KR970052712A - 반도체 웨이퍼용의 화학 기계적 연마 장치 - Google Patents

반도체 웨이퍼용의 화학 기계적 연마 장치 Download PDF

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Publication number
KR970052712A
KR970052712A KR1019960061950A KR19960061950A KR970052712A KR 970052712 A KR970052712 A KR 970052712A KR 1019960061950 A KR1019960061950 A KR 1019960061950A KR 19960061950 A KR19960061950 A KR 19960061950A KR 970052712 A KR970052712 A KR 970052712A
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KR
South Korea
Prior art keywords
pad
polishing
belt
wafer
slurry
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KR1019960061950A
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English (en)
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KR100239199B1 (ko
Inventor
야스시 시라이시
Original Assignee
가네꼬 히사시
닛뽕덴끼 가부시끼가이샤
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Publication of KR970052712A publication Critical patent/KR970052712A/ko
Application granted granted Critical
Publication of KR100239199B1 publication Critical patent/KR100239199B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/921—Pad for lens shaping tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

화학 기계적 연마(CMP)장치에서, 반도체 웨이퍼는 연마된 표면이 위로 향하도록 캐리어에 의해서 지지된다. 연마 벨트는 하나의 릴에 의해 공급되고, 연마될 웨이퍼의 표면과 접촉하여 가동하는 플러에 의해 다른 릴로 감긴다. 조절 패드는 밸트의 정변 또는 연마 표면을 웨이퍼와 마주보도록 조절한다. 노즐은 연마 슬러리를 웨이퍼와 마주보지 않는 벨트의 후면에 공급된다. 다수의 압박 롤러는 슬러리와 벨트를 웨이퍼의 표면에 대해 압박하면서, 벨트의 정면으로부터 슬러리가 유출하도록 한다. 벨트는 슬러리로 들어가는 불순물을 여과한다.

Description

반도체 웨이퍼용의 화학 기계적 연마장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명을 실시한 CMP장치의 도면

Claims (5)

  1. 반도체 웨이퍼 연마용 화학 기계적 연마(CMP)장치에 있어서, 상기 반도체 웨이퍼를 지지하는 캐리어와, 연마 슬러리를 유지하면서 반도체 웨이퍼를 연마하고, 상기 연마 슬러리가 상기 패드의 후면에서 정면으로 침투하도록 허용하는 패드를 구비하며, 상기 캐리어와 상기 패드는 연마될 반도체 웨이퍼의 표면이 위를 향하도록 위치되고, 상기 연마 슬러리는 상기 패드의 후면에 공급되는 것을 특징으로 하는 CMP장치.
  2. 제1항에 있어서, 상기 반도체 웨이퍼의 상기 표면에 맞대어 상기 패드를 압박하기 위해, 상기 패드를 매개로 상기 캐리어와 마주보는 다수의 압박 롤러를 추가로 구비하는 것을 특징으로 하는 CMP 장치.
  3. 제2항에 있어서, 개별적인 압박 롤러의 압력을 조절하기 위한 수단을 추가로 구비하는 것을 특징으로 하는 CMP장치.
  4. 제1항에 있어서, 상기 패드는 발포재료로 형성되고, 상기 패드의 후면에서 정면으로 갈수록 점차로 직경이 감소하는 셀들을 가진 것을 특징으로 하는 CMP장치.
  5. 제1항에 있어서, 상기 패드는 기다란 연마 벨트를 구비하는 것을 특징으로 하는 CMP 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960061950A 1995-12-06 1996-12-05 반도체 웨이퍼용의 화학 기계적 연마 장치 KR100239199B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7317884A JP2830907B2 (ja) 1995-12-06 1995-12-06 半導体基板研磨装置
JP95-317884 1995-12-06

Publications (2)

Publication Number Publication Date
KR970052712A true KR970052712A (ko) 1997-07-29
KR100239199B1 KR100239199B1 (ko) 2000-01-15

Family

ID=18093135

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960061950A KR100239199B1 (ko) 1995-12-06 1996-12-05 반도체 웨이퍼용의 화학 기계적 연마 장치

Country Status (3)

Country Link
US (1) US5810964A (ko)
JP (1) JP2830907B2 (ko)
KR (1) KR100239199B1 (ko)

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JP4734353B2 (ja) * 2008-02-05 2011-07-27 トッキ株式会社 ポリシング装置
JP5322730B2 (ja) * 2009-03-30 2013-10-23 富士紡ホールディングス株式会社 研磨パッド
JP5555460B2 (ja) * 2009-09-02 2014-07-23 ニッタ・ハース株式会社 研磨パッド及び研磨パッドの製造方法
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JP6134255B2 (ja) * 2013-11-21 2017-05-24 株式会社沖データ ベルト、転写ベルト、転写ベルトユニットおよび画像形成装置
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JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法
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CN114952642B (zh) * 2022-06-15 2023-10-31 安徽禾臣新材料有限公司 一种蓝宝石防护盖板抛光用阻尼布及其生产工艺

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Also Published As

Publication number Publication date
KR100239199B1 (ko) 2000-01-15
US5810964A (en) 1998-09-22
JPH09155723A (ja) 1997-06-17
JP2830907B2 (ja) 1998-12-02

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