DE2940994T1 - Amorphous semiconductors equivalent to crystalline semiconductors - Google Patents
Amorphous semiconductors equivalent to crystalline semiconductorsInfo
- Publication number
- DE2940994T1 DE2940994T1 DE792940994T DE2940994T DE2940994T1 DE 2940994 T1 DE2940994 T1 DE 2940994T1 DE 792940994 T DE792940994 T DE 792940994T DE 2940994 T DE2940994 T DE 2940994T DE 2940994 T1 DE2940994 T1 DE 2940994T1
- Authority
- DE
- Germany
- Prior art keywords
- film
- amorphous semiconductor
- compensation
- materials
- density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 175
- 239000000463 material Substances 0.000 claims description 129
- 238000000034 method Methods 0.000 claims description 75
- 239000000758 substrate Substances 0.000 claims description 45
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 40
- 229910052710 silicon Inorganic materials 0.000 claims description 40
- 239000010703 silicon Substances 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 38
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 34
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 31
- 239000011737 fluorine Substances 0.000 claims description 31
- 229910052731 fluorine Inorganic materials 0.000 claims description 31
- 239000011159 matrix material Substances 0.000 claims description 30
- 239000003795 chemical substances by application Substances 0.000 claims description 29
- 230000004888 barrier function Effects 0.000 claims description 27
- 230000008021 deposition Effects 0.000 claims description 25
- 150000002431 hydrogen Chemical class 0.000 claims description 21
- 229910052739 hydrogen Inorganic materials 0.000 claims description 21
- 239000001257 hydrogen Substances 0.000 claims description 21
- 239000002019 doping agent Substances 0.000 claims description 20
- 238000001556 precipitation Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 13
- 230000000051 modifying effect Effects 0.000 claims description 10
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 9
- 230000009467 reduction Effects 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 229910052785 arsenic Inorganic materials 0.000 claims description 8
- 239000002800 charge carrier Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 8
- 238000002425 crystallisation Methods 0.000 claims description 8
- 230000008025 crystallization Effects 0.000 claims description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 8
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 5
- 230000005684 electric field Effects 0.000 claims description 5
- 239000011669 selenium Substances 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229910052711 selenium Inorganic materials 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 229910052714 tellurium Inorganic materials 0.000 claims description 4
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052744 lithium Inorganic materials 0.000 claims description 3
- 239000003607 modifier Substances 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 229910052723 transition metal Inorganic materials 0.000 claims description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 3
- 229910052793 cadmium Inorganic materials 0.000 claims 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims 2
- 239000000969 carrier Substances 0.000 claims 2
- -1 rare earth metal Transition metal Chemical class 0.000 claims 1
- 239000010408 film Substances 0.000 description 193
- 229910021417 amorphous silicon Inorganic materials 0.000 description 35
- 238000000151 deposition Methods 0.000 description 24
- 239000002178 crystalline material Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 11
- 229910000077 silane Inorganic materials 0.000 description 11
- 229910021419 crystalline silicon Inorganic materials 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 8
- 230000001629 suppression Effects 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 6
- 238000005215 recombination Methods 0.000 description 6
- 230000006798 recombination Effects 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 238000001771 vacuum deposition Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 230000003667 anti-reflective effect Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000009718 spray deposition Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010410 dusting Methods 0.000 description 3
- 150000002221 fluorine Chemical class 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910000967 As alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000008246 gaseous mixture Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910000925 Cd alloy Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910000796 S alloy Inorganic materials 0.000 description 1
- 229910001370 Se alloy Inorganic materials 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000370 acceptor Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- OWZREIFADZCYQD-NSHGMRRFSA-N deltamethrin Chemical compound CC1(C)[C@@H](C=C(Br)Br)[C@H]1C(=O)O[C@H](C#N)C1=CC=CC(OC=2C=CC=CC=2)=C1 OWZREIFADZCYQD-NSHGMRRFSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003197 gene knockdown Methods 0.000 description 1
- 229910021480 group 4 element Inorganic materials 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/884,664 US4217374A (en) | 1978-03-08 | 1978-03-08 | Amorphous semiconductors equivalent to crystalline semiconductors |
| PCT/US1979/000134 WO1979000724A1 (en) | 1978-03-08 | 1979-03-02 | Amorphous semiconductors equivalent to crystalline semiconductors |
| DE19803000904 DE3000904A1 (de) | 1978-03-08 | 1980-01-11 | Amorpher halbleiter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2940994T1 true DE2940994T1 (de) | 1982-01-28 |
| DE2940994C2 DE2940994C2 (US07223432-20070529-C00017.png) | 1989-12-14 |
Family
ID=41510774
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE792940994T Granted DE2940994T1 (de) | 1978-03-08 | 1979-03-02 | Amorphous semiconductors equivalent to crystalline semiconductors |
| DE19803000904 Withdrawn DE3000904A1 (de) | 1978-03-08 | 1980-01-11 | Amorpher halbleiter |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19803000904 Withdrawn DE3000904A1 (de) | 1978-03-08 | 1980-01-11 | Amorpher halbleiter |
Country Status (11)
Families Citing this family (187)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4265991A (en) * | 1977-12-22 | 1981-05-05 | Canon Kabushiki Kaisha | Electrophotographic photosensitive member and process for production thereof |
| DE2954551C2 (US07223432-20070529-C00017.png) * | 1978-03-03 | 1989-02-09 | Canon K.K., Tokio/Tokyo, Jp | |
| US4689645A (en) * | 1978-03-08 | 1987-08-25 | Energy Conversion Devices, Inc. | Current control device |
| US4342044A (en) * | 1978-03-08 | 1982-07-27 | Energy Conversion Devices, Inc. | Method for optimizing photoresponsive amorphous alloys and devices |
| US4492810A (en) * | 1978-03-08 | 1985-01-08 | Sovonics Solar Systems | Optimized doped and band gap adjusted photoresponsive amorphous alloys and devices |
| US4471042A (en) * | 1978-05-04 | 1984-09-11 | Canon Kabushiki Kaisha | Image-forming member for electrophotography comprising hydrogenated amorphous matrix of silicon and/or germanium |
| US4565731A (en) * | 1978-05-04 | 1986-01-21 | Canon Kabushiki Kaisha | Image-forming member for electrophotography |
| JPS5591885A (en) * | 1978-12-28 | 1980-07-11 | Canon Inc | Amorphous silicon hydride photoconductive layer |
| JPS55127561A (en) * | 1979-03-26 | 1980-10-02 | Canon Inc | Image forming member for electrophotography |
| JPS5662254A (en) * | 1979-10-24 | 1981-05-28 | Canon Inc | Electrophotographic imaging material |
| DE3040972A1 (de) * | 1979-10-30 | 1981-05-14 | Fuji Photo Film Co. Ltd., Minami-Ashigara, Kanagawa | Elektrophotographisches lichtempfindliches material und verfahren zu dessen herstellung |
| EP0029747A1 (en) * | 1979-11-27 | 1981-06-03 | Konica Corporation | An apparatus for vacuum deposition and a method for forming a thin film by the use thereof |
| US4291318A (en) * | 1979-12-03 | 1981-09-22 | Exxon Research & Engineering Co. | Amorphous silicon MIS device |
| IL61679A (en) * | 1979-12-13 | 1984-11-30 | Energy Conversion Devices Inc | Thin film,field effect transistor |
| US5382487A (en) * | 1979-12-13 | 1995-01-17 | Canon Kabushiki Kaisha | Electrophotographic image forming member |
| IL61678A (en) * | 1979-12-13 | 1984-04-30 | Energy Conversion Devices Inc | Programmable cell and programmable electronic arrays comprising such cells |
| JPS5713777A (en) | 1980-06-30 | 1982-01-23 | Shunpei Yamazaki | Semiconductor device and manufacture thereof |
| JPS56137614A (en) * | 1980-03-31 | 1981-10-27 | Futaba Corp | Manufacture of amorphous silicon coat |
| US4339255A (en) * | 1980-09-09 | 1982-07-13 | Energy Conversion Devices, Inc. | Method and apparatus for making a modified amorphous glass material |
| JPS56146142A (en) * | 1980-04-16 | 1981-11-13 | Hitachi Ltd | Electrophotographic sensitive film |
| JPS56150752A (en) * | 1980-04-25 | 1981-11-21 | Hitachi Ltd | Electrophotographic sensitive film |
| US4322253A (en) * | 1980-04-30 | 1982-03-30 | Rca Corporation | Method of making selective crystalline silicon regions containing entrapped hydrogen by laser treatment |
| DE3117037A1 (de) * | 1980-05-08 | 1982-03-11 | Takao Sakai Osaka Kawamura | Elektrophotografisches, lichtempfindliches element |
| US4400409A (en) * | 1980-05-19 | 1983-08-23 | Energy Conversion Devices, Inc. | Method of making p-doped silicon films |
| JPS574053A (en) * | 1980-06-09 | 1982-01-09 | Canon Inc | Photoconductive member |
| JPS574172A (en) * | 1980-06-09 | 1982-01-09 | Canon Inc | Light conductive member |
| JPS5710920A (en) * | 1980-06-23 | 1982-01-20 | Canon Inc | Film forming process |
| FR2485810A1 (fr) * | 1980-06-24 | 1981-12-31 | Thomson Csf | Procede de realisation d'une couche contenant du silicium et dispositif de conversion photo-electrique mettant en oeuvre ce procede |
| US5144367A (en) * | 1980-06-25 | 1992-09-01 | Semiconductor Energy Laboratory Co., Ltd. | Printing member for electrostatic photocopying |
| US5859443A (en) * | 1980-06-30 | 1999-01-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US6900463B1 (en) | 1980-06-30 | 2005-05-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US5262350A (en) * | 1980-06-30 | 1993-11-16 | Semiconductor Energy Laboratory Co., Ltd. | Forming a non single crystal semiconductor layer by using an electric current |
| JPS5744154A (en) * | 1980-08-29 | 1982-03-12 | Canon Inc | Electrophotographic image formation member |
| JPS5748735A (en) * | 1980-09-08 | 1982-03-20 | Canon Inc | Manufacture of image forming member for electrophotography |
| ES505270A0 (es) * | 1980-09-09 | 1982-12-16 | Energy Conversion Devices Inc | Dispositivo amorfo fotosensible de celulas multiples mejora-do |
| IE52207B1 (en) * | 1980-09-09 | 1987-08-05 | Energy Conversion Devices Inc | Method of grading the band gaps of amorphous alloys and devices |
| IN157308B (US07223432-20070529-C00017.png) * | 1980-09-09 | 1986-03-01 | Energy Conversion Devices Inc | |
| US4522663A (en) * | 1980-09-09 | 1985-06-11 | Sovonics Solar Systems | Method for optimizing photoresponsive amorphous alloys and devices |
| ES505269A0 (es) * | 1980-09-09 | 1982-12-16 | Energy Conversion Devices Inc | Metodo para preparar una aleacion amorfa fotosensible mejo- rada |
| DE3135375C2 (de) * | 1980-09-09 | 1995-02-23 | Energy Conversion Devices Inc | Verfahren zum Herstellen einer lichtempfindlichen amorphen Legierung |
| US4394425A (en) * | 1980-09-12 | 1983-07-19 | Canon Kabushiki Kaisha | Photoconductive member with α-Si(C) barrier layer |
| JPS5752176A (en) * | 1980-09-16 | 1982-03-27 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| US4394426A (en) * | 1980-09-25 | 1983-07-19 | Canon Kabushiki Kaisha | Photoconductive member with α-Si(N) barrier layer |
| GB2086135B (en) * | 1980-09-30 | 1985-08-21 | Nippon Telegraph & Telephone | Electrode and semiconductor device provided with the electrode |
| US4409308A (en) * | 1980-10-03 | 1983-10-11 | Canon Kabuskiki Kaisha | Photoconductive member with two amorphous silicon layers |
| JPS5764596A (en) * | 1980-10-06 | 1982-04-19 | Fuji Photo Film Co Ltd | Heat mode recording material |
| US4499557A (en) * | 1980-10-28 | 1985-02-12 | Energy Conversion Devices, Inc. | Programmable cell for use in programmable electronic arrays |
| JPS5785271A (en) * | 1980-11-10 | 1982-05-27 | Atlantic Richfield Co | Photovoltaic device and method of producing same |
| US4701592A (en) * | 1980-11-17 | 1987-10-20 | Rockwell International Corporation | Laser assisted deposition and annealing |
| JPS57104938A (en) * | 1980-12-22 | 1982-06-30 | Canon Inc | Image forming member for electrophotography |
| US4357179A (en) * | 1980-12-23 | 1982-11-02 | Bell Telephone Laboratories, Incorporated | Method for producing devices comprising high density amorphous silicon or germanium layers by low pressure CVD technique |
| DE3200376A1 (de) * | 1981-01-09 | 1982-11-04 | Canon K.K., Tokyo | Fotoleitfaehiges element |
| US5258250A (en) * | 1981-01-16 | 1993-11-02 | Canon Kabushiki Kaisha | Photoconductive member |
| US4539283A (en) * | 1981-01-16 | 1985-09-03 | Canon Kabushiki Kaisha | Amorphous silicon photoconductive member |
| US4490453A (en) * | 1981-01-16 | 1984-12-25 | Canon Kabushiki Kaisha | Photoconductive member of a-silicon with nitrogen |
| US5582947A (en) * | 1981-01-16 | 1996-12-10 | Canon Kabushiki Kaisha | Glow discharge process for making photoconductive member |
| US4464451A (en) * | 1981-02-06 | 1984-08-07 | Canon Kabushiki Kaisha | Electrophotographic image-forming member having aluminum oxide layer on a substrate |
| US4868614A (en) * | 1981-02-09 | 1989-09-19 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting semiconductor device matrix with non-single-crystalline semiconductor |
| US4527179A (en) * | 1981-02-09 | 1985-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Non-single-crystal light emitting semiconductor device |
| US4441113A (en) * | 1981-02-13 | 1984-04-03 | Energy Conversion Devices, Inc. | P-Type semiconductor material having a wide band gap |
| US4468443A (en) * | 1981-03-12 | 1984-08-28 | Canon Kabushiki Kaisha | Process for producing photoconductive member from gaseous silicon compounds |
| US4542711A (en) * | 1981-03-16 | 1985-09-24 | Sovonics Solar Systems | Continuous system for depositing amorphous semiconductor material |
| DE3270551D1 (en) * | 1981-03-16 | 1986-05-22 | Energy Conversion Devices Inc | Optical methods for controlling layer thickness |
| US4409311A (en) * | 1981-03-25 | 1983-10-11 | Minolta Camera Kabushiki Kaisha | Photosensitive member |
| JPS57160123A (en) * | 1981-03-30 | 1982-10-02 | Hitachi Ltd | Semiconductor device |
| US4416755A (en) * | 1981-04-03 | 1983-11-22 | Xerox Corporation | Apparatus and method for producing semiconducting films |
| JPS57177156A (en) * | 1981-04-24 | 1982-10-30 | Canon Inc | Photoconductive material |
| JPS57189393A (en) * | 1981-05-18 | 1982-11-20 | Seiko Epson Corp | Semiconductor storage device |
| US4490208A (en) * | 1981-07-08 | 1984-12-25 | Agency Of Industrial Science And Technology | Method of producing thin films of silicon |
| JPS5832411A (ja) * | 1981-08-21 | 1983-02-25 | Konishiroku Photo Ind Co Ltd | アモルフアスシリコンの製造方法 |
| WO1983000950A1 (en) * | 1981-09-11 | 1983-03-17 | Sato, Shigeru | Method and device for producing amorphous silicon solar battery |
| US4536460A (en) * | 1981-11-09 | 1985-08-20 | Canon Kabushiki Kaisha | Photoconductive member |
| US4423133A (en) * | 1981-11-17 | 1983-12-27 | Canon Kabushiki Kaisha | Photoconductive member of amorphous silicon |
| US4460670A (en) * | 1981-11-26 | 1984-07-17 | Canon Kabushiki Kaisha | Photoconductive member with α-Si and C, N or O and dopant |
| US4460669A (en) * | 1981-11-26 | 1984-07-17 | Canon Kabushiki Kaisha | Photoconductive member with α-Si and C, U or D and dopant |
| US4465750A (en) * | 1981-12-22 | 1984-08-14 | Canon Kabushiki Kaisha | Photoconductive member with a -Si having two layer regions |
| GB2115570B (en) * | 1981-12-28 | 1985-07-10 | Canon Kk | Photoconductive member |
| US4508931A (en) * | 1981-12-30 | 1985-04-02 | Stauffer Chemical Company | Catenated phosphorus materials, their preparation and use, and semiconductor and other devices employing them |
| US4620968A (en) * | 1981-12-30 | 1986-11-04 | Stauffer Chemical Company | Monoclinic phosphorus formed from vapor in the presence of an alkali metal |
| AU553091B2 (en) * | 1981-12-30 | 1986-07-03 | Stauffer Chemical Company | High phosphorus pholyphosphides |
| EP0098296B1 (en) * | 1981-12-31 | 1987-04-08 | Western Electric Company, Incorporated | Optical recording media |
| DE3303266A1 (de) * | 1982-02-01 | 1983-08-11 | Canon K.K., Tokyo | Fotoeleitfaehiges element |
| US4522905A (en) * | 1982-02-04 | 1985-06-11 | Canon Kk | Amorphous silicon photoconductive member with interface and rectifying layers |
| US4452874A (en) * | 1982-02-08 | 1984-06-05 | Canon Kabushiki Kaisha | Photoconductive member with multiple amorphous Si layers |
| US4452875A (en) * | 1982-02-15 | 1984-06-05 | Canon Kabushiki Kaisha | Amorphous photoconductive member with α-Si interlayers |
| DE3208086C2 (de) * | 1982-03-06 | 1983-12-22 | Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5300 Bonn | Verwendung einer Plasmakanone |
| US4795688A (en) * | 1982-03-16 | 1989-01-03 | Canon Kabushiki Kaisha | Layered photoconductive member comprising amorphous silicon |
| JPS58197775A (ja) * | 1982-05-13 | 1983-11-17 | Canon Inc | 薄膜トランジスタ |
| US4466992A (en) * | 1982-05-28 | 1984-08-21 | Phillips Petroleum Company | Healing pinhole defects in amorphous silicon films |
| DE3226624A1 (de) * | 1982-07-16 | 1984-01-19 | Siemens AG, 1000 Berlin und 8000 München | Lichtzuendbarer thyristor mit geringem lichtleistungsbedarf und hoher kritischer spannungsanstiegsgeschwindigkeit |
| DE3331601A1 (de) * | 1982-09-02 | 1984-03-08 | Canon K.K., Tokyo | Halbleitervorrichtung |
| IN161171B (US07223432-20070529-C00017.png) | 1982-09-16 | 1987-10-10 | Energy Conversion Devices Inc | |
| GB8324779D0 (en) * | 1982-09-29 | 1983-10-19 | Nat Res Dev | Depositing film onto substrate |
| US4483725A (en) * | 1982-09-30 | 1984-11-20 | At&T Bell Laboratories | Reactive vapor deposition of multiconstituent material |
| US4569894A (en) * | 1983-01-14 | 1986-02-11 | Canon Kabushiki Kaisha | Photoconductive member comprising germanium atoms |
| AU562641B2 (en) | 1983-01-18 | 1987-06-18 | Energy Conversion Devices Inc. | Electronic matrix array |
| US4569120A (en) * | 1983-03-07 | 1986-02-11 | Signetics Corporation | Method of fabricating a programmable read-only memory cell incorporating an antifuse utilizing ion implantation |
| US4761300A (en) * | 1983-06-29 | 1988-08-02 | Stauffer Chemical Company | Method of vacuum depostion of pnictide films on a substrate using a pnictide bubbler and a sputterer |
| EP0135294A3 (en) * | 1983-07-18 | 1986-08-20 | Energy Conversion Devices, Inc. | Enhanced narrow band gap alloys for photovoltaic applications |
| DE3427637A1 (de) * | 1983-07-26 | 1985-02-14 | Konishiroku Photo Industry Co., Ltd., Tokio/Tokyo | Photorezeptor und verfahren zu seiner herstellung |
| DE3429899A1 (de) * | 1983-08-16 | 1985-03-07 | Canon K.K., Tokio/Tokyo | Verfahren zur bildung eines abscheidungsfilms |
| US4637938A (en) * | 1983-08-19 | 1987-01-20 | Energy Conversion Devices, Inc. | Methods of using selective optical excitation in deposition processes and the detection of new compositions |
| US4569697A (en) * | 1983-08-26 | 1986-02-11 | Energy Conversion Devices, Inc. | Method of forming photovoltaic quality amorphous alloys by passivating defect states |
| US4544423A (en) * | 1984-02-10 | 1985-10-01 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Amorphous silicon semiconductor and process for same |
| US4619729A (en) | 1984-02-14 | 1986-10-28 | Energy Conversion Devices, Inc. | Microwave method of making semiconductor members |
| US4678679A (en) * | 1984-06-25 | 1987-07-07 | Energy Conversion Devices, Inc. | Continuous deposition of activated process gases |
| JPS6113626A (ja) * | 1984-06-29 | 1986-01-21 | Hitachi Ltd | プラズマ処理装置 |
| JPH0673988B2 (ja) * | 1984-08-14 | 1994-09-21 | 株式会社リコー | 多色感熱記録方法 |
| US4783361A (en) * | 1984-09-10 | 1988-11-08 | Ovonic Synthetic Materials Company, Inc. | Coated lenses |
| JPS6184656A (ja) * | 1984-10-03 | 1986-04-30 | Matsushita Electric Ind Co Ltd | 電子写真感光体 |
| US4759947A (en) * | 1984-10-08 | 1988-07-26 | Canon Kabushiki Kaisha | Method for forming deposition film using Si compound and active species from carbon and halogen compound |
| US5476694A (en) * | 1984-10-24 | 1995-12-19 | Canon Kabushiki Kaisha | Method for forming deposited film by separately introducing an active species and a silicon compound into a film-forming chamber |
| US4657777A (en) * | 1984-12-17 | 1987-04-14 | Canon Kabushiki Kaisha | Formation of deposited film |
| US4611090A (en) * | 1984-12-28 | 1986-09-09 | Standard Oil Company | Semirigid photovoltaic module assembly and structural support therefor |
| US4726963A (en) * | 1985-02-19 | 1988-02-23 | Canon Kabushiki Kaisha | Process for forming deposited film |
| US4784874A (en) * | 1985-02-20 | 1988-11-15 | Canon Kabushiki Kaisha | Process for forming deposited film |
| US4778692A (en) * | 1985-02-20 | 1988-10-18 | Canon Kabushiki Kaisha | Process for forming deposited film |
| US4818563A (en) * | 1985-02-21 | 1989-04-04 | Canon Kabushiki Kaisha | Process for forming deposited film |
| US5244698A (en) * | 1985-02-21 | 1993-09-14 | Canon Kabushiki Kaisha | Process for forming deposited film |
| US4853251A (en) * | 1985-02-22 | 1989-08-01 | Canon Kabushiki Kaisha | Process for forming deposited film including carbon as a constituent element |
| US4801468A (en) * | 1985-02-25 | 1989-01-31 | Canon Kabushiki Kaisha | Process for forming deposited film |
| US4630355A (en) * | 1985-03-08 | 1986-12-23 | Energy Conversion Devices, Inc. | Electric circuits having repairable circuit lines and method of making the same |
| JP2537175B2 (ja) * | 1985-03-27 | 1996-09-25 | キヤノン株式会社 | 機能性堆積膜の製造装置 |
| JPS61242631A (ja) * | 1985-04-20 | 1986-10-28 | Nippon Soken Inc | 化合物超微粒子の作製方法および作製装置 |
| JP2660243B2 (ja) * | 1985-08-08 | 1997-10-08 | 株式会社半導体エネルギー研究所 | 半導体装置作製方法 |
| JPH0647727B2 (ja) * | 1985-12-24 | 1994-06-22 | キヤノン株式会社 | 堆積膜形成法 |
| JPH084071B2 (ja) * | 1985-12-28 | 1996-01-17 | キヤノン株式会社 | 堆積膜形成法 |
| US4868014A (en) * | 1986-01-14 | 1989-09-19 | Canon Kabushiki Kaisha | Method for forming thin film multi-layer structure member |
| US4801474A (en) * | 1986-01-14 | 1989-01-31 | Canon Kabushiki Kaisha | Method for forming thin film multi-layer structure member |
| JPH084072B2 (ja) * | 1986-01-14 | 1996-01-17 | キヤノン株式会社 | 堆積膜形成法 |
| US5032193A (en) * | 1986-01-21 | 1991-07-16 | Energy Conversion Devices, Inc. | Method of making synthetically engineered materials |
| JPS62228471A (ja) * | 1986-03-31 | 1987-10-07 | Canon Inc | 堆積膜形成法 |
| US4877650A (en) * | 1986-03-31 | 1989-10-31 | Canon Kabushiki Kaisha | Method for forming deposited film |
| DE3786364T2 (de) * | 1986-04-14 | 1993-11-18 | Canon Kk | Verfahren zur Herstellung einer niedergeschlagenen Schicht. |
| US5246734A (en) * | 1986-05-05 | 1993-09-21 | Dow Corning Corporation | Amorphous silicon hermetic coatings for optical wave guides |
| US5126169A (en) * | 1986-08-28 | 1992-06-30 | Canon Kabushiki Kaisha | Process for forming a deposited film from two mutually reactive active species |
| US5082696A (en) * | 1986-10-03 | 1992-01-21 | Dow Corning Corporation | Method of forming semiconducting amorphous silicon films from the thermal decomposition of dihalosilanes |
| JPS63210630A (ja) * | 1987-02-26 | 1988-09-01 | Kanegafuchi Chem Ind Co Ltd | 平面光検出装置 |
| US4762808A (en) * | 1987-06-22 | 1988-08-09 | Dow Corning Corporation | Method of forming semiconducting amorphous silicon films from the thermal decomposition of fluorohydridodisilanes |
| JPS6424468A (en) * | 1987-07-21 | 1989-01-26 | Canon Kk | Functional deposited film |
| JPS6436086A (en) * | 1987-07-31 | 1989-02-07 | Canon Kk | Functional deposition film |
| US4804490A (en) * | 1987-10-13 | 1989-02-14 | Energy Conversion Devices, Inc. | Method of fabricating stabilized threshold switching material |
| CA1299716C (en) | 1987-11-20 | 1992-04-28 | Katsumi Nakagawa | Pin junction photovoltaic element with p or n-type semiconductor layercomprising non-single crystal material containing zn, se, h in an amount of 1 to 4 atomic % and a dopant and i-type semiconductor layer comprising non-single crystal si(h,f) material |
| US5008726A (en) * | 1987-11-20 | 1991-04-16 | Canon Kabushiki Kaisha | PIN junction photovoltaic element containing Zn, Se, Te, H in an amount of 1 to 4 atomic % |
| EP0321113A3 (en) * | 1987-12-16 | 1990-09-12 | OIS Optical Imaging Systems, Inc. | Imaging apparatus fo scanning projected and written images |
| US4971878A (en) * | 1988-04-04 | 1990-11-20 | Sharp Kabushiki Kaisha | Amorphous silicon photosensitive member for use in electrophotography |
| US5213670A (en) * | 1989-06-30 | 1993-05-25 | Siemens Aktiengesellschaft | Method for manufacturing a polycrystalline layer on a substrate |
| US5244144A (en) * | 1989-08-23 | 1993-09-14 | Showa Aluminum Kabushiki Kaisha | Method for brazing aluminum materials |
| US5502315A (en) * | 1989-09-07 | 1996-03-26 | Quicklogic Corporation | Electrically programmable interconnect structure having a PECVD amorphous silicon element |
| US5989943A (en) * | 1989-09-07 | 1999-11-23 | Quicklogic Corporation | Method for fabrication of programmable interconnect structure |
| US5155567A (en) * | 1990-01-17 | 1992-10-13 | Ricoh Company, Ltd. | Amorphous photoconductive material and photosensor employing the photoconductive material |
| US5552627A (en) * | 1990-04-12 | 1996-09-03 | Actel Corporation | Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayers |
| JPH04133313A (ja) * | 1990-09-25 | 1992-05-07 | Semiconductor Energy Lab Co Ltd | 半導体作製方法 |
| TW237562B (US07223432-20070529-C00017.png) | 1990-11-09 | 1995-01-01 | Semiconductor Energy Res Co Ltd | |
| US5092939A (en) * | 1990-11-30 | 1992-03-03 | United Solar Systems Corporation | Photovoltaic roof and method of making same |
| US5330630A (en) * | 1991-01-02 | 1994-07-19 | Energy Conversion Devices, Inc. | Switch with improved threshold voltage |
| JPH06505368A (ja) * | 1991-01-17 | 1994-06-16 | クロスポイント・ソルーションズ・インコーポレイテッド | フィールドプログラム可能なゲートアレイに使用するための改良されたアンチヒューズ回路構造およびその製造方法 |
| JP2933177B2 (ja) * | 1991-02-25 | 1999-08-09 | キヤノン株式会社 | 非単結晶炭化珪素半導体、及びその製造方法、及びそれを用いた半導体装置 |
| JP2764472B2 (ja) * | 1991-03-25 | 1998-06-11 | 東京エレクトロン株式会社 | 半導体の成膜方法 |
| US5637537A (en) * | 1991-06-27 | 1997-06-10 | United Solar Systems Corporation | Method of severing a thin film semiconductor device |
| US5614257A (en) * | 1991-08-09 | 1997-03-25 | Applied Materials, Inc | Low temperature, high pressure silicon deposition method |
| JP3121131B2 (ja) * | 1991-08-09 | 2000-12-25 | アプライド マテリアルズ インコーポレイテッド | 低温高圧のシリコン蒸着方法 |
| US6979840B1 (en) | 1991-09-25 | 2005-12-27 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistors having anodized metal film between the gate wiring and drain wiring |
| EP0553982A1 (en) * | 1992-01-29 | 1993-08-04 | General Electric Company | Amorphous multilayer avalanche photodiode |
| US5256576A (en) * | 1992-02-14 | 1993-10-26 | United Solar Systems Corporation | Method of making pin junction semiconductor device with RF deposited intrinsic buffer layer |
| US5294846A (en) * | 1992-08-17 | 1994-03-15 | Paivinen John O | Method and apparatus for programming anti-fuse devices |
| US5440167A (en) * | 1994-02-23 | 1995-08-08 | Crosspoint Solutions, Inc. | Antifuse with double via contact and method of manufacture therefor |
| US5441907A (en) * | 1994-06-27 | 1995-08-15 | Taiwan Semiconductor Manufacturing Company | Process for manufacturing a plug-diode mask ROM |
| WO1996019837A2 (en) * | 1994-12-22 | 1996-06-27 | Philips Electronics N.V. | Semiconductor memory devices and methods of producing such |
| US5663591A (en) * | 1995-02-14 | 1997-09-02 | Crosspoint Solutions, Inc. | Antifuse with double via, spacer-defined contact |
| US6638772B1 (en) * | 1996-06-17 | 2003-10-28 | Amire Medical | Electrochemical test device |
| DE69923436T2 (de) * | 1998-03-06 | 2006-01-05 | Asm America Inc., Phoenix | Verfahren zum beschichten von silizium mit hoher kantenabdeckung |
| JP4413360B2 (ja) * | 2000-02-22 | 2010-02-10 | 株式会社神戸製鋼所 | 半導体ウエハの処理方法 |
| US6468829B2 (en) | 2000-05-16 | 2002-10-22 | United Solar Systems Corporation | Method for manufacturing high efficiency photovoltaic devices at enhanced depositions rates |
| US6548751B2 (en) | 2000-12-12 | 2003-04-15 | Solarflex Technologies, Inc. | Thin film flexible solar cell |
| US7026219B2 (en) | 2001-02-12 | 2006-04-11 | Asm America, Inc. | Integration of high k gate dielectric |
| WO2002080244A2 (en) | 2001-02-12 | 2002-10-10 | Asm America, Inc. | Improved process for deposition of semiconductor films |
| US7186630B2 (en) | 2002-08-14 | 2007-03-06 | Asm America, Inc. | Deposition of amorphous silicon-containing films |
| AU2003289212A1 (en) * | 2002-12-12 | 2004-06-30 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, manufacturing apparatus, film-forming method, and cleaning method |
| US20050023718A1 (en) * | 2003-07-31 | 2005-02-03 | Sara Lee Corporation | Apparatus and method for molding spacer fabric or lofted material |
| US20070231972A1 (en) * | 2006-04-03 | 2007-10-04 | Mouttet Blaise L | Manufacture of programmable crossbar signal processor |
| US20090008577A1 (en) * | 2007-07-07 | 2009-01-08 | Varian Semiconductor Equipment Associates, Inc. | Conformal Doping Using High Neutral Density Plasma Implant |
| US20110083724A1 (en) * | 2009-10-08 | 2011-04-14 | Ovshinsky Stanford R | Monolithic Integration of Photovoltaic Cells |
| KR102002849B1 (ko) * | 2012-09-17 | 2019-07-24 | 삼성디스플레이 주식회사 | 증착 장치 |
| US9837271B2 (en) | 2014-07-18 | 2017-12-05 | Asm Ip Holding B.V. | Process for forming silicon-filled openings with a reduced occurrence of voids |
| US9443730B2 (en) | 2014-07-18 | 2016-09-13 | Asm Ip Holding B.V. | Process for forming silicon-filled openings with a reduced occurrence of voids |
| US10460932B2 (en) | 2017-03-31 | 2019-10-29 | Asm Ip Holding B.V. | Semiconductor device with amorphous silicon filled gaps and methods for forming |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3949119A (en) * | 1972-05-04 | 1976-04-06 | Atomic Energy Of Canada Limited | Method of gas doping of vacuum evaporated epitaxial silicon films |
| DE2508802A1 (de) * | 1975-02-28 | 1976-09-09 | Siemens Ag | Verfahren zum abscheiden von elementarem silicium |
| US4046565A (en) * | 1975-03-25 | 1977-09-06 | Addressograph Multigraph Corporation | Amorphous selenium coating |
| DE2631881C2 (de) * | 1975-07-18 | 1982-11-25 | Futaba Denshi Kogyo K.K., Mobara, Chiba | Verfahren zur Herstellung eines Halbleiterbauelementes |
| US4064521A (en) * | 1975-07-28 | 1977-12-20 | Rca Corporation | Semiconductor device having a body of amorphous silicon |
| US4047976A (en) * | 1976-06-21 | 1977-09-13 | Motorola, Inc. | Method for manufacturing a high-speed semiconductor device |
| US4196438A (en) * | 1976-09-29 | 1980-04-01 | Rca Corporation | Article and device having an amorphous silicon containing a halogen and method of fabrication |
| US4177473A (en) * | 1977-05-18 | 1979-12-04 | Energy Conversion Devices, Inc. | Amorphous semiconductor member and method of making the same |
| FR2394173A1 (fr) * | 1977-06-06 | 1979-01-05 | Thomson Csf | Procede de fabrication de dispositifs electroniques qui comportent une couche mince de silicium amorphe et dispositif electronique obtenu par un tel procede |
| US4113514A (en) * | 1978-01-16 | 1978-09-12 | Rca Corporation | Method of passivating a semiconductor device by treatment with atomic hydrogen |
-
1978
- 1978-03-08 US US05/884,664 patent/US4217374A/en not_active Expired - Lifetime
-
1979
- 1979-02-23 ZA ZA79880A patent/ZA79880B/xx unknown
- 1979-02-26 CA CA322,276A patent/CA1122687A/en not_active Expired
- 1979-03-01 AU AU44736/79A patent/AU523216B2/en not_active Expired
- 1979-03-02 WO PCT/US1979/000134 patent/WO1979000724A1/en unknown
- 1979-03-02 BR BR7908764A patent/BR7908764A/pt unknown
- 1979-03-02 DE DE792940994T patent/DE2940994T1/de active Granted
- 1979-03-06 MX MX79100725U patent/MX4797E/es unknown
- 1979-03-07 FR FR7905886A patent/FR2445616A1/fr active Granted
- 1979-03-08 ES ES478453A patent/ES478453A1/es not_active Expired
- 1979-03-08 IN IN224/CAL/79A patent/IN151362B/en unknown
-
1980
- 1980-01-11 DE DE19803000904 patent/DE3000904A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| MX4797E (es) | 1982-10-11 |
| WO1979000724A1 (en) | 1979-10-04 |
| ES478453A1 (es) | 1979-11-16 |
| IN151362B (US07223432-20070529-C00017.png) | 1983-04-02 |
| DE3000904A1 (de) | 1981-07-16 |
| US4217374A (en) | 1980-08-12 |
| ZA79880B (en) | 1980-04-30 |
| FR2445616A1 (fr) | 1980-07-25 |
| FR2445616B1 (US07223432-20070529-C00017.png) | 1985-02-22 |
| CA1122687A (en) | 1982-04-27 |
| BR7908764A (pt) | 1980-12-30 |
| DE2940994C2 (US07223432-20070529-C00017.png) | 1989-12-14 |
| AU4473679A (en) | 1979-09-13 |
| AU523216B2 (en) | 1982-07-15 |
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