DE69931334D1 - Flexibler Dünnfilmkondensator und Herstellungsverfahren - Google Patents
Flexibler Dünnfilmkondensator und HerstellungsverfahrenInfo
- Publication number
- DE69931334D1 DE69931334D1 DE69931334T DE69931334T DE69931334D1 DE 69931334 D1 DE69931334 D1 DE 69931334D1 DE 69931334 T DE69931334 T DE 69931334T DE 69931334 T DE69931334 T DE 69931334T DE 69931334 D1 DE69931334 D1 DE 69931334D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- film capacitor
- flexible thin
- flexible
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36388198 | 1998-12-22 | ||
JP36388198 | 1998-12-22 | ||
JP10933199 | 1999-04-16 | ||
JP10933199 | 1999-04-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69931334D1 true DE69931334D1 (de) | 2006-06-22 |
DE69931334T2 DE69931334T2 (de) | 2007-02-01 |
Family
ID=26449104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69931334T Expired - Lifetime DE69931334T2 (de) | 1998-12-22 | 1999-12-21 | Flexibler Dünnfilmkondensator und Herstellungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (2) | US6212057B1 (de) |
EP (1) | EP1014399B1 (de) |
KR (1) | KR100355534B1 (de) |
DE (1) | DE69931334T2 (de) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1048042A1 (de) * | 1998-09-02 | 2000-11-02 | Koninklijke Philips Electronics N.V. | Dünnfilmkondensator |
DE19939483A1 (de) * | 1999-08-20 | 2001-03-08 | Philips Corp Intellectual Pty | Passives Bauelement mit Verbundwerkstoff |
US7893435B2 (en) * | 2000-04-18 | 2011-02-22 | E Ink Corporation | Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough |
TW543052B (en) * | 2001-03-05 | 2003-07-21 | Nitto Denko Corp | Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets |
UA77459C2 (en) * | 2001-11-03 | 2006-12-15 | Thin-film capacitor and a method for producing the capacitor | |
JP2003332169A (ja) * | 2002-05-15 | 2003-11-21 | Matsushita Electric Ind Co Ltd | 積層コンデンサ及びその製造方法 |
US6743524B2 (en) * | 2002-05-23 | 2004-06-01 | General Electric Company | Barrier layer for an article and method of making said barrier layer by expanding thermal plasma |
JP3995619B2 (ja) * | 2003-03-12 | 2007-10-24 | 富士通株式会社 | 薄膜キャパシタ素子、その製造方法及び電子装置 |
EP1629531A2 (de) * | 2003-04-02 | 2006-03-01 | Koninklijke Philips Electronics N.V. | Verfahren zur herstellung einer flexiblen elektronischen einrichtung und flexible einrichtung |
US20050046312A1 (en) * | 2003-09-01 | 2005-03-03 | Fuji Photo Film Co., Ltd. | Laminated structure, piezoelectric actuator and method of manufacturing the same |
US7100277B2 (en) * | 2004-07-01 | 2006-09-05 | E. I. Du Pont De Nemours And Company | Methods of forming printed circuit boards having embedded thick film capacitors |
US7265063B2 (en) * | 2004-10-22 | 2007-09-04 | Hewlett-Packard Development Company, L.P. | Method of forming a component having dielectric sub-layers |
CN1841587A (zh) * | 2005-04-02 | 2006-10-04 | 鸿富锦精密工业(深圳)有限公司 | 电极结构及其制备方法 |
JP3841814B1 (ja) * | 2005-04-28 | 2006-11-08 | 三井金属鉱業株式会社 | キャパシタ層形成材及びそのキャパシタ層形成材の製造方法 |
JP2009501450A (ja) * | 2005-07-12 | 2009-01-15 | ノースロップ グルマン コーポレーション | 小型薄膜および高エネルギー密度結晶コンデンサ |
JP4857642B2 (ja) * | 2005-07-29 | 2012-01-18 | Tdk株式会社 | 薄膜電子部品の製造方法 |
US7646305B2 (en) * | 2005-10-25 | 2010-01-12 | Checkpoint Systems, Inc. | Capacitor strap |
US8414962B2 (en) | 2005-10-28 | 2013-04-09 | The Penn State Research Foundation | Microcontact printed thin film capacitors |
US20070231475A1 (en) * | 2006-03-31 | 2007-10-04 | Tadanori Shimoto | Conductor structure on dielectric material |
WO2008074165A1 (en) * | 2006-12-21 | 2008-06-26 | Abb Research Ltd | Rolled film capacitor |
US8293323B2 (en) * | 2007-02-23 | 2012-10-23 | The Penn State Research Foundation | Thin metal film conductors and their manufacture |
US8047073B2 (en) * | 2007-05-14 | 2011-11-01 | Samsung Sdi Co., Ltd. | Capacitive liquid level detector for direct methanol fuel cell systems |
KR100898974B1 (ko) * | 2007-06-18 | 2009-05-25 | 삼성전기주식회사 | 박막 커패시터, 적층구조물 및 그 제조방법 |
TW201026347A (en) * | 2008-09-10 | 2010-07-16 | Transcu Ltd | Apparatus and method to dispense HPC-based viscous liquids into porous substrates, e. g., continuous web-based process |
US8407871B2 (en) * | 2009-07-06 | 2013-04-02 | Delphi Technologies, Inc. | Method of manufacturing a shapeable short-resistant capacitor |
US10283443B2 (en) * | 2009-11-10 | 2019-05-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chip package having integrated capacitor |
US8354166B2 (en) | 2011-02-28 | 2013-01-15 | General Electric Company | Coated polymer dielectric film |
WO2013013050A1 (en) * | 2011-07-20 | 2013-01-24 | James Madison University | Adhesion of metal thin films to polymeric substrates |
CN104094678A (zh) * | 2012-02-03 | 2014-10-08 | 英派尔科技开发有限公司 | 可印制电子基板 |
JP5539430B2 (ja) * | 2012-03-22 | 2014-07-02 | 富士フイルム株式会社 | 電子機器の製造方法 |
US20150294793A1 (en) | 2012-11-21 | 2015-10-15 | 3M Innovative Properties Company | Multilayer film including first and second dielectric layers |
WO2014081918A2 (en) | 2012-11-21 | 2014-05-30 | 3M Innovative Properties Company | Multilayer film including first and second dielectric layers |
JP6191690B2 (ja) * | 2013-06-17 | 2017-09-06 | 株式会社村田製作所 | コンデンサ及び電子機器 |
KR200476896Y1 (ko) * | 2013-08-22 | 2015-04-10 | 제이 터치 코퍼레이션 | 터치패널용 전극구조 |
US9280225B2 (en) | 2013-09-30 | 2016-03-08 | J Touch Corporation | Electrode structure for touchscreen |
KR102248388B1 (ko) * | 2014-09-01 | 2021-05-07 | (주)포인트엔지니어링 | 커패시터 |
CN106158364A (zh) * | 2015-04-22 | 2016-11-23 | 陈锦棠 | 化学沉积法生产超级储能器的技术 |
CN105006362B (zh) * | 2015-07-28 | 2018-06-19 | 桂林电子科技大学 | 一种可剥离衬底的薄膜电容器制备方法 |
CN108231825B (zh) * | 2016-12-13 | 2020-10-09 | 华为技术有限公司 | 一种显示屏及移动终端 |
CN210925765U (zh) * | 2016-12-21 | 2020-07-03 | 3M创新有限公司 | 柔性电容器构造 |
US10508364B2 (en) * | 2017-03-24 | 2019-12-17 | Zhuhai Crystal Resonance Technologies Co., Ltd. | RF resonator membranes and methods of construction |
US10601397B2 (en) | 2017-03-24 | 2020-03-24 | Zhuhai Crystal Resonance Technologies Co., Ltd. | RF resonator electrode and membrane combinations and method of fabrication |
JP6892992B2 (ja) * | 2017-07-31 | 2021-06-23 | 株式会社村田製作所 | 薄膜コンデンサ及びその製造方法 |
CN110660584B (zh) * | 2018-06-29 | 2023-06-27 | 浙江清华柔性电子技术研究院 | 柔性储能薄膜的制备方法 |
CN112897521A (zh) * | 2021-01-15 | 2021-06-04 | 王立勇 | 一种石墨薄膜复合材料的制备方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4159222A (en) * | 1977-01-11 | 1979-06-26 | Pactel Corporation | Method of manufacturing high density fine line printed circuitry |
US4153518A (en) * | 1977-11-18 | 1979-05-08 | Tektronix, Inc. | Method of making a metalized substrate having a thin film barrier layer |
US4251326A (en) * | 1978-12-28 | 1981-02-17 | Western Electric Company, Inc. | Fabricating an RC network utilizing alpha tantalum |
US4374159A (en) * | 1981-07-27 | 1983-02-15 | Bell Telephone Laboratories, Incorporated | Fabrication of film circuits having a thick film crossunder and a thin film capacitor |
US4471405A (en) * | 1981-12-28 | 1984-09-11 | International Business Machines Corporation | Thin film capacitor with a dual bottom electrode structure |
JPS62194606A (ja) | 1986-02-20 | 1987-08-27 | ユニチカ株式会社 | 薄膜誘電体材料 |
JPS6386412A (ja) | 1986-09-29 | 1988-04-16 | ユニチカ株式会社 | コンデンサ用薄膜誘電体材料の製造方法 |
JPS6386413A (ja) | 1986-09-29 | 1988-04-16 | ユニチカ株式会社 | コンデンサ用薄膜誘電体材料の製造方法 |
JPS6398115A (ja) | 1986-10-14 | 1988-04-28 | ユニチカ株式会社 | コンデンサ用薄膜誘電体材料の製造方法 |
JPH02324A (ja) * | 1987-12-18 | 1990-01-05 | Mitsui Mining & Smelting Co Ltd | 導電膜回路およびその製造方法 |
JPH01175714A (ja) | 1987-12-29 | 1989-07-12 | Matsushita Electric Ind Co Ltd | 薄膜誘電体コンデンサ |
JPH01175217A (ja) | 1987-12-29 | 1989-07-11 | Onoda Cement Co Ltd | コンデンサ用誘電体薄膜積層体 |
JPH0294507A (ja) | 1988-09-30 | 1990-04-05 | Toshiba Corp | 強誘電体薄膜及びその製造方法 |
JPH04302117A (ja) | 1991-03-29 | 1992-10-26 | Sumitomo Chem Co Ltd | 薄膜コンデンサおよびその製造方法 |
JPH0855967A (ja) * | 1994-07-29 | 1996-02-27 | Texas Instr Inc <Ti> | 強誘電体薄膜キャパシタの製造方法 |
JPH0878283A (ja) | 1994-09-06 | 1996-03-22 | Toshiba Corp | 薄膜キャパシタ |
US5576925A (en) * | 1994-12-27 | 1996-11-19 | General Electric Company | Flexible multilayer thin film capacitors |
US5789323A (en) * | 1995-04-25 | 1998-08-04 | Ramtron International Corporation | Fabrication of metal-ferroelectric-metal capacitors with a two step patterning sequence |
JPH0917691A (ja) | 1995-06-27 | 1997-01-17 | Hitachi Aic Inc | フレキシブルフィルムコンデンサ |
JPH0935992A (ja) | 1995-07-18 | 1997-02-07 | Hitachi Aic Inc | フレキシブルフィルムコンデンサ |
KR100413649B1 (ko) * | 1996-01-26 | 2004-04-28 | 마츠시타 덴끼 산교 가부시키가이샤 | 반도체장치의제조방법 |
JPH09246082A (ja) | 1996-03-13 | 1997-09-19 | Matsushita Electron Corp | 容量素子およびその製造方法 |
JPH104030A (ja) | 1996-06-18 | 1998-01-06 | Hitachi Ltd | 薄型積層コンデンサ |
US6005197A (en) * | 1997-08-25 | 1999-12-21 | Lucent Technologies Inc. | Embedded thin film passive components |
-
1999
- 1999-12-21 US US09/471,621 patent/US6212057B1/en not_active Expired - Lifetime
- 1999-12-21 EP EP99310357A patent/EP1014399B1/de not_active Expired - Lifetime
- 1999-12-21 DE DE69931334T patent/DE69931334T2/de not_active Expired - Lifetime
- 1999-12-22 KR KR1019990060253A patent/KR100355534B1/ko not_active IP Right Cessation
-
2000
- 2000-11-13 US US09/711,234 patent/US6974547B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20000048333A (ko) | 2000-07-25 |
US6212057B1 (en) | 2001-04-03 |
EP1014399B1 (de) | 2006-05-17 |
DE69931334T2 (de) | 2007-02-01 |
KR100355534B1 (ko) | 2002-10-12 |
EP1014399A2 (de) | 2000-06-28 |
US6974547B1 (en) | 2005-12-13 |
EP1014399A3 (de) | 2003-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: KUDLEK & GRUNERT PATENTANWAELTE PARTNERSCHAFT, 803 |