DE102008053965B4 - Kontinuierlich arbeitende Beschichtungsvorrichtungen - Google Patents
Kontinuierlich arbeitende Beschichtungsvorrichtungen Download PDFInfo
- Publication number
- DE102008053965B4 DE102008053965B4 DE102008053965.1A DE102008053965A DE102008053965B4 DE 102008053965 B4 DE102008053965 B4 DE 102008053965B4 DE 102008053965 A DE102008053965 A DE 102008053965A DE 102008053965 B4 DE102008053965 B4 DE 102008053965B4
- Authority
- DE
- Germany
- Prior art keywords
- power supply
- workpiece
- coating
- workpieces
- supply units
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 158
- 238000000576 coating method Methods 0.000 title claims abstract description 158
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 230000003247 decreasing effect Effects 0.000 claims description 19
- 239000000969 carrier Substances 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 description 11
- 238000007654 immersion Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 102100035353 Cyclin-dependent kinase 2-associated protein 1 Human genes 0.000 description 2
- 101000737813 Homo sapiens Cyclin-dependent kinase 2-associated protein 1 Proteins 0.000 description 2
- 101001139126 Homo sapiens Krueppel-like factor 6 Proteins 0.000 description 2
- 101000585359 Homo sapiens Suppressor of tumorigenicity 20 protein Proteins 0.000 description 2
- 102100029860 Suppressor of tumorigenicity 20 protein Human genes 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 101000760620 Homo sapiens Cell adhesion molecule 1 Proteins 0.000 description 1
- 101000911772 Homo sapiens Hsc70-interacting protein Proteins 0.000 description 1
- 101000710013 Homo sapiens Reversion-inducing cysteine-rich protein with Kazal motifs Proteins 0.000 description 1
- 101000661807 Homo sapiens Suppressor of tumorigenicity 14 protein Proteins 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 108090000237 interleukin-24 Proteins 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007284841 | 2007-11-01 | ||
| JP2007-284841 | 2007-11-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102008053965A1 DE102008053965A1 (de) | 2009-05-07 |
| DE102008053965B4 true DE102008053965B4 (de) | 2021-03-25 |
Family
ID=40514646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102008053965.1A Expired - Fee Related DE102008053965B4 (de) | 2007-11-01 | 2008-10-30 | Kontinuierlich arbeitende Beschichtungsvorrichtungen |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8940137B2 (enExample) |
| JP (2) | JP5457010B2 (enExample) |
| KR (1) | KR101540474B1 (enExample) |
| CN (1) | CN101423969B (enExample) |
| DE (1) | DE102008053965B4 (enExample) |
| TW (1) | TWI415977B (enExample) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010144509A2 (en) | 2009-06-08 | 2010-12-16 | Modumetal Llc | Electrodeposited, nanolaminate coatings and claddings for corrosion protection |
| JP2012046783A (ja) * | 2010-08-25 | 2012-03-08 | Almex Pe Inc | 表面処理装置 |
| JP5613499B2 (ja) * | 2010-08-25 | 2014-10-22 | アルメックスPe株式会社 | 表面処理装置 |
| JP5602553B2 (ja) * | 2010-09-17 | 2014-10-08 | アルメックスPe株式会社 | 表面処理装置 |
| DE102012012990B4 (de) | 2011-06-30 | 2014-09-04 | Almex Pe Inc. | Oberflächenbehandlungssystem und Werkstückhaltestütze |
| JP5833355B2 (ja) * | 2011-06-30 | 2015-12-16 | アルメックスPe株式会社 | 表面処理装置 |
| JP6129497B2 (ja) * | 2011-09-29 | 2017-05-17 | アルメックスPe株式会社 | 連続メッキ装置 |
| JP5795514B2 (ja) * | 2011-09-29 | 2015-10-14 | アルメックスPe株式会社 | 連続メッキ装置 |
| JP5766091B2 (ja) * | 2011-10-24 | 2015-08-19 | 京セラサーキットソリューションズ株式会社 | めっき装置 |
| CN102677134A (zh) * | 2012-05-31 | 2012-09-19 | 无锡市喷特环保工程有限公司 | 连续镀槽 |
| CN103590079A (zh) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | 一种电镀方法 |
| CN105143521B (zh) | 2013-03-15 | 2020-07-10 | 莫杜美拓有限公司 | 用于连续施加纳米叠层金属涂层的方法和装置 |
| BR112015022235A2 (pt) | 2013-03-15 | 2017-07-18 | Modumetal Inc | revestimentos nanolaminados |
| EP2971261A4 (en) | 2013-03-15 | 2017-05-31 | Modumetal, Inc. | Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes |
| CN108486622B (zh) | 2013-03-15 | 2020-10-30 | 莫杜美拓有限公司 | 具有高硬度的镍铬纳米层压涂层 |
| WO2016044712A1 (en) | 2014-09-18 | 2016-03-24 | Modumetal, Inc. | Methods of preparing articles by electrodeposition and additive manufacturing processes |
| EA201790643A1 (ru) * | 2014-09-18 | 2017-08-31 | Модьюметал, Инк. | Способ и устройство для непрерывного нанесения нанослоистых металлических покрытий |
| CN104313657A (zh) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | Hdi印制线路板通孔的电沉积装置 |
| CN106149039B (zh) * | 2015-04-08 | 2017-11-24 | 亚硕企业股份有限公司 | 电镀设备 |
| CN104862768B (zh) * | 2015-05-27 | 2017-09-22 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
| KR102579796B1 (ko) * | 2015-10-20 | 2023-09-15 | 프로세스 오토메이션 인터내셔날 리미티드 | 전기도금 머신 및 전기도금 방법 |
| TWI698554B (zh) * | 2015-10-20 | 2020-07-11 | 香港商亞洲電鍍器材有限公司 | 電鍍機器及電鍍方法 |
| JP6117891B2 (ja) * | 2015-10-29 | 2017-04-19 | アルメックスPe株式会社 | 表面処理装置 |
| US11365488B2 (en) | 2016-09-08 | 2022-06-21 | Modumetal, Inc. | Processes for providing laminated coatings on workpieces, and articles made therefrom |
| WO2018075156A1 (en) | 2016-09-09 | 2018-04-26 | Modumetal, Inc. | Manufacturing of molds by deposition of material layers on a workpiece, molds and articles obtained by said process |
| US20190360116A1 (en) | 2016-09-14 | 2019-11-28 | Modumetal, Inc. | System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom |
| CN112962136A (zh) * | 2016-09-29 | 2021-06-15 | Almex Pe 株式会社 | 工件保持夹具和表面处理装置 |
| EP3535118A1 (en) | 2016-11-02 | 2019-09-11 | Modumetal, Inc. | Topology optimized high interface packing structures |
| CA3060619A1 (en) | 2017-04-21 | 2018-10-25 | Modumetal, Inc. | Tubular articles with electrodeposited coatings, and systems and methods for producing the same |
| MY193456A (en) | 2017-05-30 | 2022-10-14 | Almex Pe Inc | Surface treatment apparatus and transfer jig |
| CN107119309A (zh) * | 2017-06-15 | 2017-09-01 | 临安金奥科技有限公司 | 一种对板材表面进行单面连续处理的装置 |
| WO2019078064A1 (ja) * | 2017-10-20 | 2019-04-25 | アルメックスPe株式会社 | 表面処理装置 |
| EP3784823A1 (en) | 2018-04-27 | 2021-03-03 | Modumetal, Inc. | Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation |
| CN109468677A (zh) * | 2018-12-05 | 2019-03-15 | 珠海杰赛科技有限公司 | 一种垂直连续电镀方法 |
| CN215925133U (zh) * | 2021-06-30 | 2022-03-01 | 厦门海辰新能源科技有限公司 | 一种用于镀膜机的阳极板及镀膜机 |
| CN114775023A (zh) * | 2022-05-26 | 2022-07-22 | 枣庄睿诺光电信息有限公司 | 一种电镀装置 |
| CN115505996B (zh) * | 2022-11-04 | 2023-03-10 | 昆山东威科技股份有限公司 | 一种电镀装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2724691A (en) * | 1951-06-13 | 1955-11-22 | Western Electric Co | Apparatus for electroplating articles |
| JPS61133400A (ja) * | 1984-12-03 | 1986-06-20 | Kosaku:Kk | 電気めつき装置 |
| DE10153171B4 (de) * | 2001-10-27 | 2004-09-16 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2724690A (en) * | 1951-06-13 | 1955-11-22 | Western Electric Co | Apparatus for electroplating articles |
| US2935989A (en) * | 1957-12-04 | 1960-05-10 | Hanson Van Winkle Munning Co | Processing apparatus |
| US3455809A (en) * | 1966-11-25 | 1969-07-15 | Baker Bros Inc | Adjustable electrode transporter for lateral electrode spacing during electroplating |
| GB1557017A (en) * | 1976-07-20 | 1979-12-05 | Heritage Silversmiths Ltd | Electropolishing of stainless steel |
| JPS5321048A (en) * | 1976-08-10 | 1978-02-27 | Nippon Electric Co | Constant current density plating device |
| US4184927A (en) * | 1976-12-30 | 1980-01-22 | Riken Keikinzoku Kogyo Kabushiki Kaisha | Process and apparatus for effecting surface treatment of workpieces |
| FR2390517A1 (fr) * | 1977-05-10 | 1978-12-08 | Coppertron Sa | Installation pour l'electro-production de cuivre en feuilles destinees a etre appliquees en particulier sur des materiaux dielectriques |
| US4189360A (en) * | 1979-03-12 | 1980-02-19 | Woods Craig P | Process for continuous anodizing of aluminum |
| US4263122A (en) * | 1979-12-03 | 1981-04-21 | Programmed Coating Systems, Inc. | Electrocoating equipment |
| DE2951708A1 (de) * | 1979-12-19 | 1981-07-02 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Verfahren und vorrichtung zur automatischen regelung von teilstromstaerken eines gleichrichters |
| US4337134A (en) * | 1980-02-27 | 1982-06-29 | Elfab Corporation | Continuous truck mounted printed circuit board plating system |
| US4401522A (en) * | 1980-09-29 | 1983-08-30 | Micro-Plate, Inc. | Plating method and apparatus |
| US4378281A (en) * | 1981-06-25 | 1983-03-29 | Napco, Inc. | High speed plating of flat planar workpieces |
| US4534843A (en) * | 1983-01-28 | 1985-08-13 | Technic, Inc. | Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like |
| US4775046A (en) * | 1986-01-17 | 1988-10-04 | Future Automation, Inc. | Transport belt for production parts |
| DE3929728A1 (de) * | 1989-09-07 | 1991-03-14 | Werner M Kraemer | Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage |
| DE3939681A1 (de) * | 1989-12-01 | 1991-06-06 | Schering Ag | Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung |
| JPH0774479B2 (ja) * | 1990-03-22 | 1995-08-09 | 三菱電機株式会社 | 電気めっき装置 |
| JPH06346289A (ja) * | 1993-06-14 | 1994-12-20 | Fujikura Ltd | 陽極酸化処理装置および陽極酸化処理方法 |
| CN1116449C (zh) * | 1994-05-11 | 2003-07-30 | 比利时西门子公司 | 电路板的处理设备 |
| DE19539868C1 (de) * | 1995-10-26 | 1997-02-20 | Lea Ronal Gmbh | Transportvorrichtung und Transportsystem zur vertikalen Führung von plattenähnlichen Gegenständen zur chemischen oder elektrolytischen Oberflächenbehandlung |
| DE19717510C1 (de) * | 1997-04-25 | 1998-10-01 | Atotech Deutschland Gmbh | Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen |
| TW373034B (en) * | 1997-10-30 | 1999-11-01 | Kazuo Ohba | Automatic plating method and apparatus thereof |
| TW438906B (en) * | 1998-06-11 | 2001-06-07 | Kazuo Ohba | Continuous plating apparatus |
| US6471846B1 (en) * | 1998-09-25 | 2002-10-29 | Kazuo Ohba | Electric feeding method and apparatus for a continuous plating apparatus |
| JP3025254B1 (ja) * | 1999-02-05 | 2000-03-27 | 藤本電気商事有限会社 | めっき装置およびめっき方法 |
| JP3754262B2 (ja) * | 2000-02-16 | 2006-03-08 | 株式会社アルメックス | 表面処理装置 |
| US6793792B2 (en) * | 2001-01-12 | 2004-09-21 | Unitive International Limited Curaco | Electroplating methods including maintaining a determined electroplating voltage and related systems |
| JP4157308B2 (ja) * | 2001-06-27 | 2008-10-01 | シャープ株式会社 | めっき膜の形成方法及び該方法によりめっき膜が形成された電子部品 |
| WO2004107422A2 (en) * | 2003-05-27 | 2004-12-09 | Ebara Corporation | Plating apparatus and plating method |
| KR100539239B1 (ko) * | 2003-06-25 | 2005-12-27 | 삼성전자주식회사 | 도금 중단에 의해 불량이 발생되는 것을 방지하는 도금방법 및 이에 이용되는 도금 장비 |
| JP2005097721A (ja) * | 2003-08-27 | 2005-04-14 | Yamaha Corp | 両面メッキ装置および両面メッキ方法 |
| JP4707941B2 (ja) * | 2003-09-02 | 2011-06-22 | アルメックスPe株式会社 | めっき処理装置およびめっき処理方法 |
| JP2006037134A (ja) * | 2004-07-23 | 2006-02-09 | Chuo Seisakusho Ltd | 連続搬送式めっき装置の電流制御方法 |
| US20060213778A1 (en) * | 2005-03-23 | 2006-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for electrochemical plating on semiconductor wafers |
| JP4937154B2 (ja) * | 2008-02-06 | 2012-05-23 | デュポン神東・オートモティブ・システムズ株式会社 | 電着膜厚自動制御方法 |
-
2008
- 2008-10-27 JP JP2008275561A patent/JP5457010B2/ja active Active
- 2008-10-30 US US12/261,127 patent/US8940137B2/en active Active
- 2008-10-30 DE DE102008053965.1A patent/DE102008053965B4/de not_active Expired - Fee Related
- 2008-10-31 TW TW097142278A patent/TWI415977B/zh active
- 2008-10-31 CN CN2008101732961A patent/CN101423969B/zh active Active
- 2008-10-31 KR KR1020080107726A patent/KR101540474B1/ko not_active Expired - Fee Related
-
2014
- 2014-01-09 JP JP2014002497A patent/JP5740014B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2724691A (en) * | 1951-06-13 | 1955-11-22 | Western Electric Co | Apparatus for electroplating articles |
| JPS61133400A (ja) * | 1984-12-03 | 1986-06-20 | Kosaku:Kk | 電気めつき装置 |
| DE10153171B4 (de) * | 2001-10-27 | 2004-09-16 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101423969A (zh) | 2009-05-06 |
| DE102008053965A1 (de) | 2009-05-07 |
| KR101540474B1 (ko) | 2015-07-29 |
| KR20090045119A (ko) | 2009-05-07 |
| CN101423969B (zh) | 2013-08-07 |
| JP2014074237A (ja) | 2014-04-24 |
| TW200930845A (en) | 2009-07-16 |
| JP5740014B2 (ja) | 2015-06-24 |
| JP2009132999A (ja) | 2009-06-18 |
| US8940137B2 (en) | 2015-01-27 |
| TWI415977B (zh) | 2013-11-21 |
| JP5457010B2 (ja) | 2014-04-02 |
| US20090114530A1 (en) | 2009-05-07 |
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