DE60015411D1 - Wässerige Dispersionsaufschlämmung für chemisch-mechanisches Polierverfahren - Google Patents

Wässerige Dispersionsaufschlämmung für chemisch-mechanisches Polierverfahren

Info

Publication number
DE60015411D1
DE60015411D1 DE60015411T DE60015411T DE60015411D1 DE 60015411 D1 DE60015411 D1 DE 60015411D1 DE 60015411 T DE60015411 T DE 60015411T DE 60015411 T DE60015411 T DE 60015411T DE 60015411 D1 DE60015411 D1 DE 60015411D1
Authority
DE
Germany
Prior art keywords
aqueous dispersion
mechanical polishing
chemical mechanical
polishing processes
dispersion slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60015411T
Other languages
English (en)
Other versions
DE60015411T2 (de
Inventor
Hiroyuki Yano
Gaku Minamihaba
Yukiteru Matsui
Katsuya Okumura
Akira Iio
Masayuki Hattori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
JSR Corp
Original Assignee
Toshiba Corp
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7405299A external-priority patent/JP3784988B2/ja
Priority claimed from JP07456299A external-priority patent/JP3776252B2/ja
Priority claimed from JP07456199A external-priority patent/JP4723700B2/ja
Application filed by Toshiba Corp, JSR Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE60015411D1 publication Critical patent/DE60015411D1/de
Publication of DE60015411T2 publication Critical patent/DE60015411T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60015411T 1999-03-18 2000-03-17 Wässerige Dispersionsaufschlämmung für chemisch-mechanisches Polierverfahren Expired - Lifetime DE60015411T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP7405299A JP3784988B2 (ja) 1999-03-18 1999-03-18 半導体装置の製造方法
JP7405299 1999-03-18
JP07456299A JP3776252B2 (ja) 1999-03-18 1999-03-18 半導体装置の製造に用いる化学機械研磨用水系分散体
JP07456199A JP4723700B2 (ja) 1999-03-18 1999-03-18 水系分散体
JP7456299 1999-03-18
JP7456199 1999-03-18

Publications (2)

Publication Number Publication Date
DE60015411D1 true DE60015411D1 (de) 2004-12-09
DE60015411T2 DE60015411T2 (de) 2005-10-27

Family

ID=27301394

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60015411T Expired - Lifetime DE60015411T2 (de) 1999-03-18 2000-03-17 Wässerige Dispersionsaufschlämmung für chemisch-mechanisches Polierverfahren

Country Status (5)

Country Link
US (1) US6740590B1 (de)
EP (1) EP1036836B1 (de)
KR (1) KR100447552B1 (de)
DE (1) DE60015411T2 (de)
TW (1) TWI267549B (de)

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DE60015411T2 (de) 2005-10-27
US6740590B1 (en) 2004-05-25
TWI267549B (en) 2006-12-01
KR100447552B1 (ko) 2004-09-08
EP1036836B1 (de) 2004-11-03
KR20000062931A (ko) 2000-10-25
EP1036836A1 (de) 2000-09-20

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