CN101423969A - 连续电镀处理装置 - Google Patents
连续电镀处理装置 Download PDFInfo
- Publication number
- CN101423969A CN101423969A CNA2008101732961A CN200810173296A CN101423969A CN 101423969 A CN101423969 A CN 101423969A CN A2008101732961 A CNA2008101732961 A CN A2008101732961A CN 200810173296 A CN200810173296 A CN 200810173296A CN 101423969 A CN101423969 A CN 101423969A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- plating tank
- power subsystem
- negative electrode
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007284841 | 2007-11-01 | ||
JP2007-284841 | 2007-11-01 | ||
JP2007284841 | 2007-11-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101423969A true CN101423969A (zh) | 2009-05-06 |
CN101423969B CN101423969B (zh) | 2013-08-07 |
Family
ID=40514646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101732961A Active CN101423969B (zh) | 2007-11-01 | 2008-10-31 | 连续电镀处理装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8940137B2 (zh) |
JP (2) | JP5457010B2 (zh) |
KR (1) | KR101540474B1 (zh) |
CN (1) | CN101423969B (zh) |
DE (1) | DE102008053965B4 (zh) |
TW (1) | TWI415977B (zh) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102383167A (zh) * | 2010-08-25 | 2012-03-21 | Almexpe株式会社 | 表面处理装置 |
CN102383166A (zh) * | 2010-08-25 | 2012-03-21 | Almexpe株式会社 | 表面处理装置 |
CN102409387A (zh) * | 2010-09-17 | 2012-04-11 | Almexpe株式会社 | 表面处理装置 |
CN102677134A (zh) * | 2012-05-31 | 2012-09-19 | 无锡市喷特环保工程有限公司 | 连续镀槽 |
CN103031588A (zh) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | 连续电镀装置 |
CN103590079A (zh) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | 一种电镀方法 |
CN104313657A (zh) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | Hdi印制线路板通孔的电沉积装置 |
CN104532331A (zh) * | 2011-06-30 | 2015-04-22 | Almexpe株式会社 | 表面处理装置及工件保持夹具 |
CN104862768A (zh) * | 2015-05-27 | 2015-08-26 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
CN106149039A (zh) * | 2015-04-08 | 2016-11-23 | 亚硕企业股份有限公司 | 电镀设备 |
CN107012497A (zh) * | 2015-10-20 | 2017-08-04 | 亚洲电镀器材有限公司 | 一种电镀机和电镀方法 |
CN107119309A (zh) * | 2017-06-15 | 2017-09-01 | 临安金奥科技有限公司 | 一种对板材表面进行单面连续处理的装置 |
CN109468677A (zh) * | 2018-12-05 | 2019-03-15 | 珠海杰赛科技有限公司 | 一种垂直连续电镀方法 |
CN114775023A (zh) * | 2022-05-26 | 2022-07-22 | 枣庄睿诺光电信息有限公司 | 一种电镀装置 |
WO2024094129A1 (zh) * | 2022-11-04 | 2024-05-10 | 昆山东威科技股份有限公司 | 电镀装置 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2440691B1 (en) | 2009-06-08 | 2019-10-23 | Modumetal, Inc. | Electrodeposited, nanolaminate coatings and claddings for corrosion protection |
JP5833355B2 (ja) * | 2011-06-30 | 2015-12-16 | アルメックスPe株式会社 | 表面処理装置 |
JP6129497B2 (ja) * | 2011-09-29 | 2017-05-17 | アルメックスPe株式会社 | 連続メッキ装置 |
JP5766091B2 (ja) * | 2011-10-24 | 2015-08-19 | 京セラサーキットソリューションズ株式会社 | めっき装置 |
CA2905536C (en) | 2013-03-15 | 2023-03-07 | Modumetal, Inc. | Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes |
EA201500947A1 (ru) | 2013-03-15 | 2016-03-31 | Модьюметл, Инк. | Устройство и способ электроосаждения нанослоистого покрытия |
BR112015022235A2 (pt) | 2013-03-15 | 2017-07-18 | Modumetal Inc | revestimentos nanolaminados |
WO2014145588A1 (en) | 2013-03-15 | 2014-09-18 | Modumetal, Inc. | Nickel chromium nanolaminate coating having high hardness |
CN106794673B (zh) | 2014-09-18 | 2021-01-22 | 莫杜美拓有限公司 | 通过电沉积和添加制造工艺制备制品的方法 |
EP3194642A4 (en) * | 2014-09-18 | 2018-07-04 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
KR102579796B1 (ko) * | 2015-10-20 | 2023-09-15 | 프로세스 오토메이션 인터내셔날 리미티드 | 전기도금 머신 및 전기도금 방법 |
JP6117891B2 (ja) * | 2015-10-29 | 2017-04-19 | アルメックスPe株式会社 | 表面処理装置 |
CN109952391B (zh) | 2016-09-08 | 2022-11-01 | 莫杜美拓有限公司 | 在工件上提供层压涂层的方法,及由其制备的制品 |
US20190360116A1 (en) | 2016-09-14 | 2019-11-28 | Modumetal, Inc. | System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom |
CN109804108B (zh) * | 2016-09-29 | 2021-07-23 | Almex Pe 株式会社 | 工件保持夹具和表面处理装置 |
WO2018085591A1 (en) | 2016-11-02 | 2018-05-11 | Modumetal, Inc. | Topology optimized high interface packing structures |
CA3060619A1 (en) | 2017-04-21 | 2018-10-25 | Modumetal, Inc. | Tubular articles with electrodeposited coatings, and systems and methods for producing the same |
WO2018221395A1 (ja) | 2017-05-30 | 2018-12-06 | アルメックスPe株式会社 | 表面処理装置及び搬送治具 |
JP6744646B2 (ja) * | 2017-10-20 | 2020-08-19 | アルメックスPe株式会社 | 表面処理装置 |
CN112272717B (zh) | 2018-04-27 | 2024-01-05 | 莫杜美拓有限公司 | 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2724691A (en) * | 1951-06-13 | 1955-11-22 | Western Electric Co | Apparatus for electroplating articles |
US4337134A (en) * | 1980-02-27 | 1982-06-29 | Elfab Corporation | Continuous truck mounted printed circuit board plating system |
DE3929728A1 (de) * | 1989-09-07 | 1991-03-14 | Werner M Kraemer | Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage |
JP2000226697A (ja) * | 1999-02-05 | 2000-08-15 | Fujimoto Denki Shoji Kk | めっき装置およびめっき方法 |
US6793792B2 (en) * | 2001-01-12 | 2004-09-21 | Unitive International Limited Curaco | Electroplating methods including maintaining a determined electroplating voltage and related systems |
Family Cites Families (34)
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US2724690A (en) * | 1951-06-13 | 1955-11-22 | Western Electric Co | Apparatus for electroplating articles |
US2935989A (en) * | 1957-12-04 | 1960-05-10 | Hanson Van Winkle Munning Co | Processing apparatus |
US3455809A (en) * | 1966-11-25 | 1969-07-15 | Baker Bros Inc | Adjustable electrode transporter for lateral electrode spacing during electroplating |
GB1557017A (en) * | 1976-07-20 | 1979-12-05 | Heritage Silversmiths Ltd | Electropolishing of stainless steel |
JPS5321048A (en) * | 1976-08-10 | 1978-02-27 | Nippon Electric Co | Constant current density plating device |
US4184927A (en) * | 1976-12-30 | 1980-01-22 | Riken Keikinzoku Kogyo Kabushiki Kaisha | Process and apparatus for effecting surface treatment of workpieces |
FR2390517A1 (fr) * | 1977-05-10 | 1978-12-08 | Coppertron Sa | Installation pour l'electro-production de cuivre en feuilles destinees a etre appliquees en particulier sur des materiaux dielectriques |
US4189360A (en) * | 1979-03-12 | 1980-02-19 | Woods Craig P | Process for continuous anodizing of aluminum |
US4263122A (en) * | 1979-12-03 | 1981-04-21 | Programmed Coating Systems, Inc. | Electrocoating equipment |
DE2951708A1 (de) * | 1979-12-19 | 1981-07-02 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Verfahren und vorrichtung zur automatischen regelung von teilstromstaerken eines gleichrichters |
US4401522A (en) * | 1980-09-29 | 1983-08-30 | Micro-Plate, Inc. | Plating method and apparatus |
US4378281A (en) * | 1981-06-25 | 1983-03-29 | Napco, Inc. | High speed plating of flat planar workpieces |
US4534843A (en) * | 1983-01-28 | 1985-08-13 | Technic, Inc. | Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like |
JPS61133400A (ja) * | 1984-12-03 | 1986-06-20 | Kosaku:Kk | 電気めつき装置 |
US4775046A (en) * | 1986-01-17 | 1988-10-04 | Future Automation, Inc. | Transport belt for production parts |
DE3939681A1 (de) * | 1989-12-01 | 1991-06-06 | Schering Ag | Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung |
JPH0774479B2 (ja) * | 1990-03-22 | 1995-08-09 | 三菱電機株式会社 | 電気めっき装置 |
JPH06346289A (ja) * | 1993-06-14 | 1994-12-20 | Fujikura Ltd | 陽極酸化処理装置および陽極酸化処理方法 |
DK0759100T3 (da) * | 1994-05-11 | 1998-09-28 | Siemens Sa | Indretning til bearbejdning af printkort |
DE19539868C1 (de) * | 1995-10-26 | 1997-02-20 | Lea Ronal Gmbh | Transportvorrichtung und Transportsystem zur vertikalen Führung von plattenähnlichen Gegenständen zur chemischen oder elektrolytischen Oberflächenbehandlung |
DE19717510C1 (de) * | 1997-04-25 | 1998-10-01 | Atotech Deutschland Gmbh | Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen |
TW373034B (en) * | 1997-10-30 | 1999-11-01 | Kazuo Ohba | Automatic plating method and apparatus thereof |
TW438906B (en) * | 1998-06-11 | 2001-06-07 | Kazuo Ohba | Continuous plating apparatus |
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JP3754262B2 (ja) * | 2000-02-16 | 2006-03-08 | 株式会社アルメックス | 表面処理装置 |
JP4157308B2 (ja) * | 2001-06-27 | 2008-10-01 | シャープ株式会社 | めっき膜の形成方法及び該方法によりめっき膜が形成された電子部品 |
DE10153171B4 (de) * | 2001-10-27 | 2004-09-16 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen |
US20060141157A1 (en) * | 2003-05-27 | 2006-06-29 | Masahiko Sekimoto | Plating apparatus and plating method |
KR100539239B1 (ko) * | 2003-06-25 | 2005-12-27 | 삼성전자주식회사 | 도금 중단에 의해 불량이 발생되는 것을 방지하는 도금방법 및 이에 이용되는 도금 장비 |
JP2005097721A (ja) * | 2003-08-27 | 2005-04-14 | Yamaha Corp | 両面メッキ装置および両面メッキ方法 |
JP4707941B2 (ja) * | 2003-09-02 | 2011-06-22 | アルメックスPe株式会社 | めっき処理装置およびめっき処理方法 |
JP2006037134A (ja) * | 2004-07-23 | 2006-02-09 | Chuo Seisakusho Ltd | 連続搬送式めっき装置の電流制御方法 |
US20060213778A1 (en) * | 2005-03-23 | 2006-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for electrochemical plating on semiconductor wafers |
JP4937154B2 (ja) * | 2008-02-06 | 2012-05-23 | デュポン神東・オートモティブ・システムズ株式会社 | 電着膜厚自動制御方法 |
-
2008
- 2008-10-27 JP JP2008275561A patent/JP5457010B2/ja active Active
- 2008-10-30 US US12/261,127 patent/US8940137B2/en active Active
- 2008-10-30 DE DE102008053965.1A patent/DE102008053965B4/de not_active Expired - Fee Related
- 2008-10-31 TW TW097142278A patent/TWI415977B/zh active
- 2008-10-31 KR KR1020080107726A patent/KR101540474B1/ko active IP Right Grant
- 2008-10-31 CN CN2008101732961A patent/CN101423969B/zh active Active
-
2014
- 2014-01-09 JP JP2014002497A patent/JP5740014B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2724691A (en) * | 1951-06-13 | 1955-11-22 | Western Electric Co | Apparatus for electroplating articles |
US4337134A (en) * | 1980-02-27 | 1982-06-29 | Elfab Corporation | Continuous truck mounted printed circuit board plating system |
DE3929728A1 (de) * | 1989-09-07 | 1991-03-14 | Werner M Kraemer | Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage |
JP2000226697A (ja) * | 1999-02-05 | 2000-08-15 | Fujimoto Denki Shoji Kk | めっき装置およびめっき方法 |
US6793792B2 (en) * | 2001-01-12 | 2004-09-21 | Unitive International Limited Curaco | Electroplating methods including maintaining a determined electroplating voltage and related systems |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102383167B (zh) * | 2010-08-25 | 2014-04-16 | Almexpe株式会社 | 表面处理装置 |
CN102383166A (zh) * | 2010-08-25 | 2012-03-21 | Almexpe株式会社 | 表面处理装置 |
CN102383167A (zh) * | 2010-08-25 | 2012-03-21 | Almexpe株式会社 | 表面处理装置 |
CN102383166B (zh) * | 2010-08-25 | 2014-07-16 | Almexpe株式会社 | 表面处理装置 |
CN102409387A (zh) * | 2010-09-17 | 2012-04-11 | Almexpe株式会社 | 表面处理装置 |
CN105442027A (zh) * | 2010-09-17 | 2016-03-30 | Almexpe株式会社 | 表面处理装置 |
CN104532331A (zh) * | 2011-06-30 | 2015-04-22 | Almexpe株式会社 | 表面处理装置及工件保持夹具 |
CN103031588A (zh) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | 连续电镀装置 |
CN103031588B (zh) * | 2011-09-29 | 2015-11-11 | Almexpe株式会社 | 连续电镀装置 |
CN102677134A (zh) * | 2012-05-31 | 2012-09-19 | 无锡市喷特环保工程有限公司 | 连续镀槽 |
CN103590079A (zh) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | 一种电镀方法 |
CN104313657A (zh) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | Hdi印制线路板通孔的电沉积装置 |
CN106149039B (zh) * | 2015-04-08 | 2017-11-24 | 亚硕企业股份有限公司 | 电镀设备 |
CN106149039A (zh) * | 2015-04-08 | 2016-11-23 | 亚硕企业股份有限公司 | 电镀设备 |
CN104862768A (zh) * | 2015-05-27 | 2015-08-26 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
CN104862768B (zh) * | 2015-05-27 | 2017-09-22 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
CN107012497A (zh) * | 2015-10-20 | 2017-08-04 | 亚洲电镀器材有限公司 | 一种电镀机和电镀方法 |
CN107012497B (zh) * | 2015-10-20 | 2020-06-02 | 亚洲电镀器材有限公司 | 一种电镀机和电镀方法 |
CN107119309A (zh) * | 2017-06-15 | 2017-09-01 | 临安金奥科技有限公司 | 一种对板材表面进行单面连续处理的装置 |
CN109468677A (zh) * | 2018-12-05 | 2019-03-15 | 珠海杰赛科技有限公司 | 一种垂直连续电镀方法 |
CN114775023A (zh) * | 2022-05-26 | 2022-07-22 | 枣庄睿诺光电信息有限公司 | 一种电镀装置 |
WO2024094129A1 (zh) * | 2022-11-04 | 2024-05-10 | 昆山东威科技股份有限公司 | 电镀装置 |
Also Published As
Publication number | Publication date |
---|---|
US20090114530A1 (en) | 2009-05-07 |
DE102008053965B4 (de) | 2021-03-25 |
JP5740014B2 (ja) | 2015-06-24 |
TWI415977B (zh) | 2013-11-21 |
TW200930845A (en) | 2009-07-16 |
US8940137B2 (en) | 2015-01-27 |
CN101423969B (zh) | 2013-08-07 |
JP2009132999A (ja) | 2009-06-18 |
KR101540474B1 (ko) | 2015-07-29 |
DE102008053965A1 (de) | 2009-05-07 |
KR20090045119A (ko) | 2009-05-07 |
JP2014074237A (ja) | 2014-04-24 |
JP5457010B2 (ja) | 2014-04-02 |
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