CN1639246A - 包含添加剂的有机导电聚合物的印刷 - Google Patents

包含添加剂的有机导电聚合物的印刷 Download PDF

Info

Publication number
CN1639246A
CN1639246A CNA038050250A CN03805025A CN1639246A CN 1639246 A CN1639246 A CN 1639246A CN A038050250 A CNA038050250 A CN A038050250A CN 03805025 A CN03805025 A CN 03805025A CN 1639246 A CN1639246 A CN 1639246A
Authority
CN
China
Prior art keywords
composition
conductivity
acid
printing
acicular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA038050250A
Other languages
English (en)
Chinese (zh)
Inventor
G·B·布朗谢芬谢
高峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN1639246A publication Critical patent/CN1639246A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B41M5/385—Contact thermal transfer or sublimation processes characterised by the transferable dyes or pigments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B41M5/392—Additives, other than colour forming substances, dyes or pigments, e.g. sensitisers, transfer promoting agents
    • B41M5/395—Macromolecular additives, e.g. binders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • C08G61/124—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/122—Ionic conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B41M5/392—Additives, other than colour forming substances, dyes or pigments, e.g. sensitisers, transfer promoting agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/04—Antistatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/211—Fullerenes, e.g. C60
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221—Carbon nanotubes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Conductive Materials (AREA)
CNA038050250A 2002-03-01 2003-02-26 包含添加剂的有机导电聚合物的印刷 Pending CN1639246A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36099902P 2002-03-01 2002-03-01
US60/360,999 2002-03-01

Publications (1)

Publication Number Publication Date
CN1639246A true CN1639246A (zh) 2005-07-13

Family

ID=27789056

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA038050250A Pending CN1639246A (zh) 2002-03-01 2003-02-26 包含添加剂的有机导电聚合物的印刷

Country Status (7)

Country Link
US (2) US20050116202A1 (enExample)
EP (1) EP1483320A2 (enExample)
JP (1) JP2005526876A (enExample)
KR (1) KR20040096630A (enExample)
CN (1) CN1639246A (enExample)
AU (1) AU2003223198A1 (enExample)
WO (1) WO2003074601A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102576576A (zh) * 2009-09-04 2012-07-11 巴斯夫欧洲公司 用于印刷导电迹线的组合物以及制备太阳能电池的方法
CN103182877A (zh) * 2011-12-30 2013-07-03 第一毛织株式会社 热转印膜和用该膜制造的有机电致发光装置
CN104520383A (zh) * 2012-07-31 2015-04-15 国际商业机器公司 用于光刻法的水分散性导电性含氟聚苯胺组合物
CN111601855A (zh) * 2018-01-22 2020-08-28 出光兴产株式会社 组合物、和使用其的氧化还原材料

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100540628C (zh) * 2002-09-24 2009-09-16 E.I.内穆尔杜邦公司 导电有机聚合物/纳米微粒组合物及其应用方法
US7431866B2 (en) 2002-09-24 2008-10-07 E. I. Du Pont De Nemours And Company Water dispersible polythiophenes made with polymeric acid colloids
CN1681869B (zh) 2002-09-24 2010-05-26 E.I.内穆尔杜邦公司 用于电子器件用聚合物酸胶体制成的可水分散的聚苯胺
US7317047B2 (en) 2002-09-24 2008-01-08 E.I. Du Pont De Nemours And Company Electrically conducting organic polymer/nanoparticle composites and methods for use thereof
KR100720628B1 (ko) * 2002-11-01 2007-05-21 미츠비시 레이온 가부시키가이샤 탄소 나노튜브 함유 조성물, 이를 포함하는 도막을 갖는복합체, 및 이들의 제조 방법
US7390438B2 (en) 2003-04-22 2008-06-24 E.I. Du Pont De Nemours And Company Water dispersible substituted polydioxythiophenes made with fluorinated polymeric sulfonic acid colloids
US20050165155A1 (en) * 2003-10-21 2005-07-28 Blanchet-Fincher Graciela B. Insulating polymers containing polyaniline and carbon nanotubes
DE102004003784B4 (de) * 2004-01-23 2011-01-13 Ormecon Gmbh Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung
JP2007526476A (ja) * 2004-03-03 2007-09-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 化合物半導体を用いたｎｏの検出並びにｎｏを検出するためのセンサ及びデバイス
US7351358B2 (en) 2004-03-17 2008-04-01 E.I. Du Pont De Nemours And Company Water dispersible polypyrroles made with polymeric acid colloids for electronics applications
WO2005090446A1 (en) * 2004-03-18 2005-09-29 Ormecon Gmbh A composition comprising a conductive polymer in colloidal form and carbon
JP2007530741A (ja) * 2004-03-23 2007-11-01 シエラシン コーポレイション ナノチューブを含む被覆材及びその適用方法、並びにそれらを組み合わせた透明材料
US8147962B2 (en) 2004-04-13 2012-04-03 E. I. Du Pont De Nemours And Company Conductive polymer composites
DE102004030388A1 (de) * 2004-06-23 2006-01-26 Ormecon Gmbh Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung
WO2007011369A2 (en) * 2004-08-23 2007-01-25 E.I. Dupont De Nemours And Company Method for preparing cnt/pani dispersions
CN101091266A (zh) * 2004-08-27 2007-12-19 杜邦公司 半导体渗滤网状物
US20060062983A1 (en) * 2004-09-17 2006-03-23 Irvin Glen C Jr Coatable conductive polyethylenedioxythiophene with carbon nanotubes
TWI323901B (en) * 2004-11-26 2010-04-21 Hon Hai Prec Ind Co Ltd Anisotropic conductive material
FR2879347A1 (fr) * 2004-12-14 2006-06-16 Commissariat Energie Atomique Dispositif electronique a deux composants assembles et procede de fabrication d'un tel dispositif
US20060181600A1 (en) * 2005-02-15 2006-08-17 Eastman Kodak Company Patterns formed by transfer of conductive particles
US20060188721A1 (en) * 2005-02-22 2006-08-24 Eastman Kodak Company Adhesive transfer method of carbon nanotube layer
DE102005010162B4 (de) * 2005-03-02 2007-06-14 Ormecon Gmbh Leitfähige Polymere aus Teilchen mit anisotroper Morphologie
KR101356296B1 (ko) 2005-06-28 2014-02-06 이 아이 듀폰 디 네모아 앤드 캄파니 높은 일 함수의 투명한 도체
WO2007002740A2 (en) 2005-06-28 2007-01-04 E. I. Du Pont De Nemours And Company Buffer compositions
KR101121203B1 (ko) * 2005-07-27 2012-03-23 삼성전자주식회사 고농도 탄소나노튜브 용액용 분산제 및 이를 포함한 조성물
DE102005039608A1 (de) * 2005-08-19 2007-03-01 Ormecon Gmbh Zusammensetzung mit intrinsisch leitfähigem Polymer
WO2007050460A2 (en) * 2005-10-25 2007-05-03 Inorganic Specialists, Inc. Carbon nanofiber paper and applications
JP2007138112A (ja) * 2005-11-22 2007-06-07 Tokai Rubber Ind Ltd 導電性ポリマー組成物およびそれを用いた電子写真機器用導電性部材
US8216680B2 (en) 2006-02-03 2012-07-10 E I Du Pont De Nemours And Company Transparent composite conductors having high work function
US8308886B2 (en) 2006-07-17 2012-11-13 E I Du Pont De Nemours And Company Donor elements and processes for thermal transfer of nanoparticle layers
US7528448B2 (en) * 2006-07-17 2009-05-05 E.I. Du Pont De Nemours And Company Thin film transistor comprising novel conductor and dielectric compositions
US7744717B2 (en) 2006-07-17 2010-06-29 E. I. Du Pont De Nemours And Company Process for enhancing the resolution of a thermally transferred pattern
DE102006035750A1 (de) * 2006-07-28 2008-01-31 Polylc Gmbh & Co. Kg Material zur Herstellung einer Funktionsschicht eines organischen elektronischen Bauelements
ATE546032T1 (de) * 2006-09-13 2012-03-15 Enthone Artikel mit beschichtung aus elektrisch leitendem polymer und edel-/halbedelmetal sowie herstellungsverfahren dafür
US8062553B2 (en) 2006-12-28 2011-11-22 E. I. Du Pont De Nemours And Company Compositions of polyaniline made with perfuoropolymeric acid which are heat-enhanced and electronic devices made therewith
US8153029B2 (en) 2006-12-28 2012-04-10 E.I. Du Pont De Nemours And Company Laser (230NM) ablatable compositions of electrically conducting polymers made with a perfluoropolymeric acid applications thereof
US20080191172A1 (en) 2006-12-29 2008-08-14 Che-Hsiung Hsu High work-function and high conductivity compositions of electrically conducting polymers
US8241526B2 (en) 2007-05-18 2012-08-14 E I Du Pont De Nemours And Company Aqueous dispersions of electrically conducting polymers containing high boiling solvent and additives
KR100891517B1 (ko) * 2007-06-18 2009-04-06 주식회사 하이닉스반도체 플립 칩 패키지 및 그의 제조방법
US7763187B1 (en) * 2007-08-23 2010-07-27 Oceanit Laboratories, Inc. Carbon nanotubes-reinforced conductive silver ink
CA2697846A1 (en) * 2007-09-07 2009-03-12 Inorganic Specialists, Inc. Silicon modified nanofiber paper as an anode material for a lithium secondary battery
US7879678B2 (en) * 2008-02-28 2011-02-01 Versatilis Llc Methods of enhancing performance of field-effect transistors and field-effect transistors made thereby
US8206537B2 (en) * 2008-08-27 2012-06-26 Carnegie Mellon University Method for forming a conducting multi-polymer nanostructure
US8945426B2 (en) 2009-03-12 2015-02-03 E I Du Pont De Nemours And Company Electrically conductive polymer compositions for coating applications
EP2414439B1 (fr) * 2009-03-31 2014-03-26 Hutchinson Films ou revetements transparents conducteurs
CN102395628B (zh) 2009-04-21 2016-01-20 E.I.内穆尔杜邦公司 导电聚合物组合物和由其制得的膜
KR101581991B1 (ko) 2009-04-24 2015-12-31 이 아이 듀폰 디 네모아 앤드 캄파니 전기 전도성 중합체 조성물 및 그로부터 제조된 필름
JP5839683B2 (ja) 2009-06-12 2016-01-06 出光興産株式会社 π共役高分子組成物
KR100969172B1 (ko) * 2009-06-22 2010-07-14 한국기계연구원 마스크 템플릿을 이용한 미세패턴 형성방법
WO2011063037A2 (en) * 2009-11-17 2011-05-26 Lumimove, Inc., Dba Crosslink Conductive polymer composites
US10074453B2 (en) * 2014-08-21 2018-09-11 Council Of Scientific & Industrial Research P-toluenesulfonate doped polypyrrole/carbon composite electrode and a process for the preparation thereof
US20160137875A1 (en) * 2014-11-13 2016-05-19 Rice University Conductive polymer coating composition
JP2022509022A (ja) 2018-10-29 2022-01-20 ポリジュール・インコーポレイテッド 高収率貯蔵材料
CN114981986A (zh) * 2020-01-15 2022-08-30 华为技术有限公司 层沉积方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5217649A (en) * 1991-01-31 1993-06-08 Americhem, Inc. Electrically conductive blends of intrinsically conductive polymers and thermoplastic polymers containing sulfonamide plasticizer and acidic surfactant
ATE217439T1 (de) 1991-12-05 2002-05-15 Neste Oy Verfahren zur herstellung von leitfähigem polyermaterial
JPH05187825A (ja) 1992-01-10 1993-07-27 Nippon Steel Corp 異形棒鋼の形状計測方法及び装置
JPH05198925A (ja) 1992-01-21 1993-08-06 Matsushita Electric Ind Co Ltd 厚膜回路の製造方法
JP3056001B2 (ja) 1992-02-18 2000-06-26 日本ゼオン株式会社 導電性プラスチゾル成形品
US5320780A (en) 1993-01-11 1994-06-14 Tech Spray, Inc. Composition and process for preventing electrostatic discharge
JPH0710992A (ja) * 1993-06-04 1995-01-13 Neste Oy 加工可能な導電性ポリマー材料およびその製造方法
US5783111A (en) * 1993-09-03 1998-07-21 Uniax Corporation Electrically conducting compositions
FR2718140B1 (fr) 1994-03-31 1996-06-21 France Telecom Compositions polymériques électriquement conductrices, procédé de fabrication de telles compositions, substrats revêtus avec ces compositions et solutions oxydantes pour leur fabrication.
US5520852A (en) * 1994-06-08 1996-05-28 Neste Oy Processible electrically conducting polyaniline compositions
US5595689A (en) * 1994-07-21 1997-01-21 Americhem, Inc. Highly conductive polymer blends with intrinsically conductive polymers
FR2751660B1 (fr) 1996-07-29 1998-08-28 Commissariat Energie Atomique Composition pour la fabrication d'un materiau composite conducteur contenant une polyaniline et materiau composite obtenu a partir de cette composition
US5932643A (en) 1997-04-11 1999-08-03 Ncr Corporation Thermal transfer ribbon with conductive polymers
US6205016B1 (en) 1997-06-04 2001-03-20 Hyperion Catalysis International, Inc. Fibril composite electrode for electrochemical capacitors
CA2305384A1 (en) 1997-10-02 1999-04-15 Basf Aktiengesellschaft Mixtures with special softening agents suited as a solid electrolyte or separator for electrochemical cells
US6703163B2 (en) * 1998-03-31 2004-03-09 Celanese Ventures Gmbh Lithium battery and electrode
EP1144197B1 (en) 1999-01-15 2003-06-11 3M Innovative Properties Company Thermal Transfer Method.
US6114088A (en) 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
EP1052654B1 (en) * 1999-05-13 2004-01-28 Union Carbide Chemicals & Plastics Technology Corporation Cable semiconducting shield
US6284425B1 (en) 1999-12-28 2001-09-04 3M Innovative Properties Thermal transfer donor element having a heat management underlayer
GB2360524B (en) 2000-03-24 2004-02-11 Council Scient Ind Res Melt or solution processable doped polyaniline
US7033525B2 (en) * 2001-02-16 2006-04-25 E.I. Dupont De Nemours And Company High conductivity polyaniline compositions and uses therefor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102576576A (zh) * 2009-09-04 2012-07-11 巴斯夫欧洲公司 用于印刷导电迹线的组合物以及制备太阳能电池的方法
CN102576576B (zh) * 2009-09-04 2014-08-06 巴斯夫欧洲公司 用于印刷导电迹线的组合物以及制备太阳能电池的方法
CN103182877A (zh) * 2011-12-30 2013-07-03 第一毛织株式会社 热转印膜和用该膜制造的有机电致发光装置
CN103182877B (zh) * 2011-12-30 2016-08-03 第一毛织株式会社 热转印膜和用该膜制造的有机电致发光装置
CN104520383A (zh) * 2012-07-31 2015-04-15 国际商业机器公司 用于光刻法的水分散性导电性含氟聚苯胺组合物
CN104520383B (zh) * 2012-07-31 2016-10-05 国际商业机器公司 用于光刻法的水分散性导电性含氟聚苯胺组合物
CN111601855A (zh) * 2018-01-22 2020-08-28 出光兴产株式会社 组合物、和使用其的氧化还原材料

Also Published As

Publication number Publication date
US20040021131A1 (en) 2004-02-05
WO2003074601A2 (en) 2003-09-12
EP1483320A2 (en) 2004-12-08
JP2005526876A (ja) 2005-09-08
US7351357B2 (en) 2008-04-01
US20050116202A1 (en) 2005-06-02
AU2003223198A1 (en) 2003-09-16
WO2003074601A3 (en) 2004-07-29
KR20040096630A (ko) 2004-11-16

Similar Documents

Publication Publication Date Title
US7351357B2 (en) Printing of organic conductive polymers containing additives
CN1867626A (zh) 含有聚苯胺和碳纳米管的绝缘聚合物
Blanchet et al. Polyaniline nanotube composites: A high-resolution printable conductor
CN1972999B (zh) 包含电掺杂的导电性聚合物和形成胶体的聚合酸的非水性分散体
CN1303153C (zh) 含聚（3，4－二烷氧基噻吩）和聚阴离子复合物的水分散体及其制备方法
JP5428104B2 (ja) 有機半導体組成物
JP2005526876A5 (enExample)
Denneulin et al. The influence of carbon nanotubes in inkjet printing of conductive polymer suspensions
KR102027362B1 (ko) 반도체 조성물
KR101887167B1 (ko) 전자 장치
JP2011513934A (ja) 溶剤型および水性導電性金属インクのための添加剤および調整剤
CN1491419A (zh) 高电导率聚苯胺组合物及其用途
JP2010515238A (ja) 導電性または半導電性有機材料を有する電圧で切替可能な誘電体
TW201130930A (en) Conductive paste for screen printing
WO2016118536A2 (en) Printable high dielectric constant and self-healable dielectric polymer composition
KR101899083B1 (ko) 탄소나노튜브를 포함하는 반도체 잉크 조성물 및 그의 박막트랜지스터 제조 방법
JP2008511735A (ja) 半導電性パーコレーションネットワーク
CN101656297B (zh) 含有高分子半导体的电子装置
JP5715664B2 (ja) 有機半導体組成物
JP2006312673A (ja) カーボンナノチューブ分散ペースト、およびカーボンナノチューブ分散コンポジット
CN1790727A (zh) 有机薄膜晶体管阵列板及其制造方法
JP2005529474A (ja) 導電性有機機能層を製造するための材料および該材料の使用
JP2018006076A (ja) 透明導電性シート及びその製造方法
JP5811522B2 (ja) 薄膜トランジスタの製造方法
JP2007173472A (ja) 有機半導体層の形成方法及びそれを用いた有機半導体素子の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication