DE202011110832U1 - Lichtemittierende Diodeneinheit auf Waferebene - Google Patents
Lichtemittierende Diodeneinheit auf Waferebene Download PDFInfo
- Publication number
- DE202011110832U1 DE202011110832U1 DE202011110832.9U DE202011110832U DE202011110832U1 DE 202011110832 U1 DE202011110832 U1 DE 202011110832U1 DE 202011110832 U DE202011110832 U DE 202011110832U DE 202011110832 U1 DE202011110832 U1 DE 202011110832U1
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
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- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H—ELECTRICITY
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- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/486—Containers adapted for surface mounting
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/387—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0092807 | 2010-09-24 | ||
KR1020100092807A KR101142965B1 (ko) | 2010-09-24 | 2010-09-24 | 웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법 |
Publications (1)
Publication Number | Publication Date |
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DE202011110832U1 true DE202011110832U1 (de) | 2016-09-22 |
Family
ID=45874235
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202011110832.9U Expired - Lifetime DE202011110832U1 (de) | 2010-09-24 | 2011-09-05 | Lichtemittierende Diodeneinheit auf Waferebene |
DE112011106156.0T Active DE112011106156B4 (de) | 2010-09-24 | 2011-09-05 | Lichtemittierende Diodeneinheit auf Waferebene |
DE112011103186T Pending DE112011103186T5 (de) | 2010-09-24 | 2011-09-05 | Lichtemittierende Diodeneinheit auf Waferebene und Verfahren zu ihrer Herstellung |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112011106156.0T Active DE112011106156B4 (de) | 2010-09-24 | 2011-09-05 | Lichtemittierende Diodeneinheit auf Waferebene |
DE112011103186T Pending DE112011103186T5 (de) | 2010-09-24 | 2011-09-05 | Lichtemittierende Diodeneinheit auf Waferebene und Verfahren zu ihrer Herstellung |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101142965B1 (zh) |
CN (6) | CN103119735B (zh) |
DE (3) | DE202011110832U1 (zh) |
WO (1) | WO2012039555A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4163984A1 (en) * | 2021-10-05 | 2023-04-12 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device, display apparatus including the same, and method of manufacturing the same |
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US20130258637A1 (en) * | 2012-03-31 | 2013-10-03 | Michael Dongxue Wang | Wavelength-converting structure for a light source |
CN103700682A (zh) * | 2012-05-04 | 2014-04-02 | 奇力光电科技股份有限公司 | 发光二极管结构及其制造方法 |
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WO2015190817A1 (ko) * | 2014-06-10 | 2015-12-17 | 주식회사 세미콘라이트 | 반도체 발광소자 |
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KR102413224B1 (ko) * | 2015-10-01 | 2022-06-24 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자, 발광 소자 제조방법 및 발광 모듈 |
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DE112011106156B4 (de) | 2024-02-01 |
KR20120031342A (ko) | 2012-04-03 |
DE112011103186T5 (de) | 2013-07-18 |
CN105789234B (zh) | 2020-06-09 |
CN105789235B (zh) | 2019-05-03 |
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WO2012039555A3 (en) | 2012-06-28 |
CN105679751A (zh) | 2016-06-15 |
CN103119735B (zh) | 2016-04-06 |
CN105679751B (zh) | 2020-06-09 |
WO2012039555A2 (en) | 2012-03-29 |
CN105789236A (zh) | 2016-07-20 |
CN103119735A (zh) | 2013-05-22 |
CN105789236B (zh) | 2019-06-11 |
CN105575990B (zh) | 2018-12-07 |
KR101142965B1 (ko) | 2012-05-08 |
CN105789234A (zh) | 2016-07-20 |
CN105575990A (zh) | 2016-05-11 |
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