DE602005018558D1 - Festkörperabbildungsvorrichtung, Herstellungsverfahren und Ansteuerverfahren dafür und Kamera - Google Patents
Festkörperabbildungsvorrichtung, Herstellungsverfahren und Ansteuerverfahren dafür und KameraInfo
- Publication number
- DE602005018558D1 DE602005018558D1 DE602005018558T DE602005018558T DE602005018558D1 DE 602005018558 D1 DE602005018558 D1 DE 602005018558D1 DE 602005018558 T DE602005018558 T DE 602005018558T DE 602005018558 T DE602005018558 T DE 602005018558T DE 602005018558 D1 DE602005018558 D1 DE 602005018558D1
- Authority
- DE
- Germany
- Prior art keywords
- camera
- manufacturing
- imaging device
- solid state
- state imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003384 imaging method Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000007787 solid Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
- H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers
- H01L27/14843—Interline transfer
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004221981A JP4725049B2 (ja) | 2004-07-29 | 2004-07-29 | 固体撮像装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005018558D1 true DE602005018558D1 (de) | 2010-02-04 |
Family
ID=35311292
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005023391T Active DE602005023391D1 (de) | 2004-07-29 | 2005-07-25 | Festkörper-Bildaufnahmevorrichtung, Herstellungsverfahren und Ansteuerverfahren dazu, und Kamera |
DE602005018558T Active DE602005018558D1 (de) | 2004-07-29 | 2005-07-25 | Festkörperabbildungsvorrichtung, Herstellungsverfahren und Ansteuerverfahren dafür und Kamera |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005023391T Active DE602005023391D1 (de) | 2004-07-29 | 2005-07-25 | Festkörper-Bildaufnahmevorrichtung, Herstellungsverfahren und Ansteuerverfahren dazu, und Kamera |
Country Status (7)
Country | Link |
---|---|
US (7) | US7348614B2 (de) |
EP (4) | EP1622202B1 (de) |
JP (1) | JP4725049B2 (de) |
KR (1) | KR101104439B1 (de) |
CN (2) | CN100454983C (de) |
DE (2) | DE602005023391D1 (de) |
TW (1) | TWI282242B (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4281613B2 (ja) * | 2004-05-07 | 2009-06-17 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法、及び固体撮像素子の駆動方法 |
JP4725049B2 (ja) * | 2004-07-29 | 2011-07-13 | ソニー株式会社 | 固体撮像装置およびその製造方法 |
TW200746409A (en) * | 2005-12-01 | 2007-12-16 | Matsushita Electric Ind Co Ltd | Solid-state image pickup device and camera including the same |
JP2008060198A (ja) * | 2006-08-30 | 2008-03-13 | Sony Corp | 固体撮像装置の製造方法 |
JP4872779B2 (ja) * | 2007-04-24 | 2012-02-08 | ソニー株式会社 | 転送パルス供給回路及び固体撮像装置 |
JP4344759B2 (ja) * | 2007-06-15 | 2009-10-14 | シャープ株式会社 | 固体撮像素子およびその製造方法、固体撮像装置、電子情報機器 |
US8120130B2 (en) * | 2007-06-21 | 2012-02-21 | Panasonic Corporation | Solid-state imaging device and method for manufacturing the same |
JP5176453B2 (ja) * | 2007-09-27 | 2013-04-03 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法及び撮像装置 |
US8395686B2 (en) * | 2007-12-06 | 2013-03-12 | Sony Corporation | Solid-state imaging device, method of manufacturing the same, and camera |
JP2009176800A (ja) * | 2008-01-22 | 2009-08-06 | Sony Corp | 固体撮像装置およびその製造方法 |
JP2009238875A (ja) * | 2008-03-26 | 2009-10-15 | Panasonic Corp | 固体撮像装置 |
JP5296406B2 (ja) * | 2008-04-02 | 2013-09-25 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
JP4835631B2 (ja) | 2008-04-21 | 2011-12-14 | ソニー株式会社 | 固体撮像装置及び電子機器の製造方法 |
JP2010073901A (ja) * | 2008-09-18 | 2010-04-02 | Sony Corp | 固体撮像装置、固体撮像装置の製造方法、及び電子機器 |
JP2010074081A (ja) * | 2008-09-22 | 2010-04-02 | Panasonic Corp | 固体撮像装置 |
JP2010177599A (ja) | 2009-01-30 | 2010-08-12 | Panasonic Corp | 固体撮像装置及びその製造方法 |
JP5375142B2 (ja) * | 2009-02-05 | 2013-12-25 | ソニー株式会社 | 固体撮像装置、固体撮像装置の駆動方法、及び電子機器 |
WO2010103814A1 (ja) * | 2009-03-11 | 2010-09-16 | パナソニック株式会社 | 固体撮像装置 |
JP5452511B2 (ja) * | 2011-01-14 | 2014-03-26 | 浜松ホトニクス株式会社 | 固体撮像装置 |
JP5680979B2 (ja) | 2011-01-20 | 2015-03-04 | 浜松ホトニクス株式会社 | 固体撮像装置 |
JP6106382B2 (ja) * | 2012-08-24 | 2017-03-29 | シャープ株式会社 | 固体撮像素子およびその製造方法、電子情報機器 |
JP7067221B2 (ja) * | 2018-04-12 | 2022-05-16 | コニカミノルタ株式会社 | X線撮影システム |
CN110444648B (zh) * | 2019-07-29 | 2020-09-04 | 南京中电熊猫平板显示科技有限公司 | 微型发光二极管阵列显示背板及其制造方法和修复方法 |
CN112017596A (zh) * | 2020-09-11 | 2020-12-01 | 京东方科技集团股份有限公司 | 一种显示面板、亮度调整方法及显示装置 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0821705B2 (ja) * | 1986-03-10 | 1996-03-04 | 株式会社日立製作所 | 電荷移送形固体撮像素子 |
JP3123068B2 (ja) | 1990-09-05 | 2001-01-09 | ソニー株式会社 | 固体撮像装置 |
JPH0575930A (ja) | 1991-09-12 | 1993-03-26 | Canon Inc | 静止画撮像装置 |
EP0495503B1 (de) | 1991-01-17 | 1997-03-26 | Sony Corporation | CCD-Bildaufnahmevorrichtung |
JPH05267356A (ja) * | 1992-03-23 | 1993-10-15 | Sony Corp | 半導体装置およびその製造方法 |
JPH05315588A (ja) * | 1992-05-13 | 1993-11-26 | Nec Corp | 固体撮像装置およびその製造方法 |
JP2878546B2 (ja) * | 1993-02-16 | 1999-04-05 | シャープ株式会社 | 固体撮像装置及びその製造方法 |
JPH06268192A (ja) * | 1993-03-12 | 1994-09-22 | Toshiba Corp | 固体撮像装置 |
JP3456000B2 (ja) | 1993-05-17 | 2003-10-14 | ソニー株式会社 | 固体撮像素子及びその製造方法 |
JP2571011B2 (ja) * | 1993-12-20 | 1997-01-16 | 日本電気株式会社 | 半導体装置の製造方法 |
JPH07283387A (ja) | 1994-04-14 | 1995-10-27 | Sony Corp | 固体撮像素子 |
JPH08236743A (ja) | 1995-02-27 | 1996-09-13 | Sony Corp | 電荷転送素子 |
KR0151266B1 (ko) * | 1995-06-22 | 1998-10-01 | 문정환 | 고체촬상소자 |
JPH09172156A (ja) * | 1995-12-20 | 1997-06-30 | Toshiba Corp | 固体撮像素子及びその製造方法 |
JPH09219506A (ja) * | 1996-02-07 | 1997-08-19 | Sony Corp | 固体撮像素子 |
KR100209758B1 (ko) * | 1996-06-26 | 1999-07-15 | 구본준 | 고체 촬상 소자 및 그의 제조 방법 |
JP2943714B2 (ja) | 1996-08-22 | 1999-08-30 | 日本電気株式会社 | 固体撮像装置 |
JP3329291B2 (ja) * | 1998-02-06 | 2002-09-30 | 日本電気株式会社 | 電荷転送装置 |
JP2894341B1 (ja) * | 1998-03-12 | 1999-05-24 | 日本電気株式会社 | 固体撮像装置の駆動方法 |
JP3988239B2 (ja) * | 1998-03-19 | 2007-10-10 | ソニー株式会社 | 固体撮像素子及びその製造方法 |
JP2000022134A (ja) * | 1998-07-01 | 2000-01-21 | Matsushita Electron Corp | 固体撮像装置およびその駆動方法 |
JP4178638B2 (ja) | 1998-12-25 | 2008-11-12 | ソニー株式会社 | 固体撮像素子及びその駆動方法 |
JP4397989B2 (ja) * | 1998-12-28 | 2010-01-13 | 浜松ホトニクス株式会社 | 半導体エネルギー検出器 |
JP3991543B2 (ja) * | 2000-01-11 | 2007-10-17 | 株式会社日立製作所 | 撮像装置 |
JP2001352050A (ja) | 2000-06-07 | 2001-12-21 | Sony Corp | 固体撮像装置およびその製造方法 |
JP2002076320A (ja) | 2000-08-28 | 2002-03-15 | Sony Corp | 固体撮像素子 |
JP2002076319A (ja) | 2000-08-28 | 2002-03-15 | Sony Corp | 固体撮像素子 |
US6809359B2 (en) * | 2001-05-16 | 2004-10-26 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device, method for manufacturing the same, and method for driving the same |
JP4404239B2 (ja) | 2001-08-15 | 2010-01-27 | 株式会社リコー | 画像形成装置 |
KR100945467B1 (ko) * | 2001-10-09 | 2010-03-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 스위칭소자, 표시장치, 그 스위칭소자를 사용한 발광장치및 반도체장치 |
JP4249433B2 (ja) * | 2002-05-15 | 2009-04-02 | Necエレクトロニクス株式会社 | 電荷転送素子及びその製造方法 |
JP2004221981A (ja) | 2003-01-15 | 2004-08-05 | Fujitsu Ltd | 電話機及びコンピュータプログラム |
JP4725049B2 (ja) * | 2004-07-29 | 2011-07-13 | ソニー株式会社 | 固体撮像装置およびその製造方法 |
-
2004
- 2004-07-29 JP JP2004221981A patent/JP4725049B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-12 US US11/179,963 patent/US7348614B2/en active Active
- 2005-07-19 TW TW094124348A patent/TWI282242B/zh not_active IP Right Cessation
- 2005-07-25 EP EP05016095A patent/EP1622202B1/de not_active Expired - Fee Related
- 2005-07-25 EP EP10008240A patent/EP2259317B1/de not_active Expired - Fee Related
- 2005-07-25 EP EP10006024A patent/EP2224488B9/de not_active Expired - Fee Related
- 2005-07-25 DE DE602005023391T patent/DE602005023391D1/de active Active
- 2005-07-25 DE DE602005018558T patent/DE602005018558D1/de active Active
- 2005-07-25 EP EP08006118A patent/EP1950809B1/de not_active Expired - Fee Related
- 2005-07-27 CN CNB200510087556XA patent/CN100454983C/zh not_active Expired - Fee Related
- 2005-07-27 CN CN2008101774485A patent/CN101425527B/zh not_active Expired - Fee Related
- 2005-07-29 KR KR1020050069297A patent/KR101104439B1/ko not_active IP Right Cessation
-
2007
- 2007-03-02 US US11/681,436 patent/US7534644B2/en not_active Expired - Fee Related
- 2007-03-02 US US11/681,433 patent/US7446358B2/en not_active Expired - Fee Related
- 2007-03-02 US US11/681,440 patent/US7667251B2/en active Active
-
2009
- 2009-07-07 US US12/498,474 patent/US8883542B2/en not_active Expired - Fee Related
- 2009-07-07 US US12/498,472 patent/US7952125B2/en active Active
- 2009-07-07 US US12/498,471 patent/US8149306B2/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |