DE60143502D1 - Chipkondensator, dessen Herstellungsverfahren und Metallform - Google Patents

Chipkondensator, dessen Herstellungsverfahren und Metallform

Info

Publication number
DE60143502D1
DE60143502D1 DE60143502T DE60143502T DE60143502D1 DE 60143502 D1 DE60143502 D1 DE 60143502D1 DE 60143502 T DE60143502 T DE 60143502T DE 60143502 T DE60143502 T DE 60143502T DE 60143502 D1 DE60143502 D1 DE 60143502D1
Authority
DE
Germany
Prior art keywords
manufacturing process
metal mold
chip capacitor
capacitor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60143502T
Other languages
English (en)
Inventor
Mitsunori Sano
Kazunori Watanabe
Hideaki Sato
Kazuhiro Mine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
NEC Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Tokin Corp filed Critical NEC Tokin Corp
Application granted granted Critical
Publication of DE60143502D1 publication Critical patent/DE60143502D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
DE60143502T 2000-04-07 2001-04-05 Chipkondensator, dessen Herstellungsverfahren und Metallform Expired - Lifetime DE60143502D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000107035A JP3349133B2 (ja) 2000-04-07 2000-04-07 チップ型コンデンサ及びその製造方法並びにモールド金型

Publications (1)

Publication Number Publication Date
DE60143502D1 true DE60143502D1 (de) 2011-01-05

Family

ID=18620092

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60143502T Expired - Lifetime DE60143502D1 (de) 2000-04-07 2001-04-05 Chipkondensator, dessen Herstellungsverfahren und Metallform

Country Status (4)

Country Link
US (1) US6430034B2 (de)
EP (1) EP1143465B1 (de)
JP (1) JP3349133B2 (de)
DE (1) DE60143502D1 (de)

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US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
US6625009B2 (en) * 2001-04-05 2003-09-23 Rohm Co., Ltd. Solid electrolytic capacitor and method of making the same
US7220615B2 (en) * 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
JP4264648B2 (ja) * 2001-08-22 2009-05-20 ソニー株式会社 モジュール電子部品の成形方法及び成形装置並びにモジュール電子部品
JP4477287B2 (ja) * 2002-03-15 2010-06-09 Ｎｅｃトーキン株式会社 陽極端子板およびチップ型コンデンサの製造方法
DE10262263B4 (de) * 2002-05-21 2008-12-04 Epcos Ag Oberflächenmontierbarer Feststoff-Elektrolytkondensator, Verfahren zu dessen Herstellung sowie Systemträger
JP2004103981A (ja) 2002-09-12 2004-04-02 Sanyo Electric Co Ltd 固体電解コンデンサの製造方法及びこの方法によって製造される固体電解コンデンサ
US6870727B2 (en) * 2002-10-07 2005-03-22 Avx Corporation Electrolytic capacitor with improved volumetric efficiency
JP2004228424A (ja) 2003-01-24 2004-08-12 Nec Tokin Corp チップ電解コンデンサおよびその製造方法
JP2004247594A (ja) 2003-02-14 2004-09-02 Nec Tokin Corp チップ型コンデンサ及びその製造方法並びにモールド金型
JP4201721B2 (ja) * 2003-09-05 2008-12-24 三洋電機株式会社 固体電解コンデンサ
JP2005093463A (ja) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd ニオブ固体電解コンデンサ
KR100568280B1 (ko) * 2003-11-14 2006-04-05 삼성전기주식회사 고체전해 콘덴서 및 그 제조방법
US7085127B2 (en) * 2004-03-02 2006-08-01 Vishay Sprague, Inc. Surface mount chip capacitor
US7088573B2 (en) * 2004-03-02 2006-08-08 Vishay Sprague, Inc. Surface mount MELF capacitor
JP4382546B2 (ja) * 2004-03-22 2009-12-16 三菱電機株式会社 キャパシタの実装構造
JP2006059928A (ja) * 2004-08-18 2006-03-02 Orion Denki Kk プリント基板
JP2006173383A (ja) * 2004-12-16 2006-06-29 Rohm Co Ltd 固体電解コンデンサ及びこの固体電解コンデンサの基板への実装構造
JP2006286939A (ja) * 2005-03-31 2006-10-19 Sanyo Electric Co Ltd 固体電解コンデンサ及びその製造方法
US7161797B2 (en) * 2005-05-17 2007-01-09 Vishay Sprague, Inc. Surface mount capacitor and method of making same
JP2007080923A (ja) * 2005-09-12 2007-03-29 Oki Electric Ind Co Ltd 半導体パッケージの形成方法及び半導体パッケージを形成するための金型
JP2007103400A (ja) * 2005-09-30 2007-04-19 Nec Tokin Corp 下面電極型固体電解コンデンサ
US20070084043A1 (en) * 2005-10-14 2007-04-19 Sb Electronics Conductive Adhesive Attachment of Capacitor Terminals
CN101292311B (zh) * 2005-10-24 2012-08-22 三洋电机株式会社 固体电解电容器
JP4784373B2 (ja) * 2006-04-14 2011-10-05 パナソニック株式会社 固体電解コンデンサ及びその製造方法
JP2007317930A (ja) * 2006-05-26 2007-12-06 Hitachi Aic Inc 固体電解コンデンサ
JP4836738B2 (ja) * 2006-10-04 2011-12-14 三洋電機株式会社 固体電解コンデンサの製造方法
US7532457B2 (en) * 2007-01-15 2009-05-12 Avx Corporation Fused electrolytic capacitor assembly
CN101286417B (zh) * 2007-03-09 2011-02-02 Nec东金株式会社 固体电解电容器及其制造方法
US7724502B2 (en) * 2007-09-04 2010-05-25 Avx Corporation Laser-welded solid electrolytic capacitor
US8116102B2 (en) * 2007-12-26 2012-02-14 Infineon Technologies Ag Integrated circuit device and method of producing
JP5370364B2 (ja) * 2008-07-10 2013-12-18 パナソニック株式会社 モールド型コンデンサとその製造方法
US8199462B2 (en) * 2008-09-08 2012-06-12 Avx Corporation Solid electrolytic capacitor for embedding into a circuit board
US8075640B2 (en) 2009-01-22 2011-12-13 Avx Corporation Diced electrolytic capacitor assembly and method of production yielding improved volumetric efficiency
US8441777B2 (en) * 2009-05-29 2013-05-14 Avx Corporation Solid electrolytic capacitor with facedown terminations
US8279583B2 (en) * 2009-05-29 2012-10-02 Avx Corporation Anode for an electrolytic capacitor that contains individual components connected by a refractory metal paste
US8139344B2 (en) * 2009-09-10 2012-03-20 Avx Corporation Electrolytic capacitor assembly and method with recessed leadframe channel
US8199460B2 (en) * 2010-09-27 2012-06-12 Avx Corporation Solid electrolytic capacitor with improved anode termination
US8355242B2 (en) 2010-11-12 2013-01-15 Avx Corporation Solid electrolytic capacitor element
US9545008B1 (en) 2016-03-24 2017-01-10 Avx Corporation Solid electrolytic capacitor for embedding into a circuit board
US10381166B2 (en) 2016-05-25 2019-08-13 Vishay Sprague, Inc. High performance and reliability solid electrolytic tantalum capacitors and screening method
JP7178609B2 (ja) * 2018-11-30 2022-11-28 パナソニックＩｐマネジメント株式会社 電解コンデンサ
US20220028622A1 (en) * 2018-11-30 2022-01-27 Panasonic Intellectual Property Management Co., Ltd. Electrolytic capacitor and method for producing the same
WO2022138223A1 (ja) * 2020-12-25 2022-06-30 パナソニックＩｐマネジメント株式会社 電解コンデンサ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066807A (ja) 1983-09-24 1985-04-17 日本電気株式会社 チップ型電解コンデンサおよびその製造方法
JPS60220921A (ja) 1984-04-06 1985-11-05 松下電器産業株式会社 電子部品
JPS6171652A (ja) * 1984-09-17 1986-04-12 Oki Electric Ind Co Ltd 半導体装置
US4697869A (en) 1985-10-11 1987-10-06 Northern Telecom Limited Attenuator for optical fiber
US4852964A (en) 1987-03-04 1989-08-01 Storm Products Co. Fiber optic coil cord
JPH02111005A (ja) * 1988-10-20 1990-04-24 Matsushita Electric Ind Co Ltd チップ型電子部品
JPH04101406A (ja) * 1990-08-20 1992-04-02 Nec Corp チップ型固体電解タンタルコンデンサ
JP2766446B2 (ja) * 1993-05-12 1998-06-18 ローム株式会社 固体電解コンデンサーの構造
US5319734A (en) 1993-07-19 1994-06-07 California Institute Of Technology Fiber optic attenuator
US5638253A (en) * 1994-04-28 1997-06-10 Rohm Co. Ltd. Package-type solid electrolytic capacitor
JP2934174B2 (ja) * 1995-08-29 1999-08-16 日本レック株式会社 電子部品の製造方法
JP3447443B2 (ja) * 1995-10-02 2003-09-16 ローム株式会社 安全ヒューズ付き面実装型固体電解コンデンサの構造
JP3536722B2 (ja) * 1998-06-18 2004-06-14 松下電器産業株式会社 チップ形固体電解コンデンサおよびその製造方法

Also Published As

Publication number Publication date
US6430034B2 (en) 2002-08-06
EP1143465B1 (de) 2010-11-24
JP3349133B2 (ja) 2002-11-20
US20010028544A1 (en) 2001-10-11
EP1143465A2 (de) 2001-10-10
JP2001291641A (ja) 2001-10-19
EP1143465A3 (de) 2006-09-20

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