DE602004028716D1 - Festkörperbildsensor und Herstellungsverfahren - Google Patents

Festkörperbildsensor und Herstellungsverfahren

Info

Publication number
DE602004028716D1
DE602004028716D1 DE602004028716T DE602004028716T DE602004028716D1 DE 602004028716 D1 DE602004028716 D1 DE 602004028716D1 DE 602004028716 T DE602004028716 T DE 602004028716T DE 602004028716 T DE602004028716 T DE 602004028716T DE 602004028716 D1 DE602004028716 D1 DE 602004028716D1
Authority
DE
Germany
Prior art keywords
image sensor
manufacturing process
solid state
state image
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004028716T
Other languages
English (en)
Inventor
Narumi Ohkawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Semiconductor Ltd
Original Assignee
Fujitsu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Semiconductor Ltd filed Critical Fujitsu Semiconductor Ltd
Publication of DE602004028716D1 publication Critical patent/DE602004028716D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1463—Pixel isolation structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14645—Colour imagers
DE602004028716T 2004-07-16 2004-11-30 Festkörperbildsensor und Herstellungsverfahren Active DE602004028716D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004209681A JP4530747B2 (ja) 2004-07-16 2004-07-16 固体撮像装置及びその製造方法

Publications (1)

Publication Number Publication Date
DE602004028716D1 true DE602004028716D1 (de) 2010-09-30

Family

ID=34930864

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004028716T Active DE602004028716D1 (de) 2004-07-16 2004-11-30 Festkörperbildsensor und Herstellungsverfahren

Country Status (7)

Country Link
US (1) US7119387B2 (de)
EP (1) EP1617479B1 (de)
JP (1) JP4530747B2 (de)
KR (1) KR100614072B1 (de)
CN (1) CN100428485C (de)
DE (1) DE602004028716D1 (de)
TW (1) TWI249244B (de)

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JP4843951B2 (ja) * 2005-01-27 2011-12-21 ソニー株式会社 固体撮像装置の製造方法、固体撮像装置およびカメラ
JP4742602B2 (ja) * 2005-02-01 2011-08-10 ソニー株式会社 固体撮像装置及びその製造方法
US20060183323A1 (en) * 2005-02-14 2006-08-17 Omnivision Technologies, Inc. Salicide process using CMP for image sensor
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KR100653716B1 (ko) * 2005-07-19 2006-12-05 삼성전자주식회사 이미지 센서 및 그 제조 방법
JP2007048893A (ja) * 2005-08-09 2007-02-22 Fujifilm Corp 固体撮像素子およびその製造方法
JP4807014B2 (ja) * 2005-09-02 2011-11-02 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および撮像装置
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US7763913B2 (en) 2006-12-12 2010-07-27 Aptina Imaging Corporation Imaging method, apparatus, and system providing improved imager quantum efficiency
KR100859481B1 (ko) 2006-12-29 2008-09-23 동부일렉트로닉스 주식회사 씨모스 이미지 센서 및 그 제조방법
US8072513B2 (en) * 2007-05-02 2011-12-06 Canon Kabushiki Kaisha Image capturing system, signal processing circuit, and signal processing method
JP2009065156A (ja) * 2007-09-06 2009-03-26 Dongbu Hitek Co Ltd イメージセンサーの製造方法
US20090121264A1 (en) * 2007-11-12 2009-05-14 Ching-Hung Kao Cmos image sensor and method of forming the same
KR101374301B1 (ko) * 2007-11-15 2014-03-17 삼성전자 주식회사 이미지 센서
JP2009253559A (ja) * 2008-04-03 2009-10-29 Sharp Corp 固体撮像装置および電子情報機器
JP4492736B2 (ja) * 2008-06-12 2010-06-30 ソニー株式会社 半導体集積回路
US7833819B2 (en) * 2008-07-23 2010-11-16 Aptina Imaging Corporation Method and apparatus for decreasing storage node parasitic charge in active pixel image sensors
JP5282543B2 (ja) * 2008-11-28 2013-09-04 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および撮像装置
JP5531417B2 (ja) * 2009-02-12 2014-06-25 株式会社ニコン 固体撮像装置
JP5322816B2 (ja) * 2009-07-15 2013-10-23 キヤノン株式会社 撮像装置およびその制御方法
JP5493669B2 (ja) * 2009-10-07 2014-05-14 ソニー株式会社 固体撮像装置、撮像装置、および固体撮像装置の製造方法
JP5564918B2 (ja) * 2009-12-03 2014-08-06 ソニー株式会社 撮像素子およびカメラシステム
TW201129087A (en) * 2010-02-09 2011-08-16 Novatek Microelectronics Corp Image sensor
JP5558859B2 (ja) * 2010-02-18 2014-07-23 キヤノン株式会社 固体撮像装置および固体撮像装置の製造方法
JP2012182377A (ja) * 2011-03-02 2012-09-20 Sony Corp 固体撮像装置
JP5971565B2 (ja) * 2011-06-22 2016-08-17 パナソニックＩｐマネジメント株式会社 固体撮像装置
JP5677238B2 (ja) 2011-08-29 2015-02-25 株式会社日立製作所 固体撮像装置
JP5930650B2 (ja) 2011-10-07 2016-06-08 キヤノン株式会社 半導体装置の製造方法
JP5355740B2 (ja) * 2012-04-02 2013-11-27 キヤノン株式会社 光電変換装置の製造方法
KR101989907B1 (ko) * 2012-05-31 2019-06-17 삼성전자주식회사 유기 이미지 센서 및 그 제조방법
JP5991739B2 (ja) * 2012-06-15 2016-09-14 キヤノン株式会社 固体撮像装置およびその製造方法、ならびにカメラ
CN103491323B (zh) * 2013-09-02 2018-10-16 上海集成电路研发中心有限公司 一种cmos图像传感器的像素单元和阵列及其制作方法
US9560294B2 (en) * 2014-12-10 2017-01-31 Semiconductor Components Industries, Llc Systems and methods for pixel-level dark current compensation in image sensors
JP2017045838A (ja) * 2015-08-26 2017-03-02 ルネサスエレクトロニクス株式会社 撮像装置およびその製造方法
JP7121468B2 (ja) * 2017-02-24 2022-08-18 ブリルニクス シンガポール プライベート リミテッド 固体撮像装置、固体撮像装置の製造方法、および電子機器
JP2019029448A (ja) * 2017-07-27 2019-02-21 キヤノン株式会社 撮像装置、カメラおよび撮像装置の製造方法
CN109273473A (zh) * 2018-09-25 2019-01-25 德淮半导体有限公司 图像传感器及其制造方法以及电子装置
CN110784634B (zh) * 2019-11-15 2021-10-29 Oppo广东移动通信有限公司 图像传感器、控制方法、摄像头组件及移动终端
CN113130516A (zh) * 2020-01-15 2021-07-16 联华电子股份有限公司 半导体影像感测元件及其制作方法
CN111769130B (zh) * 2020-07-17 2021-10-08 山东大学 一种cmos像素传感器

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Also Published As

Publication number Publication date
EP1617479A3 (de) 2006-11-08
JP2006032672A (ja) 2006-02-02
CN100428485C (zh) 2008-10-22
KR20060006718A (ko) 2006-01-19
TWI249244B (en) 2006-02-11
JP4530747B2 (ja) 2010-08-25
KR100614072B1 (ko) 2006-08-22
US7119387B2 (en) 2006-10-10
EP1617479A2 (de) 2006-01-18
TW200605340A (en) 2006-02-01
US20060011952A1 (en) 2006-01-19
CN1722454A (zh) 2006-01-18
EP1617479B1 (de) 2010-08-18

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