CN1685220A - 暗场检测系统 - Google Patents
暗场检测系统 Download PDFInfo
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- CN1685220A CN1685220A CNA03823095XA CN03823095A CN1685220A CN 1685220 A CN1685220 A CN 1685220A CN A03823095X A CNA03823095X A CN A03823095XA CN 03823095 A CN03823095 A CN 03823095A CN 1685220 A CN1685220 A CN 1685220A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
Abstract
Description
Claims (70)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US41508202P | 2002-09-30 | 2002-09-30 | |
US60/415,082 | 2002-09-30 | ||
PCT/US2003/028062 WO2004031754A1 (en) | 2002-09-30 | 2003-09-08 | Dark field inspection system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1685220A true CN1685220A (zh) | 2005-10-19 |
CN1685220B CN1685220B (zh) | 2010-04-28 |
Family
ID=32069808
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
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CNB038230968A Expired - Fee Related CN100561204C (zh) | 2002-09-30 | 2003-09-08 | 具有倾斜视角的检测系统 |
CNA038230976A Pending CN1771456A (zh) | 2002-09-30 | 2003-09-08 | 用于光学检测的照射系统 |
CN201110240143.6A Expired - Lifetime CN102393398B (zh) | 2002-09-30 | 2003-09-08 | 用于光学检测的照射系统 |
CN201410569577.4A Expired - Lifetime CN104502357B (zh) | 2002-09-30 | 2003-09-08 | 用于光学检测的照射系统 |
CN03823095XA Expired - Fee Related CN1685220B (zh) | 2002-09-30 | 2003-09-08 | 暗场检测系统 |
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Application Number | Title | Priority Date | Filing Date |
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CNB038230968A Expired - Fee Related CN100561204C (zh) | 2002-09-30 | 2003-09-08 | 具有倾斜视角的检测系统 |
CNA038230976A Pending CN1771456A (zh) | 2002-09-30 | 2003-09-08 | 用于光学检测的照射系统 |
CN201110240143.6A Expired - Lifetime CN102393398B (zh) | 2002-09-30 | 2003-09-08 | 用于光学检测的照射系统 |
CN201410569577.4A Expired - Lifetime CN104502357B (zh) | 2002-09-30 | 2003-09-08 | 用于光学检测的照射系统 |
Country Status (7)
Country | Link |
---|---|
US (5) | US7339661B2 (zh) |
EP (3) | EP1546693A1 (zh) |
JP (4) | JP4546830B2 (zh) |
CN (5) | CN100561204C (zh) |
AU (3) | AU2003265989A1 (zh) |
IL (2) | IL167352A (zh) |
WO (3) | WO2004031753A1 (zh) |
Cited By (20)
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CN102473663A (zh) * | 2009-07-22 | 2012-05-23 | 克拉-坦科股份有限公司 | 用环形照射的暗场检查系统 |
CN102854196A (zh) * | 2012-09-24 | 2013-01-02 | 江苏物联网研究发展中心 | Mems结构缺陷的晶圆级自动检测系统及检测方法 |
WO2013152509A1 (zh) * | 2012-04-14 | 2013-10-17 | 中国科学技术大学 | 实现显微镜系统超分辨成像的方法 |
CN103728314A (zh) * | 2012-10-16 | 2014-04-16 | 希捷科技有限公司 | 区分原生表面特征与外来表面特征的方法 |
CN104215579A (zh) * | 2010-10-21 | 2014-12-17 | 光学传感器公司 | 具有验证单元的光谱仪 |
CN104321805A (zh) * | 2012-05-14 | 2015-01-28 | 皇家飞利浦有限公司 | 暗场计算机断层摄影成像 |
CN104967759A (zh) * | 2015-02-13 | 2015-10-07 | 华中科技大学 | 一种用于弱光信号的扫描成像系统 |
CN105358966A (zh) * | 2013-05-23 | 2016-02-24 | 材料开发中心股份公司 | 用于对长材进行表面检查的方法以及适用于执行这样的方法的设备 |
CN105358961A (zh) * | 2013-05-30 | 2016-02-24 | 希捷科技有限公司 | 表面特征管理器 |
CN107121161A (zh) * | 2017-04-18 | 2017-09-01 | 北京佳百瑞科技有限责任公司 | 基于可控偏振的多成像单元视觉检测系统 |
CN107209011A (zh) * | 2015-02-05 | 2017-09-26 | 国立大学法人神户大学 | 形状评价方法以及形状评价装置 |
US9863892B2 (en) | 2012-10-16 | 2018-01-09 | Seagate Technology Llc | Distinguishing foreign surface features from native surface features |
CN108345104A (zh) * | 2017-01-23 | 2018-07-31 | 应用材料以色列公司 | 非对称放大检查系统和照射模块 |
TWI685653B (zh) * | 2017-03-07 | 2020-02-21 | 美商伊路米納有限公司 | 用於修正成像樣品中的光學失真的方法、用於修正包含複數個光點之圖案化樣品的影像中之光學失真的方法以及非暫時性電腦可讀媒體 |
CN110849900A (zh) * | 2018-08-21 | 2020-02-28 | 深圳中科飞测科技有限公司 | 晶圆缺陷检测系统及方法 |
CN110873957A (zh) * | 2014-12-22 | 2020-03-10 | 加州理工学院 | 用于厚样本的epi照明傅立叶重叠关联成像 |
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CN111521613A (zh) * | 2019-02-01 | 2020-08-11 | 由田新技股份有限公司 | 一种用于量测孔状结构的自动光学检测系统以及方法 |
CN111638226A (zh) * | 2019-02-14 | 2020-09-08 | 深圳中科飞测科技有限公司 | 检测方法、图像处理器以及检测系统 |
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KR101165650B1 (ko) * | 2007-01-30 | 2012-07-17 | 에프. 포스잣 후, 엘.엘.씨. | 이미지 전달 장치 |
US7697128B2 (en) * | 2007-03-23 | 2010-04-13 | Asml Netherlands B.V. | Method of imaging radiation from an object on a detection device and an inspection device for inspecting an object |
JP4876019B2 (ja) * | 2007-04-25 | 2012-02-15 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置およびその方法 |
JP2009014510A (ja) * | 2007-07-04 | 2009-01-22 | Hitachi High-Technologies Corp | 検査方法及び検査装置 |
US7570354B1 (en) * | 2007-09-06 | 2009-08-04 | Kla-Tencor Corporation | Image intensification for low light inspection |
JP5317468B2 (ja) * | 2007-12-19 | 2013-10-16 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置 |
US7653097B2 (en) * | 2007-12-31 | 2010-01-26 | Corning Incorporated | Systems and methods for polarization modulation of an optical signal |
US7738092B1 (en) * | 2008-01-08 | 2010-06-15 | Kla-Tencor Corporation | System and method for reducing speckle noise in die-to-die inspection systems |
US20110175997A1 (en) * | 2008-01-23 | 2011-07-21 | Cyberoptics Corporation | High speed optical inspection system with multiple illumination imagery |
US7970028B2 (en) * | 2008-01-30 | 2011-06-28 | Corning Incorporated | System and methods for speckle reduction |
US8285025B2 (en) * | 2008-03-25 | 2012-10-09 | Electro Scientific Industries, Inc. | Method and apparatus for detecting defects using structured light |
US8494802B2 (en) * | 2008-06-19 | 2013-07-23 | Kla-Tencor Corp. | Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer |
US7843558B2 (en) * | 2008-06-25 | 2010-11-30 | Applied Materials South East Asia Pte. Ltd. | Optical inspection tools featuring light shaping diffusers |
WO2010065565A2 (en) * | 2008-12-01 | 2010-06-10 | Reald Inc. | Stereoscopic projection systems and methods for employing spatial multiplexing at an intermediate image plane |
DE102009000528B4 (de) * | 2009-01-30 | 2011-04-07 | Nanophotonics Ag | Inspektionsvorrichtung und -verfahren für die optische Untersuchung von Objektoberflächen, insbesondere von Waferoberflächen |
KR101038206B1 (ko) * | 2009-02-09 | 2011-05-31 | 한국과학기술원 | 텔리센트릭 스캐너와 두 쐐기형 프리즘을 이용한 가변시야 광학계 |
DE102009044151B4 (de) * | 2009-05-19 | 2012-03-29 | Kla-Tencor Mie Gmbh | Vorrichtung zur optischen Waferinspektion |
JP5331586B2 (ja) | 2009-06-18 | 2013-10-30 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置および検査方法 |
EP2454137B1 (de) * | 2009-07-17 | 2015-09-09 | Continental Teves AG & Co. oHG | Laserbasiertes verfahren zur reibwertklassifikation in kraftfahrzeugen |
US9068952B2 (en) * | 2009-09-02 | 2015-06-30 | Kla-Tencor Corporation | Method and apparatus for producing and measuring dynamically focussed, steered, and shaped oblique laser illumination for spinning wafer inspection system |
US8388204B2 (en) * | 2009-09-22 | 2013-03-05 | Cyberoptics Corporation | High speed, high resolution, three dimensional solar cell inspection system |
US8670031B2 (en) * | 2009-09-22 | 2014-03-11 | Cyberoptics Corporation | High speed optical inspection system with camera array and compact, integrated illuminator |
US8681211B2 (en) * | 2009-09-22 | 2014-03-25 | Cyberoptics Corporation | High speed optical inspection system with adaptive focusing |
US8894259B2 (en) * | 2009-09-22 | 2014-11-25 | Cyberoptics Corporation | Dark field illuminator with large working area |
US8872912B2 (en) * | 2009-09-22 | 2014-10-28 | Cyberoptics Corporation | High speed distributed optical sensor inspection system |
JP5417268B2 (ja) * | 2010-06-28 | 2014-02-12 | 富士フイルム株式会社 | 内視鏡システム |
WO2012006221A1 (en) | 2010-07-03 | 2012-01-12 | Rudolph Technologies, Inc. | Scratch detection method and apparatus |
JP5814371B2 (ja) * | 2010-09-21 | 2015-11-17 | 中国科学院理化技術研究所 | レーザマイクロ・ナノ加工方法 |
US8573785B2 (en) | 2010-11-23 | 2013-11-05 | Corning Incorporated | Wavelength-switched optical systems |
TWI440114B (zh) * | 2010-11-30 | 2014-06-01 | King Yuan Electronics Co Ltd | 晶圓檢測系統 |
CN102486521B (zh) * | 2010-12-02 | 2014-04-02 | 京元电子股份有限公司 | 晶圆检测系统 |
US20120307349A1 (en) * | 2010-12-07 | 2012-12-06 | Laser Light Engines | Speckle Reduction Using Multiple Starting Wavelengths |
JP2012127682A (ja) | 2010-12-13 | 2012-07-05 | Hitachi High-Technologies Corp | 欠陥検査方法及びその装置 |
EP2652776B1 (en) | 2010-12-16 | 2019-08-07 | KLA-Tencor Corporation | Wafer inspection |
US9429742B1 (en) | 2011-01-04 | 2016-08-30 | Nlight, Inc. | High power laser imaging systems |
US9409255B1 (en) | 2011-01-04 | 2016-08-09 | Nlight, Inc. | High power laser imaging systems |
US10095016B2 (en) | 2011-01-04 | 2018-10-09 | Nlight, Inc. | High power laser system |
US9244290B2 (en) | 2011-01-06 | 2016-01-26 | Applied Materials Israel Ltd. | Method and system for coherence reduction |
JP2012185149A (ja) * | 2011-02-17 | 2012-09-27 | Ricoh Co Ltd | 欠陥検査装置及び欠陥検査処理方法 |
CN102122081B (zh) * | 2011-03-27 | 2013-03-20 | 山东大学 | 激光光束匀光整形消散斑装置 |
US9012875B2 (en) * | 2011-04-07 | 2015-04-21 | Applied Materials Israel, Ltd. | Inspection method and an inspection system exhibiting speckle reduction characteristics |
US9279774B2 (en) * | 2011-07-12 | 2016-03-08 | Kla-Tencor Corp. | Wafer inspection |
GB2494733A (en) * | 2011-09-14 | 2013-03-20 | Malvern Instr Ltd | Measuring particle size distribution by light scattering |
US9720244B1 (en) | 2011-09-30 | 2017-08-01 | Nlight, Inc. | Intensity distribution management system and method in pixel imaging |
US9402036B2 (en) * | 2011-10-17 | 2016-07-26 | Rudolph Technologies, Inc. | Scanning operation with concurrent focus and inspection |
US9046697B2 (en) | 2012-01-02 | 2015-06-02 | Jgm Associates, Inc. | Low-speckle light sources and displays employing multimode optical fiber |
JP5865738B2 (ja) * | 2012-03-13 | 2016-02-17 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
WO2013148487A1 (en) * | 2012-03-27 | 2013-10-03 | Nlight Photonics Corporation | High power laser system |
CN103377746B (zh) * | 2012-04-14 | 2015-12-02 | 中国科学技术大学 | 实现显微镜系统超分辨成像的方法 |
US8772731B2 (en) * | 2012-04-15 | 2014-07-08 | Kla-Tencor Corporation | Apparatus and method for synchronizing sample stage motion with a time delay integration charge-couple device in a semiconductor inspection tool |
US20130313440A1 (en) * | 2012-05-22 | 2013-11-28 | Kla-Tencor Corporation | Solid-State Laser And Inspection System Using 193nm Laser |
US8896827B2 (en) * | 2012-06-26 | 2014-11-25 | Kla-Tencor Corporation | Diode laser based broad band light sources for wafer inspection tools |
US8860937B1 (en) * | 2012-10-24 | 2014-10-14 | Kla-Tencor Corp. | Metrology systems and methods for high aspect ratio and large lateral dimension structures |
TWI489090B (zh) | 2012-10-31 | 2015-06-21 | Pixart Imaging Inc | 偵測系統 |
CN103808305B (zh) * | 2012-11-07 | 2017-11-07 | 原相科技股份有限公司 | 检测系统 |
US8912495B2 (en) | 2012-11-21 | 2014-12-16 | Kla-Tencor Corp. | Multi-spectral defect inspection for 3D wafers |
US9310248B2 (en) | 2013-03-14 | 2016-04-12 | Nlight, Inc. | Active monitoring of multi-laser systems |
US9214786B2 (en) | 2013-04-09 | 2015-12-15 | Nlight Photonics Corporation | Diode laser packages with flared laser oscillator waveguides |
US9166369B2 (en) | 2013-04-09 | 2015-10-20 | Nlight Photonics Corporation | Flared laser oscillator waveguide |
US9513215B2 (en) | 2013-05-30 | 2016-12-06 | Seagate Technology Llc | Surface features by azimuthal angle |
US9255887B2 (en) | 2013-06-19 | 2016-02-09 | Kla-Tencor Corporation | 2D programmable aperture mechanism |
US9852519B2 (en) | 2013-06-25 | 2017-12-26 | Pixart Imaging Inc. | Detection system |
US9747670B2 (en) | 2013-06-26 | 2017-08-29 | Kla-Tencor Corporation | Method and system for improving wafer surface inspection sensitivity |
JP6069133B2 (ja) * | 2013-08-30 | 2017-02-01 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置及び欠陥検査方法 |
US9110034B1 (en) * | 2013-09-16 | 2015-08-18 | L-3 Communications Corp. | Night vision device test apparatus |
KR102099722B1 (ko) | 2014-02-05 | 2020-05-18 | 엔라이트 인크. | 단일-이미터 라인 빔 시스템 |
US10914902B2 (en) | 2014-02-26 | 2021-02-09 | TeraDiode, Inc. | Methods for altering properties of a radiation beam |
US9435964B2 (en) | 2014-02-26 | 2016-09-06 | TeraDiode, Inc. | Systems and methods for laser systems with variable beam parameter product |
US9506873B2 (en) | 2014-04-15 | 2016-11-29 | Kla-Tencor Corp. | Pattern suppression in logic for wafer inspection |
WO2015200271A1 (en) * | 2014-06-25 | 2015-12-30 | TeraDiode, Inc. | Systems and methods for laser systems with variable beam parameter product |
JP6408817B2 (ja) * | 2014-07-22 | 2018-10-17 | オリンパス株式会社 | 画像処理装置、画像処理方法、画像処理プログラム、及び撮像システム |
KR20160013695A (ko) | 2014-07-28 | 2016-02-05 | 삼성전자주식회사 | 기판 결함 검사 장치 및 방법 |
BR112017002707B1 (pt) * | 2014-08-13 | 2022-08-09 | Ipg Photonics Corporation | Sistema a laser de fibra de saída de feixes múltiplos e método de fornecimento de um feixe de laser de fibras múltiplas dinamicamente alteráveis |
US9766186B2 (en) * | 2014-08-27 | 2017-09-19 | Kla-Tencor Corp. | Array mode repeater detection |
US10186836B2 (en) | 2014-10-10 | 2019-01-22 | Nlight, Inc. | Multiple flared laser oscillator waveguide |
SG10201913246TA (en) | 2014-12-05 | 2020-02-27 | Kla Tencor Corp | Apparatus, method and computer program product for defect detection in work pieces |
US10270224B2 (en) | 2015-06-04 | 2019-04-23 | Nlight, Inc. | Angled DBR-grating laser/amplifier with one or more mode-hopping regions |
EP3144887A1 (en) * | 2015-09-17 | 2017-03-22 | Thomson Licensing | A method and an apparatus for generating data representative of a pixel beam |
EP3144888A1 (en) * | 2015-09-17 | 2017-03-22 | Thomson Licensing | An apparatus and a method for generating data representing a pixel beam |
JP6723633B2 (ja) * | 2015-12-10 | 2020-07-15 | 株式会社ディスコ | 検査装置 |
WO2017149689A1 (ja) * | 2016-03-02 | 2017-09-08 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置、パターンチップ及び欠陥検査方法 |
JP2017198612A (ja) * | 2016-04-28 | 2017-11-02 | キヤノン株式会社 | 検査装置、検査システム、および物品製造方法 |
EP3296723A1 (en) | 2016-09-14 | 2018-03-21 | ASML Netherlands B.V. | Illumination source for an inspection apparatus, inspection apparatus and inspection method |
EP3542183A1 (en) * | 2016-11-17 | 2019-09-25 | trinamiX GmbH | Detector for optically detecting at least one object |
CN106645197B (zh) * | 2016-12-29 | 2024-01-30 | 中国工程物理研究院激光聚变研究中心 | 检测精密光学元件表面颗粒物的在线检测系统及应用方法 |
GB201704771D0 (en) * | 2017-01-05 | 2017-05-10 | Illumina Inc | Modular optical analytic systems and methods |
CN106707492B (zh) * | 2017-01-13 | 2019-07-26 | 清华大学 | 基于空间光调制器的采集端频域拼贴显微系统 |
CN106990119A (zh) * | 2017-04-27 | 2017-07-28 | 中科慧远视觉技术(洛阳)有限公司 | 一种自动检测白玻表面缺陷的视觉检测系统及检测方法 |
JP6876576B2 (ja) * | 2017-08-17 | 2021-05-26 | 日本電子株式会社 | 三次元像構築方法 |
CN111149037B (zh) | 2017-09-29 | 2022-07-12 | 徕卡生物系统成像股份有限公司 | 实时自动对焦聚焦算法 |
EP4254037A3 (en) * | 2017-09-29 | 2023-12-27 | Leica Biosystems Imaging, Inc. | Real-time autofocus scanning |
KR102601473B1 (ko) * | 2017-10-26 | 2023-11-10 | 파티클 머슈어링 시스템즈, 인크. | 입자 측정을 위한 시스템 및 방법 |
CN107727655A (zh) * | 2017-11-24 | 2018-02-23 | 苏州精濑光电有限公司 | 一种快速光学校正装置 |
US11087451B2 (en) * | 2017-12-19 | 2021-08-10 | Texas Instruments Incorporated | Generating multi-focal defect maps using optical tools |
US20190355110A1 (en) * | 2018-05-15 | 2019-11-21 | Camtek Ltd. | Cross talk reduction |
US20190369307A1 (en) * | 2018-05-30 | 2019-12-05 | Key Technology, Inc. | Electromagnetic Radiation Detector Assembly |
EP3581091A1 (en) * | 2018-06-12 | 2019-12-18 | Koninklijke Philips N.V. | System and method for determining at least one vital sign of a subject |
US10408767B1 (en) * | 2018-06-13 | 2019-09-10 | Hatch Ltd. | System and method for detecting imperfections in a reflective surface |
US10877382B2 (en) * | 2018-08-14 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for handling mask and lithography apparatus |
CN109239078A (zh) * | 2018-09-12 | 2019-01-18 | 苏州工业园区纳米产业技术研究院有限公司微纳制造分公司 | 一种晶圆缺陷检测装置 |
JP7158224B2 (ja) * | 2018-09-26 | 2022-10-21 | 浜松ホトニクス株式会社 | 半導体デバイス検査方法及び半導体デバイス検査装置 |
CN109916902A (zh) * | 2019-03-12 | 2019-06-21 | 中国工程物理研究院激光聚变研究中心 | 成像设备和成像方法 |
CN109932826B (zh) * | 2019-04-29 | 2023-10-31 | 中国工程物理研究院激光聚变研究中心 | 一种用于光学元件缺陷检测的拼接式条形激光装置 |
US11162897B2 (en) * | 2019-05-15 | 2021-11-02 | Onto Innovation Inc. | Optical metrology device using numerical aperture reduction |
CN110208284B (zh) * | 2019-05-27 | 2021-09-17 | 武汉中导光电设备有限公司 | 一种多通道缺陷合并分析的方法及系统 |
JP2020204579A (ja) * | 2019-06-18 | 2020-12-24 | 住友電工デバイス・イノベーション株式会社 | ウェハの表面検査方法、表面検査装置、および電子部品の製造方法 |
CN110426397B (zh) * | 2019-08-14 | 2022-03-25 | 深圳市麓邦技术有限公司 | 光学检测系统、装置及方法 |
CN112581512A (zh) * | 2019-09-27 | 2021-03-30 | 鲁班嫡系机器人(深圳)有限公司 | 图像匹配、3d成像及姿态识别方法、装置及系统 |
JP7424607B2 (ja) * | 2019-09-30 | 2024-01-30 | 国立大学法人 奈良先端科学技術大学院大学 | 植物センシングデバイスおよびリアルタイム植物モニタリングシステム |
CN110779694B (zh) * | 2019-11-11 | 2021-02-19 | 四川大学 | 照射双棱镜棱面测量折射率方法 |
US11343435B2 (en) | 2019-12-26 | 2022-05-24 | Waymo Llc | Microlensing for real-time sensing of stray light |
US20230204519A1 (en) * | 2020-07-03 | 2023-06-29 | Scuola universitaria professionale della Svizzera italiana (SUPSI) | 3d image acquisition system for optical inspection and method for optical inspection of objects, in particular electronic assemblies, electronic boards and the like |
CN112180579B (zh) * | 2020-09-11 | 2021-11-16 | 中国科学院西安光学精密机械研究所 | 采用阵列式物镜的显微成像组件、装置、系统及成像方法 |
TWI779357B (zh) * | 2020-09-23 | 2022-10-01 | 南亞科技股份有限公司 | 偵測物品表面缺陷的方法及其系統 |
US11899375B2 (en) | 2020-11-20 | 2024-02-13 | Kla Corporation | Massive overlay metrology sampling with multiple measurement columns |
CN112630128B (zh) * | 2020-12-21 | 2023-11-10 | 深圳中科飞测科技股份有限公司 | 照明系统及扫描设备 |
KR102470065B1 (ko) * | 2020-12-22 | 2022-11-23 | (주) 엘티아이에스 | 입자 측정 장치 |
CN114666455A (zh) * | 2020-12-23 | 2022-06-24 | Oppo广东移动通信有限公司 | 拍摄控制方法、装置、存储介质及电子装置 |
CN112908126B (zh) * | 2021-01-21 | 2022-07-08 | 潍坊学院 | 一种具有对焦状态数字化显示的透镜成像实验装置 |
CN113418932B (zh) * | 2021-06-30 | 2023-08-04 | 天津大学 | 一种半导体晶片无损探伤装置及方法 |
JP2023031022A (ja) * | 2021-08-24 | 2023-03-08 | 株式会社東芝 | 光学検査方法、光学検査プログラム、及び、光学検査装置 |
FR3127296B1 (fr) * | 2021-09-17 | 2024-02-02 | Safran Electronics & Defense | Dispositif d’imagerie à conception modulaire et capteur infrarouge déporté |
CN113768472B (zh) * | 2021-11-10 | 2022-03-22 | 华中科技大学 | 一种具有荧光标记的三维图像获取装置及方法 |
NL1044332B1 (en) * | 2022-05-17 | 2023-11-24 | Felixsonip B V | Method for improved scanning of a photographic emulsion |
Family Cites Families (90)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3628080A (en) | 1969-08-08 | 1971-12-14 | Westinghouse Electric Corp | Fiber optic output faceplate assembly system |
NL7309383A (nl) | 1973-07-05 | 1975-01-07 | Philips Nv | Koppeling van twee optische vensters. |
JPS6114009Y2 (zh) * | 1980-12-18 | 1986-05-01 | ||
DE3232885A1 (de) * | 1982-09-04 | 1984-03-08 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zur automatischen pruefung von oberflaechen |
US4619508A (en) * | 1984-04-28 | 1986-10-28 | Nippon Kogaku K. K. | Illumination optical arrangement |
JPH079368B2 (ja) * | 1986-04-07 | 1995-02-01 | 株式会社日立製作所 | 回路基板検査装置 |
JPS62293718A (ja) * | 1986-06-13 | 1987-12-21 | Canon Inc | 露光装置 |
DE3875999T2 (de) * | 1987-04-10 | 1993-03-25 | British Aerospace | Abbildungsanlage. |
JP2838797B2 (ja) * | 1987-04-13 | 1998-12-16 | 株式会社ニコン | 投影光学装置 |
JP2512059B2 (ja) * | 1988-02-26 | 1996-07-03 | 株式会社日立製作所 | 異物検出方法及びその装置 |
JPH0235447A (ja) | 1988-07-26 | 1990-02-06 | Fuji Photo Film Co Ltd | 定着型光像形成シートの作成方法 |
JP2693791B2 (ja) * | 1988-10-25 | 1997-12-24 | 三菱電機株式会社 | 欠陥検査装置 |
DE3936930C1 (zh) | 1989-11-06 | 1990-05-17 | Proxitronic Funk Gmbh & Co Kg, 6140 Bensheim, De | |
JP3204406B2 (ja) | 1991-10-30 | 2001-09-04 | 株式会社ニコン | 面位置検出方法及び装置、半導体露光装置、並びに前記方法を用いた露光方法 |
US5264912A (en) * | 1992-02-07 | 1993-11-23 | Tencor Instruments | Speckle reduction track filter apparatus for optical inspection of patterned substrates |
US5228101A (en) | 1992-03-02 | 1993-07-13 | Motorola, Inc. | Electrical to optical links using metalization |
JP2987007B2 (ja) * | 1992-05-28 | 1999-12-06 | 日立電子エンジニアリング株式会社 | カラーフィルタの異物検出光学系 |
US5313479A (en) * | 1992-07-29 | 1994-05-17 | Texas Instruments Incorporated | Speckle-free display system using coherent light |
CN2138294Y (zh) * | 1992-09-19 | 1993-07-14 | 杨锡庚 | 激光快速红外测温仪 |
CN1025642C (zh) * | 1992-11-02 | 1994-08-10 | 中国大恒公司 | 光电指纹识别仪 |
EP0617431B1 (en) | 1993-03-25 | 1997-05-14 | Seiko Instruments Inc. | X-ray analysing apparatus |
US5420954A (en) | 1993-05-24 | 1995-05-30 | Photonics Research Incorporated | Parallel optical interconnect |
US5359447A (en) | 1993-06-25 | 1994-10-25 | Hewlett-Packard Company | Optical communication with vertical-cavity surface-emitting laser operating in multiple transverse modes |
JPH07104192A (ja) * | 1993-10-07 | 1995-04-21 | Olympus Optical Co Ltd | 顕微鏡用tv観察装置 |
JP3271425B2 (ja) * | 1994-03-30 | 2002-04-02 | ソニー株式会社 | 異物検査装置及び異物検査方法 |
US5526458A (en) * | 1994-05-27 | 1996-06-11 | Eastman Kodak Company | Vision system with fiber optic plate to detilt oblique images |
US5673144A (en) | 1994-09-14 | 1997-09-30 | International Business Machines, Corporation | Oblique viewing microscope system |
DE4434699C2 (de) * | 1994-09-28 | 2001-02-22 | Fraunhofer Ges Forschung | Anordnung zur Prüfung durchsichtiger oder spiegelnder Objekte |
JP3744966B2 (ja) * | 1994-10-07 | 2006-02-15 | 株式会社ルネサステクノロジ | 半導体基板の製造方法 |
JPH08152430A (ja) * | 1994-11-29 | 1996-06-11 | Seiko Instr Inc | 位置合わせ機能付き顕微鏡 |
US5633747A (en) * | 1994-12-21 | 1997-05-27 | Tencor Instruments | Variable spot-size scanning apparatus |
US5500770A (en) * | 1994-12-30 | 1996-03-19 | Amarel Precision Instruments | Macrolens system for emission microscopy |
US6118525A (en) * | 1995-03-06 | 2000-09-12 | Ade Optical Systems Corporation | Wafer inspection system for distinguishing pits and particles |
US5903342A (en) * | 1995-04-10 | 1999-05-11 | Hitachi Electronics Engineering, Co., Ltd. | Inspection method and device of wafer surface |
WO1996039619A1 (en) * | 1995-06-06 | 1996-12-12 | Kla Instruments Corporation | Optical inspection of a specimen using multi-channel responses from the specimen |
US5729374A (en) * | 1995-07-03 | 1998-03-17 | The Regents Of The University Of California | Speckle averaging system for laser raster-scan image projection |
JP2820103B2 (ja) * | 1996-01-31 | 1998-11-05 | 日本電気株式会社 | 注入同期レーザ装置 |
FR2744764B1 (fr) * | 1996-02-12 | 1998-04-17 | Inst Francais Du Petrole | Moteur deux temps ayant un moyen de controle du mouvement de la soupape |
US5933473A (en) | 1996-04-04 | 1999-08-03 | Hitachi, Ltd. | Non-destructive inspection apparatus and inspection system using it |
JPH09305094A (ja) * | 1996-05-10 | 1997-11-28 | Komatsu Ltd | テレセントリック光学装置 |
AU3376597A (en) * | 1996-06-04 | 1998-01-05 | Tencor Instruments | Optical scanning system for surface inspection |
US6392241B1 (en) | 1996-07-10 | 2002-05-21 | Packard Instrument Company, Inc. | Fiber optic coupling device for detecting fluorescence samples |
JPH10141932A (ja) * | 1996-11-07 | 1998-05-29 | Fujitsu Ltd | パターン検査方法と装置 |
US5801824A (en) * | 1996-11-25 | 1998-09-01 | Photon Dynamics, Inc. | Large area defect monitor tool for manufacture of clean surfaces |
US5774224A (en) * | 1997-01-24 | 1998-06-30 | International Business Machines Corporation | Linear-scanning, oblique-viewing optical apparatus |
EP1016126B1 (en) * | 1997-03-31 | 2018-12-26 | Nanometrics Incorporated | Optical inspection module and method for detecting particles and defects on substrates in integrated process tools |
JPH10335240A (ja) * | 1997-05-30 | 1998-12-18 | Nikon Corp | 表面位置検出装置 |
JPH1164234A (ja) * | 1997-08-20 | 1999-03-05 | Advantest Corp | 異物検出方法、および異物検出装置 |
US6201601B1 (en) * | 1997-09-19 | 2001-03-13 | Kla-Tencor Corporation | Sample inspection system |
US6956644B2 (en) * | 1997-09-19 | 2005-10-18 | Kla-Tencor Technologies Corporation | Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination |
US6104481A (en) * | 1997-11-11 | 2000-08-15 | Kabushiki Kaisha Topcon | Surface inspection apparatus |
US6304373B1 (en) * | 1998-03-09 | 2001-10-16 | Lucid, Inc. | Imaging system using multi-mode laser illumination to enhance image quality |
JPH11223795A (ja) * | 1998-02-06 | 1999-08-17 | Sony Corp | 光のコヒーレンス低減方法及びその装置、照明方法及びその装置、並びにバンドルファイバー |
JP3385994B2 (ja) * | 1998-02-27 | 2003-03-10 | 株式会社ニコン | 像検出装置 |
JPH11271453A (ja) | 1998-03-25 | 1999-10-08 | Toshiba Corp | 放射線弁別測定方法および放射線弁別測定装置 |
JPH11326826A (ja) * | 1998-05-13 | 1999-11-26 | Sony Corp | 照明方法及び照明装置 |
JPH11326653A (ja) * | 1998-05-15 | 1999-11-26 | Sony Corp | 光のコヒーレンス低減方法及びその装置、照明方法及びその装置、並びに、光ファイバーバンドル |
US6256093B1 (en) * | 1998-06-25 | 2001-07-03 | Applied Materials, Inc. | On-the-fly automatic defect classification for substrates using signal attributes |
US6137570A (en) * | 1998-06-30 | 2000-10-24 | Kla-Tencor Corporation | System and method for analyzing topological features on a surface |
US6987873B1 (en) * | 1998-07-08 | 2006-01-17 | Applied Materials, Inc. | Automatic defect classification with invariant core classes |
JP4426026B2 (ja) * | 1998-08-07 | 2010-03-03 | シスメックス株式会社 | マルチ光源ユニットおよびそれを用いた光学システム |
US6122046A (en) * | 1998-10-02 | 2000-09-19 | Applied Materials, Inc. | Dual resolution combined laser spot scanning and area imaging inspection |
JP4304548B2 (ja) * | 1998-12-01 | 2009-07-29 | 株式会社ニコン | 顕微鏡装置 |
US6621570B1 (en) * | 1999-03-04 | 2003-09-16 | Inspex Incorporated | Method and apparatus for inspecting a patterned semiconductor wafer |
JP4258058B2 (ja) * | 1999-03-23 | 2009-04-30 | ソニー株式会社 | 円盤状記録媒体の検査装置及び検査方法 |
JP4455771B2 (ja) * | 1999-04-12 | 2010-04-21 | ドイッチェ テレコム アーゲー | プロジェクションスクリーン上のスペックル形成を低減するための方法および装置 |
US6370219B1 (en) | 1999-04-20 | 2002-04-09 | Lucent Technologies Inc. | Self-modulated, filament-based, solid state laser |
US6853446B1 (en) * | 1999-08-16 | 2005-02-08 | Applied Materials, Inc. | Variable angle illumination wafer inspection system |
JP2000136910A (ja) * | 1999-11-01 | 2000-05-16 | Olympus Optical Co Ltd | 基板検査装置 |
US6369888B1 (en) * | 1999-11-17 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for article inspection including speckle reduction |
US6956878B1 (en) * | 2000-02-07 | 2005-10-18 | Silicon Light Machines Corporation | Method and apparatus for reducing laser speckle using polarization averaging |
JP4604300B2 (ja) | 2000-02-09 | 2011-01-05 | 株式会社ニコン | 顕微鏡 |
JP2001250760A (ja) * | 2000-03-06 | 2001-09-14 | Nikon Corp | 収差計測方法、該方法を使用するマーク検出方法、及び露光方法 |
JP3996728B2 (ja) * | 2000-03-08 | 2007-10-24 | 株式会社日立製作所 | 表面検査装置およびその方法 |
JP4671573B2 (ja) * | 2000-03-24 | 2011-04-20 | オリンパス株式会社 | 基板搬送装置及び外観検査装置 |
JP3858571B2 (ja) | 2000-07-27 | 2006-12-13 | 株式会社日立製作所 | パターン欠陥検査方法及びその装置 |
US7136159B2 (en) * | 2000-09-12 | 2006-11-14 | Kla-Tencor Technologies Corporation | Excimer laser inspection system |
US6323984B1 (en) * | 2000-10-11 | 2001-11-27 | Silicon Light Machines | Method and apparatus for reducing laser speckle |
US6693930B1 (en) * | 2000-12-12 | 2004-02-17 | Kla-Tencor Technologies Corporation | Peak power and speckle contrast reduction for a single laser pulse |
US6522437B2 (en) * | 2001-02-15 | 2003-02-18 | Harris Corporation | Agile multi-beam free-space optical communication apparatus |
US6625381B2 (en) * | 2001-02-20 | 2003-09-23 | Eastman Kodak Company | Speckle suppressed laser projection system with partial beam reflection |
US6445487B1 (en) * | 2001-02-20 | 2002-09-03 | Eastman Kodak Company | Speckle suppressed laser projection system using a multi-wavelength doppler shifted beam |
JP3271622B2 (ja) * | 2001-03-12 | 2002-04-02 | 株式会社日立製作所 | 半導体デバイスの製造方法 |
RU2214058C2 (ru) * | 2001-04-25 | 2003-10-10 | Общество с ограниченной ответственностью "Подсолнечник Технологии" | Способ формирования световых пучков для систем открытой оптической связи |
US6747781B2 (en) * | 2001-06-25 | 2004-06-08 | Silicon Light Machines, Inc. | Method, apparatus, and diffuser for reducing laser speckle |
US6778267B2 (en) * | 2001-09-24 | 2004-08-17 | Kla-Tencor Technologies Corp. | Systems and methods for forming an image of a specimen at an oblique viewing angle |
US7015452B2 (en) | 2001-10-09 | 2006-03-21 | Itt Manufacturing Enterprises, Inc. | Intensified hybrid solid-state sensor |
US6895149B1 (en) * | 2002-05-13 | 2005-05-17 | James Jeffery Jacob | Apparatus for beam homogenization and speckle reduction |
US7116413B2 (en) * | 2002-09-13 | 2006-10-03 | Kla-Tencor Corporation | Inspection system for integrated applications |
JP4546830B2 (ja) * | 2002-09-30 | 2010-09-22 | アプライド マテリアルズ イスラエル リミテッド | 暗フィールド検査システム |
-
2003
- 2003-09-08 JP JP2004541516A patent/JP4546830B2/ja not_active Expired - Lifetime
- 2003-09-08 CN CNB038230968A patent/CN100561204C/zh not_active Expired - Fee Related
- 2003-09-08 US US10/511,092 patent/US7339661B2/en active Active
- 2003-09-08 AU AU2003265989A patent/AU2003265989A1/en not_active Abandoned
- 2003-09-08 JP JP2004541515A patent/JP2006501469A/ja active Pending
- 2003-09-08 CN CNA038230976A patent/CN1771456A/zh active Pending
- 2003-09-08 JP JP2004541513A patent/JP4704040B2/ja not_active Expired - Fee Related
- 2003-09-08 AU AU2003263108A patent/AU2003263108A1/en not_active Abandoned
- 2003-09-08 EP EP03799278A patent/EP1546693A1/en not_active Withdrawn
- 2003-09-08 WO PCT/US2003/028061 patent/WO2004031753A1/en active Application Filing
- 2003-09-08 WO PCT/US2003/028054 patent/WO2004031741A2/en active Application Filing
- 2003-09-08 AU AU2003263109A patent/AU2003263109A1/en not_active Abandoned
- 2003-09-08 CN CN201110240143.6A patent/CN102393398B/zh not_active Expired - Lifetime
- 2003-09-08 EP EP03799277A patent/EP1546691A1/en not_active Withdrawn
- 2003-09-08 CN CN201410569577.4A patent/CN104502357B/zh not_active Expired - Lifetime
- 2003-09-08 CN CN03823095XA patent/CN1685220B/zh not_active Expired - Fee Related
- 2003-09-08 EP EP03799276A patent/EP1576355A2/en not_active Withdrawn
- 2003-09-08 WO PCT/US2003/028062 patent/WO2004031754A1/en active Application Filing
-
2005
- 2005-03-09 IL IL167352A patent/IL167352A/en unknown
- 2005-03-09 IL IL167353A patent/IL167353A/en active IP Right Grant
-
2006
- 2006-01-23 US US11/394,218 patent/US7630069B2/en active Active
-
2007
- 2007-10-30 US US11/929,216 patent/US20080054166A1/en not_active Abandoned
-
2008
- 2008-07-11 JP JP2008181750A patent/JP5702045B2/ja not_active Expired - Lifetime
-
2009
- 2009-11-25 US US12/626,592 patent/US7924419B2/en not_active Expired - Lifetime
-
2011
- 2011-03-22 US US13/069,332 patent/US8134699B2/en not_active Expired - Fee Related
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