DE60116148D1 - System zur endpunktbestimmung beim chemisch-mechanischen polieren - Google Patents

System zur endpunktbestimmung beim chemisch-mechanischen polieren

Info

Publication number
DE60116148D1
DE60116148D1 DE60116148T DE60116148T DE60116148D1 DE 60116148 D1 DE60116148 D1 DE 60116148D1 DE 60116148 T DE60116148 T DE 60116148T DE 60116148 T DE60116148 T DE 60116148T DE 60116148 D1 DE60116148 D1 DE 60116148D1
Authority
DE
Germany
Prior art keywords
point
polishing pad
chemical
mechanical polishing
determination system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60116148T
Other languages
English (en)
Other versions
DE60116148T2 (de
Inventor
A Mikhaylich
Mike Ravkin
Yehiel Gotkis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE60116148D1 publication Critical patent/DE60116148D1/de
Application granted granted Critical
Publication of DE60116148T2 publication Critical patent/DE60116148T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE60116148T 2001-06-26 2001-06-26 System zur endpunktbestimmung beim chemisch-mechanischen polieren Expired - Fee Related DE60116148T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/020283 WO2003002301A1 (en) 2001-06-26 2001-06-26 End point detection system for chemical mechanical polishing applications

Publications (2)

Publication Number Publication Date
DE60116148D1 true DE60116148D1 (de) 2006-01-26
DE60116148T2 DE60116148T2 (de) 2006-08-31

Family

ID=21742667

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60116148T Expired - Fee Related DE60116148T2 (de) 2001-06-26 2001-06-26 System zur endpunktbestimmung beim chemisch-mechanischen polieren

Country Status (6)

Country Link
EP (1) EP1399294B1 (de)
JP (1) JP5027377B2 (de)
CN (1) CN1246125C (de)
AT (1) ATE313412T1 (de)
DE (1) DE60116148T2 (de)
WO (1) WO2003002301A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050066739A1 (en) * 2003-09-26 2005-03-31 Lam Research Corporation Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring
CN100369713C (zh) * 2005-04-11 2008-02-20 广东工业大学 一种化学机械法金刚石膜抛光装置及其抛光方法
JP5481417B2 (ja) * 2010-08-04 2014-04-23 株式会社東芝 半導体装置の製造方法
JP2012148376A (ja) * 2011-01-20 2012-08-09 Ebara Corp 研磨方法及び研磨装置
WO2013015750A1 (en) * 2011-07-25 2013-01-31 Hoya Glass Disk (Thailand) Ltd A method of manufacturing glass substrates for information recording medium
CN102441839B (zh) * 2011-11-11 2014-06-04 上海华力微电子有限公司 提高固定研磨料在研磨垫上进行cmp工艺稳定性的方法
CN102528664A (zh) * 2012-01-11 2012-07-04 上海理工大学 磨削砂轮表面磨粒温度测量装置
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
CN103978421B (zh) * 2013-02-07 2017-04-19 中芯国际集成电路制造(上海)有限公司 终点侦测方法及化学机械抛光系统的抛光方法
CN109719617B (zh) * 2017-10-30 2021-12-17 凯斯科技股份有限公司 基板处理装置
CN109719613B (zh) * 2017-10-30 2021-09-24 凯斯科技股份有限公司 基板处理装置及方法
CN109719615A (zh) * 2017-10-30 2019-05-07 凯斯科技股份有限公司 基板处理装置
EP3632254A1 (de) 2018-10-03 2020-04-08 The Swatch Group Research and Development Ltd Plastikarmband mit verminderter rauigkeit
KR101973712B1 (ko) * 2018-10-15 2019-04-29 안종팔 반도체 웨이퍼 세정장치에서 웨이퍼 표면 온도 실시간 모니터링 방법
US11355369B2 (en) * 2018-10-15 2022-06-07 Jongpal AHN Method of monitoring surface temperatures of wafers in real time in semiconductor wafer cleaning apparatus and temperature sensor for measuring surface temperatures of wafer
KR20200068785A (ko) * 2018-12-05 2020-06-16 삼성디스플레이 주식회사 연마 모니터링 시스템 및 연마 모니터링 방법
CN110900337B (zh) * 2019-12-06 2020-10-30 宿迁学院 一种用于金属件打磨的高精度打磨磨床

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0616362A3 (de) * 1993-03-15 1995-06-21 Tokyo Shibaura Electric Co Verfahren zum Polieren von Werkstücken und Vorrichtung dafür.
JPH0794452A (ja) * 1993-09-22 1995-04-07 Toshiba Corp 研磨方法及び研磨装置
JPH0724708A (ja) * 1993-07-15 1995-01-27 Toshiba Corp 研磨方法及び研磨装置
US5597442A (en) * 1995-10-16 1997-01-28 Taiwan Semiconductor Manufacturing Company Ltd. Chemical/mechanical planarization (CMP) endpoint method using measurement of polishing pad temperature
JPH09148281A (ja) * 1995-11-24 1997-06-06 Matsushita Electric Ind Co Ltd 研磨装置及び研磨方法
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6007408A (en) * 1997-08-21 1999-12-28 Micron Technology, Inc. Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates
TW398036B (en) * 1998-08-18 2000-07-11 Promos Technologies Inc Method of monitoring of chemical mechanical polishing end point and uniformity
US6325706B1 (en) * 1998-10-29 2001-12-04 Lam Research Corporation Use of zeta potential during chemical mechanical polishing for end point detection
JP2000340538A (ja) * 1999-05-31 2000-12-08 Hitachi Ltd 基板の平坦化方法および平坦化加工装置とそれを用いた半導体装置の製造方法

Also Published As

Publication number Publication date
WO2003002301A1 (en) 2003-01-09
JP2004522310A (ja) 2004-07-22
EP1399294A1 (de) 2004-03-24
JP5027377B2 (ja) 2012-09-19
EP1399294B1 (de) 2005-12-21
DE60116148T2 (de) 2006-08-31
CN1520348A (zh) 2004-08-11
ATE313412T1 (de) 2006-01-15
CN1246125C (zh) 2006-03-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee