DE10197124T1 - Mehrstufiger Array-Kondensator und dafür geeignetes Herstellungsverfahren - Google Patents
Mehrstufiger Array-Kondensator und dafür geeignetes HerstellungsverfahrenInfo
- Publication number
- DE10197124T1 DE10197124T1 DE10197124T DE10197124T DE10197124T1 DE 10197124 T1 DE10197124 T1 DE 10197124T1 DE 10197124 T DE10197124 T DE 10197124T DE 10197124 T DE10197124 T DE 10197124T DE 10197124 T1 DE10197124 T1 DE 10197124T1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- suitable manufacturing
- stage array
- array capacitor
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/751,612 US6532143B2 (en) | 2000-12-29 | 2000-12-29 | Multiple tier array capacitor |
US09/751,612 | 2000-12-29 | ||
PCT/US2001/044878 WO2002054421A2 (en) | 2000-12-29 | 2001-11-28 | Multiple tier array capacitor and methods of fabrication therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10197124T1 true DE10197124T1 (de) | 2003-11-13 |
DE10197124B4 DE10197124B4 (de) | 2006-10-26 |
Family
ID=25022769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10197124T Expired - Fee Related DE10197124B4 (de) | 2000-12-29 | 2001-11-28 | Mehrstufiger elektrischer Kondensator und dafür geeignetes Herstellungsverfahren |
Country Status (10)
Country | Link |
---|---|
US (1) | US6532143B2 (de) |
EP (1) | EP1384237A2 (de) |
JP (1) | JP3995596B2 (de) |
KR (1) | KR100550480B1 (de) |
CN (1) | CN1316524C (de) |
AU (1) | AU2002219953A1 (de) |
DE (1) | DE10197124B4 (de) |
GB (1) | GB2384912B (de) |
MY (1) | MY128533A (de) |
WO (1) | WO2002054421A2 (de) |
Families Citing this family (103)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US6970362B1 (en) * | 2000-07-31 | 2005-11-29 | Intel Corporation | Electronic assemblies and systems comprising interposer with embedded capacitors |
US6775150B1 (en) * | 2000-08-30 | 2004-08-10 | Intel Corporation | Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
US6515222B2 (en) * | 2001-02-05 | 2003-02-04 | Motorola, Inc. | Printed circuit board arrangement |
WO2002096166A1 (en) * | 2001-05-18 | 2002-11-28 | Corporation For National Research Initiatives | Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates |
US7385286B2 (en) * | 2001-06-05 | 2008-06-10 | Matsushita Electric Industrial Co., Ltd. | Semiconductor module |
US6636416B2 (en) * | 2001-06-14 | 2003-10-21 | Intel Corporation | Electronic assembly with laterally connected capacitors and manufacturing method |
US6873185B2 (en) * | 2002-06-19 | 2005-03-29 | Viasic, Inc. | Logic array devices having complex macro-cell architecture and methods facilitating use of same |
US20040022038A1 (en) * | 2002-07-31 | 2004-02-05 | Intel Corporation | Electronic package with back side, cavity mounted capacitors and method of fabrication therefor |
JP2006179956A (ja) * | 2002-10-30 | 2006-07-06 | Kyocera Corp | コンデンサの製造方法 |
JP2006222442A (ja) * | 2002-10-30 | 2006-08-24 | Kyocera Corp | コンデンサ、及び配線基板 |
CN100437850C (zh) * | 2002-10-30 | 2008-11-26 | 京瓷株式会社 | 电容器,布线基板,退耦电路以及高频电路 |
US6819543B2 (en) * | 2002-12-31 | 2004-11-16 | Intel Corporation | Multilayer capacitor with multiple plates per layer |
US6753595B1 (en) * | 2003-01-14 | 2004-06-22 | Silicon Integrated Systems Corp | Substrates for semiconductor devices with shielding for NC contacts |
US7327554B2 (en) * | 2003-03-19 | 2008-02-05 | Ngk Spark Plug Co., Ltd. | Assembly of semiconductor device, interposer and substrate |
DE10313891A1 (de) * | 2003-03-27 | 2004-10-14 | Epcos Ag | Elektrisches Vielschichtbauelement |
US6785118B1 (en) | 2003-03-31 | 2004-08-31 | Intel Corporation | Multiple electrode capacitor |
KR101162522B1 (ko) * | 2003-04-07 | 2012-07-09 | 이비덴 가부시키가이샤 | 다층프린트배선판 |
CN1771601A (zh) * | 2003-04-07 | 2006-05-10 | 皇家飞利浦电子股份有限公司 | 具有集成的分布式退耦电容器的电子封装结构 |
JP4246543B2 (ja) * | 2003-05-13 | 2009-04-02 | 日本特殊陶業株式会社 | 積層電子部品の製造方法 |
CN1317923C (zh) * | 2003-09-29 | 2007-05-23 | 财团法人工业技术研究院 | 一种具内藏电容的基板结构 |
US6873228B1 (en) | 2003-09-30 | 2005-03-29 | National Semiconductor Corporation | Buried self-resonant bypass capacitors within multilayered low temperature co-fired ceramic (LTCC) substrate |
US6881895B1 (en) | 2003-09-30 | 2005-04-19 | National Semiconductor Corporation | Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate |
US6872962B1 (en) | 2003-09-30 | 2005-03-29 | National Semiconductor Corporation | Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate |
EP1673142A2 (de) | 2003-10-06 | 2006-06-28 | Koninklijke Philips Electronics N.V. | Vorrichtung und verfahren zum kapseln eines kondensators |
US8569142B2 (en) * | 2003-11-28 | 2013-10-29 | Blackberry Limited | Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same |
JP2005191562A (ja) * | 2003-12-05 | 2005-07-14 | Ngk Spark Plug Co Ltd | コンデンサとその製造方法 |
US7335966B2 (en) * | 2004-02-26 | 2008-02-26 | Triad Semiconductor, Inc. | Configurable integrated circuit capacitor array using via mask layers |
WO2005098954A1 (en) * | 2004-04-02 | 2005-10-20 | Triad Semiconductor, Inc. | Via configurable architecture for customization of analog circuitry in a semiconductor device |
US20050225955A1 (en) * | 2004-04-09 | 2005-10-13 | Hewlett-Packard Development Company, L.P. | Multi-layer printed circuit boards |
US7095108B2 (en) * | 2004-05-05 | 2006-08-22 | Intel Corporation | Array capacitors in interposers, and methods of using same |
JP2005340647A (ja) * | 2004-05-28 | 2005-12-08 | Nec Compound Semiconductor Devices Ltd | インターポーザ基板、半導体パッケージ及び半導体装置並びにそれらの製造方法 |
JP4079120B2 (ja) * | 2004-06-04 | 2008-04-23 | 株式会社村田製作所 | 積層型セラミックコンデンサの製造方法 |
JP4597585B2 (ja) * | 2004-06-04 | 2010-12-15 | 日本特殊陶業株式会社 | 積層電子部品及びその製造方法 |
US7183651B1 (en) * | 2004-06-15 | 2007-02-27 | Storage Technology Corporation | Power plane decoupling |
US20050285281A1 (en) * | 2004-06-29 | 2005-12-29 | Simmons Asher L | Pad-limited integrated circuit |
US7501698B2 (en) * | 2004-10-26 | 2009-03-10 | Kabushiki Kaisha Toshiba | Method and system for an improved power distribution network for use with a semiconductor device |
US7149072B2 (en) * | 2004-11-04 | 2006-12-12 | Samsung Electro-Mechanics Co., Ltd. | Multilayered chip capacitor array |
KR100674823B1 (ko) | 2004-12-07 | 2007-01-26 | 삼성전기주식회사 | 적층형 캐패시터 어레이의 배선접속구조 |
US7334208B1 (en) | 2004-11-09 | 2008-02-19 | Viasic, Inc. | Customization of structured ASIC devices using pre-process extraction of routing information |
KR100714608B1 (ko) * | 2004-12-03 | 2007-05-07 | 삼성전기주식회사 | 적층형 칩 커패시터 |
US20060158828A1 (en) * | 2004-12-21 | 2006-07-20 | Amey Daniel I Jr | Power core devices and methods of making thereof |
US7613007B2 (en) * | 2004-12-21 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Power core devices |
WO2006070807A1 (ja) * | 2004-12-28 | 2006-07-06 | Ngk Spark Plug Co., Ltd. | 配線基板及び配線基板の製造方法 |
JP2008535207A (ja) | 2005-03-01 | 2008-08-28 | エックストゥーワイ アテニュエイターズ,エルエルシー | 共平面導体を有する調整器 |
EP1891650A4 (de) * | 2005-03-05 | 2012-03-28 | Innovation Engineering Llc | Elektronisch variables kondensator-array |
US7372126B2 (en) * | 2005-03-31 | 2008-05-13 | Intel Corporation | Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same |
JP4757587B2 (ja) * | 2005-09-21 | 2011-08-24 | Tdk株式会社 | 積層コンデンサ、及び、その製造方法 |
US7701052B2 (en) * | 2005-10-21 | 2010-04-20 | E. I. Du Pont De Nemours And Company | Power core devices |
JP4911036B2 (ja) * | 2005-12-01 | 2012-04-04 | 株式会社村田製作所 | 積層コンデンサおよびその実装構造 |
US7692284B2 (en) * | 2005-12-12 | 2010-04-06 | Intel Corporation | Package using array capacitor core |
KR100761860B1 (ko) * | 2006-09-20 | 2007-09-28 | 삼성전자주식회사 | 와이어 본딩 모니터링이 가능한 인터포저 칩을 갖는 적층반도체 패키지 및 이의 제조방법 |
FI20065692L (fi) * | 2006-11-02 | 2008-05-03 | Waertsilae Finland Oy | Menetelmä kiinteäoksidipolttokennon käyttämiseksi |
US20080239685A1 (en) * | 2007-03-27 | 2008-10-02 | Tadahiko Kawabe | Capacitor built-in wiring board |
US7902662B2 (en) | 2007-04-02 | 2011-03-08 | E.I. Du Pont De Nemours And Company | Power core devices and methods of making thereof |
US8493744B2 (en) * | 2007-04-03 | 2013-07-23 | Tdk Corporation | Surface mount devices with minimum lead inductance and methods of manufacturing the same |
US7589394B2 (en) * | 2007-04-10 | 2009-09-15 | Ibiden Co., Ltd. | Interposer |
US7969712B2 (en) * | 2007-04-19 | 2011-06-28 | Oracle America, Inc. | Power integrity circuits with EMI benefits |
KR100851065B1 (ko) * | 2007-04-30 | 2008-08-12 | 삼성전기주식회사 | 전자기 밴드갭 구조물 및 인쇄회로기판 |
JP2009027044A (ja) * | 2007-07-20 | 2009-02-05 | Taiyo Yuden Co Ltd | 積層コンデンサ及びコンデンサ内蔵配線基板 |
US7692309B2 (en) * | 2007-09-06 | 2010-04-06 | Viasic, Inc. | Configuring structured ASIC fabric using two non-adjacent via layers |
US20090128993A1 (en) * | 2007-11-21 | 2009-05-21 | Industrial Technology Reaserch Institute | Multi-tier capacitor structure, fabrication method thereof and semiconductor substrate employing the same |
US8227894B2 (en) * | 2007-11-21 | 2012-07-24 | Industrial Technology Research Institute | Stepwise capacitor structure and substrate employing the same |
CN101458994B (zh) * | 2007-12-10 | 2012-09-26 | 财团法人工业技术研究院 | 阶梯式电容结构、其制造方法、及应用其的基板 |
JP4502006B2 (ja) * | 2007-12-28 | 2010-07-14 | Tdk株式会社 | 貫通型積層コンデンサアレイ |
US8125761B2 (en) * | 2008-02-22 | 2012-02-28 | Industrial Technology Research Institute | Capacitor devices with co-coupling electrode planes |
US8395902B2 (en) * | 2008-05-21 | 2013-03-12 | International Business Machines Corporation | Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process |
US20100073894A1 (en) * | 2008-09-22 | 2010-03-25 | Russell Mortensen | Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating same |
US20100108369A1 (en) * | 2008-10-31 | 2010-05-06 | Alexander Tom | Printed Circuit Boards, Printed Circuit Board Capacitors, Electronic Filters, Capacitor Forming Methods, and Articles of Manufacture |
US8094429B2 (en) * | 2009-06-22 | 2012-01-10 | Industrial Technology Research Institute | Multilayer capacitors and methods for making the same |
KR101067178B1 (ko) * | 2009-09-04 | 2011-09-22 | 삼성전기주식회사 | 칩형 전기이중층 커패시터 및 그 패키지 구조 |
US9450556B2 (en) * | 2009-10-16 | 2016-09-20 | Avx Corporation | Thin film surface mount components |
TWI381512B (zh) * | 2009-11-12 | 2013-01-01 | Powertech Technology Inc | 多晶片堆疊結構 |
KR20120017245A (ko) * | 2010-08-18 | 2012-02-28 | 삼성전기주식회사 | 인쇄회로기판 및 이의 제조방법 |
US8717773B2 (en) * | 2011-03-04 | 2014-05-06 | General Electric Company | Multi-plate board embedded capacitor and methods for fabricating the same |
US9406738B2 (en) | 2011-07-20 | 2016-08-02 | Xilinx, Inc. | Inductive structure formed using through silicon vias |
US9330823B1 (en) | 2011-12-19 | 2016-05-03 | Xilinx, Inc. | Integrated circuit structure with inductor in silicon interposer |
JP5919009B2 (ja) * | 2012-02-03 | 2016-05-18 | 太陽誘電株式会社 | ポーラスコンデンサ及びその製造方法 |
US8767408B2 (en) * | 2012-02-08 | 2014-07-01 | Apple Inc. | Three dimensional passive multi-component structures |
US9337138B1 (en) * | 2012-03-09 | 2016-05-10 | Xilinx, Inc. | Capacitors within an interposer coupled to supply and ground planes of a substrate |
US8643141B2 (en) * | 2012-04-16 | 2014-02-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Capacitor array layout arrangement for high matching methodology |
CN102655055A (zh) * | 2012-04-23 | 2012-09-05 | 苏州达方电子有限公司 | 制造积层电容器的方法 |
US20130334657A1 (en) * | 2012-06-15 | 2013-12-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Planar interdigitated capacitor structures and methods of forming the same |
US9035194B2 (en) * | 2012-10-30 | 2015-05-19 | Intel Corporation | Circuit board with integrated passive devices |
US9299498B2 (en) * | 2012-11-15 | 2016-03-29 | Eulex Corp. | Miniature wire-bondable capacitor |
US20140167900A1 (en) | 2012-12-14 | 2014-06-19 | Gregorio R. Murtagian | Surface-mount inductor structures for forming one or more inductors with substrate traces |
US9595526B2 (en) * | 2013-08-09 | 2017-03-14 | Apple Inc. | Multi-die fine grain integrated voltage regulation |
US9093295B2 (en) | 2013-11-13 | 2015-07-28 | Qualcomm Incorporated | Embedded sheet capacitor |
US9642261B2 (en) * | 2014-01-24 | 2017-05-02 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Composite electronic structure with partially exposed and protruding copper termination posts |
US10068181B1 (en) | 2015-04-27 | 2018-09-04 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafer and methods for making the same |
US10892105B2 (en) | 2017-01-31 | 2021-01-12 | International Business Machines Corporation | Multi-layer capacitor package |
US11443898B2 (en) * | 2017-04-10 | 2022-09-13 | Presidio Components. Inc. | Multilayer broadband ceramic capacitor with internal air gap capacitance |
US11636978B2 (en) * | 2017-05-15 | 2023-04-25 | KYOCERA AVX Components Corporation | Multilayer capacitor and circuit board containing the same |
US11121301B1 (en) | 2017-06-19 | 2021-09-14 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafers and their methods of manufacture |
CN107591256B (zh) * | 2017-07-14 | 2019-07-19 | 电子科技大学 | 一种大容量梯度板式阵列电容芯片及其制备方法 |
JP6981476B2 (ja) * | 2017-11-30 | 2021-12-15 | 株式会社村田製作所 | キャパシタ |
JP2021082786A (ja) * | 2019-11-22 | 2021-05-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
GB2590643B (en) * | 2019-12-20 | 2022-08-03 | Graphcore Ltd | Method of manufacturing a computer device |
US11024551B1 (en) | 2020-01-07 | 2021-06-01 | International Business Machines Corporation | Metal replacement vertical interconnections for buried capacitance |
CN113410053A (zh) * | 2021-06-18 | 2021-09-17 | 安徽安努奇科技有限公司 | 一种电容器 |
CN115705959A (zh) * | 2021-08-17 | 2023-02-17 | 比亚迪股份有限公司 | 母线电容及汽车 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2507379A1 (fr) * | 1981-06-05 | 1982-12-10 | Europ Composants Electron | Bloc de condensateurs en serie et multiplicateur de tension utilisant un tel bloc de condensateurs |
US4729061A (en) * | 1985-04-29 | 1988-03-01 | Advanced Micro Devices, Inc. | Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom |
US5757611A (en) * | 1996-04-12 | 1998-05-26 | Norhtrop Grumman Corporation | Electronic package having buried passive components |
US5874770A (en) * | 1996-10-10 | 1999-02-23 | General Electric Company | Flexible interconnect film including resistor and capacitor layers |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
DE69837516T2 (de) * | 1997-11-14 | 2007-12-27 | Murata Mfg. Co., Ltd., Nagaokakyo | Vielschichtkondensator |
US5939782A (en) * | 1998-03-03 | 1999-08-17 | Sun Microsystems, Inc. | Package construction for integrated circuit chip with bypass capacitor |
KR100268424B1 (ko) * | 1998-08-07 | 2000-10-16 | 윤종용 | 반도체 장치의 배선 형성 방법 |
JP3337018B2 (ja) * | 1999-11-19 | 2002-10-21 | 株式会社村田製作所 | 積層コンデンサ、配線基板、デカップリング回路および高周波回路 |
JP2001189234A (ja) * | 1999-12-28 | 2001-07-10 | Tdk Corp | 積層コンデンサ |
US6414835B1 (en) * | 2000-03-01 | 2002-07-02 | Medtronic, Inc. | Capacitive filtered feedthrough array for an implantable medical device |
US6346743B1 (en) * | 2000-06-30 | 2002-02-12 | Intel Corp. | Embedded capacitor assembly in a package |
-
2000
- 2000-12-29 US US09/751,612 patent/US6532143B2/en not_active Expired - Lifetime
-
2001
- 2001-11-28 CN CNB018214436A patent/CN1316524C/zh not_active Expired - Fee Related
- 2001-11-28 JP JP2002555429A patent/JP3995596B2/ja not_active Expired - Fee Related
- 2001-11-28 WO PCT/US2001/044878 patent/WO2002054421A2/en active IP Right Grant
- 2001-11-28 DE DE10197124T patent/DE10197124B4/de not_active Expired - Fee Related
- 2001-11-28 AU AU2002219953A patent/AU2002219953A1/en not_active Abandoned
- 2001-11-28 GB GB0311850A patent/GB2384912B/en not_active Expired - Fee Related
- 2001-11-28 EP EP01273030A patent/EP1384237A2/de not_active Withdrawn
- 2001-11-28 KR KR1020037008753A patent/KR100550480B1/ko not_active IP Right Cessation
- 2001-12-10 MY MYPI20015605A patent/MY128533A/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20020085334A1 (en) | 2002-07-04 |
KR20030064887A (ko) | 2003-08-02 |
CN1484840A (zh) | 2004-03-24 |
EP1384237A2 (de) | 2004-01-28 |
MY128533A (en) | 2007-02-28 |
CN1316524C (zh) | 2007-05-16 |
JP2004534376A (ja) | 2004-11-11 |
AU2002219953A1 (en) | 2002-07-16 |
GB2384912B (en) | 2004-12-22 |
GB2384912A (en) | 2003-08-06 |
KR100550480B1 (ko) | 2006-02-09 |
WO2002054421A2 (en) | 2002-07-11 |
GB0311850D0 (en) | 2003-06-25 |
WO2002054421A3 (en) | 2003-11-06 |
DE10197124B4 (de) | 2006-10-26 |
JP3995596B2 (ja) | 2007-10-24 |
US6532143B2 (en) | 2003-03-11 |
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