CN1777999B - 复合式白色光源及其制造方法 - Google Patents
复合式白色光源及其制造方法 Download PDFInfo
- Publication number
- CN1777999B CN1777999B CN200480011028XA CN200480011028A CN1777999B CN 1777999 B CN1777999 B CN 1777999B CN 200480011028X A CN200480011028X A CN 200480011028XA CN 200480011028 A CN200480011028 A CN 200480011028A CN 1777999 B CN1777999 B CN 1777999B
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- Prior art keywords
- light
- light source
- reflector
- loaded lid
- phosphor loaded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 35
- 239000002131 composite material Substances 0.000 title description 2
- 238000006243 chemical reaction Methods 0.000 claims abstract description 93
- 239000002245 particle Substances 0.000 claims abstract description 92
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 52
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 43
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 238000001228 spectrum Methods 0.000 claims description 11
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- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
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- 239000007924 injection Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45106703P | 2003-02-26 | 2003-02-26 | |
US60/451,067 | 2003-02-26 | ||
PCT/US2004/005650 WO2004077580A2 (en) | 2003-02-26 | 2004-02-24 | White light source using emitting diode and phosphor and method of fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1777999A CN1777999A (zh) | 2006-05-24 |
CN1777999B true CN1777999B (zh) | 2010-05-26 |
Family
ID=32927698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200480011028XA Expired - Lifetime CN1777999B (zh) | 2003-02-26 | 2004-02-24 | 复合式白色光源及其制造方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9142734B2 (ko) |
EP (2) | EP1597777B1 (ko) |
JP (3) | JP2006519500A (ko) |
KR (2) | KR20050113200A (ko) |
CN (1) | CN1777999B (ko) |
CA (1) | CA2517009A1 (ko) |
MY (1) | MY142684A (ko) |
TW (2) | TW200423438A (ko) |
WO (1) | WO2004077580A2 (ko) |
Families Citing this family (166)
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EP1540746B1 (en) * | 2002-08-30 | 2009-11-11 | Lumination LLC | Coated led with improved efficiency |
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US7775685B2 (en) * | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
US7244965B2 (en) * | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
WO2004077580A2 (en) | 2003-02-26 | 2004-09-10 | Cree, Inc. | White light source using emitting diode and phosphor and method of fabrication |
US20050006659A1 (en) * | 2003-07-09 | 2005-01-13 | Ng Kee Yean | Light emitting diode utilizing a discrete wavelength-converting layer for color conversion |
KR101426836B1 (ko) * | 2004-05-05 | 2014-08-05 | 렌슬러 폴리테크닉 인스티튜트 | 고체-상태 에미터 및 하향-변환 재료를 이용한 고효율 광 소스 |
US7837348B2 (en) * | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
US7315119B2 (en) * | 2004-05-07 | 2008-01-01 | Avago Technologies Ip (Singapore) Pte Ltd | Light-emitting device having a phosphor particle layer with specific thickness |
JP3875247B2 (ja) * | 2004-09-27 | 2007-01-31 | 株式会社エンプラス | 発光装置、面光源装置、表示装置及び光束制御部材 |
JP4756841B2 (ja) * | 2004-09-29 | 2011-08-24 | スタンレー電気株式会社 | 半導体発光装置の製造方法 |
US7352011B2 (en) * | 2004-11-15 | 2008-04-01 | Philips Lumileds Lighting Company, Llc | Wide emitting lens for LED useful for backlighting |
JP2006156837A (ja) | 2004-11-30 | 2006-06-15 | Matsushita Electric Ind Co Ltd | 半導体発光装置、発光モジュール、および照明装置 |
US7821023B2 (en) * | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US7358543B2 (en) * | 2005-05-27 | 2008-04-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device |
US7980743B2 (en) * | 2005-06-14 | 2011-07-19 | Cree, Inc. | LED backlighting for displays |
CN101203965B (zh) * | 2005-06-23 | 2010-04-21 | 皇家飞利浦电子股份有限公司 | 发光设备和用于发光设备设计的方法 |
US7319246B2 (en) * | 2005-06-23 | 2008-01-15 | Lumination Llc | Luminescent sheet covering for LEDs |
JP2008544553A (ja) * | 2005-06-23 | 2008-12-04 | レンセレイアー ポリテクニック インスティテュート | 短波長ledとダウンコンバージョン物質で白色光を生成するパッケージ設計 |
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KR100665222B1 (ko) * | 2005-07-26 | 2007-01-09 | 삼성전기주식회사 | 확산재료를 이용한 엘이디 패키지 및 그 제조 방법 |
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Also Published As
Publication number | Publication date |
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EP2262006A3 (en) | 2012-03-21 |
TW201225339A (en) | 2012-06-16 |
KR20110137403A (ko) | 2011-12-22 |
WO2004077580A3 (en) | 2005-03-10 |
US20050093430A1 (en) | 2005-05-05 |
JP2006519500A (ja) | 2006-08-24 |
KR20050113200A (ko) | 2005-12-01 |
EP1597777B1 (en) | 2013-04-24 |
JP5559013B2 (ja) | 2014-07-23 |
CA2517009A1 (en) | 2004-09-10 |
CN1777999A (zh) | 2006-05-24 |
WO2004077580A2 (en) | 2004-09-10 |
TW200423438A (en) | 2004-11-01 |
JP2013093595A (ja) | 2013-05-16 |
MY142684A (en) | 2010-12-31 |
US9142734B2 (en) | 2015-09-22 |
JP2011061230A (ja) | 2011-03-24 |
EP1597777A2 (en) | 2005-11-23 |
EP2262006A2 (en) | 2010-12-15 |
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