DE60000958T2 - Epoxidharzzusammensetzung und ihre Verwendung - Google Patents
Epoxidharzzusammensetzung und ihre VerwendungInfo
- Publication number
- DE60000958T2 DE60000958T2 DE2000600958 DE60000958T DE60000958T2 DE 60000958 T2 DE60000958 T2 DE 60000958T2 DE 2000600958 DE2000600958 DE 2000600958 DE 60000958 T DE60000958 T DE 60000958T DE 60000958 T2 DE60000958 T2 DE 60000958T2
- Authority
- DE
- Germany
- Prior art keywords
- resin composition
- epoxy resin
- epoxy
- composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
- Y10T428/249941—Fiber is on the surface of a polymeric matrix having no embedded portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2971—Impregnation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29150399 | 1999-10-13 | ||
JP2000302070A JP4423779B2 (ja) | 1999-10-13 | 2000-10-02 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60000958D1 DE60000958D1 (de) | 2003-01-23 |
DE60000958T2 true DE60000958T2 (de) | 2003-10-09 |
Family
ID=26558567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2000600958 Expired - Lifetime DE60000958T2 (de) | 1999-10-13 | 2000-10-12 | Epoxidharzzusammensetzung und ihre Verwendung |
Country Status (7)
Country | Link |
---|---|
US (2) | US6403221B1 (de) |
EP (1) | EP1092739B1 (de) |
JP (1) | JP4423779B2 (de) |
KR (1) | KR100663050B1 (de) |
CN (1) | CN1131883C (de) |
DE (1) | DE60000958T2 (de) |
TW (1) | TW499827B (de) |
Families Citing this family (110)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1009206A3 (de) * | 1998-12-02 | 2003-01-15 | Ajinomoto Co., Inc. | Verfahren zur Vakuumlaminierung eines Klebefilms |
US6447915B1 (en) * | 1999-03-11 | 2002-09-10 | Sumitomo Bakelite Company Limited | Interlaminar insulating adhesive for multilayer printed circuit board |
JP2000294921A (ja) * | 1999-04-01 | 2000-10-20 | Victor Co Of Japan Ltd | プリンス基板及びその製造方法 |
JP4423779B2 (ja) * | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
JP5485487B2 (ja) * | 1999-12-13 | 2014-05-07 | ダウ グローバル テクノロジーズ エルエルシー | 難燃性リン元素含有エポキシ樹脂組成物 |
WO2003009655A1 (en) * | 2001-07-18 | 2003-01-30 | Ajinomoto Co., Inc. | Film for circuit board |
JP2003055534A (ja) * | 2001-08-14 | 2003-02-26 | Nippon Oil Corp | 複合材料用樹脂組成物、複合材料用中間材および複合材料 |
EP1457515A4 (de) * | 2001-08-31 | 2004-11-24 | Sumitomo Bakelite Co | Harzzusammensetzung, prepreg, laminatfolie und halbleiterbaustein |
JP4880841B2 (ja) * | 2001-09-19 | 2012-02-22 | 太陽ホールディングス株式会社 | 粗化面形成用樹脂組成物を用いた多層プリント配線板 |
AU2002355051A1 (en) * | 2001-11-30 | 2003-06-10 | Ajinomoto Co., Inc. | Method of laminating circuit board and method of forming insulation layer, multilayer printed wiring board and production method therefor and adhesion film for multilayer printed wiring board |
JP3888254B2 (ja) * | 2002-07-29 | 2007-02-28 | 富士電機ホールディングス株式会社 | 多層プリント配線板 |
TW200415197A (en) * | 2002-10-03 | 2004-08-16 | Nippon Kayaku Kk | Epoxy resin composition for optical semiconductor package |
KR20040042315A (ko) * | 2002-11-14 | 2004-05-20 | 삼성전기주식회사 | 절연층의 두께 편차가 감소된 절연필름, 그 제조방법 및이를 이용한 다층 인쇄회로기판 |
FR2848016B1 (fr) * | 2002-11-29 | 2005-01-28 | Nexans | Cable ignifuge |
JP4503239B2 (ja) * | 2003-05-07 | 2010-07-14 | 京セラケミカル株式会社 | 難燃性接着剤組成物、フレキシブル銅張積層板、カバーレイおよび接着フィルム |
JP4725704B2 (ja) * | 2003-05-27 | 2011-07-13 | 味の素株式会社 | 多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ |
TWI335347B (en) * | 2003-05-27 | 2011-01-01 | Ajinomoto Kk | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
TW200516126A (en) * | 2003-06-23 | 2005-05-16 | Toray Industries | Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition |
TWI262041B (en) * | 2003-11-14 | 2006-09-11 | Hitachi Chemical Co Ltd | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
US20050186434A1 (en) * | 2004-01-28 | 2005-08-25 | Ajinomoto Co., Inc. | Thermosetting resin composition, adhesive film and multilayer printed wiring board using same |
JP5085125B2 (ja) * | 2004-03-29 | 2012-11-28 | 住友ベークライト株式会社 | 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板 |
TW200602427A (en) | 2004-03-30 | 2006-01-16 | Taiyo Ink Mfg Co Ltd | Thermosetting resin composition and multilayered printed wiring board comprising the same |
JP5055683B2 (ja) * | 2004-03-30 | 2012-10-24 | 住友ベークライト株式会社 | 絶縁シート、基材付き絶縁シート、及び多層プリント配線板 |
US8123896B2 (en) * | 2004-06-02 | 2012-02-28 | Semiconductor Energy Laboratory Co., Ltd. | Laminating system |
CN101499479B (zh) | 2004-08-23 | 2010-11-03 | 株式会社半导体能源研究所 | 无线芯片及其制造方法 |
JP4654647B2 (ja) * | 2004-09-30 | 2011-03-23 | 味の素株式会社 | 回路基板用金属付きポリアミドイミドフィルム及びその製造方法 |
EP1863038B1 (de) * | 2005-03-23 | 2010-09-08 | Murata Manufacturing Co., Ltd. | Zusammengesetztes dielektrisches blatt, verfahren zu seiner herstellung und mehrschichtige elektronische komponente |
EP1647576A1 (de) * | 2005-04-01 | 2006-04-19 | Huntsman Advanced Materials (Switzerland) GmbH | Zusammensetzung beinhaltend Benzoxazin- und Epoxyharz |
WO2007034679A1 (ja) * | 2005-09-22 | 2007-03-29 | Toho Tenax Co., Ltd. | 放射線硬化用樹脂組成物及びプリプレグ |
CN101283017B (zh) * | 2005-09-29 | 2011-06-15 | 旭化成电子材料株式会社 | 高稳定性微胶囊型环氧树脂用固化剂和环氧树脂组合物 |
TWI410442B (zh) | 2005-11-29 | 2013-10-01 | Ajinomoto Kk | A resin composition for an insulating layer of a multilayer printed circuit board |
MY159048A (en) * | 2005-12-06 | 2016-12-15 | Isola Usa Corp | Laminates for high speed and high frequency printed circuit boards |
US7927514B2 (en) * | 2006-02-03 | 2011-04-19 | Asahi Kasei Chemicals Corporation | Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good |
US7658988B2 (en) * | 2006-04-03 | 2010-02-09 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from filled epoxy compositions |
US8216668B2 (en) | 2006-10-06 | 2012-07-10 | Sumitomo Bakelite Company, Ltd. | Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device |
KR100831153B1 (ko) * | 2006-10-26 | 2008-05-20 | 제일모직주식회사 | 반도체 조립용 접착 필름 조성물, 이에 의한 접착 필름 및이를 포함하는 다이싱 다이본드 필름 |
US8409704B2 (en) | 2007-01-25 | 2013-04-02 | Panasonic Corporation | Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board |
KR20090109114A (ko) * | 2007-02-14 | 2009-10-19 | 스미토모 베이클리트 컴퍼니 리미티드 | 캐리어 재료 부착 층간 절연막 및 이것을 이용하는 다층 프린트 회로판 |
KR101409048B1 (ko) * | 2007-02-16 | 2014-06-18 | 스미토모 베이클리트 컴퍼니 리미티드 | 회로 기판의 제조 방법, 반도체 제조 장치, 회로 기판 및 반도체 장치 |
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KR101530868B1 (ko) | 2007-09-11 | 2015-06-23 | 아지노모토 가부시키가이샤 | 다층 프린트 배선판의 제조 방법 |
JP5446866B2 (ja) * | 2007-09-21 | 2014-03-19 | 味の素株式会社 | エポキシ樹脂組成物 |
US20090111948A1 (en) * | 2007-10-25 | 2009-04-30 | Thomas Eugene Dueber | Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto |
JP5301299B2 (ja) | 2008-01-31 | 2013-09-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
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TW294693B (de) | 1994-09-09 | 1997-01-01 | Siemens Ag | |
JPH0959346A (ja) | 1995-08-28 | 1997-03-04 | Matsushita Electric Works Ltd | 積層板用エポキシ樹脂組成物 |
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ID19337A (id) | 1996-12-26 | 1998-07-02 | Ajinomoto Kk | Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini |
JP3785749B2 (ja) | 1997-04-17 | 2006-06-14 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた多層プリント配線板の製造法 |
JP3809273B2 (ja) | 1998-03-25 | 2006-08-16 | 東都化成株式会社 | エポキシ樹脂組成物 |
EP1009206A3 (de) | 1998-12-02 | 2003-01-15 | Ajinomoto Co., Inc. | Verfahren zur Vakuumlaminierung eines Klebefilms |
US6447915B1 (en) * | 1999-03-11 | 2002-09-10 | Sumitomo Bakelite Company Limited | Interlaminar insulating adhesive for multilayer printed circuit board |
JP4423779B2 (ja) * | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
JP2001217508A (ja) | 2000-01-31 | 2001-08-10 | Toshiba Corp | プリント基板 |
-
2000
- 2000-10-02 JP JP2000302070A patent/JP4423779B2/ja not_active Expired - Lifetime
- 2000-10-09 TW TW89121131A patent/TW499827B/zh not_active IP Right Cessation
- 2000-10-11 US US09/684,671 patent/US6403221B1/en not_active Expired - Lifetime
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- 2000-10-12 DE DE2000600958 patent/DE60000958T2/de not_active Expired - Lifetime
- 2000-10-12 EP EP20000308974 patent/EP1092739B1/de not_active Expired - Lifetime
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KR20010050996A (ko) | 2001-06-25 |
TW499827B (en) | 2002-08-21 |
CN1131883C (zh) | 2003-12-24 |
KR100663050B1 (ko) | 2007-01-02 |
JP2001181375A (ja) | 2001-07-03 |
EP1092739B1 (de) | 2002-12-11 |
US6403221B1 (en) | 2002-06-11 |
US20020187353A1 (en) | 2002-12-12 |
US6805958B2 (en) | 2004-10-19 |
JP4423779B2 (ja) | 2010-03-03 |
EP1092739A1 (de) | 2001-04-18 |
DE60000958D1 (de) | 2003-01-23 |
CN1293218A (zh) | 2001-05-02 |
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