DE69615437D1 - Integrierte Schaltungsanordnung und Herstellungsverfahren - Google Patents
Integrierte Schaltungsanordnung und HerstellungsverfahrenInfo
- Publication number
- DE69615437D1 DE69615437D1 DE69615437T DE69615437T DE69615437D1 DE 69615437 D1 DE69615437 D1 DE 69615437D1 DE 69615437 T DE69615437 T DE 69615437T DE 69615437 T DE69615437 T DE 69615437T DE 69615437 D1 DE69615437 D1 DE 69615437D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- manufacturing process
- circuit arrangement
- arrangement
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/08—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements
- H03F1/083—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements in transistor amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
- H01L2223/665—Bias feed arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7080221A JPH08279596A (ja) | 1995-04-05 | 1995-04-05 | 集積回路装置，及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69615437D1 true DE69615437D1 (de) | 2001-10-31 |
| DE69615437T2 DE69615437T2 (de) | 2002-07-11 |
Family
ID=13712321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69615437T Expired - Fee Related DE69615437T2 (de) | 1995-04-05 | 1996-01-17 | Integrierte Schaltungsanordnung und Herstellungsverfahren |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5675184A (de) |
| EP (2) | EP1059666A1 (de) |
| JP (1) | JPH08279596A (de) |
| DE (1) | DE69615437T2 (de) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08288452A (ja) * | 1995-04-20 | 1996-11-01 | Mitsubishi Electric Corp | 集積回路装置，及びその製造方法 |
| JP3185918B2 (ja) * | 1996-08-05 | 2001-07-11 | 株式会社村田製作所 | 電子装置 |
| US6329234B1 (en) | 2000-07-24 | 2001-12-11 | Taiwan Semiconductor Manufactuirng Company | Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow |
| JP4804643B2 (ja) * | 2001-05-08 | 2011-11-02 | 三菱電機株式会社 | 高周波回路装置とその製造方法 |
| DE10162637C1 (de) * | 2001-12-20 | 2003-08-21 | Eupec Gmbh & Co Kg | Schaltungsanordnung mit elektronischen Bauelementen auf einem isolierenden Trägersubstrat |
| US7091542B1 (en) * | 2005-01-28 | 2006-08-15 | International Business Machines Corporation | Method of forming a MIM capacitor for Cu BEOL application |
| US20060197183A1 (en) * | 2005-03-01 | 2006-09-07 | International Business Machines Corporation | Improved mim capacitor structure and process |
| US7223654B2 (en) * | 2005-04-15 | 2007-05-29 | International Business Machines Corporation | MIM capacitor and method of fabricating same |
| US8696662B2 (en) | 2005-05-12 | 2014-04-15 | Aesculap Ag | Electrocautery method and apparatus |
| US9339323B2 (en) | 2005-05-12 | 2016-05-17 | Aesculap Ag | Electrocautery method and apparatus |
| US8728072B2 (en) | 2005-05-12 | 2014-05-20 | Aesculap Ag | Electrocautery method and apparatus |
| US7862565B2 (en) | 2005-05-12 | 2011-01-04 | Aragon Surgical, Inc. | Method for tissue cauterization |
| US8574229B2 (en) | 2006-05-02 | 2013-11-05 | Aesculap Ag | Surgical tool |
| JP5078471B2 (ja) * | 2007-07-06 | 2012-11-21 | 三菱電機株式会社 | 高周波増幅器 |
| US8870867B2 (en) | 2008-02-06 | 2014-10-28 | Aesculap Ag | Articulable electrosurgical instrument with a stabilizable articulation actuator |
| KR101580925B1 (ko) * | 2009-04-28 | 2015-12-30 | 삼성전자주식회사 | 칩온 보드 타입의 패키지 |
| BR112012003356B1 (pt) | 2010-02-04 | 2021-02-02 | Aesculap Ag | dispositivo eletrocirúrgico |
| US8419727B2 (en) | 2010-03-26 | 2013-04-16 | Aesculap Ag | Impedance mediated power delivery for electrosurgery |
| US8827992B2 (en) | 2010-03-26 | 2014-09-09 | Aesculap Ag | Impedance mediated control of power delivery for electrosurgery |
| US9173698B2 (en) | 2010-09-17 | 2015-11-03 | Aesculap Ag | Electrosurgical tissue sealing augmented with a seal-enhancing composition |
| US8405135B2 (en) | 2010-10-05 | 2013-03-26 | International Business Machines Corporation | 3D via capacitor with a floating conductive plate for improved reliability |
| US9339327B2 (en) | 2011-06-28 | 2016-05-17 | Aesculap Ag | Electrosurgical tissue dissecting device |
| KR102174907B1 (ko) | 2012-09-26 | 2020-11-05 | 아에스쿨랍 아게 | 조직을 커팅 및 봉합하기 위한 장치 |
| US8901711B1 (en) | 2013-08-07 | 2014-12-02 | International Business Machines Corporation | Horizontal metal-insulator-metal capacitor |
| US10090240B2 (en) | 2016-06-03 | 2018-10-02 | Globalfoundries Inc. | Interconnect structure with capacitor element and related methods |
| US9875959B2 (en) | 2016-06-09 | 2018-01-23 | International Business Machines Corporation | Forming a stacked capacitor |
| US10032711B2 (en) | 2016-07-25 | 2018-07-24 | International Business Machines Corporation | Integrating metal-insulator-metal capacitors with air gap process flow |
| US9893144B1 (en) | 2016-08-05 | 2018-02-13 | International Business Machines Corporation | Methods for fabricating metal-insulator-metal capacitors |
| US9698213B1 (en) | 2016-09-28 | 2017-07-04 | International Business Machines Corporation | Vertical MIM capacitor |
| US9876068B1 (en) | 2016-10-31 | 2018-01-23 | International Business Machines Corporation | High-K metal-insulator-metal capacitor and method of manufacturing the same |
| US10008558B1 (en) | 2017-01-05 | 2018-06-26 | International Business Machines Corporation | Advanced metal insulator metal capacitor |
| US10032855B1 (en) | 2017-01-05 | 2018-07-24 | International Business Machines Corporation | Advanced metal insulator metal capacitor |
| US10090378B1 (en) | 2017-03-17 | 2018-10-02 | International Business Machines Corporation | Efficient metal-insulator-metal capacitor |
| US11031457B2 (en) | 2017-12-15 | 2021-06-08 | International Business Machines Corporation | Low resistance high capacitance density MIM capacitor |
| US10497519B1 (en) | 2018-09-27 | 2019-12-03 | International Business Machines Corporation | Back-end-of-the line capacitor |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3959874A (en) * | 1974-12-20 | 1976-06-01 | Western Electric Company, Inc. | Method of forming an integrated circuit assembly |
| JPS5797201A (en) * | 1980-12-09 | 1982-06-16 | Fujitsu Ltd | Integrated circuit for microwave |
| EP0169694B1 (de) * | 1984-07-25 | 1990-09-05 | Rca Licensing Corporation | Bauteil zur Unterdrückung von hochfrequenten Signalen |
| US4716389A (en) * | 1986-10-20 | 1987-12-29 | Honeywell Inc. | Millimeter wave microstrip surface mounted attenuator |
| US5019535A (en) * | 1989-03-28 | 1991-05-28 | General Electric Company | Die attachment method using nonconductive adhesive for use in high density interconnected assemblies |
| JPH0352302A (ja) * | 1989-07-19 | 1991-03-06 | Sanyo Electric Co Ltd | モノリシックマイクロ波集積回路 |
| US5138431A (en) * | 1990-01-31 | 1992-08-11 | Vlsi Technology, Inc. | Lead and socket structures with reduced self-inductance |
| US5469334A (en) * | 1991-09-09 | 1995-11-21 | Power Integrations, Inc. | Plastic quad-packaged switched-mode integrated circuit with integrated transformer windings and mouldings for transformer core pieces |
| JPH05235655A (ja) * | 1992-02-19 | 1993-09-10 | Toshiba Lighting & Technol Corp | 高周波用増幅回路 |
| JP3137223B2 (ja) * | 1995-01-20 | 2001-02-19 | 三菱電機株式会社 | 高周波増幅器およびその発振防止方法 |
-
1995
- 1995-04-05 JP JP7080221A patent/JPH08279596A/ja active Pending
-
1996
- 1996-01-17 DE DE69615437T patent/DE69615437T2/de not_active Expired - Fee Related
- 1996-01-17 US US08/587,527 patent/US5675184A/en not_active Expired - Fee Related
- 1996-01-17 EP EP00117641A patent/EP1059666A1/de not_active Withdrawn
- 1996-01-17 EP EP96100652A patent/EP0736902B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08279596A (ja) | 1996-10-22 |
| EP0736902A2 (de) | 1996-10-09 |
| EP1059666A1 (de) | 2000-12-13 |
| EP0736902B1 (de) | 2001-09-26 |
| EP0736902A3 (de) | 1997-10-29 |
| DE69615437T2 (de) | 2002-07-11 |
| US5675184A (en) | 1997-10-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |