DE602006015981D1 - Schallaussendungsmembran, elektronisches bauteil mit schallaussendungsmembran und prozess zur herstee bauteil angebracht ist - Google Patents
Schallaussendungsmembran, elektronisches bauteil mit schallaussendungsmembran und prozess zur herstee bauteil angebracht istInfo
- Publication number
- DE602006015981D1 DE602006015981D1 DE200660015981 DE602006015981T DE602006015981D1 DE 602006015981 D1 DE602006015981 D1 DE 602006015981D1 DE 200660015981 DE200660015981 DE 200660015981 DE 602006015981 T DE602006015981 T DE 602006015981T DE 602006015981 D1 DE602006015981 D1 DE 602006015981D1
- Authority
- DE
- Germany
- Prior art keywords
- dispensing membrane
- sound dispensing
- sound
- component
- process applied
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/023—Screens for loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005267647A JP4708134B2 (ja) | 2005-09-14 | 2005-09-14 | 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法 |
PCT/JP2006/317983 WO2007032312A1 (fr) | 2005-09-14 | 2006-09-11 | Membrane de transmission acoustique, composant électronique à membrane de transmission acoustique, et procédé de production de carte de circuit sur laquelle le composant électronique est monté |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006015981D1 true DE602006015981D1 (de) | 2010-09-16 |
Family
ID=37864905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200660015981 Active DE602006015981D1 (de) | 2005-09-14 | 2006-09-11 | Schallaussendungsmembran, elektronisches bauteil mit schallaussendungsmembran und prozess zur herstee bauteil angebracht ist |
Country Status (9)
Country | Link |
---|---|
US (1) | US8141678B2 (fr) |
EP (1) | EP1933588B1 (fr) |
JP (1) | JP4708134B2 (fr) |
KR (1) | KR101204550B1 (fr) |
CN (1) | CN101263733B (fr) |
DE (1) | DE602006015981D1 (fr) |
DK (1) | DK1933588T3 (fr) |
TW (1) | TWI405471B (fr) |
WO (1) | WO2007032312A1 (fr) |
Families Citing this family (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4708134B2 (ja) * | 2005-09-14 | 2011-06-22 | 日東電工株式会社 | 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法 |
JP2008271426A (ja) * | 2007-04-24 | 2008-11-06 | Matsushita Electric Works Ltd | 音響センサ |
JP5160984B2 (ja) * | 2007-07-18 | 2013-03-13 | 日東電工株式会社 | 防水通音膜、防水通音膜の製造方法およびそれを用いた電気製品 |
JP5356734B2 (ja) * | 2008-06-20 | 2013-12-04 | 日本ゴア株式会社 | 音響部品及びその製造方法 |
JP5286006B2 (ja) * | 2008-09-17 | 2013-09-11 | 日本ゴア株式会社 | 防水通音フード |
EP2351647B1 (fr) * | 2009-01-21 | 2018-08-08 | Nitto Denko Corporation | Film d'imperméabilisation transmettant le son, procédé de fabrication associé, et matériel électrique employant un tel film |
US8157048B2 (en) | 2009-04-22 | 2012-04-17 | Gore Enterprise Holdings, Inc. | Splash proof acoustically resistive color assembly |
EP2422528B8 (fr) * | 2009-04-23 | 2016-06-29 | Audio Pixels LTD. | Dispositif anti-poussière pour haut-parleurs plats |
JP4751476B2 (ja) * | 2009-09-04 | 2011-08-17 | 日東電工株式会社 | マイクロフォン用通音膜とそれを備えるマイクロフォン用通音膜部材、マイクロフォンならびにマイクロフォンを備える電子機器 |
US9005334B2 (en) | 2010-06-16 | 2015-04-14 | Nitto Denko Corporation | Water-proof air-permeable filter and use of the same |
JP5739699B2 (ja) | 2010-06-16 | 2015-06-24 | 日東電工株式会社 | 防水通気フィルタおよびその使用 |
CN102547497A (zh) * | 2010-12-14 | 2012-07-04 | 富泰华工业(深圳)有限公司 | 喇叭孔防尘网及其固定方法与采用其的电子装置 |
US9171535B2 (en) * | 2011-03-03 | 2015-10-27 | Nitto Denko Corporation | Waterproof sound-transmitting membrane and electrical product |
ITMI20111579A1 (it) * | 2011-09-02 | 2013-03-03 | Saati Spa | Microfono mems con schermo tessile integrato di protezione. |
DE102011086722A1 (de) * | 2011-11-21 | 2013-05-23 | Robert Bosch Gmbh | Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren |
JP6068886B2 (ja) * | 2012-03-30 | 2017-01-25 | 日東電工株式会社 | 換気システム |
US10219054B2 (en) * | 2012-05-31 | 2019-02-26 | Nitto Denko Corporation | Protective member for acoustic component and waterproof case |
JP2015528756A (ja) | 2012-06-28 | 2015-10-01 | スリーエム イノベイティブ プロパティズ カンパニー | 熱伝導性基板物品 |
JP5947655B2 (ja) * | 2012-08-02 | 2016-07-06 | 日東電工株式会社 | ポリテトラフルオロエチレン多孔質膜、並びに、それを用いた通気膜および通気部材 |
KR101948969B1 (ko) * | 2012-11-21 | 2019-02-15 | 닛토덴코 가부시키가이샤 | 통음막, 및 통음막을 구비한 전자 기기 |
KR101509597B1 (ko) * | 2012-12-11 | 2015-04-07 | 주식회사 아모그린텍 | 방수통음시트 및 이의 제조 방법 |
JP5913643B2 (ja) * | 2012-12-11 | 2016-04-27 | アモグリーンテック カンパニー リミテッド | 防水通音シートおよびその製造方法 |
US9514735B2 (en) | 2012-12-11 | 2016-12-06 | Amogreentech Co., Ltd. | Waterproof sound transmitting sheet, and method for producing same |
JP6118131B2 (ja) * | 2013-02-25 | 2017-04-19 | 日東電工株式会社 | 防水通音膜、通音部材、及び電気機器 |
JP6069078B2 (ja) * | 2013-04-15 | 2017-01-25 | 日東電工株式会社 | 防水通音膜およびその製造方法、ならびに防水通音部材 |
US20140374608A1 (en) * | 2013-06-19 | 2014-12-25 | Canon Kabushiki Kaisha | Radiation detection apparatus and method of manufacturing the same |
JP6687516B2 (ja) * | 2013-10-15 | 2020-04-22 | ドナルドソン カンパニー,インコーポレイティド | 音響ベント用の微孔質膜積層体 |
US9264832B2 (en) * | 2013-10-30 | 2016-02-16 | Solid State System Co., Ltd. | Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level |
CN105706459B (zh) * | 2013-11-07 | 2019-07-30 | 日东电工株式会社 | 防水透声膜和电子设备 |
US11582564B2 (en) | 2014-01-06 | 2023-02-14 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11375324B2 (en) | 2014-01-06 | 2022-06-28 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11974097B2 (en) | 2014-01-06 | 2024-04-30 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
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US11558698B2 (en) | 2014-01-06 | 2023-01-17 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11297446B2 (en) | 2014-01-06 | 2022-04-05 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11368800B2 (en) | 2014-01-06 | 2022-06-21 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11304011B2 (en) | 2014-01-06 | 2022-04-12 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11582563B2 (en) | 2014-01-06 | 2023-02-14 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11706574B2 (en) | 2014-01-06 | 2023-07-18 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11589172B2 (en) | 2014-01-06 | 2023-02-21 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11363392B2 (en) | 2014-01-06 | 2022-06-14 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11950055B2 (en) | 2014-01-06 | 2024-04-02 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11582565B2 (en) * | 2014-01-06 | 2023-02-14 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11622209B2 (en) | 2014-01-06 | 2023-04-04 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11570556B2 (en) | 2014-01-06 | 2023-01-31 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11197106B2 (en) | 2014-01-06 | 2021-12-07 | Shenzhen Voxtech Co., Ltd. | Systems and methods for suppressing sound leakage |
US11627419B2 (en) | 2014-01-06 | 2023-04-11 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11805375B2 (en) | 2014-01-06 | 2023-10-31 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
JP6324109B2 (ja) * | 2014-02-26 | 2018-05-16 | 日東電工株式会社 | 防水通音膜の製造方法、防水通音膜及び電子機器 |
JP2016022415A (ja) * | 2014-07-18 | 2016-02-08 | 日本バルカー工業株式会社 | ポリテトラフルオロエチレンファイバを含む不織布層からなる防水通気膜と接着層とを有する防水通気部材およびその用途 |
US9538272B2 (en) * | 2014-09-08 | 2017-01-03 | Apple Inc. | Acoustic mesh and methods of use for electronic devices |
EP3209027B1 (fr) | 2014-10-16 | 2019-07-03 | Nitto Denko Corporation | Membrane laissant passer le son, son élément de membrane laissant passer le son, microphone et dispositif électronique |
CN104853294B (zh) * | 2015-04-23 | 2019-05-24 | 歌尔股份有限公司 | 一种硅胶振膜、扬声器模组和再加工硅胶振膜的方法 |
CN104853304A (zh) * | 2015-04-23 | 2015-08-19 | 歌尔声学股份有限公司 | 一种硅胶振膜、受话器模组和加工硅胶振膜的方法 |
JP6581876B2 (ja) * | 2015-10-07 | 2019-09-25 | 中興化成工業株式会社 | 通気膜及びマイクロフォン |
WO2017090246A1 (fr) | 2015-11-24 | 2017-06-01 | 日東電工株式会社 | Film laissant passer le son et étanche à l'eau, élément laissant passer le son et étanche à l'eau, et appareil électronique |
WO2017095855A1 (fr) * | 2015-11-30 | 2017-06-08 | W. L. Gore & Associates, Inc. | Barrière protectrice environnementale pour un moule |
ITUB20160059A1 (it) | 2016-02-04 | 2017-08-04 | Saati Spa | Struttura composita filtrante multistrato, in particolare per l'uso come subcomponente all'interno di prodotti acustici ed elettronici in generale |
EP3219837B1 (fr) | 2016-03-15 | 2019-08-14 | Sefar AG | Dispositive électrique avec un composant acoustique et un élement textile |
KR20190086429A (ko) * | 2016-11-24 | 2019-07-22 | 린텍 가부시키가이샤 | 양면 실리콘 점착 시트 및 양면 실리콘 점착 시트의 제조 방법 |
WO2018194073A1 (fr) * | 2017-04-18 | 2018-10-25 | 日東電工株式会社 | Stratifié et corps enroulé |
CN109715388B (zh) * | 2017-04-18 | 2020-05-19 | 日东电工株式会社 | 层叠体及卷绕体 |
JP7079261B2 (ja) | 2017-11-09 | 2022-06-01 | 日東電工株式会社 | 防水通音部材とこれを備える電子機器 |
WO2019132044A1 (fr) * | 2017-12-28 | 2019-07-04 | 日東電工株式会社 | Élément d'imperméabilisation et équipement électronique |
CN108430015A (zh) * | 2018-03-28 | 2018-08-21 | 努比亚技术有限公司 | 一种扬声结构及扬声器和听筒 |
KR102297943B1 (ko) * | 2018-12-28 | 2021-09-02 | 닛토덴코 가부시키가이샤 | 방수 부재 및 전자 기기 |
JP2021121090A (ja) | 2019-07-12 | 2021-08-19 | 日東電工株式会社 | 保護カバー部材及びこれを備える部材供給用シート |
CN115279855A (zh) * | 2020-03-18 | 2022-11-01 | 日东电工株式会社 | 保护罩构件及构件供给用片 |
JP7529450B2 (ja) | 2020-06-12 | 2024-08-06 | 日鉄ケミカル&マテリアル株式会社 | 樹脂フィルム、その製造方法、金属張積層板及びプリント配線板 |
CN114929825B (zh) * | 2020-08-07 | 2024-03-19 | 日东电工株式会社 | 保护罩构件及构件供给用片 |
CN112929798B (zh) * | 2021-01-29 | 2022-11-01 | 杭州安普鲁薄膜科技有限公司 | 一种防水透声膜组件及其装有防水透声膜组件的mems |
KR20240031338A (ko) | 2021-07-02 | 2024-03-07 | 닛토덴코 가부시키가이샤 | 보호 커버 부재, 부재 공급용 시트 및 미소 전기 기계 시스템 |
CN113573220B (zh) * | 2021-07-28 | 2023-01-03 | 杭州安普鲁薄膜科技有限公司 | 一种带有防尘透声膜组件的mems复合件 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH098446A (ja) * | 1995-06-26 | 1997-01-10 | Matsushita Electric Ind Co Ltd | プリント基板の高密度実装方法 |
JP2834039B2 (ja) * | 1995-07-26 | 1998-12-09 | 埼玉日本電気株式会社 | 携帯無線電話 |
JPH09199631A (ja) * | 1996-01-23 | 1997-07-31 | Seiko Epson Corp | 半導体装置の構造と製造方法 |
US5828012A (en) * | 1996-05-31 | 1998-10-27 | W. L. Gore & Associates, Inc. | Protective cover assembly having enhanced acoustical characteristics |
JPH10150259A (ja) * | 1996-11-20 | 1998-06-02 | Matsushita Electric Works Ltd | 部品付きプリント配線板およびその製造方法 |
JPH10176150A (ja) | 1996-12-20 | 1998-06-30 | Hitachi Chem Co Ltd | 耐熱性接着剤層付きフィルム及びこれを用いた半導体装置 |
DE19927145A1 (de) | 1999-06-15 | 2000-12-28 | Bosch Gmbh Robert | Hochdruckanschluß für ein Kraftstoffeinspritzsystem für Brennkraftmaschinen |
US6512834B1 (en) * | 1999-07-07 | 2003-01-28 | Gore Enterprise Holdings, Inc. | Acoustic protective cover assembly |
JP2001244598A (ja) * | 2000-02-25 | 2001-09-07 | Sony Corp | チップ部品実装方法 |
US7434305B2 (en) * | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
JP4380115B2 (ja) * | 2001-07-04 | 2009-12-09 | 東レ株式会社 | 耐熱性接着剤、耐熱性積層フィルム、金属箔付き積層フィルム及びこれを用いた半導体装置 |
JP2003053872A (ja) | 2001-08-13 | 2003-02-26 | Nitto Denko Corp | 通気性通音膜 |
JP3775329B2 (ja) * | 2002-03-27 | 2006-05-17 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープの製造方法、その製造装置およびその方法に用いられる保護テープ |
JP4213488B2 (ja) * | 2002-05-15 | 2009-01-21 | 日東電工株式会社 | 通気部材、これを用いた通気筐体、通気部材の抜け防止具および通気構造形成キット |
JP3974834B2 (ja) * | 2002-08-26 | 2007-09-12 | 松下電器産業株式会社 | 電子部品の装着方法 |
JP4204835B2 (ja) * | 2002-09-30 | 2009-01-07 | 日東電工株式会社 | 粘着テープ及び粘着テープの使用方法 |
JP4484478B2 (ja) * | 2003-09-19 | 2010-06-16 | 日東電工株式会社 | 接着機能付き回路基板 |
JP4459111B2 (ja) * | 2005-05-24 | 2010-04-28 | 信越ポリマー株式会社 | 電子部品保持具の製造方法 |
JP4708134B2 (ja) * | 2005-09-14 | 2011-06-22 | 日東電工株式会社 | 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法 |
US7561704B2 (en) * | 2005-12-07 | 2009-07-14 | Yen-Chen Chan | Structure of speaker |
US8290179B2 (en) * | 2008-08-21 | 2012-10-16 | Apple Inc. | Multiple-use acoustic port |
TW201026097A (en) * | 2008-12-30 | 2010-07-01 | Ind Tech Res Inst | Solar flexpeaker structure and speaker therewith |
EP2351647B1 (fr) * | 2009-01-21 | 2018-08-08 | Nitto Denko Corporation | Film d'imperméabilisation transmettant le son, procédé de fabrication associé, et matériel électrique employant un tel film |
-
2005
- 2005-09-14 JP JP2005267647A patent/JP4708134B2/ja active Active
-
2006
- 2006-09-11 WO PCT/JP2006/317983 patent/WO2007032312A1/fr active Application Filing
- 2006-09-11 DE DE200660015981 patent/DE602006015981D1/de active Active
- 2006-09-11 CN CN2006800335757A patent/CN101263733B/zh active Active
- 2006-09-11 KR KR1020087008626A patent/KR101204550B1/ko active IP Right Grant
- 2006-09-11 EP EP20060783260 patent/EP1933588B1/fr active Active
- 2006-09-11 US US11/991,977 patent/US8141678B2/en active Active
- 2006-09-11 DK DK06783260T patent/DK1933588T3/da active
- 2006-09-13 TW TW95133852A patent/TWI405471B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1933588A1 (fr) | 2008-06-18 |
KR101204550B1 (ko) | 2012-11-26 |
US20090268928A1 (en) | 2009-10-29 |
JP2007081881A (ja) | 2007-03-29 |
CN101263733B (zh) | 2011-11-30 |
KR20080064832A (ko) | 2008-07-09 |
JP4708134B2 (ja) | 2011-06-22 |
EP1933588B1 (fr) | 2010-08-04 |
EP1933588A4 (fr) | 2009-03-18 |
DK1933588T3 (da) | 2010-11-08 |
CN101263733A (zh) | 2008-09-10 |
TW200729992A (en) | 2007-08-01 |
WO2007032312A1 (fr) | 2007-03-22 |
US8141678B2 (en) | 2012-03-27 |
TWI405471B (zh) | 2013-08-11 |
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