DE60131384D1 - Harzzusammensetzung mit exzellentem dielektrischem verhalten, verfahren zur herstellung einer harzzusammensetzung, mit der zusammensetzung hergestellter lack, verfahren zur herstellung des lacks, mit dem lack hergestellte schichtplatten sowie metallbeschichtetes laminat - Google Patents
Harzzusammensetzung mit exzellentem dielektrischem verhalten, verfahren zur herstellung einer harzzusammensetzung, mit der zusammensetzung hergestellter lack, verfahren zur herstellung des lacks, mit dem lack hergestellte schichtplatten sowie metallbeschichtetes laminatInfo
- Publication number
- DE60131384D1 DE60131384D1 DE60131384T DE60131384T DE60131384D1 DE 60131384 D1 DE60131384 D1 DE 60131384D1 DE 60131384 T DE60131384 T DE 60131384T DE 60131384 T DE60131384 T DE 60131384T DE 60131384 D1 DE60131384 D1 DE 60131384D1
- Authority
- DE
- Germany
- Prior art keywords
- paint
- resin composition
- produced
- composition
- preparing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 2
- 239000003973 paint Substances 0.000 title 2
- 238000010030 laminating Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 238000010422 painting Methods 0.000 title 1
- -1 cyanate compound Chemical class 0.000 abstract 5
- 229910020485 SiO4/2 Inorganic materials 0.000 abstract 1
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 229920005573 silicon-containing polymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/065—Preparatory processes
- C08G73/0655—Preparatory processes from polycyanurates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000078792 | 2000-03-21 | ||
JP2000078792 | 2000-03-21 | ||
JP2000078796 | 2000-03-21 | ||
JP2000078796 | 2000-03-21 | ||
PCT/JP2001/002237 WO2001070885A1 (fr) | 2000-03-21 | 2001-03-21 | Composition de resine a caracteristiques dielectriques elevees, procede de fabrication de ladite composition, vernis prepare a partir de ladite composition, procede de production dudit vernis, preimpregne prepare a partir de ladite composition et dudit vernis, stratifie revetu de metal |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60131384D1 true DE60131384D1 (de) | 2007-12-27 |
DE60131384T2 DE60131384T2 (de) | 2008-09-04 |
Family
ID=26587984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2001631384 Expired - Lifetime DE60131384T2 (de) | 2000-03-21 | 2001-03-21 | Harzzusammensetzung mit exzellentem dielektrischem verhalten, verfahren zur herstellung einer harzzusammensetzung, mit der zusammensetzung hergestellter lack, verfahren zur herstellung des lacks, mit dem lack hergestellte schichtplatten sowie metallbeschichtetes laminat |
Country Status (8)
Country | Link |
---|---|
US (2) | US7157506B2 (de) |
EP (1) | EP1275696B1 (de) |
KR (2) | KR20050055042A (de) |
CN (1) | CN100506917C (de) |
AT (1) | ATE378379T1 (de) |
DE (1) | DE60131384T2 (de) |
TW (2) | TWI279420B (de) |
WO (1) | WO2001070885A1 (de) |
Families Citing this family (31)
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KR20100094586A (ko) * | 2002-09-30 | 2010-08-26 | 히다치 가세고교 가부시끼가이샤 | 인쇄 배선판용 수지 조성물, 및 이것을 사용한 와니스, 프리프레그 및 금속 피복 적층판 |
AU2002953570A0 (en) * | 2002-12-24 | 2003-01-16 | Robert Bosch Gmbh | Polymer compositions |
AU2003208142B2 (en) * | 2002-12-24 | 2005-04-07 | Robert Bosch Gmbh | Polymer compositions |
US7056571B2 (en) | 2002-12-24 | 2006-06-06 | Matsushita Electric Industrial Co., Ltd. | Wiring board and its production process |
JP2007524723A (ja) * | 2003-06-25 | 2007-08-30 | ダウ グローバル テクノロジーズ インコーポレイティド | ポリマー組成物−腐食防止剤 |
KR100561070B1 (ko) * | 2003-09-05 | 2006-03-15 | 주식회사 엘지화학 | 고속전송 회로기판용 열경화성 수지 조성물 |
TWI429692B (zh) * | 2004-03-04 | 2014-03-11 | Hitachi Chemical Co Ltd | Pre-paste, paste metal foil laminates and use these printed circuit boards |
TW200626659A (en) * | 2004-11-05 | 2006-08-01 | Hitachi Chemical Co Ltd | Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same |
US7326546B2 (en) | 2005-03-10 | 2008-02-05 | Ajinomoto Co., Inc. | Purine-derived substance-producing bacterium and a method for producing purine-derived substance |
CN100400572C (zh) * | 2005-12-14 | 2008-07-09 | 浙江大学 | 聚氨酯弹性体和双环戊二烯型氰酸酯树脂改性体及制备方法 |
JP4988218B2 (ja) * | 2006-02-13 | 2012-08-01 | 株式会社日立製作所 | 低誘電損失樹脂の製造方法 |
JP2007224162A (ja) * | 2006-02-23 | 2007-09-06 | Matsushita Electric Works Ltd | 難燃性樹脂組成物、プリプレグ、樹脂シート、成形品 |
KR100861645B1 (ko) * | 2006-03-17 | 2008-10-07 | 주식회사 엘지화학 | 난연성 수지 조성물, 이를 이용한 프리프레그, 및 이를이용한 동박 적층판 |
DE102006022372A1 (de) | 2006-05-12 | 2007-11-15 | Airbus Deutschland Gmbh | Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Prepregharze für Honeycomb-Sandwichbauteile mit exzellenten Oberflächen |
US8084765B2 (en) * | 2007-05-07 | 2011-12-27 | Xerox Corporation | Electronic device having a dielectric layer |
KR100823998B1 (ko) * | 2007-05-28 | 2008-04-23 | 전자부품연구원 | 동박적층판, 인쇄회로기판 및 동박적층판의 제조방법 |
KR100835782B1 (ko) | 2007-06-26 | 2008-06-09 | 주식회사 두산 | 인쇄회로기판용 수지 조성물, 이를 이용한 복합기재 및동박 적층판 |
EP2098571A1 (de) * | 2008-03-07 | 2009-09-09 | Robert Bosch GmbH | Modifiziertes Reaktionsharz |
CN102134431B (zh) * | 2010-01-22 | 2013-06-05 | 南亚塑胶工业股份有限公司 | 积层板用低介电树脂清漆组成物及其制法 |
JP5148648B2 (ja) * | 2010-03-19 | 2013-02-20 | 富士フイルム株式会社 | 難燃性樹脂組成物、その製造方法、及び成形品 |
WO2012018126A1 (ja) * | 2010-08-06 | 2012-02-09 | 日立化成工業株式会社 | 相容化樹脂の製造法、熱硬化性樹脂組成物、プリプレグ及び積層板 |
US10155835B2 (en) | 2011-08-09 | 2018-12-18 | Mitsubishi Gas Chemical Company, Inc. | Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition |
KR20140097272A (ko) * | 2011-11-01 | 2014-08-06 | 다우 코닝 코포레이션 | 고 유리 전이 온도 수지 제형 |
SG11201402889YA (en) | 2011-12-07 | 2014-11-27 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, and laminate |
TWI480345B (zh) * | 2012-11-23 | 2015-04-11 | Ind Tech Res Inst | 塗料及其製備方法及塗料所形成之薄膜 |
US9911521B2 (en) * | 2014-06-06 | 2018-03-06 | General Electric Company | Curable composition for electrical machine, and associated method |
KR102167547B1 (ko) * | 2014-06-19 | 2020-10-19 | 엘지이노텍 주식회사 | 무기 충전재 |
CN104559757A (zh) * | 2014-12-23 | 2015-04-29 | 王新民 | 一种电绝缘的硅氧烷清漆 |
CN107860833A (zh) * | 2017-10-20 | 2018-03-30 | 广东生益科技股份有限公司 | 氰酸酯单体含量的测定方法 |
CN112111059B (zh) * | 2019-06-21 | 2022-08-30 | 中国科学院化学研究所 | 一种改性氰酸酯树脂及其制备方法和用途 |
US20240247107A1 (en) * | 2021-06-01 | 2024-07-25 | Wacker Chemie Ag | Cross-linkable organosiloxane-modified reaction resins |
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GB1497960A (en) | 1975-06-27 | 1978-01-12 | Voith Turbo Kg | Hydrodynamic couplings |
JPS6118937A (ja) | 1984-07-06 | 1986-01-27 | Mitsubishi Electric Corp | 工業用テレビカメラの照明装置 |
JPS61272243A (ja) | 1985-05-28 | 1986-12-02 | Hitachi Chem Co Ltd | 印刷配線板用プリプレグの製造方法 |
JPS62275744A (ja) | 1986-05-26 | 1987-11-30 | 松下電工株式会社 | 積層板 |
JPH066727B2 (ja) | 1986-07-24 | 1994-01-26 | 住友特殊金属株式会社 | 永久磁石材料用原料粉末の製造方法 |
JPH066728B2 (ja) | 1986-07-24 | 1994-01-26 | 住友特殊金属株式会社 | 永久磁石材料用原料粉末の製造方法 |
JP3069367B2 (ja) | 1990-08-07 | 2000-07-24 | 旭化成工業株式会社 | 硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体 |
JP3219795B2 (ja) | 1991-09-20 | 2001-10-15 | マツダ株式会社 | 車両のアンチスキッドブレーキ装置 |
JP2653603B2 (ja) | 1992-05-14 | 1997-09-17 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物 |
JPH0692533A (ja) | 1992-09-11 | 1994-04-05 | Ricoh Co Ltd | 画像形成装置の後処理装置 |
JP3466304B2 (ja) | 1994-12-26 | 2003-11-10 | 日立化成工業株式会社 | 熱硬化性樹脂組成物 |
KR100272785B1 (ko) * | 1995-06-27 | 2000-11-15 | 우찌가사끼 이사오 | 인쇄배선판용프리프래그,수지니스,수지조성물및상기물질을사용하여제조된인쇄배선판용적층판 |
JPH10212336A (ja) | 1997-01-31 | 1998-08-11 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、この樹脂組成物を用いたプリプレグ及びこのプリプレグを用いた積層板 |
JP3261062B2 (ja) | 1997-03-31 | 2002-02-25 | 日立化成工業株式会社 | 印刷配線板用樹脂ワニス及びそれを用いたプリプレグ、金属張り積層板の製造方法 |
DE69807793T2 (de) | 1997-07-04 | 2003-08-14 | Hitachi Chemical Co., Ltd. | Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte |
JP3382508B2 (ja) | 1997-07-04 | 2003-03-04 | 日立化成工業株式会社 | 印刷配線板用変性シアネートエステル樹脂ワニス及びその製造方法 |
JP3382507B2 (ja) | 1997-07-04 | 2003-03-04 | 日立化成工業株式会社 | 印刷配線板用変性シアネートエステル樹脂ワニス並びにこれを用いた積層板用プリプレグ及び金属張り積層板の製造方法 |
JP3382509B2 (ja) | 1997-07-07 | 2003-03-04 | 日立化成工業株式会社 | 印刷配線板用変性シアネートエステル樹脂ワニス及びその製造方法 |
JP4164883B2 (ja) * | 1997-08-19 | 2008-10-15 | 日立化成工業株式会社 | 印刷配線板用樹脂組成物及びそれを用いたプリプレグ、金属張り積層板 |
-
2001
- 2001-03-21 EP EP20010917481 patent/EP1275696B1/de not_active Expired - Lifetime
- 2001-03-21 CN CNB018070736A patent/CN100506917C/zh not_active Expired - Fee Related
- 2001-03-21 DE DE2001631384 patent/DE60131384T2/de not_active Expired - Lifetime
- 2001-03-21 TW TW92104855A patent/TWI279420B/zh not_active IP Right Cessation
- 2001-03-21 KR KR1020057007287A patent/KR20050055042A/ko not_active Application Discontinuation
- 2001-03-21 KR KR1020027012476A patent/KR20020081700A/ko not_active Application Discontinuation
- 2001-03-21 US US10/221,171 patent/US7157506B2/en not_active Expired - Fee Related
- 2001-03-21 WO PCT/JP2001/002237 patent/WO2001070885A1/ja active IP Right Grant
- 2001-03-21 TW TW90106627A patent/TWI279419B/zh not_active IP Right Cessation
- 2001-03-21 AT AT01917481T patent/ATE378379T1/de not_active IP Right Cessation
-
2006
- 2006-12-29 US US11/647,598 patent/US20070207326A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US7157506B2 (en) | 2007-01-02 |
WO2001070885A1 (fr) | 2001-09-27 |
TWI279419B (en) | 2007-04-21 |
EP1275696A1 (de) | 2003-01-15 |
ATE378379T1 (de) | 2007-11-15 |
EP1275696A4 (de) | 2005-04-13 |
TW200404088A (en) | 2004-03-16 |
TWI279420B (en) | 2007-04-21 |
CN100506917C (zh) | 2009-07-01 |
CN1419587A (zh) | 2003-05-21 |
KR20020081700A (ko) | 2002-10-30 |
EP1275696B1 (de) | 2007-11-14 |
KR20050055042A (ko) | 2005-06-10 |
US20070207326A1 (en) | 2007-09-06 |
US20030130412A1 (en) | 2003-07-10 |
DE60131384T2 (de) | 2008-09-04 |
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