DE60031089D1 - Kapazitiver Drucksensor und zugehöriges Herstellungsverfahren - Google Patents

Kapazitiver Drucksensor und zugehöriges Herstellungsverfahren

Info

Publication number
DE60031089D1
DE60031089D1 DE60031089T DE60031089T DE60031089D1 DE 60031089 D1 DE60031089 D1 DE 60031089D1 DE 60031089 T DE60031089 T DE 60031089T DE 60031089 T DE60031089 T DE 60031089T DE 60031089 D1 DE60031089 D1 DE 60031089D1
Authority
DE
Germany
Prior art keywords
pressure sensor
manufacturing process
capacitive pressure
related manufacturing
capacitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60031089T
Other languages
English (en)
Other versions
DE60031089T2 (de
Inventor
Yasuo Onose
Atsuo Watanabe
Seiji Kuryu
Shinya Satou
Junichi Horie
Satoshi Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Automotive Systems Engineering Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Car Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Car Engineering Co Ltd filed Critical Hitachi Ltd
Publication of DE60031089D1 publication Critical patent/DE60031089D1/de
Application granted granted Critical
Publication of DE60031089T2 publication Critical patent/DE60031089T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/146—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors for measuring force distributions, e.g. using force arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
DE60031089T 2000-02-23 2000-09-05 Kapazitiver Drucksensor und zugehöriges Herstellungsverfahren Expired - Lifetime DE60031089T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000052187 2000-02-23
JP2000052187A JP3507978B2 (ja) 2000-02-23 2000-02-23 静電容量式圧力センサー

Publications (2)

Publication Number Publication Date
DE60031089D1 true DE60031089D1 (de) 2006-11-16
DE60031089T2 DE60031089T2 (de) 2007-05-03

Family

ID=18573745

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60031089T Expired - Lifetime DE60031089T2 (de) 2000-02-23 2000-09-05 Kapazitiver Drucksensor und zugehöriges Herstellungsverfahren

Country Status (4)

Country Link
US (1) US6640642B1 (de)
EP (1) EP1128174B1 (de)
JP (1) JP3507978B2 (de)
DE (1) DE60031089T2 (de)

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US7121145B2 (en) 2004-10-18 2006-10-17 Silverbrook Research Pty Ltd Capacitative pressure sensor
US20060191351A1 (en) * 2005-02-25 2006-08-31 Meehan Peter G Sealed capacitive sensor
EP1707931B1 (de) * 2005-03-31 2013-03-27 STMicroelectronics Srl Analoge Dateneingabevorrichtung versehen mit einem mikroelektromechanischem Drucksensor
EP1762925B1 (de) * 2005-09-09 2016-12-21 STMicroelectronics Srl Analoge Eingabevorrichtung mit integriertem Druckaufnehmer und elektronisches Gerät ausgestattet mit einer solchen Eingabevorrichtung.
US7181864B1 (en) 2006-03-31 2007-02-27 Honda Motor Co., Ltd. Dehydration of body hem flanges
US7644731B2 (en) 2006-11-30 2010-01-12 Honeywell International Inc. Gas valve with resilient seat
EP2111148B1 (de) * 2007-01-19 2015-08-12 Given Imaging (Los Angeles) LLC Physiologische magen-darm-mikro- und remote-messvorrichtung
WO2008133942A2 (en) * 2007-04-23 2008-11-06 Sierra Scientific Instruments, Inc. Suspended membrane pressure sensing array
EP2071312B1 (de) 2007-12-13 2015-09-16 Yamaha Corporation Drucksensor und Dateneingabevorrichtung
JP2009231951A (ja) * 2008-03-19 2009-10-08 Panasonic Corp マイクロホン装置
US8072056B2 (en) 2009-06-10 2011-12-06 Medtronic, Inc. Apparatus for restricting moisture ingress
US8172760B2 (en) 2009-06-18 2012-05-08 Medtronic, Inc. Medical device encapsulated within bonded dies
DE102010008044B4 (de) * 2010-02-16 2016-11-24 Epcos Ag MEMS-Mikrofon und Verfahren zur Herstellung
JP2012080165A (ja) 2010-09-30 2012-04-19 Yamaha Corp コンデンサマイクロホンアレイチップ
US8666505B2 (en) 2010-10-26 2014-03-04 Medtronic, Inc. Wafer-scale package including power source
US8424388B2 (en) * 2011-01-28 2013-04-23 Medtronic, Inc. Implantable capacitive pressure sensor apparatus and methods regarding same
US9851103B2 (en) 2011-12-15 2017-12-26 Honeywell International Inc. Gas valve with overpressure diagnostics
US9995486B2 (en) 2011-12-15 2018-06-12 Honeywell International Inc. Gas valve with high/low gas pressure detection
US9557059B2 (en) 2011-12-15 2017-01-31 Honeywell International Inc Gas valve with communication link
US9074770B2 (en) 2011-12-15 2015-07-07 Honeywell International Inc. Gas valve with electronic valve proving system
US9846440B2 (en) 2011-12-15 2017-12-19 Honeywell International Inc. Valve controller configured to estimate fuel comsumption
US8947242B2 (en) 2011-12-15 2015-02-03 Honeywell International Inc. Gas valve with valve leakage test
US8899264B2 (en) 2011-12-15 2014-12-02 Honeywell International Inc. Gas valve with electronic proof of closure system
US8905063B2 (en) 2011-12-15 2014-12-09 Honeywell International Inc. Gas valve with fuel rate monitor
US8839815B2 (en) 2011-12-15 2014-09-23 Honeywell International Inc. Gas valve with electronic cycle counter
US9835265B2 (en) 2011-12-15 2017-12-05 Honeywell International Inc. Valve with actuator diagnostics
JP2013156066A (ja) * 2012-01-27 2013-08-15 Wacom Co Ltd 静電容量方式圧力センシング半導体デバイス
US9234661B2 (en) 2012-09-15 2016-01-12 Honeywell International Inc. Burner control system
US10422531B2 (en) 2012-09-15 2019-09-24 Honeywell International Inc. System and approach for controlling a combustion chamber
CN103091030A (zh) * 2013-02-02 2013-05-08 浙江大学 一种基于高分子薄膜的流体压力测量传感器
EP2868970B1 (de) 2013-10-29 2020-04-22 Honeywell Technologies Sarl Regelungsvorrichtung
US10024439B2 (en) 2013-12-16 2018-07-17 Honeywell International Inc. Valve over-travel mechanism
JP6119615B2 (ja) 2014-01-08 2017-04-26 三菱電機株式会社 半導体装置の製造方法
US9546923B2 (en) 2014-01-24 2017-01-17 Infineon Technologies Dresden Gmbh Sensor structures, systems and methods with improved integration and optimized footprint
JP6399803B2 (ja) 2014-05-14 2018-10-03 キヤノン株式会社 力覚センサおよび把持装置
US9821340B2 (en) * 2014-07-28 2017-11-21 Kolo Medical Ltd. High displacement ultrasonic transducer
US9841122B2 (en) 2014-09-09 2017-12-12 Honeywell International Inc. Gas valve with electronic valve proving system
US9645584B2 (en) 2014-09-17 2017-05-09 Honeywell International Inc. Gas valve with electronic health monitoring
JP6534548B2 (ja) * 2015-03-31 2019-06-26 長野計器株式会社 センサモジュール
CN205302239U (zh) * 2015-10-29 2016-06-08 深圳市汇顶科技股份有限公司 一种压力检测结构及触摸设备
US10503181B2 (en) 2016-01-13 2019-12-10 Honeywell International Inc. Pressure regulator
US10549982B2 (en) 2016-02-15 2020-02-04 Stmicroelectronics S.R.L. Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor
TWI677669B (zh) * 2016-09-20 2019-11-21 友達光電股份有限公司 壓力感測陣列與壓力感測方法
US10564062B2 (en) 2016-10-19 2020-02-18 Honeywell International Inc. Human-machine interface for gas valve
US11073281B2 (en) 2017-12-29 2021-07-27 Honeywell International Inc. Closed-loop programming and control of a combustion appliance
US10466126B2 (en) * 2018-02-27 2019-11-05 Globalfoundries Inc. MEMS capacitive pressure sensors in fully depleted semiconductor on insulator (FDSOI)
US10697815B2 (en) 2018-06-09 2020-06-30 Honeywell International Inc. System and methods for mitigating condensation in a sensor module

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Publication number Priority date Publication date Assignee Title
US5316619A (en) * 1993-02-05 1994-05-31 Ford Motor Company Capacitive surface micromachine absolute pressure sensor and method for processing
EP0618435A3 (de) 1993-03-30 1995-02-01 Siemens Ag Kapazitiver Drucksensor.
JP2748079B2 (ja) 1993-04-12 1998-05-06 山武ハネウエル株式会社 静電容量式圧力センサ
US5479827A (en) * 1994-10-07 1996-01-02 Yamatake-Honeywell Co., Ltd. Capacitive pressure sensor isolating electrodes from external environment
DE59508560D1 (de) 1994-11-24 2000-08-17 Siemens Ag Kapazitiver Drucksensor
WO1998023935A1 (de) * 1996-11-28 1998-06-04 Siemens Aktiengesellschaft Verfahren zur herstellung von mikromechanischen sensoren
JP3386336B2 (ja) 1997-06-24 2003-03-17 株式会社日立製作所 静電容量式圧力センサ及びその製造方法
US6167761B1 (en) * 1998-03-31 2001-01-02 Hitachi, Ltd. And Hitachi Car Engineering Co., Ltd. Capacitance type pressure sensor with capacitive elements actuated by a diaphragm

Also Published As

Publication number Publication date
EP1128174A2 (de) 2001-08-29
JP3507978B2 (ja) 2004-03-15
JP2001235382A (ja) 2001-08-31
US6640642B1 (en) 2003-11-04
EP1128174B1 (de) 2006-10-04
DE60031089T2 (de) 2007-05-03
EP1128174A3 (de) 2005-01-19

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: YASUO, HITACHI LTD. INTELL. PROP. GROUP, ONOSE, JP

Inventor name: WATANABE, HITACHI LTD. INTELL. PROP. GROUP, AT, JP

Inventor name: SEIJI, HITACHI CAR ENGINEERING CO. LTD., KURYU, JP

Inventor name: SHINYA, HITACHI LTD. INTELL. PROP. GROUP, SATO, JP

Inventor name: JUNICHI, HITACHI LTD. INTELL. PROP. GROUP, HOR, JP

Inventor name: SATOSHI, SHIMADA, CHIYODA-KU, TOKYO 100-8220, JP

8364 No opposition during term of opposition