ATE450345T1 - Chemisch-mechanische polierkopfvorrichtung mit einem schwimmenden waferhaltering und waferträger mit mehrzoniger polierdrucksteuerung - Google Patents
Chemisch-mechanische polierkopfvorrichtung mit einem schwimmenden waferhaltering und waferträger mit mehrzoniger polierdrucksteuerungInfo
- Publication number
- ATE450345T1 ATE450345T1 AT07011957T AT07011957T ATE450345T1 AT E450345 T1 ATE450345 T1 AT E450345T1 AT 07011957 T AT07011957 T AT 07011957T AT 07011957 T AT07011957 T AT 07011957T AT E450345 T1 ATE450345 T1 AT E450345T1
- Authority
- AT
- Austria
- Prior art keywords
- carrier
- housing
- retaining ring
- chemical
- wafer
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/261,112 US6231428B1 (en) | 1999-03-03 | 1999-03-03 | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US09/294,547 US6309290B1 (en) | 1999-03-03 | 1999-04-19 | Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
US09/390,142 US6368189B1 (en) | 1999-03-03 | 1999-09-03 | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE450345T1 true ATE450345T1 (de) | 2009-12-15 |
Family
ID=22992002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07011957T ATE450345T1 (de) | 1999-03-03 | 2000-02-24 | Chemisch-mechanische polierkopfvorrichtung mit einem schwimmenden waferhaltering und waferträger mit mehrzoniger polierdrucksteuerung |
Country Status (4)
Country | Link |
---|---|
US (3) | US6231428B1 (de) |
JP (2) | JP2008302495A (de) |
AT (1) | ATE450345T1 (de) |
DE (1) | DE60043469D1 (de) |
Families Citing this family (69)
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US6336845B1 (en) | 1997-11-12 | 2002-01-08 | Lam Research Corporation | Method and apparatus for polishing semiconductor wafers |
US6368189B1 (en) * | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US6673216B2 (en) * | 1999-08-31 | 2004-01-06 | Semitool, Inc. | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
TW477733B (en) * | 1999-12-17 | 2002-03-01 | Fujikoshi Machinery Corp | Abrasive machine |
CN1319130C (zh) * | 1999-12-24 | 2007-05-30 | 株式会社荏原制作所<Del/> | 半导体基片处理装置及处理方法 |
KR100349216B1 (ko) * | 2000-04-19 | 2002-08-14 | 삼성전자 주식회사 | 화학적 기계적 연마장치의 연마헤드 |
US6354928B1 (en) * | 2000-04-21 | 2002-03-12 | Agere Systems Guardian Corp. | Polishing apparatus with carrier ring and carrier head employing like polarities |
JP4067307B2 (ja) * | 2000-04-27 | 2008-03-26 | 株式会社荏原製作所 | 回転保持装置 |
US6486550B1 (en) * | 2000-06-29 | 2002-11-26 | Lam Research Corporation | Locking mechanism for detachably securing a wafer carrier to a conveyor |
US6567718B1 (en) * | 2000-07-28 | 2003-05-20 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring consumable performance |
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EP1193031A1 (de) * | 2000-09-29 | 2002-04-03 | Infineon Technologies SC300 GmbH & Co. KG | Vorrichtung zum Polieren von Scheibenartigen Gegenständen |
JP3768399B2 (ja) * | 2000-11-17 | 2006-04-19 | 株式会社荏原製作所 | ドレッシング装置及びポリッシング装置 |
US6537141B1 (en) * | 2001-01-30 | 2003-03-25 | Koninklijke Philips Electronics N.V. | Non-slip polisher head backing film |
JP2002239895A (ja) * | 2001-01-31 | 2002-08-28 | Internatl Business Mach Corp <Ibm> | 研磨用保持部材、研磨方法および研磨装置 |
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US7217175B2 (en) * | 2001-05-29 | 2007-05-15 | Ebara Corporation | Polishing apparatus and polishing method |
US6893327B2 (en) * | 2001-06-04 | 2005-05-17 | Multi Planar Technologies, Inc. | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface |
KR100470227B1 (ko) * | 2001-06-07 | 2005-02-05 | 두산디앤디 주식회사 | 화학기계적 연마장치의 캐리어 헤드 |
TW505967B (en) * | 2001-10-11 | 2002-10-11 | Macronix Int Co Ltd | Wafer carrier structure of chemical mechanical polishing device |
US6746313B1 (en) | 2001-10-24 | 2004-06-08 | Lam Research Corporation | Polishing head assembly in an apparatus for chemical mechanical planarization |
DE10208414B4 (de) * | 2002-02-27 | 2013-01-10 | Advanced Micro Devices, Inc. | Vorrichtung mit einem verbesserten Polierkissenaufbereiter für das chemisch mechanische Polieren |
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EP1542832A1 (de) * | 2002-09-25 | 2005-06-22 | PPG Industries Ohio, Inc. | Polierkissen mit fenster zur planarisierung |
US7507148B2 (en) * | 2002-09-27 | 2009-03-24 | Sumco Techxiv Corporation | Polishing apparatus, polishing head and polishing method |
US20060180486A1 (en) * | 2003-04-21 | 2006-08-17 | Bennett David W | Modular panel and storage system for flat items such as media discs and holders therefor |
DE10332624A1 (de) * | 2003-07-17 | 2005-02-24 | Siltronic Ag | Verrundete Retainerringe |
US6869348B1 (en) | 2003-10-07 | 2005-03-22 | Strasbaugh | Retaining ring for wafer carriers |
US7063604B2 (en) * | 2004-03-05 | 2006-06-20 | Strasbaugh | Independent edge control for CMP carriers |
JP2006079800A (ja) * | 2004-08-11 | 2006-03-23 | Showa Denko Kk | 磁気記録媒体用シリコン基板及びその製造方法並びに磁気記録媒体 |
JP2006114198A (ja) * | 2004-09-17 | 2006-04-27 | Showa Denko Kk | 磁気記録媒体用シリコン基板及び磁気記録媒体 |
KR101186239B1 (ko) * | 2004-11-01 | 2012-09-27 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
KR100579865B1 (ko) * | 2004-12-23 | 2006-05-12 | 동부일렉트로닉스 주식회사 | 화학기계적 연마장치 |
JP4756884B2 (ja) * | 2005-03-14 | 2011-08-24 | 信越半導体株式会社 | 半導体ウエーハ用の研磨ヘッド及び研磨装置並びに研磨方法 |
JP4814677B2 (ja) | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
US7597609B2 (en) * | 2006-10-12 | 2009-10-06 | Iv Technologies Co., Ltd. | Substrate retaining ring for CMP |
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DE102006062017A1 (de) * | 2006-12-29 | 2008-07-03 | Advanced Micro Devices, Inc., Sunnyvale | Haltering für ein chemisch-mechanisches Poliergerät |
KR100814069B1 (ko) | 2007-03-30 | 2008-03-17 | 티아이씨덕흥 주식회사 | 에어백 방식의 웨이퍼 폴리싱 헤드 |
JP5199691B2 (ja) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置 |
CN101585150B (zh) * | 2008-05-20 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | 治具辅助定位装置 |
US20090311945A1 (en) * | 2008-06-17 | 2009-12-17 | Roland Strasser | Planarization System |
US8639377B2 (en) * | 2008-11-07 | 2014-01-28 | Applied Materials, Inc. | Metrology for GST film thickness and phase |
US8989890B2 (en) * | 2008-11-07 | 2015-03-24 | Applied Materials, Inc. | GST film thickness monitoring |
KR101110268B1 (ko) * | 2010-04-30 | 2012-02-16 | 삼성전자주식회사 | 로터리 유니온을 구동하는 공압 공급관의 꼬임을 방지하는 화학 기계식 연마시스템 |
KR101839453B1 (ko) * | 2011-08-02 | 2018-03-16 | 엘지디스플레이 주식회사 | 플렉시블 디스플레이 장치의 제조 장비 및 제조 방법 |
US20130196572A1 (en) * | 2012-01-27 | 2013-08-01 | Sen-Hou Ko | Conditioning a pad in a cleaning module |
JP5807580B2 (ja) * | 2012-02-15 | 2015-11-10 | 信越半導体株式会社 | 研磨ヘッド及び研磨装置 |
US9876129B2 (en) * | 2012-05-10 | 2018-01-23 | International Business Machines Corporation | Cone-shaped holes for high efficiency thin film solar cells |
US8920103B2 (en) * | 2012-05-10 | 2014-12-30 | Varian Semiconductor Equipment Associates, Inc. | Multi-cell rotary end effector mechanism with slip ring |
JP2014223684A (ja) | 2013-05-15 | 2014-12-04 | 株式会社東芝 | 研磨装置および研磨方法 |
US9321143B2 (en) | 2013-10-08 | 2016-04-26 | Seagate Technology Llc | Lapping device with lapping control feature and method |
JP2015188955A (ja) * | 2014-03-27 | 2015-11-02 | 株式会社荏原製作所 | 研磨装置 |
KR20140092273A (ko) * | 2014-05-30 | 2014-07-23 | 원종수 | 고강도 합금을 포함하는 씨엠피 장치의 연마헤드 |
JP6398939B2 (ja) * | 2015-10-07 | 2018-10-03 | 信越半導体株式会社 | テンプレートの測定方法及び評価方法 |
JP6447472B2 (ja) | 2015-11-26 | 2019-01-09 | 株式会社Sumco | ウェーハ研磨方法 |
US11267099B2 (en) * | 2017-09-27 | 2022-03-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical mechanical planarization membrane |
JP6917966B2 (ja) * | 2017-10-25 | 2021-08-11 | 株式会社荏原製作所 | 弾性膜のストレッチ動作プログラム、弾性膜のストレッチ動作方法、および研磨装置 |
JP7219009B2 (ja) * | 2018-03-27 | 2023-02-07 | 株式会社荏原製作所 | 基板保持装置およびドライブリングの製造方法 |
CN109551365B (zh) * | 2019-01-15 | 2023-12-08 | 合肥哈工普利世智能装备有限公司 | 等离子抛光夹持组件、等离子抛光机及其抛光方法 |
US11705354B2 (en) | 2020-07-10 | 2023-07-18 | Applied Materials, Inc. | Substrate handling systems |
CN114734338B (zh) * | 2022-04-07 | 2023-01-10 | 江阴市恒润传动科技有限公司 | 一种双向运动式快速作业的主轴轴承打磨设备 |
US20230381915A1 (en) * | 2022-05-27 | 2023-11-30 | Applied Materials, Inc. | Operation of clamping retainer for chemical mechanical polishing |
CN115401587B (zh) * | 2022-09-28 | 2023-06-27 | 浙江芯晖装备技术有限公司 | 一种抛光头及半导体晶圆平坦化设备 |
CN117884989A (zh) * | 2024-03-12 | 2024-04-16 | 成都洁立众泰科技有限公司 | 一种自动化上下料数控工具磨床及加工方法 |
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-
1999
- 1999-03-03 US US09/261,112 patent/US6231428B1/en not_active Expired - Lifetime
- 1999-04-19 US US09/294,547 patent/US6309290B1/en not_active Expired - Lifetime
-
2000
- 2000-02-24 AT AT07011957T patent/ATE450345T1/de not_active IP Right Cessation
- 2000-02-24 DE DE60043469T patent/DE60043469D1/de not_active Expired - Fee Related
-
2001
- 2001-02-13 US US09/782,818 patent/US20010007810A1/en not_active Abandoned
-
2008
- 2008-08-11 JP JP2008207305A patent/JP2008302495A/ja active Pending
-
2010
- 2010-02-01 JP JP2010020663A patent/JP5185958B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6231428B1 (en) | 2001-05-15 |
US6309290B1 (en) | 2001-10-30 |
US20010007810A1 (en) | 2001-07-12 |
JP5185958B2 (ja) | 2013-04-17 |
JP2010120160A (ja) | 2010-06-03 |
DE60043469D1 (de) | 2010-01-14 |
JP2008302495A (ja) | 2008-12-18 |
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