TWI415977B - 連續電鍍處理裝置 - Google Patents

連續電鍍處理裝置 Download PDF

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Publication number
TWI415977B
TWI415977B TW097142278A TW97142278A TWI415977B TW I415977 B TWI415977 B TW I415977B TW 097142278 A TW097142278 A TW 097142278A TW 97142278 A TW97142278 A TW 97142278A TW I415977 B TWI415977 B TW I415977B
Authority
TW
Taiwan
Prior art keywords
workpiece
power supply
plating
plating tank
power
Prior art date
Application number
TW097142278A
Other languages
English (en)
Chinese (zh)
Other versions
TW200930845A (en
Inventor
Tomohiro Noda
Kazutoshi Akamatsu
Original Assignee
Almex Pe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Pe Inc filed Critical Almex Pe Inc
Publication of TW200930845A publication Critical patent/TW200930845A/zh
Application granted granted Critical
Publication of TWI415977B publication Critical patent/TWI415977B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
TW097142278A 2007-11-01 2008-10-31 連續電鍍處理裝置 TWI415977B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007284841 2007-11-01

Publications (2)

Publication Number Publication Date
TW200930845A TW200930845A (en) 2009-07-16
TWI415977B true TWI415977B (zh) 2013-11-21

Family

ID=40514646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097142278A TWI415977B (zh) 2007-11-01 2008-10-31 連續電鍍處理裝置

Country Status (6)

Country Link
US (1) US8940137B2 (enExample)
JP (2) JP5457010B2 (enExample)
KR (1) KR101540474B1 (enExample)
CN (1) CN101423969B (enExample)
DE (1) DE102008053965B4 (enExample)
TW (1) TWI415977B (enExample)

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BR122013014461B1 (pt) 2009-06-08 2020-10-20 Modumetal, Inc revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada
JP5613499B2 (ja) * 2010-08-25 2014-10-22 アルメックスＰｅ株式会社 表面処理装置
JP2012046783A (ja) * 2010-08-25 2012-03-08 Almex Pe Inc 表面処理装置
JP5602553B2 (ja) * 2010-09-17 2014-10-08 アルメックスＰｅ株式会社 表面処理装置
KR101500966B1 (ko) 2011-06-30 2015-03-10 아루멕쿠스 피이 가부시키가이샤 표면 처리 장치 및 워크 유지 지그
JP5833355B2 (ja) * 2011-06-30 2015-12-16 アルメックスＰｅ株式会社 表面処理装置
JP5795514B2 (ja) 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 連続メッキ装置
JP6129497B2 (ja) * 2011-09-29 2017-05-17 アルメックスＰｅ株式会社 連続メッキ装置
JP5766091B2 (ja) * 2011-10-24 2015-08-19 京セラサーキットソリューションズ株式会社 めっき装置
CN102677134A (zh) * 2012-05-31 2012-09-19 无锡市喷特环保工程有限公司 连续镀槽
CN103590079A (zh) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 一种电镀方法
HK1220743A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 具有高硬度的镍铬纳米层压涂层
EP2971264A4 (en) 2013-03-15 2017-05-31 Modumetal, Inc. Nanolaminate coatings
EP2971266A4 (en) 2013-03-15 2017-03-01 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN105189826B (zh) 2013-03-15 2019-07-16 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
EP3194163A4 (en) 2014-09-18 2018-06-27 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
CA2961508C (en) * 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
CN106149039B (zh) * 2015-04-08 2017-11-24 亚硕企业股份有限公司 电镀设备
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
KR102579796B1 (ko) * 2015-10-20 2023-09-15 프로세스 오토메이션 인터내셔날 리미티드 전기도금 머신 및 전기도금 방법
JP6117891B2 (ja) * 2015-10-29 2017-04-19 アルメックスＰｅ株式会社 表面処理装置
CA3036191A1 (en) 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US12227869B2 (en) 2016-09-09 2025-02-18 Modumetal, Inc. Application of laminate and nanolaminate materials to tooling and molding processes
KR102412452B1 (ko) 2016-09-14 2022-06-23 모두메탈, 인크. 신뢰가능한 고처리량 복합 전기장 발생을 위한 시스템, 및 그로부터 코팅을 제조하는 방법
WO2018062259A1 (ja) * 2016-09-29 2018-04-05 アルメックスＰｅ株式会社 ワーク保持治具及び表面処理装置
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
JP6779545B2 (ja) 2017-05-30 2020-11-04 株式会社アルメックステクノロジーズ 表面処理装置及び搬送治具
CN107119309A (zh) * 2017-06-15 2017-09-01 临安金奥科技有限公司 一种对板材表面进行单面连续处理的装置
CN111247273B (zh) * 2017-10-20 2022-12-20 Almex 科技株式会社 表面处理装置和工件保持夹具
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN109468677A (zh) * 2018-12-05 2019-03-15 珠海杰赛科技有限公司 一种垂直连续电镀方法
CN215925133U (zh) * 2021-06-30 2022-03-01 厦门海辰新能源科技有限公司 一种用于镀膜机的阳极板及镀膜机
CN114775023A (zh) * 2022-05-26 2022-07-22 枣庄睿诺光电信息有限公司 一种电镀装置
CN115505996B (zh) * 2022-11-04 2023-03-10 昆山东威科技股份有限公司 一种电镀装置

Citations (4)

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Publication number Priority date Publication date Assignee Title
US2724691A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
US4337134A (en) * 1980-02-27 1982-06-29 Elfab Corporation Continuous truck mounted printed circuit board plating system
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage
JP2000226697A (ja) * 1999-02-05 2000-08-15 Fujimoto Denki Shoji Kk めっき装置およびめっき方法

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Publication number Priority date Publication date Assignee Title
US2724691A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
US4337134A (en) * 1980-02-27 1982-06-29 Elfab Corporation Continuous truck mounted printed circuit board plating system
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage
JP2000226697A (ja) * 1999-02-05 2000-08-15 Fujimoto Denki Shoji Kk めっき装置およびめっき方法

Also Published As

Publication number Publication date
JP5740014B2 (ja) 2015-06-24
CN101423969A (zh) 2009-05-06
KR20090045119A (ko) 2009-05-07
TW200930845A (en) 2009-07-16
JP2014074237A (ja) 2014-04-24
DE102008053965B4 (de) 2021-03-25
US8940137B2 (en) 2015-01-27
JP5457010B2 (ja) 2014-04-02
US20090114530A1 (en) 2009-05-07
KR101540474B1 (ko) 2015-07-29
DE102008053965A1 (de) 2009-05-07
JP2009132999A (ja) 2009-06-18
CN101423969B (zh) 2013-08-07

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