能としつつ、配線部分の端子部近傍以外の箇所を合成樹脂層で保護することができる。したがって、配線部分へ異物が付着し短絡が生じるのを抑制することができる。
また、本発明の記録ヘッドの製造方法では、前記硬化工程により硬化した前記合成樹脂層が、前記バンプの表面を覆うと共に、前記プリント配線板と前記アクチュエータユニットの表面とに跨って形成されることが好ましい。
次に、図12〜14を参照しつつ、本発明の実施の形態について説明する。図12は、本実施の形態のFPCとアクチュエータユニットとの接合部分の拡大断面図であり、図13は、図12に示すFPCの製造過程における断面図であり、図14は、図13(b)に示す製造過程におけるFPCの平面図である。本実施の形態は、FPC350の構成を除いては、参考例と同様である。したがって、以下の説明においては、FPC350の構成及びその製造方法についてのみ説明する。
4 流路ユニット
5 マニホールド(共通インク室)
8 ノズル
10 圧力室
21 アクチュエータユニット
32 個別インク流路(記録素子)
35 個別電極
35a 主電極部
35b ランド部
41、42、43、44 圧電シート
50、250、350、450 FPC(プリント配線板)
52、252 導体部(配線部分)
53、253 端子部
54、254 残部
55 ハンダ層
56 合成樹脂層
90 バンプ
252a くびれ領域
357 第1の合成樹脂層
357、457 第2の合成樹脂層
357a 開口
Claims (8)
- 複数の記録素子に対応する複数の個別電極を有するアクチュエータユニットと、前記記録素子を駆動するための信号を前記個別電極に供給する可撓性のプリント配線板とを備えた記録ヘッドの製造方法であって、
前記アクチュエータユニットの表面に、前記複数の個別電極とそれぞれ電気的に接続された導電性の複数のバンプを形成するバンプ形成工程と、
前記プリント配線板に形成された金属製の配線部分の複数の端子部上にハンダペースト体をそれぞれ部分的に塗布するハンダペースト塗布工程と、
前記複数の端子部上に塗布された前記複数のハンダペースト体のそれぞれを加熱することによって、前記複数の端子部上に前記ハンダペースト体が塗布された部分以上に広がった複数のハンダ層を形成する加熱工程と、
前記複数の端子部及び前記複数のハンダ層を未硬化の合成樹脂層で覆う被覆工程と、
前記合成樹脂層の前記ハンダ層を覆う領域と前記バンプとをそれぞれ押し当てて前記合成樹脂層を変形させることによって、前記複数のバンプと前記複数のハンダ層とを接触させる接触工程と、
未硬化の前記合成樹脂層を硬化させる硬化工程とを備えており、
前記ハンダペースト塗布工程の前に、前記複数の端子部をそれぞれ個別に露出させる前記端子部よりも大きな複数の開口を有しており、前記プリント配線板の前記配線部分が形成されている面を覆う硬化状態の合成樹脂層を形成する事前被覆工程をさらに備えており、
前記加熱工程において、前記ハンダ層は、前記プリント配線板からの高さが、前記事前被覆工程で形成された前記合成樹脂層の前記プリント配線板からの高さよりも高く形成されることを特徴とする記録ヘッドの製造方法。 - 前記端子部と前記配線部分の残部とが、前記端子部及び前記残部よりも幅の狭いくびれ領域を介して接続されていることを特徴とする請求項1に記載の記録ヘッドの製造方法。
- 前記加熱工程において、前記端子部の全域を覆う前記ハンダ層を形成することを特徴とする請求項1または2に記載の記録ヘッドの製造方法。
- 前記記録ヘッドは、インクを吐出するノズルに連通した複数の圧力室とこれら複数の圧力室に連通した共通インク室とを有する流路ユニットを備えたインクジェットヘッドであり、
前記アクチュエータユニットは、前記流路ユニットの表面に設けられて前記圧力室の容積を変化させる圧電シートと、前記圧電シートの表面に前記複数の圧力室にそれぞれ対応して形成された前記複数の個別電極とを有し、
前記個別電極は、前記圧電シートに垂直な方向から見て、前記圧電シートの表面の前記圧力室に重なる領域に形成された主電極部と、前記圧電シートに垂直な方向から見て、前記主電極部から前記圧力室に重ならない領域まで引き出されたランド部とを有し、
前記バンプ形成工程において、前記バンプを前記ランド部の表面に形成することを特徴とする請求項1〜3のいずれか1項に記載の記録ヘッドの製造方法。 - 前記被覆工程において、前記事前被覆工程において形成された前記合成樹脂層の前記複数の開口を未硬化の前記合成樹脂層でそれぞれ覆うことを特徴とする請求項1〜4のいずれか1項に記載の記録ヘッドの製造方法。
- 前記被覆工程において、前記事前被覆工程において形成された前記合成樹脂層における前記複数の開口を内包する領域を未硬化の前記合成樹脂層で覆うことを特徴とする請求項1〜4のいずれか1項に記載の記録ヘッドの製造方法。
- 前記硬化工程において、前記ハンダペースト体が広がる前記ハンダペースト体の融点よりも低い温度で加熱することにより未硬化の前記合成樹脂層を硬化させることを特徴とする請求項1〜6のいずれか1項に記載の記録ヘッドの製造方法。
- 前記硬化工程により硬化した前記合成樹脂層が、前記バンプの表面を覆うと共に、前記プリント配線板と前記アクチュエータユニットの表面とに跨って形成されることを特徴とする請求項1〜7のいずれか1項に記載の記録ヘッドの製造方法。
Priority Applications (2)
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JP5621447B2 (ja) * | 2010-09-16 | 2014-11-12 | ブラザー工業株式会社 | アクチュエータの配線構造 |
WO2012165321A1 (ja) * | 2011-05-27 | 2012-12-06 | コニカミノルタホールディングス株式会社 | インクジェットヘッドの製造方法、インクジェットヘッド、部材間通電構造の製造方法及び部材間通電構造 |
US9802408B2 (en) * | 2015-02-24 | 2017-10-31 | Xerox Corporation | Raised fluid pass-through structure in print heads |
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US7562428B2 (en) | 2002-09-24 | 2009-07-21 | Brother Kogyo Kabushiki Kaisha | Manufacturing an ink jet head |
JP4281608B2 (ja) | 2004-04-22 | 2009-06-17 | ブラザー工業株式会社 | 記録ヘッドの製造方法及び記録ヘッド |
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