DE60110226D1 - Unterlage für polierscheibe - Google Patents

Unterlage für polierscheibe

Info

Publication number
DE60110226D1
DE60110226D1 DE60110226T DE60110226T DE60110226D1 DE 60110226 D1 DE60110226 D1 DE 60110226D1 DE 60110226 T DE60110226 T DE 60110226T DE 60110226 T DE60110226 T DE 60110226T DE 60110226 D1 DE60110226 D1 DE 60110226D1
Authority
DE
Germany
Prior art keywords
document
polishing disc
polishing
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60110226T
Other languages
English (en)
Other versions
DE60110226T2 (de
Inventor
B Scott
Richard Baker
Tao Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Application granted granted Critical
Publication of DE60110226D1 publication Critical patent/DE60110226D1/de
Publication of DE60110226T2 publication Critical patent/DE60110226T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60110226T 2000-06-30 2001-06-29 Unterlage für polierscheibe Expired - Lifetime DE60110226T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21522900P 2000-06-30 2000-06-30
US215229P 2000-06-30
PCT/US2001/020890 WO2002002274A2 (en) 2000-06-30 2001-06-29 Base-pad for a polishing pad

Publications (2)

Publication Number Publication Date
DE60110226D1 true DE60110226D1 (de) 2005-05-25
DE60110226T2 DE60110226T2 (de) 2006-03-09

Family

ID=22802167

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60110226T Expired - Lifetime DE60110226T2 (de) 2000-06-30 2001-06-29 Unterlage für polierscheibe

Country Status (6)

Country Link
US (1) US6623337B2 (de)
EP (1) EP1294536B1 (de)
JP (1) JP4916638B2 (de)
KR (1) KR100767429B1 (de)
DE (1) DE60110226T2 (de)
WO (1) WO2002002274A2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002016257A2 (en) * 2000-08-24 2002-02-28 William Marsh Rice University Polymer-wrapped single wall carbon nanotubes
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
NZ519162A (en) * 2002-08-27 2004-10-29 Stephen Ross Hope Abrasive holder
CN1684799A (zh) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 平面化用的抛光垫片
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US6942549B2 (en) * 2003-10-29 2005-09-13 International Business Machines Corporation Two-sided chemical mechanical polishing pad for semiconductor processing
WO2005077602A1 (en) * 2004-02-17 2005-08-25 Skc Co., Ltd. Base pad polishing pad and multi-layer pad comprising the same
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
US7485028B2 (en) 2004-03-19 2009-02-03 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same
AU2005202973A1 (en) * 2004-07-06 2006-02-02 Stephen Arthur Dickins Improvements in or Relating to Reinforced Means
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7556555B2 (en) * 2007-02-15 2009-07-07 San Fang Chemical Industry Co., Ltd. Polishing pad, use thereof and method for manufacturing the same
JP5194516B2 (ja) * 2007-03-30 2013-05-08 富士通セミコンダクター株式会社 化学機械研磨装置の管理方法
US20080268227A1 (en) * 2007-04-30 2008-10-30 Chung-Chih Feng Complex polishing pad and method for making the same
US8414669B2 (en) * 2007-05-29 2013-04-09 San Fang Chemical Industry Co., Ltd. Polishing pad, the use thereof and the method for manufacturing the same
US7815491B2 (en) * 2007-05-29 2010-10-19 San Feng Chemical Industry Co., Ltd. Polishing pad, the use thereof and the method for manufacturing the same
US20130040543A1 (en) * 2008-09-11 2013-02-14 San Fang Chemical Industry Co., Ltd. Polishing pad and method for making the same
US8162728B2 (en) * 2009-09-28 2012-04-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Dual-pore structure polishing pad
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
CN102452041B (zh) * 2010-10-29 2014-07-23 三芳化学工业股份有限公司 吸附垫片及其制造方法
JP5844189B2 (ja) * 2012-03-26 2016-01-13 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
KR102100654B1 (ko) 2012-04-02 2020-04-14 토마스 웨스트 인코포레이티드 폴리머 연마패드의 원심주조를 위한 방법 및 시스템 및 상기 방법으로 만들어진 연마패드
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US10201886B2 (en) * 2014-05-21 2019-02-12 Fujibo Holdings, Inc. Polishing pad and method for manufacturing the same
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3100721A (en) 1961-02-21 1963-08-13 Du Pont Process for producing microporous films and coatings
NL296361A (de) 1962-08-13 1900-01-01
US4263755A (en) * 1979-10-12 1981-04-28 Jack Globus Abrasive product
US4927432A (en) 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
US5396737B1 (en) * 1989-01-18 1997-12-23 Minnesota Mining & Mfg Compound glazing or polishing pad
JPH02250776A (ja) * 1989-03-21 1990-10-08 Rodeele Nitta Kk 半導体ウェハー研磨用クロスの製造方法
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5287663A (en) 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6022264A (en) 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
JP3450485B2 (ja) * 1994-02-21 2003-09-22 株式会社東芝 半導体装置の製造方法及び半導体製造装置
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US6017265A (en) 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
JP3329644B2 (ja) 1995-07-21 2002-09-30 株式会社東芝 研磨パッド、研磨装置及び研磨方法
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US5899799A (en) 1996-01-19 1999-05-04 Micron Display Technology, Inc. Method and system to increase delivery of slurry to the surface of large substrates during polishing operations
JP3944260B2 (ja) * 1996-03-29 2007-07-11 東京エレクトロン株式会社 基板研磨方法及びその装置
US5871392A (en) * 1996-06-13 1999-02-16 Micron Technology, Inc. Under-pad for chemical-mechanical planarization of semiconductor wafers
US5795218A (en) * 1996-09-30 1998-08-18 Micron Technology, Inc. Polishing pad with elongated microcolumns
JP2738392B1 (ja) 1996-11-05 1998-04-08 日本電気株式会社 半導体装置の研磨装置及び研磨方法
JPH10156705A (ja) * 1996-11-29 1998-06-16 Sumitomo Metal Ind Ltd 研磨装置および研磨方法
US5916011A (en) * 1996-12-26 1999-06-29 Motorola, Inc. Process for polishing a semiconductor device substrate
US6022268A (en) 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
WO1998050201A1 (en) 1997-05-09 1998-11-12 Rodel Holdings, Inc. Mosaic polishing pads and methods relating thereto
US5899745A (en) 1997-07-03 1999-05-04 Motorola, Inc. Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor
JP2001513452A (ja) * 1997-08-06 2001-09-04 ローデル ホールディングス インコーポレイテッド 連続的に変化し得る平坦化及び研磨パッドシステム
JPH11156699A (ja) * 1997-11-25 1999-06-15 Speedfam Co Ltd 平面研磨用パッド
JPH11320387A (ja) * 1998-05-07 1999-11-24 Speedfam-Ipec Co Ltd 研磨パッドの貼着方法
US6135865A (en) * 1998-08-31 2000-10-24 International Business Machines Corporation CMP apparatus with built-in slurry distribution and removal
US6241585B1 (en) * 1999-06-25 2001-06-05 Applied Materials, Inc. Apparatus and method for chemical mechanical polishing
US6371833B1 (en) * 1999-09-13 2002-04-16 Infineon Technologies Ag Backing film for chemical mechanical planarization (CMP) of a semiconductor wafer
US6390891B1 (en) * 2000-04-26 2002-05-21 Speedfam-Ipec Corporation Method and apparatus for improved stability chemical mechanical polishing
US6267659B1 (en) * 2000-05-04 2001-07-31 International Business Machines Corporation Stacked polish pad

Also Published As

Publication number Publication date
JP4916638B2 (ja) 2012-04-18
DE60110226T2 (de) 2006-03-09
WO2002002274A2 (en) 2002-01-10
KR20030022165A (ko) 2003-03-15
EP1294536A2 (de) 2003-03-26
US6623337B2 (en) 2003-09-23
WO2002002274A3 (en) 2002-04-11
JP2004511083A (ja) 2004-04-08
EP1294536B1 (de) 2005-04-20
US20020081946A1 (en) 2002-06-27
KR100767429B1 (ko) 2007-10-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition