DE60033775D1 - Lithographischer Apparat mit einem System zur Positionsdetektion - Google Patents

Lithographischer Apparat mit einem System zur Positionsdetektion

Info

Publication number
DE60033775D1
DE60033775D1 DE60033775T DE60033775T DE60033775D1 DE 60033775 D1 DE60033775 D1 DE 60033775D1 DE 60033775 T DE60033775 T DE 60033775T DE 60033775 T DE60033775 T DE 60033775T DE 60033775 D1 DE60033775 D1 DE 60033775D1
Authority
DE
Germany
Prior art keywords
detection system
position detection
lithographic apparatus
lithographic
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60033775T
Other languages
English (en)
Other versions
DE60033775T2 (de
Inventor
Thomas Josephus M Castenmiller
Andreas Bernardus Gerar Ariens
Martinus Hendricus Hendr Hoeks
Patrick David Vogelsang
Erik Roelof Loopstra
Yim Bun Patrick Kwan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Application granted granted Critical
Publication of DE60033775D1 publication Critical patent/DE60033775D1/de
Publication of DE60033775T2 publication Critical patent/DE60033775T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60033775T 1999-12-22 2000-12-20 Lithographischer Apparat mit einem System zur Positionsdetektion Expired - Fee Related DE60033775T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99310407 1999-12-22
EP99310407 1999-12-22

Publications (2)

Publication Number Publication Date
DE60033775D1 true DE60033775D1 (de) 2007-04-19
DE60033775T2 DE60033775T2 (de) 2007-11-29

Family

ID=8241829

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60033775T Expired - Fee Related DE60033775T2 (de) 1999-12-22 2000-12-20 Lithographischer Apparat mit einem System zur Positionsdetektion

Country Status (5)

Country Link
US (2) US6894261B2 (de)
JP (1) JP3880312B2 (de)
KR (1) KR100585464B1 (de)
DE (1) DE60033775T2 (de)
TW (1) TWI231405B (de)

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US7729030B2 (en) * 2002-10-21 2010-06-01 Hrl Laboratories, Llc Optical retro-reflective apparatus with modulation capability
SG147288A1 (en) * 2003-04-29 2008-11-28 Asml Netherlands Bv Lithographic apparatus, device manufacturing method and angular encoder
DE10327268B4 (de) * 2003-06-17 2010-12-23 Siemens Ag Vorrichtung zur Erkennung der Position und des Formats einer Filmkassette
JP4335084B2 (ja) * 2003-07-02 2009-09-30 エーエスエムエル ネザーランズ ビー．ブイ． 測定装置を有するリトグラフ投影装置
US7061579B2 (en) * 2003-11-13 2006-06-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352472B2 (en) * 2004-02-18 2008-04-01 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and method for determining z-displacement
US7315032B2 (en) * 2004-05-18 2008-01-01 Asml Netherlands B.V. Lithographic apparatus and a device manufacturing method
TWI252301B (en) * 2004-07-30 2006-04-01 Delta Electronics Inc Deposition system and film thickness monitoring device thereof
US7382857B2 (en) * 2004-12-10 2008-06-03 Carl Zeiss Ag X-ray catheter assembly
US7437911B2 (en) * 2004-12-15 2008-10-21 Asml Holding N.V. Method and system for operating an air gauge at programmable or constant standoff
US7224431B2 (en) * 2005-02-22 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100405222C (zh) * 2005-02-23 2008-07-23 上海微电子装备有限公司 七自由度定位机构
US7505152B2 (en) * 2005-02-24 2009-03-17 The Boeing Company Optical metrology system
US7394073B2 (en) * 2005-04-05 2008-07-01 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for ion beam angle measurement in two dimensions
US7515281B2 (en) 2005-04-08 2009-04-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102005062038A1 (de) * 2005-12-22 2007-06-28 Carl Zeiss Smt Ag Optisches Projektionssystem mit einer Positionsbestimmungseinrichtung
US7602489B2 (en) * 2006-02-22 2009-10-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7483120B2 (en) * 2006-05-09 2009-01-27 Asml Netherlands B.V. Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
JP4409552B2 (ja) * 2006-09-08 2010-02-03 住友重機械工業株式会社 ロール自動供給装置
US7804579B2 (en) 2007-06-21 2010-09-28 Asml Netherlands B.V. Control system, lithographic projection apparatus, method of controlling a support structure, and a computer program product
US8174671B2 (en) * 2007-06-21 2012-05-08 Asml Netherlands B.V. Lithographic projection apparatus and method for controlling a support structure
US7837907B2 (en) * 2007-07-20 2010-11-23 Molecular Imprints, Inc. Alignment system and method for a substrate in a nano-imprint process
US7847938B2 (en) * 2007-10-01 2010-12-07 Maskless Lithography, Inc. Alignment system for optical lithography
US8482732B2 (en) * 2007-10-01 2013-07-09 Maskless Lithography, Inc. Alignment system for various materials and material flows
US8111377B2 (en) * 2008-01-10 2012-02-07 Asml Netherlands B.V. Lithographic apparatus with an encoder arranged for defining a zero level
CN102519369A (zh) * 2011-12-16 2012-06-27 中国科学院西安光学精密机械研究所 测量反射式望远镜次镜六自由度对准误差的装置及方法
DE102013220214A1 (de) * 2013-10-07 2015-04-09 Dr. Johannes Heidenhain Gmbh Anordnung zur Positionierung eines Werkzeugs relativ zu einem Werkstück
CN104197850A (zh) * 2014-08-11 2014-12-10 东莞市乐琪光电科技有限公司 一种基于机器视觉的元件管脚检测方法及其装置
CN106461372B (zh) * 2014-09-03 2019-08-09 北京交通大学 单根光纤耦合双频激光六自由度误差同时测量系统
JP6376408B2 (ja) 2015-06-30 2018-08-22 三菱重工業株式会社 電磁パルス防護方法及び電磁パルス防護システム
JP6376407B2 (ja) * 2015-06-30 2018-08-22 三菱重工業株式会社 電磁パルス照射方法及び電磁パルス照射システム
DE102020124704B4 (de) * 2020-09-22 2022-06-23 Carl Zeiss Industrielle Messtechnik Gmbh Vorrichtung und Verfahren zur Erfassung einer räumlichen Position eines Körpers
CN114877809B (zh) * 2022-05-27 2023-10-20 中北大学 一种基于二维复合平面大量程光栅结构的位移测量系统

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4538069A (en) 1983-10-28 1985-08-27 Control Data Corporation Capacitance height gage applied in reticle position detection system for electron beam lithography apparatus
US4686531A (en) 1983-10-28 1987-08-11 Control Data Corporation Capacitance height gage applied in reticle position detection system for electron beam lithography apparatus
GB8420096D0 (en) 1984-08-07 1984-09-12 Putra Siregar N I Measurement of errors
US4676649A (en) * 1985-11-27 1987-06-30 Compact Spindle Bearing Corp. Multi-axis gas bearing stage assembly
NL8600639A (nl) * 1986-03-12 1987-10-01 Asm Lithography Bv Werkwijze voor het ten opzichte van elkaar uitrichten van een masker en een substraat en inrichting voor het uitvoeren van de werkwijze.
JP2606285B2 (ja) * 1988-06-07 1997-04-30 株式会社ニコン 露光装置および位置合わせ方法
NL8900991A (nl) * 1989-04-20 1990-11-16 Asm Lithography Bv Apparaat voor het afbeelden van een maskerpatroon op een substraat.
NL9001611A (nl) * 1990-07-16 1992-02-17 Asm Lithography Bv Apparaat voor het afbeelden van een maskerpatroon op een substraat.
NL9100215A (nl) * 1991-02-07 1992-09-01 Asm Lithography Bv Inrichting voor het repeterend afbeelden van een maskerpatroon op een substraat.
US5243195A (en) * 1991-04-25 1993-09-07 Nikon Corporation Projection exposure apparatus having an off-axis alignment system and method of alignment therefor
JP3306972B2 (ja) 1993-02-26 2002-07-24 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
KR0156800B1 (ko) 1995-02-10 1998-12-15 이대원 레이저 다이오드를 이용한 자동 초점 조절 장치
US5552608A (en) * 1995-06-26 1996-09-03 Philips Electronics North America Corporation Closed cycle gas cryogenically cooled radiation detector
US5907392A (en) * 1995-07-20 1999-05-25 Nikon Corporation Exposure apparatus
JP3689949B2 (ja) * 1995-12-19 2005-08-31 株式会社ニコン 投影露光装置、及び該投影露光装置を用いたパターン形成方法
US5995222A (en) * 1995-12-28 1999-11-30 Fuji Photo Optical Co., Ltd. Subject positioning device for optical interferometer
JPH11504770A (ja) * 1996-03-04 1999-04-27 アーエスエム リソグラフィ ベスローテン フェンノートシャップ マスクパターンをステップ及びスキャン結像するリソグラフィ装置
EP0824722B1 (de) * 1996-03-06 2001-07-25 Asm Lithography B.V. Differential-interferometer-system und lithographischer "step and scan" apparat ausgestattet mit diesem system
JPH1050604A (ja) * 1996-04-04 1998-02-20 Nikon Corp 位置管理方法及び位置合わせ方法
IL135139A0 (en) * 1997-09-19 2001-05-20 Nikon Corp Stage apparatus, scanning type exposure apparatus, and device produced with the same
US6020964A (en) * 1997-12-02 2000-02-01 Asm Lithography B.V. Interferometer system and lithograph apparatus including an interferometer system
JP3587343B2 (ja) * 1997-12-09 2004-11-10 キヤノン株式会社 面位置検出方法、露光装置およびデバイス製造方法
TW367407B (en) * 1997-12-22 1999-08-21 Asml Netherlands Bv Interferometer system with two wavelengths, and lithographic apparatus provided with such a system
US6160622A (en) * 1997-12-29 2000-12-12 Asm Lithography, B.V. Alignment device and lithographic apparatus comprising such a device
US6144025A (en) * 1999-01-13 2000-11-07 Santec Corporation Laser light source apparatus

Also Published As

Publication number Publication date
DE60033775T2 (de) 2007-11-29
KR100585464B1 (ko) 2006-06-02
TWI231405B (en) 2005-04-21
JP3880312B2 (ja) 2007-02-14
JP2001217190A (ja) 2001-08-10
US6875992B2 (en) 2005-04-05
KR20010062560A (ko) 2001-07-07
US6894261B2 (en) 2005-05-17
US20010011712A1 (en) 2001-08-09
US20040211921A1 (en) 2004-10-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee