DE69919235D1 - Variabler Halbleiterkondensator und Herstellungsverfahren - Google Patents

Variabler Halbleiterkondensator und Herstellungsverfahren

Info

Publication number
DE69919235D1
DE69919235D1 DE69919235T DE69919235T DE69919235D1 DE 69919235 D1 DE69919235 D1 DE 69919235D1 DE 69919235 T DE69919235 T DE 69919235T DE 69919235 T DE69919235 T DE 69919235T DE 69919235 D1 DE69919235 D1 DE 69919235D1
Authority
DE
Germany
Prior art keywords
manufacturing process
semiconductor capacitor
variable semiconductor
variable
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69919235T
Other languages
English (en)
Other versions
DE69919235T2 (de
Inventor
Alexander Kalnitsky
Alan Kramer
Vito Fabbrizio
Giovanni Gozzini
Bhusan Gupta
Marco Sabarini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
STMicroelectronics lnc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics lnc USA filed Critical STMicroelectronics lnc USA
Application granted granted Critical
Publication of DE69919235D1 publication Critical patent/DE69919235D1/de
Publication of DE69919235T2 publication Critical patent/DE69919235T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
DE69919235T 1998-01-13 1999-01-12 Variabler Halbleiterkondensator und Herstellungsverfahren Expired - Fee Related DE69919235T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6269 1998-01-13
US09/006,269 US5982608A (en) 1998-01-13 1998-01-13 Semiconductor variable capacitor

Publications (2)

Publication Number Publication Date
DE69919235D1 true DE69919235D1 (de) 2004-09-16
DE69919235T2 DE69919235T2 (de) 2005-09-08

Family

ID=21720094

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69919235T Expired - Fee Related DE69919235T2 (de) 1998-01-13 1999-01-12 Variabler Halbleiterkondensator und Herstellungsverfahren

Country Status (4)

Country Link
US (2) US5982608A (de)
EP (1) EP0928959B1 (de)
JP (1) JP4602494B2 (de)
DE (1) DE69919235T2 (de)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
DE69933339T8 (de) 1998-07-02 2007-09-13 Nippon Telegraph And Telephone Corp. Nachweisvorrichtung für kleine Kapazitätsänderungen
US6271620B1 (en) * 1999-05-20 2001-08-07 Sen Corporation Acoustic transducer and method of making the same
WO2001050106A1 (en) 2000-01-06 2001-07-12 Rosemount Inc. Grain growth of electrical interconnection for microelectromechanical systems (mems)
US6505516B1 (en) * 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6355534B1 (en) * 2000-01-26 2002-03-12 Intel Corporation Variable tunable range MEMS capacitor
EP1146471B1 (de) * 2000-04-14 2005-11-23 Infineon Technologies AG Kapazitiver biometrischer Sensor
KR100364781B1 (ko) * 2000-05-10 2002-12-16 엘지전자 주식회사 가변 캐패시터 및 그 제조방법
US6465830B2 (en) 2000-06-13 2002-10-15 Texas Instruments Incorporated RF voltage controlled capacitor on thick-film SOI
KR100754518B1 (ko) * 2000-10-11 2007-09-03 삼성전자주식회사 가변 커패시터 및 이를 적용한 메모리장치
US6437965B1 (en) * 2000-11-28 2002-08-20 Harris Corporation Electronic device including multiple capacitance value MEMS capacitor and associated methods
US6306721B1 (en) * 2001-03-16 2001-10-23 Chartered Semiconductor Maufacturing Ltd. Method of forming salicided poly to metal capacitor
KR20040010746A (ko) * 2001-06-18 2004-01-31 허니웰 인터내셔널 인코포레이티드 소형의 고 커패시턴스 판독 실리콘 베이스의 미세 가공된전자기계적 센서 가속도 측정장치
US7005314B2 (en) * 2001-06-27 2006-02-28 Intel Corporation Sacrificial layer technique to make gaps in MEMS applications
FR2830978B1 (fr) * 2001-10-17 2006-07-21 Commissariat Energie Atomique Dispositif a capacite electrique variable integree et procede de realisation d'un tel dispositif
JP3890952B2 (ja) * 2001-10-18 2007-03-07 ソニー株式会社 容量可変型キャパシタ装置
US6835977B2 (en) * 2002-03-05 2004-12-28 United Microelectronics Corp. Variable capactor structure
US6664691B1 (en) * 2002-10-15 2003-12-16 Harris Corporation Filter circuit incorporating a micro-electromechanical capacitor
US6661069B1 (en) * 2002-10-22 2003-12-09 International Business Machines Corporation Micro-electromechanical varactor with enhanced tuning range
US7137300B2 (en) * 2003-03-19 2006-11-21 California Institute Of Technology Parylene capacitive accelerometer utilizing electrical fringing field sensing and method of making
WO2005117042A1 (ja) * 2004-05-31 2005-12-08 Fujitsu Limited 可変キャパシタ及びその製造方法
FR2873849A1 (fr) * 2004-07-27 2006-02-03 St Microelectronics Sa Procede d'obtention d'un film mince magnetique doux, a forte aimantation et isolant, film et circuit integre correspondants
US7114378B1 (en) * 2005-04-14 2006-10-03 Agilent Technologies, Inc. Planar resonant tunneling sensor and method of fabricating and using the same
JP2007273932A (ja) 2006-03-06 2007-10-18 Fujitsu Ltd 可変キャパシタおよび可変キャパシタ製造方法
TWM302070U (en) * 2006-05-19 2006-12-01 Inventec Corp Key module
MX2009002193A (es) * 2006-08-29 2009-04-28 California Inst Of Techn Sensor de presion inalambrico microfabricado implantado para uso en aplicaciones biomedicas y la medicion de la presion y los metodos de implantacion del sensor.
US8169772B2 (en) 2007-05-01 2012-05-01 Avx Corporation Precision laser adjustable thin film capacitors
EP2083431A1 (de) * 2008-01-25 2009-07-29 University College Cork-National University of Ireland, Cork Mikroelektromechanisch einstellbarer Kondensator
US8053865B2 (en) * 2008-03-10 2011-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. MOM capacitors integrated with air-gaps
JP5558198B2 (ja) 2010-05-13 2014-07-23 三菱電機株式会社 半導体圧力センサ
DE102010035247A1 (de) * 2010-08-24 2012-03-01 Siemens Aktiengesellschaft Dielektrischer kapazitiver MEMS Energiewandler
US8498094B2 (en) * 2011-05-05 2013-07-30 Eta Semiconductor Inc. Semiconductor variable capacitor
US9401436B2 (en) * 2011-05-05 2016-07-26 Qualcomm Incorporated Multiple control transcap variable capacitor
ITTO20110881A1 (it) * 2011-10-03 2013-04-04 Milano Politecnico Sensore microelettromeccanico con massa di rilevamento non conduttiva e metodo di rilevamento mediante un sensore microelettromeccanico
US9080871B2 (en) 2011-09-30 2015-07-14 Stmicroelectronics S.R.L. Microelectromechanical sensor with non-conductive sensing mass, and method of sensing through a microelectromechanical sensor
US10112556B2 (en) 2011-11-03 2018-10-30 Ford Global Technologies, Llc Proximity switch having wrong touch adaptive learning and method
US8952529B2 (en) 2011-11-22 2015-02-10 Stats Chippac, Ltd. Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids
US9520875B2 (en) 2012-04-11 2016-12-13 Ford Global Technologies, Llc Pliable proximity switch assembly and activation method
US9944237B2 (en) 2012-04-11 2018-04-17 Ford Global Technologies, Llc Proximity switch assembly with signal drift rejection and method
US9531379B2 (en) * 2012-04-11 2016-12-27 Ford Global Technologies, Llc Proximity switch assembly having groove between adjacent proximity sensors
US9660644B2 (en) 2012-04-11 2017-05-23 Ford Global Technologies, Llc Proximity switch assembly and activation method
US9568527B2 (en) 2012-04-11 2017-02-14 Ford Global Technologies, Llc Proximity switch assembly and activation method having virtual button mode
US9831870B2 (en) 2012-04-11 2017-11-28 Ford Global Technologies, Llc Proximity switch assembly and method of tuning same
US9559688B2 (en) * 2012-04-11 2017-01-31 Ford Global Technologies, Llc Proximity switch assembly having pliable surface and depression
US8963289B2 (en) * 2012-05-08 2015-02-24 Eta Semiconductor Inc. Digital semiconductor variable capacitor
EP2674392B1 (de) 2012-06-12 2017-12-27 ams international AG Integrierte Schaltung mit Drucksensor und Herstellungsverfahren
US10038443B2 (en) 2014-10-20 2018-07-31 Ford Global Technologies, Llc Directional proximity switch assembly
JP2016170018A (ja) * 2015-03-12 2016-09-23 株式会社東芝 Mems装置
US9654103B2 (en) 2015-03-18 2017-05-16 Ford Global Technologies, Llc Proximity switch assembly having haptic feedback and method
US9548733B2 (en) 2015-05-20 2017-01-17 Ford Global Technologies, Llc Proximity sensor assembly having interleaved electrode configuration

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4342227A (en) * 1980-12-24 1982-08-03 International Business Machines Corporation Planar semiconductor three direction acceleration detecting device and method of fabrication
JPS5855732A (ja) * 1981-09-30 1983-04-02 Hitachi Ltd 静電容量型圧力センサ
JPS61234064A (ja) * 1985-04-10 1986-10-18 Nissan Motor Co Ltd 半導体振動検出装置
CH669998A5 (de) * 1986-07-01 1989-04-28 Mettler Instrumente Ag
GB2244164A (en) * 1990-05-18 1991-11-20 Philips Electronic Associated Fingerprint sensing
US5130276A (en) * 1991-05-16 1992-07-14 Motorola Inc. Method of fabricating surface micromachined structures
WO1992022820A2 (en) * 1991-06-12 1992-12-23 Harris Corporation Semiconductor accelerometer and method of its manufacture
JP2765316B2 (ja) * 1991-11-21 1998-06-11 日本電気株式会社 容量型三軸加速度センサ
US5479042A (en) * 1993-02-01 1995-12-26 Brooktree Corporation Micromachined relay and method of forming the relay
US5426070A (en) * 1993-05-26 1995-06-20 Cornell Research Foundation, Inc. Microstructures and high temperature isolation process for fabrication thereof
DE4414969C1 (de) * 1994-04-28 1995-06-08 Siemens Ag Mikromechanisches Bauteil mit einer dielektrischen beweglichen Struktur, Mikrosystem und Herstellverfahren
JPH07306221A (ja) * 1994-05-11 1995-11-21 Nippondenso Co Ltd 半導体加速度センサ
DE4432837B4 (de) * 1994-09-15 2004-05-13 Robert Bosch Gmbh Beschleunigungssensor und Meßverfahren
US5604313A (en) * 1994-11-23 1997-02-18 Tokyo Gas Co., Ltd. Varying apparent mass accelerometer
FR2739977B1 (fr) * 1995-10-17 1998-01-23 France Telecom Capteur monolithique d'empreintes digitales
US6034414A (en) * 1997-11-18 2000-03-07 Industrial Technology Research Institute Variable capacitor using resistor generated heat to control dielectric thickness
US6018175A (en) * 1998-09-03 2000-01-25 Micron Technology, Inc. Gapped-plate capacitor

Also Published As

Publication number Publication date
EP0928959B1 (de) 2004-08-11
US5982608A (en) 1999-11-09
JP4602494B2 (ja) 2010-12-22
DE69919235T2 (de) 2005-09-08
JPH11261015A (ja) 1999-09-24
EP0928959A3 (de) 1999-12-08
EP0928959A2 (de) 1999-07-14
US6110791A (en) 2000-08-29

Similar Documents

Publication Publication Date Title
DE69919235D1 (de) Variabler Halbleiterkondensator und Herstellungsverfahren
DE69929456D1 (de) Nahfeldabtastkopf und herstellungsverfahren
DE60037057D1 (de) Halbleiterelement und Herstellungsverfahren dafür
DE69931334D1 (de) Flexibler Dünnfilmkondensator und Herstellungsverfahren
DE69522514T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE60045755D1 (de) Halbleiterbauelement und dessen Herstellungsverfahren
DE69526539D1 (de) Halbleiteranordnung und Herstellungsverfahren
DE69527330D1 (de) Halbleiteranordnung und Herstellungsverfahren
DE69718693T2 (de) Elektronisches Bauteil und Herstellungsverfahren
DE69525795T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE69834561D1 (de) Halbleiteranordnung und herstellungsverfahren dafür
DE69615437T2 (de) Integrierte Schaltungsanordnung und Herstellungsverfahren
DE69840246D1 (de) Elektronisches Bauteil und Herstellungsverfahren
DE69935095D1 (de) Halbleiterbauelement und deren Herstellungsverfahren
DE10197124T1 (de) Mehrstufiger Array-Kondensator und dafür geeignetes Herstellungsverfahren
DE60235142D1 (de) Kondensator und dessen Herstellungsverfahren
DE59601335D1 (de) Halbleiterbauelement und Herstellverfahren
DE69627252D1 (de) Halbleitersubstrat und Herstellungsverfahren
ATE285951T1 (de) Orginalitätsverschluss und herstellungverfahren
DE69941874D1 (de) Optielektronisches bauelement und herstellungsverfahren
DE69941531D1 (de) ie, und Herstellungsverfahren
DE69712541D1 (de) Halbleiterlaser und Herstellungsverfahren
DE60012592D1 (de) Halbleiterlaser und zugehöriges Herstellungsverfahren
DE69536130D1 (de) Halbleiterbauelement und dessen Herstellungsverfahren
DE60134189D1 (de) Halbleiteranordnung und Herstellungsverfahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee