DE60033773D1 - Lithographischer Apparat mit einem ausbalancierten Positionierungssystem - Google Patents

Lithographischer Apparat mit einem ausbalancierten Positionierungssystem

Info

Publication number
DE60033773D1
DE60033773D1 DE60033773T DE60033773T DE60033773D1 DE 60033773 D1 DE60033773 D1 DE 60033773D1 DE 60033773 T DE60033773 T DE 60033773T DE 60033773 T DE60033773 T DE 60033773T DE 60033773 D1 DE60033773 D1 DE 60033773D1
Authority
DE
Germany
Prior art keywords
positioning system
lithographic apparatus
balanced positioning
balanced
lithographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60033773T
Other languages
English (en)
Other versions
DE60033773T2 (de
Inventor
Yim Bun Patrick Kwan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Application granted granted Critical
Publication of DE60033773D1 publication Critical patent/DE60033773D1/de
Publication of DE60033773T2 publication Critical patent/DE60033773T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Vibration Prevention Devices (AREA)
DE60033773T 1999-12-21 2000-12-19 Lithographischer Apparat mit einem ausbalancierten Positionierungssystem Expired - Fee Related DE60033773T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99310371 1999-12-21
EP99310371 1999-12-21

Publications (2)

Publication Number Publication Date
DE60033773D1 true DE60033773D1 (de) 2007-04-19
DE60033773T2 DE60033773T2 (de) 2007-11-08

Family

ID=8241828

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60033773T Expired - Fee Related DE60033773T2 (de) 1999-12-21 2000-12-19 Lithographischer Apparat mit einem ausbalancierten Positionierungssystem

Country Status (5)

Country Link
US (3) US6449030B1 (de)
JP (4) JP4279449B2 (de)
KR (1) KR100570252B1 (de)
DE (1) DE60033773T2 (de)
TW (1) TW546551B (de)

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TWI347741B (en) * 2003-05-30 2011-08-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
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TWI245163B (en) * 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
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US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US7224432B2 (en) * 2004-05-14 2007-05-29 Canon Kabushiki Kaisha Stage device, exposure apparatus, and device manufacturing method
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US7193683B2 (en) * 2005-01-06 2007-03-20 Nikon Corporation Stage design for reflective optics
US7456935B2 (en) * 2005-04-05 2008-11-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing a positioning device for positioning an object table
US7696652B2 (en) * 2005-11-01 2010-04-13 Asml Netherlands B.V. Electromagnetic actuator, method of manufacturing a part of an electromagnetic actuator, and lithographic apparatus comprising and electromagnetic actuator
US20070268475A1 (en) * 2006-05-16 2007-11-22 Nikon Corporation System and method for controlling a stage assembly
US7502103B2 (en) * 2006-05-31 2009-03-10 Asml Netherlands B.V. Metrology tool, system comprising a lithographic apparatus and a metrology tool, and a method for determining a parameter of a substrate
US7538273B2 (en) 2006-08-08 2009-05-26 Asml Netherlands B.V. Cable connection to decrease the passing on of vibrations from a first object to a second object
US20080285004A1 (en) * 2007-05-18 2008-11-20 Nikon Corporation Monolithic, Non-Contact Six Degree-of-Freedom Stage Apparatus
NL1036161A1 (nl) * 2007-11-20 2009-05-25 Asml Netherlands Bv Combination of structure and an active damping system, and a lithographic apparatus.
WO2009110202A1 (ja) * 2008-03-07 2009-09-11 株式会社ニコン 移動体装置及び露光装置
US8144310B2 (en) 2008-04-14 2012-03-27 Asml Netherlands B.V. Positioning system, lithographic apparatus and device manufacturing method
WO2011108170A1 (ja) * 2010-03-04 2011-09-09 株式会社安川電機 ステージ装置
DE102011006024A1 (de) * 2011-03-24 2012-09-27 Carl Zeiss Smt Gmbh Anordnung zur Vibrationsisolation einer Nutzlast
JP5844468B2 (ja) * 2011-09-12 2016-01-20 マッパー・リソグラフィー・アイピー・ビー．ブイ． ターゲット位置決め装置、ターゲット位置決め装置を駆動する方法、およびそのようなターゲット位置決め装置を備えているリソグラフィシステム
NL2009902A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
WO2013160123A1 (en) * 2012-04-27 2013-10-31 Asml Netherlands B.V. Lithographic apparatus comprising an actuator, and method for protecting such actuator
CN103809384B (zh) * 2012-11-12 2016-03-09 上海微电子装备有限公司 工件台与掩模台公用的平衡质量系统及光刻机
JP6322718B6 (ja) * 2014-04-16 2018-07-11 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、リソグラフィ装置においてオブジェクトを位置決めするための方法、及びデバイス製造方法
DE102019207940A1 (de) * 2019-05-29 2020-12-03 Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg Verfahren zum dynamischen Wuchten eines Rotationskörpers

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Also Published As

Publication number Publication date
US20040041994A1 (en) 2004-03-04
TW546551B (en) 2003-08-11
KR100570252B1 (ko) 2006-04-12
JP4621765B2 (ja) 2011-01-26
JP2005333145A (ja) 2005-12-02
US6671036B2 (en) 2003-12-30
US20020048009A1 (en) 2002-04-25
JP2009141371A (ja) 2009-06-25
KR20010067452A (ko) 2001-07-12
US6924882B2 (en) 2005-08-02
DE60033773T2 (de) 2007-11-08
US6449030B1 (en) 2002-09-10
JP4279449B2 (ja) 2009-06-17
JP4490875B2 (ja) 2010-06-30
JP4914885B2 (ja) 2012-04-11
US20020191173A1 (en) 2002-12-19
JP2009135507A (ja) 2009-06-18
JP2001351856A (ja) 2001-12-21

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