CN1747192B - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN1747192B
CN1747192B CN200510102512XA CN200510102512A CN1747192B CN 1747192 B CN1747192 B CN 1747192B CN 200510102512X A CN200510102512X A CN 200510102512XA CN 200510102512 A CN200510102512 A CN 200510102512A CN 1747192 B CN1747192 B CN 1747192B
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CN
China
Prior art keywords
led
light
emitting device
light emitting
led element
Prior art date
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Expired - Fee Related
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CN200510102512XA
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English (en)
Chinese (zh)
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CN1747192A (zh
Inventor
末广好伸
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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Publication of CN1747192A publication Critical patent/CN1747192A/zh
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/853Encapsulations characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN200510102512XA 2004-09-09 2005-09-08 发光装置 Expired - Fee Related CN1747192B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2004-263127 2004-09-09
JP2004263127 2004-09-09
JP2004263127 2004-09-09
JP2005-228837 2005-08-05
JP2005228837A JP4747726B2 (ja) 2004-09-09 2005-08-05 発光装置
JP2005228837 2005-08-05

Publications (2)

Publication Number Publication Date
CN1747192A CN1747192A (zh) 2006-03-15
CN1747192B true CN1747192B (zh) 2010-08-11

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CN200510102512XA Expired - Fee Related CN1747192B (zh) 2004-09-09 2005-09-08 发光装置

Country Status (4)

Country Link
US (1) US7875897B2 (https=)
JP (1) JP4747726B2 (https=)
CN (1) CN1747192B (https=)
DE (1) DE102005042814A1 (https=)

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JP2006108640A (ja) 2006-04-20
DE102005042814A1 (de) 2006-04-06

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