CN1532905A - 电子部件的制造方法、电子部件、电子部件的安装方法和电子装置 - Google Patents
电子部件的制造方法、电子部件、电子部件的安装方法和电子装置 Download PDFInfo
- Publication number
- CN1532905A CN1532905A CNA200410008863XA CN200410008863A CN1532905A CN 1532905 A CN1532905 A CN 1532905A CN A200410008863X A CNA200410008863X A CN A200410008863XA CN 200410008863 A CN200410008863 A CN 200410008863A CN 1532905 A CN1532905 A CN 1532905A
- Authority
- CN
- China
- Prior art keywords
- electroconductive particle
- electronic unit
- salient point
- manufacture method
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 97
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 51
- 239000002245 particle Substances 0.000 claims abstract description 272
- 229920005989 resin Polymers 0.000 claims description 136
- 239000011347 resin Substances 0.000 claims description 136
- 229920005992 thermoplastic resin Polymers 0.000 claims description 51
- 238000000576 coating method Methods 0.000 claims description 39
- 239000011248 coating agent Substances 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 230000015572 biosynthetic process Effects 0.000 claims description 37
- 238000009434 installation Methods 0.000 claims description 33
- 238000013007 heat curing Methods 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 10
- 238000001723 curing Methods 0.000 claims description 8
- 230000008014 freezing Effects 0.000 claims description 6
- 238000007710 freezing Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 4
- 238000000935 solvent evaporation Methods 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 23
- 238000005755 formation reaction Methods 0.000 description 36
- 239000004973 liquid crystal related substance Substances 0.000 description 32
- 239000000243 solution Substances 0.000 description 18
- 230000010287 polarization Effects 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 238000010586 diagram Methods 0.000 description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 150000004040 pyrrolidinones Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
- E05B47/00—Operating or controlling locks or other fastening devices by electric or magnetic means
- E05B47/02—Movement of the bolt by electromagnetic means; Adaptation of locks, latches, or parts thereof, for movement of the bolt by electromagnetic means
- E05B47/026—Movement of the bolt by electromagnetic means; Adaptation of locks, latches, or parts thereof, for movement of the bolt by electromagnetic means the bolt moving rectilinearly
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
- E05B47/00—Operating or controlling locks or other fastening devices by electric or magnetic means
- E05B47/0001—Operating or controlling locks or other fastening devices by electric or magnetic means with electric actuators; Constructional features thereof
- E05B2047/0014—Constructional features of actuators or power transmissions therefor
- E05B2047/0018—Details of actuator transmissions
- E05B2047/002—Geared transmissions
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
- E05B49/00—Electric permutation locks; Circuits therefor ; Mechanical aspects of electronic locks; Mechanical keys therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11332—Manufacturing methods by local deposition of the material of the bump connector in solid form using a powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/1147—Manufacturing methods using a lift-off mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/119—Methods of manufacturing bump connectors involving a specific sequence of method steps
- H01L2224/11901—Methods of manufacturing bump connectors involving a specific sequence of method steps with repetition of the same manufacturing step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (39)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003085874A JP3891133B2 (ja) | 2003-03-26 | 2003-03-26 | 電子部品の製造方法および電子部品の実装方法 |
JP085874/2003 | 2003-03-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1532905A true CN1532905A (zh) | 2004-09-29 |
CN1307704C CN1307704C (zh) | 2007-03-28 |
Family
ID=33400672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200410008863XA Expired - Lifetime CN1307704C (zh) | 2003-03-26 | 2004-03-24 | 电子部件的制造方法、电子部件、电子部件的安装方法和电子装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7060602B2 (zh) |
JP (1) | JP3891133B2 (zh) |
KR (1) | KR100588925B1 (zh) |
CN (1) | CN1307704C (zh) |
TW (1) | TWI272642B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101188219B (zh) * | 2006-11-22 | 2012-01-25 | 三星电子株式会社 | 液晶显示装置的驱动电路及制造方法和具有其的显示装置 |
CN106842647A (zh) * | 2017-03-20 | 2017-06-13 | 武汉华星光电技术有限公司 | 一种显示装置、绑定结构及其制备方法 |
CN107784952A (zh) * | 2017-11-17 | 2018-03-09 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
CN107830876A (zh) * | 2017-10-16 | 2018-03-23 | 厦门乃尔电子有限公司 | 一种压电传感器组件的制备方法 |
CN108476591A (zh) * | 2015-06-16 | 2018-08-31 | 迪睿合株式会社 | 连接体、连接体的制造方法、检测方法 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4494745B2 (ja) * | 2003-09-25 | 2010-06-30 | 浜松ホトニクス株式会社 | 半導体装置 |
JP4494746B2 (ja) * | 2003-09-25 | 2010-06-30 | 浜松ホトニクス株式会社 | 半導体装置 |
JP4351012B2 (ja) * | 2003-09-25 | 2009-10-28 | 浜松ホトニクス株式会社 | 半導体装置 |
JP4649852B2 (ja) * | 2004-03-08 | 2011-03-16 | カシオ計算機株式会社 | 電子部品の接合方法および電子部品の接合構造 |
JP2006237412A (ja) * | 2005-02-28 | 2006-09-07 | Seiko Instruments Inc | 半導体装置の製造方法および電子機器の製造方法 |
JP5546125B2 (ja) * | 2005-04-01 | 2014-07-09 | トルンプ・ヴェルクツォイクマシーネン・ゲーエム・ベーハー・ウント・コンパニ・カーゲー | ピクセル・マトリクスの形態で設けられる温度センサを備える、ビーム・パラメータを記録する光学要素および方法 |
CN100573839C (zh) * | 2005-04-14 | 2009-12-23 | 松下电器产业株式会社 | 电子电路装置及其制造方法 |
KR100801073B1 (ko) * | 2005-10-06 | 2008-02-11 | 삼성전자주식회사 | 도전성 입자를 포함하는 범프를 구비하는 반도체 칩 및 이의 제조 방법 |
US7550846B2 (en) * | 2005-12-21 | 2009-06-23 | Palo Alto Research Center | Conductive bump with a plurality of contact elements |
US20070239256A1 (en) * | 2006-03-22 | 2007-10-11 | Jan Weber | Medical devices having electrical circuits with multilayer regions |
TW200803639A (en) * | 2006-06-01 | 2008-01-01 | Unimicron Technology Corp | Selective metal surface treatment process and apparatus for circuit board and resist used in the process |
WO2010109718A1 (ja) * | 2009-03-26 | 2010-09-30 | シャープ株式会社 | チップ部品実装構造、チップ部品実装方法および液晶表示装置 |
JP5732631B2 (ja) | 2009-09-18 | 2015-06-10 | ボンドテック株式会社 | 接合装置および接合方法 |
KR101666214B1 (ko) * | 2009-11-05 | 2016-10-14 | 삼성디스플레이 주식회사 | 이방성 도전 필름, 이의 제조 방법 및 이를 포함하는 표시 장치 |
JP5418367B2 (ja) | 2010-03-30 | 2014-02-19 | 富士通株式会社 | プリント配線板ユニットおよび電子機器 |
EP2383773B1 (en) | 2010-04-27 | 2013-05-08 | Instytut Technologii Materialów Elektronicznych | Method of electrochemical-mechanical polishing of silicon carbide wafers |
US8384215B2 (en) | 2010-12-30 | 2013-02-26 | Industrial Technology Research Institute | Wafer level molding structure |
KR101526278B1 (ko) * | 2012-12-21 | 2015-06-05 | 제일모직주식회사 | 경화 필름과 도전 필름을 포함하는 분리형 이방 도전성 필름 |
US9130016B2 (en) * | 2013-04-15 | 2015-09-08 | Schott Corporation | Method of manufacturing through-glass vias |
USD760230S1 (en) * | 2014-09-16 | 2016-06-28 | Daishinku Corporation | Piezoelectric vibration device |
US10886250B2 (en) | 2015-07-10 | 2021-01-05 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
TWI822659B (zh) | 2016-10-27 | 2023-11-21 | 美商艾德亞半導體科技有限責任公司 | 用於低溫接合的結構和方法 |
US10224301B2 (en) * | 2017-07-05 | 2019-03-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
JP7046351B2 (ja) | 2018-01-31 | 2022-04-04 | 三国電子有限会社 | 接続構造体の作製方法 |
JP7185252B2 (ja) | 2018-01-31 | 2022-12-07 | 三国電子有限会社 | 接続構造体の作製方法 |
JP7160302B2 (ja) * | 2018-01-31 | 2022-10-25 | 三国電子有限会社 | 接続構造体および接続構造体の作製方法 |
US11039531B1 (en) | 2018-02-05 | 2021-06-15 | Flex Ltd. | System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features |
US10964660B1 (en) * | 2018-11-20 | 2021-03-30 | Flex Ltd. | Use of adhesive films for 3D pick and place assembly of electronic components |
US10896877B1 (en) | 2018-12-14 | 2021-01-19 | Flex Ltd. | System in package with double side mounted board |
US10568215B1 (en) | 2019-05-20 | 2020-02-18 | Flex Ltd. | PCBA encapsulation by thermoforming |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669278A (ja) * | 1992-08-18 | 1994-03-11 | Toshiba Corp | 半導体素子の接続方法 |
JPH076799A (ja) * | 1993-06-18 | 1995-01-10 | Ricoh Co Ltd | 電子部品の接続方法 |
JPH1084178A (ja) * | 1996-09-09 | 1998-03-31 | Ricoh Co Ltd | 微小物体の配列方法及び該配列方法を用いた接続構造の形成方法 |
KR100232678B1 (ko) * | 1996-12-18 | 1999-12-01 | 구본준 | 돌기가 형성된 범프 및 그 제조방법 |
JPH10209210A (ja) * | 1997-01-20 | 1998-08-07 | Sharp Corp | 半導体装置及びその製造方法並びにその検査方法 |
WO1999010928A1 (en) | 1997-08-21 | 1999-03-04 | Citizen Watch Co., Ltd. | Semiconductor device and method of fabricating the same |
TW366548B (en) * | 1998-04-18 | 1999-08-11 | United Microelectronics Corp | Trench bump block and the application of the same |
SG74729A1 (en) * | 1998-05-29 | 2000-08-22 | Hitachi Ltd | Method of forming bumps |
JP2000340595A (ja) * | 1999-05-31 | 2000-12-08 | Matsushita Electronics Industry Corp | 金バンプおよびその形成方法 |
JP3506424B2 (ja) * | 2000-11-30 | 2004-03-15 | ソニーケミカル株式会社 | 半導体素子の実装方法 |
JP2003059959A (ja) * | 2001-08-10 | 2003-02-28 | Citizen Watch Co Ltd | 半導体装置とその実装方法 |
JP2003124259A (ja) | 2001-10-15 | 2003-04-25 | Seiko Epson Corp | 電子部品の実装構造、電子部品モジュール、および電子部品の実装方法 |
-
2003
- 2003-03-26 JP JP2003085874A patent/JP3891133B2/ja not_active Expired - Lifetime
-
2004
- 2004-03-16 TW TW093106970A patent/TWI272642B/zh active
- 2004-03-24 CN CNB200410008863XA patent/CN1307704C/zh not_active Expired - Lifetime
- 2004-03-25 KR KR1020040020326A patent/KR100588925B1/ko active IP Right Grant
- 2004-03-26 US US10/809,515 patent/US7060602B2/en active Active
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101188219B (zh) * | 2006-11-22 | 2012-01-25 | 三星电子株式会社 | 液晶显示装置的驱动电路及制造方法和具有其的显示装置 |
US8576368B2 (en) | 2006-11-22 | 2013-11-05 | Samsung Display Co., Ltd. | Driving circuit for a liquid crystal display device, method of manufacturing the same and display device having the same |
CN108476591A (zh) * | 2015-06-16 | 2018-08-31 | 迪睿合株式会社 | 连接体、连接体的制造方法、检测方法 |
CN108476591B (zh) * | 2015-06-16 | 2021-01-01 | 迪睿合株式会社 | 连接体、连接体的制造方法、检测方法 |
CN106842647A (zh) * | 2017-03-20 | 2017-06-13 | 武汉华星光电技术有限公司 | 一种显示装置、绑定结构及其制备方法 |
CN107830876A (zh) * | 2017-10-16 | 2018-03-23 | 厦门乃尔电子有限公司 | 一种压电传感器组件的制备方法 |
CN107784952A (zh) * | 2017-11-17 | 2018-03-09 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1307704C (zh) | 2007-03-28 |
TWI272642B (en) | 2007-02-01 |
US20040224441A1 (en) | 2004-11-11 |
JP3891133B2 (ja) | 2007-03-14 |
KR20040084820A (ko) | 2004-10-06 |
TW200507011A (en) | 2005-02-16 |
US7060602B2 (en) | 2006-06-13 |
JP2004296692A (ja) | 2004-10-21 |
KR100588925B1 (ko) | 2006-06-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1532905A (zh) | 电子部件的制造方法、电子部件、电子部件的安装方法和电子装置 | |
CN1306333C (zh) | 显示基板及具有该基板的液晶显示器 | |
CN1197145C (zh) | 凸块形成方法、半导体装置及其制造方法和半导体芯片 | |
CN1870860A (zh) | 电子基板的制造方法、半导体装置及电子机器的制造方法 | |
CN1820361A (zh) | 端子间的连接方法及半导体装置的安装方法 | |
CN1642394A (zh) | 电子装置及其制造方法 | |
CN1275246A (zh) | 半导体装置及其制造方法、电路基板和电子装置 | |
CN1605903A (zh) | 各向异性导电材料体、显示设备、用于制造该显示设备的方法以及导电构件 | |
CN1434980A (zh) | 微粒子配置薄膜、导电连接薄膜、导电连接构造体以及微粒子的配置方法 | |
CN101076449A (zh) | 液体排出记录头及喷墨记录装置 | |
CN1166880A (zh) | 液晶屏的制造方法 | |
CN1577736A (zh) | 内部装有半导体的模块及其制造方法 | |
CN1165591C (zh) | 导电粘接剂、安装结构体、液晶装置、电子设备及其制造方法 | |
CN1819116A (zh) | 半导体装置及其制法、电路基板、电光学装置和电子仪器 | |
CN1805657A (zh) | 配线电路基板 | |
CN1943024A (zh) | 布线基板及半导体装置 | |
CN1217828A (zh) | 连接结构体、液晶装置、电子装置和各向异性导电性粘接剂及其制造方法 | |
CN1670578A (zh) | 电光学装置用面板及其制造方法、电光学装置及电子设备 | |
CN1706641A (zh) | 电路元件及电子元件的制造方法、电路基板、电子仪器 | |
CN1638073A (zh) | 形成倒装芯片的凸块焊盘的方法及其结构 | |
CN1574261A (zh) | 电子部件的安装方法、电子部件的安装结构、电子部件模块和电子设备 | |
CN1735300A (zh) | 显示装置用的混合溶液及使用其的显示装置的制造方法 | |
CN1294652C (zh) | 半导体器件及其制造方法 | |
CN1817645A (zh) | 液滴喷射装置、形成薄薄膜的方法及用于显示装置的衬底 | |
CN1607425A (zh) | 热压接装置和热压接方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160602 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Address before: Hongkong, China Patentee before: BOE Technology (Hongkong) Co.,Ltd. Effective date of registration: 20160602 Address after: Hongkong, China Patentee after: BOE Technology (Hongkong) Co.,Ltd. Address before: Tokyo, Japan Patentee before: Seiko Epson Corp. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20070328 |