DE60043469D1 - Chemisch-mechanische Polierkopfvorrichtung mit einem schwimmenden Waferhaltering und Waferträger mit mehrzoniger Polierdrucksteuerung - Google Patents

Chemisch-mechanische Polierkopfvorrichtung mit einem schwimmenden Waferhaltering und Waferträger mit mehrzoniger Polierdrucksteuerung

Info

Publication number
DE60043469D1
DE60043469D1 DE60043469T DE60043469T DE60043469D1 DE 60043469 D1 DE60043469 D1 DE 60043469D1 DE 60043469 T DE60043469 T DE 60043469T DE 60043469 T DE60043469 T DE 60043469T DE 60043469 D1 DE60043469 D1 DE 60043469D1
Authority
DE
Germany
Prior art keywords
carrier
housing
wafer
retaining ring
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60043469T
Other languages
English (en)
Inventor
Huey-Ming Wang
Gerard S Moloney
Scott Chin
Joh J Geraghity
William Dyson Jr
Tanlin K Dickey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/390,142 external-priority patent/US6368189B1/en
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60043469D1 publication Critical patent/DE60043469D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60043469T 1999-03-03 2000-02-24 Chemisch-mechanische Polierkopfvorrichtung mit einem schwimmenden Waferhaltering und Waferträger mit mehrzoniger Polierdrucksteuerung Expired - Fee Related DE60043469D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/261,112 US6231428B1 (en) 1999-03-03 1999-03-03 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US09/294,547 US6309290B1 (en) 1999-03-03 1999-04-19 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
US09/390,142 US6368189B1 (en) 1999-03-03 1999-09-03 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Publications (1)

Publication Number Publication Date
DE60043469D1 true DE60043469D1 (de) 2010-01-14

Family

ID=22992002

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60043469T Expired - Fee Related DE60043469D1 (de) 1999-03-03 2000-02-24 Chemisch-mechanische Polierkopfvorrichtung mit einem schwimmenden Waferhaltering und Waferträger mit mehrzoniger Polierdrucksteuerung

Country Status (4)

Country Link
US (3) US6231428B1 (de)
JP (2) JP2008302495A (de)
AT (1) ATE450345T1 (de)
DE (1) DE60043469D1 (de)

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Also Published As

Publication number Publication date
JP5185958B2 (ja) 2013-04-17
ATE450345T1 (de) 2009-12-15
US20010007810A1 (en) 2001-07-12
JP2008302495A (ja) 2008-12-18
US6309290B1 (en) 2001-10-30
US6231428B1 (en) 2001-05-15
JP2010120160A (ja) 2010-06-03

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