DE602006015981D1 - Schallaussendungsmembran, elektronisches bauteil mit schallaussendungsmembran und prozess zur herstee bauteil angebracht ist - Google Patents

Schallaussendungsmembran, elektronisches bauteil mit schallaussendungsmembran und prozess zur herstee bauteil angebracht ist

Info

Publication number
DE602006015981D1
DE602006015981D1 DE200660015981 DE602006015981T DE602006015981D1 DE 602006015981 D1 DE602006015981 D1 DE 602006015981D1 DE 200660015981 DE200660015981 DE 200660015981 DE 602006015981 T DE602006015981 T DE 602006015981T DE 602006015981 D1 DE602006015981 D1 DE 602006015981D1
Authority
DE
Germany
Prior art keywords
dispensing membrane
sound dispensing
sound
component
process applied
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200660015981
Other languages
German (de)
English (en)
Inventor
Yoshiki Ikeyama
Yuri Horie
Kouji Furuuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602006015981D1 publication Critical patent/DE602006015981D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023Screens for loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00Presence of polyamine or polyimide
    • C09J2479/08Presence of polyamine or polyimide polyimide
    • C09J2479/086Presence of polyamine or polyimide polyimide in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00Presence of polysiloxane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249953Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982With component specified as adhesive or bonding agent

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
DE200660015981 2005-09-14 2006-09-11 Schallaussendungsmembran, elektronisches bauteil mit schallaussendungsmembran und prozess zur herstee bauteil angebracht ist Active DE602006015981D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005267647A JP4708134B2 (ja) 2005-09-14 2005-09-14 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法
PCT/JP2006/317983 WO2007032312A1 (fr) 2005-09-14 2006-09-11 Membrane de transmission acoustique, composant électronique à membrane de transmission acoustique, et procédé de production de carte de circuit sur laquelle le composant électronique est monté

Publications (1)

Publication Number Publication Date
DE602006015981D1 true DE602006015981D1 (de) 2010-09-16

Family

ID=37864905

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200660015981 Active DE602006015981D1 (de) 2005-09-14 2006-09-11 Schallaussendungsmembran, elektronisches bauteil mit schallaussendungsmembran und prozess zur herstee bauteil angebracht ist

Country Status (9)

Country Link
US (1) US8141678B2 (fr)
EP (1) EP1933588B1 (fr)
JP (1) JP4708134B2 (fr)
KR (1) KR101204550B1 (fr)
CN (1) CN101263733B (fr)
DE (1) DE602006015981D1 (fr)
DK (1) DK1933588T3 (fr)
TW (1) TWI405471B (fr)
WO (1) WO2007032312A1 (fr)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4708134B2 (ja) * 2005-09-14 2011-06-22 日東電工株式会社 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法
JP2008271426A (ja) * 2007-04-24 2008-11-06 Matsushita Electric Works Ltd 音響センサ
JP5160984B2 (ja) * 2007-07-18 2013-03-13 日東電工株式会社 防水通音膜、防水通音膜の製造方法およびそれを用いた電気製品
JP5356734B2 (ja) * 2008-06-20 2013-12-04 日本ゴア株式会社 音響部品及びその製造方法
JP5286006B2 (ja) * 2008-09-17 2013-09-11 日本ゴア株式会社 防水通音フード
EP2351647B1 (fr) * 2009-01-21 2018-08-08 Nitto Denko Corporation Film d'imperméabilisation transmettant le son, procédé de fabrication associé, et matériel électrique employant un tel film
US8157048B2 (en) 2009-04-22 2012-04-17 Gore Enterprise Holdings, Inc. Splash proof acoustically resistive color assembly
EP2422528B8 (fr) * 2009-04-23 2016-06-29 Audio Pixels LTD. Dispositif anti-poussière pour haut-parleurs plats
JP4751476B2 (ja) * 2009-09-04 2011-08-17 日東電工株式会社 マイクロフォン用通音膜とそれを備えるマイクロフォン用通音膜部材、マイクロフォンならびにマイクロフォンを備える電子機器
US9005334B2 (en) 2010-06-16 2015-04-14 Nitto Denko Corporation Water-proof air-permeable filter and use of the same
JP5739699B2 (ja) 2010-06-16 2015-06-24 日東電工株式会社 防水通気フィルタおよびその使用
CN102547497A (zh) * 2010-12-14 2012-07-04 富泰华工业(深圳)有限公司 喇叭孔防尘网及其固定方法与采用其的电子装置
US9171535B2 (en) * 2011-03-03 2015-10-27 Nitto Denko Corporation Waterproof sound-transmitting membrane and electrical product
ITMI20111579A1 (it) * 2011-09-02 2013-03-03 Saati Spa Microfono mems con schermo tessile integrato di protezione.
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
JP6068886B2 (ja) * 2012-03-30 2017-01-25 日東電工株式会社 換気システム
US10219054B2 (en) * 2012-05-31 2019-02-26 Nitto Denko Corporation Protective member for acoustic component and waterproof case
JP2015528756A (ja) 2012-06-28 2015-10-01 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性基板物品
JP5947655B2 (ja) * 2012-08-02 2016-07-06 日東電工株式会社 ポリテトラフルオロエチレン多孔質膜、並びに、それを用いた通気膜および通気部材
KR101948969B1 (ko) * 2012-11-21 2019-02-15 닛토덴코 가부시키가이샤 통음막, 및 통음막을 구비한 전자 기기
KR101509597B1 (ko) * 2012-12-11 2015-04-07 주식회사 아모그린텍 방수통음시트 및 이의 제조 방법
JP5913643B2 (ja) * 2012-12-11 2016-04-27 アモグリーンテック カンパニー リミテッド 防水通音シートおよびその製造方法
US9514735B2 (en) 2012-12-11 2016-12-06 Amogreentech Co., Ltd. Waterproof sound transmitting sheet, and method for producing same
JP6118131B2 (ja) * 2013-02-25 2017-04-19 日東電工株式会社 防水通音膜、通音部材、及び電気機器
JP6069078B2 (ja) * 2013-04-15 2017-01-25 日東電工株式会社 防水通音膜およびその製造方法、ならびに防水通音部材
US20140374608A1 (en) * 2013-06-19 2014-12-25 Canon Kabushiki Kaisha Radiation detection apparatus and method of manufacturing the same
JP6687516B2 (ja) * 2013-10-15 2020-04-22 ドナルドソン カンパニー,インコーポレイティド 音響ベント用の微孔質膜積層体
US9264832B2 (en) * 2013-10-30 2016-02-16 Solid State System Co., Ltd. Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
CN105706459B (zh) * 2013-11-07 2019-07-30 日东电工株式会社 防水透声膜和电子设备
US11582564B2 (en) 2014-01-06 2023-02-14 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11375324B2 (en) 2014-01-06 2022-06-28 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11974097B2 (en) 2014-01-06 2024-04-30 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11617045B2 (en) 2014-01-06 2023-03-28 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11832060B2 (en) 2014-01-06 2023-11-28 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11589171B2 (en) 2014-01-06 2023-02-21 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11558698B2 (en) 2014-01-06 2023-01-17 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11297446B2 (en) 2014-01-06 2022-04-05 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11368800B2 (en) 2014-01-06 2022-06-21 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11304011B2 (en) 2014-01-06 2022-04-12 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11582563B2 (en) 2014-01-06 2023-02-14 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11706574B2 (en) 2014-01-06 2023-07-18 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11589172B2 (en) 2014-01-06 2023-02-21 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11363392B2 (en) 2014-01-06 2022-06-14 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11950055B2 (en) 2014-01-06 2024-04-02 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11582565B2 (en) * 2014-01-06 2023-02-14 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11622209B2 (en) 2014-01-06 2023-04-04 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11570556B2 (en) 2014-01-06 2023-01-31 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11197106B2 (en) 2014-01-06 2021-12-07 Shenzhen Voxtech Co., Ltd. Systems and methods for suppressing sound leakage
US11627419B2 (en) 2014-01-06 2023-04-11 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11805375B2 (en) 2014-01-06 2023-10-31 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
JP6324109B2 (ja) * 2014-02-26 2018-05-16 日東電工株式会社 防水通音膜の製造方法、防水通音膜及び電子機器
JP2016022415A (ja) * 2014-07-18 2016-02-08 日本バルカー工業株式会社 ポリテトラフルオロエチレンファイバを含む不織布層からなる防水通気膜と接着層とを有する防水通気部材およびその用途
US9538272B2 (en) * 2014-09-08 2017-01-03 Apple Inc. Acoustic mesh and methods of use for electronic devices
EP3209027B1 (fr) 2014-10-16 2019-07-03 Nitto Denko Corporation Membrane laissant passer le son, son élément de membrane laissant passer le son, microphone et dispositif électronique
CN104853294B (zh) * 2015-04-23 2019-05-24 歌尔股份有限公司 一种硅胶振膜、扬声器模组和再加工硅胶振膜的方法
CN104853304A (zh) * 2015-04-23 2015-08-19 歌尔声学股份有限公司 一种硅胶振膜、受话器模组和加工硅胶振膜的方法
JP6581876B2 (ja) * 2015-10-07 2019-09-25 中興化成工業株式会社 通気膜及びマイクロフォン
WO2017090246A1 (fr) 2015-11-24 2017-06-01 日東電工株式会社 Film laissant passer le son et étanche à l'eau, élément laissant passer le son et étanche à l'eau, et appareil électronique
WO2017095855A1 (fr) * 2015-11-30 2017-06-08 W. L. Gore & Associates, Inc. Barrière protectrice environnementale pour un moule
ITUB20160059A1 (it) 2016-02-04 2017-08-04 Saati Spa Struttura composita filtrante multistrato, in particolare per l'uso come subcomponente all'interno di prodotti acustici ed elettronici in generale
EP3219837B1 (fr) 2016-03-15 2019-08-14 Sefar AG Dispositive électrique avec un composant acoustique et un élement textile
KR20190086429A (ko) * 2016-11-24 2019-07-22 린텍 가부시키가이샤 양면 실리콘 점착 시트 및 양면 실리콘 점착 시트의 제조 방법
WO2018194073A1 (fr) * 2017-04-18 2018-10-25 日東電工株式会社 Stratifié et corps enroulé
CN109715388B (zh) * 2017-04-18 2020-05-19 日东电工株式会社 层叠体及卷绕体
JP7079261B2 (ja) 2017-11-09 2022-06-01 日東電工株式会社 防水通音部材とこれを備える電子機器
WO2019132044A1 (fr) * 2017-12-28 2019-07-04 日東電工株式会社 Élément d'imperméabilisation et équipement électronique
CN108430015A (zh) * 2018-03-28 2018-08-21 努比亚技术有限公司 一种扬声结构及扬声器和听筒
KR102297943B1 (ko) * 2018-12-28 2021-09-02 닛토덴코 가부시키가이샤 방수 부재 및 전자 기기
JP2021121090A (ja) 2019-07-12 2021-08-19 日東電工株式会社 保護カバー部材及びこれを備える部材供給用シート
CN115279855A (zh) * 2020-03-18 2022-11-01 日东电工株式会社 保护罩构件及构件供给用片
JP7529450B2 (ja) 2020-06-12 2024-08-06 日鉄ケミカル&マテリアル株式会社 樹脂フィルム、その製造方法、金属張積層板及びプリント配線板
CN114929825B (zh) * 2020-08-07 2024-03-19 日东电工株式会社 保护罩构件及构件供给用片
CN112929798B (zh) * 2021-01-29 2022-11-01 杭州安普鲁薄膜科技有限公司 一种防水透声膜组件及其装有防水透声膜组件的mems
KR20240031338A (ko) 2021-07-02 2024-03-07 닛토덴코 가부시키가이샤 보호 커버 부재, 부재 공급용 시트 및 미소 전기 기계 시스템
CN113573220B (zh) * 2021-07-28 2023-01-03 杭州安普鲁薄膜科技有限公司 一种带有防尘透声膜组件的mems复合件

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH098446A (ja) * 1995-06-26 1997-01-10 Matsushita Electric Ind Co Ltd プリント基板の高密度実装方法
JP2834039B2 (ja) * 1995-07-26 1998-12-09 埼玉日本電気株式会社 携帯無線電話
JPH09199631A (ja) * 1996-01-23 1997-07-31 Seiko Epson Corp 半導体装置の構造と製造方法
US5828012A (en) * 1996-05-31 1998-10-27 W. L. Gore & Associates, Inc. Protective cover assembly having enhanced acoustical characteristics
JPH10150259A (ja) * 1996-11-20 1998-06-02 Matsushita Electric Works Ltd 部品付きプリント配線板およびその製造方法
JPH10176150A (ja) 1996-12-20 1998-06-30 Hitachi Chem Co Ltd 耐熱性接着剤層付きフィルム及びこれを用いた半導体装置
DE19927145A1 (de) 1999-06-15 2000-12-28 Bosch Gmbh Robert Hochdruckanschluß für ein Kraftstoffeinspritzsystem für Brennkraftmaschinen
US6512834B1 (en) * 1999-07-07 2003-01-28 Gore Enterprise Holdings, Inc. Acoustic protective cover assembly
JP2001244598A (ja) * 2000-02-25 2001-09-07 Sony Corp チップ部品実装方法
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
JP4380115B2 (ja) * 2001-07-04 2009-12-09 東レ株式会社 耐熱性接着剤、耐熱性積層フィルム、金属箔付き積層フィルム及びこれを用いた半導体装置
JP2003053872A (ja) 2001-08-13 2003-02-26 Nitto Denko Corp 通気性通音膜
JP3775329B2 (ja) * 2002-03-27 2006-05-17 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープの製造方法、その製造装置およびその方法に用いられる保護テープ
JP4213488B2 (ja) * 2002-05-15 2009-01-21 日東電工株式会社 通気部材、これを用いた通気筐体、通気部材の抜け防止具および通気構造形成キット
JP3974834B2 (ja) * 2002-08-26 2007-09-12 松下電器産業株式会社 電子部品の装着方法
JP4204835B2 (ja) * 2002-09-30 2009-01-07 日東電工株式会社 粘着テープ及び粘着テープの使用方法
JP4484478B2 (ja) * 2003-09-19 2010-06-16 日東電工株式会社 接着機能付き回路基板
JP4459111B2 (ja) * 2005-05-24 2010-04-28 信越ポリマー株式会社 電子部品保持具の製造方法
JP4708134B2 (ja) * 2005-09-14 2011-06-22 日東電工株式会社 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法
US7561704B2 (en) * 2005-12-07 2009-07-14 Yen-Chen Chan Structure of speaker
US8290179B2 (en) * 2008-08-21 2012-10-16 Apple Inc. Multiple-use acoustic port
TW201026097A (en) * 2008-12-30 2010-07-01 Ind Tech Res Inst Solar flexpeaker structure and speaker therewith
EP2351647B1 (fr) * 2009-01-21 2018-08-08 Nitto Denko Corporation Film d'imperméabilisation transmettant le son, procédé de fabrication associé, et matériel électrique employant un tel film

Also Published As

Publication number Publication date
EP1933588A1 (fr) 2008-06-18
KR101204550B1 (ko) 2012-11-26
US20090268928A1 (en) 2009-10-29
JP2007081881A (ja) 2007-03-29
CN101263733B (zh) 2011-11-30
KR20080064832A (ko) 2008-07-09
JP4708134B2 (ja) 2011-06-22
EP1933588B1 (fr) 2010-08-04
EP1933588A4 (fr) 2009-03-18
DK1933588T3 (da) 2010-11-08
CN101263733A (zh) 2008-09-10
TW200729992A (en) 2007-08-01
WO2007032312A1 (fr) 2007-03-22
US8141678B2 (en) 2012-03-27
TWI405471B (zh) 2013-08-11

Similar Documents

Publication Publication Date Title
DE602006015981D1 (de) Schallaussendungsmembran, elektronisches bauteil mit schallaussendungsmembran und prozess zur herstee bauteil angebracht ist
EP2219387A4 (fr) Elément laissant passer le son utilisant une membrane étanche laissant passer le son et son procédé de fabrication
EP2126940A4 (fr) Matériaux à tolérance de défaut et leurs procédés de fabrication
EP2011775A4 (fr) Structure ceramique et son procede de fabrication
EP1937591A4 (fr) Charbon actif et procede de fabrication correspondant
DE602006020226D1 (de) Elektronisches Bauteil und dessen Herstellungsverfahren
EP2400572A4 (fr) Matériaux de conversion thermoélectrique, leur procédé de production, et élément de conversion thermoélectrique
EP1850633A4 (fr) Haut-parleur piézoélectrique pour procédé de fabrication de celui-ci
EP1935916A4 (fr) Polyarylène et son procédé de production
DE602006007660D1 (de) Duroplastische Zusammensetzung und Herstellungsverfahren
EP2095908A4 (fr) Meule à affûter avec sillons inclinés et son procédé de fabrication
EP1959510A4 (fr) Élément piézoélectrique stratifié et son processus de fabrication
EP1978548A4 (fr) Procede de fabrication de film siliceux et substrat avec film siliceux ainsi obtenu
HK1119070A1 (en) Use of trans-clomiphene in the manufacture of medicines
EP1900970A4 (fr) Dispositif de vis et son procédé de fabrication
EP1841581A4 (fr) Composites et procedes de fabrication et d'utilisation correspondants
DE102006032069A8 (de) Beschichteter Holzverbundwerkstoff und Herstellungsverfahren davon
EP2099071A4 (fr) Dispositif à changement de résistance et son procédé de fabrication
EP2098497A4 (fr) Structure alvéolaire céramique et son procédé de fabrication
EP2022612A4 (fr) Contreplaqué en bambou multicouches et procédé de fabrication associés
DE602005006105D1 (de) Membrankörper und entsprechendes herstellungsverfahren
HK1100011A1 (en) Component of musical instrument, musical instrument and production method of the same
EP2101364A4 (fr) Dispositif piézoélectrique laminé et son procédé de fabrication
EP1995265A4 (fr) Polyarylene et son procede de production
EP1950607A4 (fr) Element d'affichage et procede de production associe