CN101188219B - 液晶显示装置的驱动电路及制造方法和具有其的显示装置 - Google Patents
液晶显示装置的驱动电路及制造方法和具有其的显示装置 Download PDFInfo
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- CN101188219B CN101188219B CN2007103051965A CN200710305196A CN101188219B CN 101188219 B CN101188219 B CN 101188219B CN 2007103051965 A CN2007103051965 A CN 2007103051965A CN 200710305196 A CN200710305196 A CN 200710305196A CN 101188219 B CN101188219 B CN 101188219B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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Abstract
一种用于液晶显示的驱动电路,该驱动电路是这样一种集成电路,即其具有配置在集成电路表面上的电极垫、形成在电极垫上的凸块、形成在凸块上的导电粘合层、以及沉积在导电粘合层上具有外部导电层和弹性聚合物内部部分的导电颗粒。该驱动电路安装在TFT阵列基板上并且键合到设置在基板上的垫。导电颗粒减少了否则将由于多个凸块中凸块之间的高度差别而产生的电连接阻抗,并且防止了电开路缺陷和电短路缺陷。
Description
技术领域
本发明涉及一种液晶显示(LCD)装置的驱动电路。更特别地,本发明涉及LCD装置的驱动电路、制造该驱动电路的方法和具有该驱动电路的显示装置。
背景技术
液晶显示(LCD)装置具有例如厚度薄、质量轻、功耗低的优点,并具有良好的分辨率、色彩再现性、和显示质量。因此,作为一种平板显示装置,LCD装置被广泛地应用和深入地研究。
LCD装置典型包括LCD面板,其具有薄膜晶体管(TFT)阵列基板、滤色器基板、位于TFT阵列基板和滤色器基板之间的液晶层,背光组件安置在LCD面板下面以用作光源,以及驱动电路部分安置在LCD面板周围部分用于驱动LCD面板。LCD面板包括两个玻璃基板(如前所述的TFT阵列基板和滤色器基板),多个像素设置在两个玻璃基板之间并且以矩阵形状布置在薄膜晶体管(TFT)阵列基板上,以及对于每一像素,用来控制信号的例如TFT的开关元件被提供给像素。
驱动电路部分包括印制电路板(PCB),其上安装了用于产生例如控制信号、时钟信号以及数据信号等各种信号的部分。驱动电路为LCD驱动器集成电路(IC)(LDI),其连接到LCD面板和PCB,以向形成于LCD面板上的布线施加信号。该LCD驱动器集成电路包括一组键合垫,每个键合垫包括金属凸块(bump)。将要安装驱动器集成电路的表面提供有一组匹配垫。通过将该组键合垫键合到该组匹配垫,将驱动器集成电路安装到所述表面上。
LDI安装方法的实例包括玻璃上芯片(COG)、带式载体封装(TCP)和薄膜上芯片(COF)。LDI安装方法需要微细垫间距键合、简单的键合工艺和高的可靠性,特别是随着由例如像素数量增加和高分辨率导致的LDI芯片复杂程度越来越高。因此,形成凸块的方法和微细垫间距键合的方法成为关键技术。
当使用各向异性导电膜(ACF)将传统驱动电路安装在LCD面板上时,驱动电路和LCD面板通过传统ACF相互电连接。该ACF包括分布在非导电膜中的导电微粒。在通过传统ACF的连接中,ACF被粘接到玻璃TFT阵列基板上,并且驱动器IC结合到ACF。然后,在最后的键合过程中,多个导电微粒在ACF中流动,并且其中一些导电微粒在凸块和TFT阵列基板上的垫之间被捕获,从而将驱动电路电连接到垫和电连接到TFT阵列基板上的布线。然而,通过如上所述的方式,仅仅有大约10-30%的原始数量的导电微粒被捕获,并且因而大量导电微粒被浪费。另外,由于凸块的面积被制作得较小,在凸块和垫之间捕获的导电微粒数量变得更小,并且从而增大了凸块和垫之间电连接的电阻。
随着LCD装置变得更小、更轻和更薄,COG芯片的间距也变得更窄,而外引线键合(OLB)或玻璃上薄膜(FOG)键合的间距也变得更窄。
当COG芯片的凸块间的间距小于或等于约15μm时,导电微粒的凝聚可以从一个凸块扩展到相邻凸块,从而形成凸块之间的电连接,而引起短路缺陷。如上所提到的,随着凸块面积减小,在凸块和垫之间捕获的导电微粒数量减少。事实上,所捕获的导电微粒的数量可能为零,导电微粒的缺乏引起COG键合之后的开路缺陷。
如上所述的缺陷可能在LCD的制造中被发现,或在使用一段时间后被LCD装置的使用者发现。因而,产量和可靠性可能会下降。
发明内容
本发明提供一种液晶显示(LCD)装置的驱动电路,能够通过键合垫容易地电连接到LCD装置,其中导电微粒安置于凸块上。
本发明进一步提供了一种制造该驱动电路的方法。
本发明还进一步提供了一种具有该驱动电路的LCD装置。
在本发明的一方面,驱动电路包括形成于集成电路(IC)垫电极上的凸块上的树脂层、以及沉积并耦合到树脂层上的导电微粒。该树脂层是电传导的,且导电微粒粘接到树脂层。
所述导电微粒可以具有例如球型、六面体型、四面体型等或任何合适的外形。该导电微粒包括含电传导材料的外层部分和含例如弹性聚合体的弹性材料的内部部分。该弹性材料在键合期间可以被压缩,以防止因为多个凸块中个体凸块间的高度差别引起的电连接缺陷。
在第一示范性实施例中,LCD装置的驱动电路包括集成电路IC、电极垫、凸块和导电微粒。该IC产生信号。该电极垫形成于IC上以从外部传递信号。该凸块形成于电极垫上来接收信号。该导电微粒安置于凸块上,从而电连接凸块到外部电子装置。
该驱动电路可以进一步包括位于凸块和导电微粒之间的树脂层。该树脂层是电传导的。
该导电微粒可以包括含有电传导材料的外层和含有弹性聚合体材料的内层。
所述电传导材料可以包括金属金(Au)和镍(Ni)中的至少一种。
在本发明的另一个具体实施例中,如下提供了一种制造LCD装置的驱动电路的方法。电极垫形成在晶片的集成电路芯片部分上。第一钝化层形成在芯片上。开口设置在钝化层中以暴露部分垫。第二钝化层形成在第一钝化层上。第二钝化层中的开口设置为再次暴露部分垫。金属层形成在第二钝化层和所暴露的部分垫上。形成相应于垫具有开口的光刻胶图案。该开口填充有金属从而形成凸块。具有电传导性的树脂层形成于凸块和光刻胶图案上。导电微粒喷洒到该树脂层上。所述光刻胶图案被移除从而仅仅在凸块上保留导电微粒。
导电微粒可以通过使用墨水喷射器或精细的喷管来喷射到树脂层上。
每个传导微粒可以包括含有电传导材料的外层和含有弹性聚合体材料的内部部分。
在另一个示范性实施例中,LCD装置包括驱动电路、薄膜晶体管(TFT)阵列基板、滤色器基板和液晶层。所述驱动电路包括IC、电极垫、凸块和导电微粒。所述IC产生信号。电极垫形成于IC上以从外面传递信号。凸块形成在电极垫上以接收信号。导电微粒安置于凸块上。所述TFT阵列基板包括垫,该垫通过驱动电路的导电微粒电连接到驱动电路的凸块。所述滤色器基板面对所述TFT阵列基板。所述液晶层安置在TFT阵列基板和滤色器基板之间。
所述驱动电路可以包括多个互相电绝缘的凸块。
所述LCD装置可以进一步包括非导电粘合剂,配置成将驱动电路的凸块粘接到TFT阵列基板。
非导电粘合剂可以包括非导电薄膜、非导电浆料、紫外线粘合剂和环氧族粘合剂中的一个。
所述导电微粒可以包括含有电传导材料的外层和含有弹性聚合体材料的内部部分。
所述电传导材料可以包括从由金和镍组成的组中所选择的至少一种金属。
附图说明
基于以下参考附图对其示范性实施例的详细描述,本发明的上述以及其它特征和优点将变得更加清楚明了,其中:
图1是阐述了根据本发明一个示范性实施例的液晶显示(LCD)面板的分解透视图;
图2是阐述了LCD装置的传统驱动电路的横截面图;
图3是阐述了当传统驱动电路安装到LCD面板上时在凸块处产生的电开路缺陷的显微照片;
图4是阐述了当传统驱动电路安装到LCD面板上时在凸块处产生的电短路缺陷的显微照片;
图5到10是阐述了根据本发明一个示范性实施例的一种制造驱动电路的方法的横截面图。图10也示出了根据本发明一个示范性实施例的一种驱动电路的横截面;
图11A和11B是阐述了根据本发明一个示范性实施例的应用于驱动电路中的导电微粒的横截面图;
图12是阐述了通过采用各向异性导电膜(ACF)将传统驱动电路安装到LCD装置上的方法的横截面图;
图13是阐述了采用ACF的LCD装置上的传统驱动电路的结构的横截面图;
图14是阐述了采用非导电膜(NCF)在LCD装置上根据本发明一个示范性实施例安装驱动电路的方法的横截面图;
图15是阐述了采用非导电浆料(NCP)在LCD装置上根据本发明的一个示范性实施例安装驱动电路的方法的横截面图;以及
图16是阐述了根据本发明一个实施例的驱动电路贴装到LCD装置的结构的横截面图。
具体实施方式
下文将参照在其中示出本发明实施例的附图对本发明进行更加详细的描述。然而,本发明可以以多种不同的形式实现,而不应认为被这里所阐述的实施例所限制。或者,这些实施例被提供以使得公开彻底和完全,并对于本领域技术人员来说全部传达了发明的范围。在附图中,为了清楚层和区域的尺寸和相对大小会被放大。
应当理解,当元件或层被描述为在另一个元件或层“上”、“连接到”或“ 耦合到”另一个元件或层时,它们可以直接在其它元件或层上、或直接连接或耦合到其它元件或层,或者可以存在中间的元件或层。相反,当元件被称为“直接”在其他元件“上”、“直接连接到”和/或“直接耦合到”另一元件或层时,则没有中间元件或层存在。类似附图标记始终指代类似的元件。如这里所使用的,术语“和/或”包括一种或更多关联列出项的任意和所有组合。
应当理解,尽管术语第一、第二、第三等在此可被用来描述不同的元件、部件、区域、层和/或部分,但是这些元件、部件、区域、层和/或部分不应被这些术语限制。这些术语仅仅用来将一个元件、部件、区域、层或部分区分于另一个区域、层或部分。因此,下文论述的第一元件、部件、区域、层或部分可以在不背离本发明教导的情况下被称为第二元件、部件、区域、层或部分。
为便于描述,在这里可使用空间相对术语,例如“下面”、“下方”、“下”、“上方”、“上”等等,以说明附图中记载的一个元件或特征与另一个元件或特征的相对位置关系。应当理解,空间相对术语旨在包含除了在图中所绘的方向之外的装置在使用或操作中的不同方向。例如,当附图中的装置被翻转时,元件被描述成在其它元件或特征“下方”或“下面”则被定向为位于其它元件或特征“上方”。因此,示范术语“下方”可以包括“下方”和“上方”两个定向。所述装置也可以不同地定向(旋转90度或者其它定向)并且文中空间相对描述符被相应地解释。
这里所采用的术语描述是仅为了对特定的具体实施例进行说明,而不对本发明进行任何的限制。如这里所述的,单数形式“一”、“某”和“该”试图包括复数形式,除非上下文清楚地作了其它指示。应当进一步地理解,术语“包含”和/或“包括”当用在该说明书中时指出了所描述的特征、整体、步骤、操作、元件和/或组分的存在,但是不排除其它一种或多种特征、整体、步骤、操作、元件、组分和/或其组群的存在。
这里参考剖面视图对本发明实施例进行说明,该剖面视图是发明的理想化实施例(和中间结构)的示意性视图。就其本身而言,由于例如制造技术和/或公差等导致的所阐述形状的变化是可以预见的。因此,本发明实施例不应该认为限制于这里具体说明的区域的特定形状,而应包括由于例如制造等所导致的形状的偏离。比如,描述为矩形的注入区域一般具有圆形或曲线的特征和/或位于其边缘的注入浓度的梯度,而非简单的从注入区域到非注入区域的二元变化。同样,通过注入形成的掩埋区域会导致在掩埋区域和发生注入的表面之间的区域中的一些注入。因此,附图中所说明的区域实际上起到示意性的作用,而它们的形状并不是用来说明装置的区域的实际形状,也不是用来限制本发明的范围。
除非有其它定义,这里所使用的所有术语(包括技术的和科学的术语)对于本申请所属领域的技术人员来说,都可以用其常用的概念来理解。可以进一步的理解,比如在通常使用的字典中定义的术语应该被解释为与在相关技术的语境中的概念一致的概念,而不能理解为理想化或过度正式的含义,除非在这里被这样的定义。
下文中,本发明将参照附图进行具体详细的说明。
图1是阐述根据本发明的一个示范性实施例的液晶显示(LCD)面板的分解透视图。
如图1所示,LCD装置包括滤色器基板7,薄膜晶体管(TFT)阵列基板1和插置在滤色器基板7和TFT阵列基板1之间的液晶层5。
所述滤色器基板7包括具有红、绿和蓝滤色器9的滤色器层,用来分割滤色器并阻止光线穿过液晶层5的黑色矩阵8,以及向液晶层5施加电压的透明公共电极6。
栅线和数据线水平和垂直地形成在TFT阵列基板1上。像素区域定义在TFT阵列基板1上栅线和数据线的交叉点之间。每个像素区域中都形成有TFT开关元件。所述TFT开关元件位于栅线2和数据线3的交叉点附近。每个像素区域中还形成有像素电极。每个TFT开关元件控制将数据电压提供给其关联的像素电极。
每个像素区域对应于滤色器基板7的滤色器9之一。全彩色图像可以通过组合红、绿和蓝色得到。在滤色器基板上,滤色器9以包括红、绿和蓝的三色为一组的方式布置以产生全彩色图像。
图2是用来说明用在LCD装置中的传统驱动电路的横截面图。
电极23形成于驱动电路21上。凸块25形成在每个电极23上。凸块被直接电连接到设置在LCD装置中TFT阵列基板上的垫。
图3是用来说明当传统驱动电路安装到LCD装置上时在凸块处产生的电开路缺陷的显微照片。
图4是用显微照片来说明当传统驱动电路安装到LCD装置上时在两个凸块之间产生的电短路缺陷的横截面图。
参考图3和4,两种类型缺陷显而易见。当COG芯片上的凸块25之间的间隙小于等于约15μm时,导电微粒35的凝聚可在相邻凸块25之间形成电连接,从而导致电短路缺陷(如图4所示)。如图3所示,导电颗粒35存在于所有凸块25上而从凸块25a缺失。凸块25面积的减小将会导致导电微粒35的缺乏和在COG键合后产生的电开路缺陷。
下文中,将参考图5至10描述用于具有安置到凸块上的导电微粒的LCD装置的驱动电路的制造方法。
图5-10是解释说明根据本发明一个示范性实施例的驱动电路的制造方法的横截面图。为了方便描述,图5-10示出了作为包含很多该种驱动电路的晶片(未示出)的一部分的驱动电路的横截面图,该晶片并在后来被分割成如图5-10所示的个体驱动电路。
如图5所示,芯片41包含需要用于提供驱动电路功能的电路(未示出)。下文中,芯片41可能被描述成集成电路41。电极垫43形成于芯片41上。这些电极垫43提供电连接到芯片41,其中一些电极垫用于接收信号,其它电极垫用于输出信号,并且其它的提供电源和地连接。钝化层45形成于芯片41上和电极垫43上。开口提供在钝化层45中,使得每个电极垫43的一部分暴露。例如聚酰亚胺层47等电绝缘材料层形成在钝化层45上。开口设置在聚酰亚胺层47中,使得每个电极垫43的开口部分再次暴露。下文中,层47可能被称为第二绝缘层47。
如图6所示,凸块底部金属化(under bump metallurgy,UBM)层49形成于具有钝化层45和聚酰亚胺层47的芯片41上。该凸块底部金属化层49是可选择的。然后,光刻胶图案51在UBM层49上形成。该光刻胶图案51具有与电极垫43对应的开口A。光刻胶图案51可以通过使用正性光刻胶材料得到。可替代地,该光刻胶图案51可以通过使用负性光刻胶材料得到。
如图7所示,执行电镀操作,从而光刻胶图案51中的开口被金属填充以形成凸块53。适合于形成凸块53的金属的实例包括金(Au)和镍(Ni)并且可以包括其它合适的金属。这些金属可以单独使用或以其组合使用。
如图8所示,在凸块53形成之后,不是立刻剥去光刻胶图案51,而是将粘合材料涂于光刻胶图案51上和凸块53上以形成粘合层60。该粘合材料可以包含树脂材料,并且该粘合层60在下文中可能被称为树脂层60。该粘合材料包含导电材料,从而使沉积在凸块53上的导电微粒30很好的电接触电极垫43。粘合层60中所采用的导电材料的实例可以包括银浆料。
如图9所示,导电微粒30被均匀地喷洒到粘合层60上。每个导电微粒30包括含有至少一个金属层的外层部分和包括如弹性聚合体的弹性材料的内部部分。该外层部分可以包括单金属层,或者可以包括具有不同组分的第一金属层和第二金属层。形成外层部分的金属的实例可以包括金(Au)、镍(Ni)或铜(Cu)。这些金属可以单独使用或以其组合使用。
墨水喷射器或精细的喷嘴或其它适合的装置可以被用来将导电微粒30均匀地施加到粘合层60上,从而增加导电微粒30分布的均匀性。
当导电微粒30被黏附到粘合层60以后,光刻胶图案51将被去掉,和所述UBM层49(如果存在)也被蚀刻从而使得UBM层49仅仅存在于凸块53之下。
如图10所示,经过上述的各个步骤,具有附于凸块53的导电微粒30的LCD装置的驱动电路终于被形成。驱动电路40包括集成电路41、在集成电路41上形成的电极垫43、电极垫43上形成的凸块53、形成于凸块53上的导电粘合层60以及沉积于粘合层60上的导电微粒30。
附图11A和11B是用来解释说明依照本发明的一个示范性实施例中的驱动电路中所使用的导电微粒的横截面图。附图11A和11B说明了导电微粒30的形状和结构。
如图11A和11B所示,导电微粒30均匀地将凸块53和LCD面板相互电连接以减少电连接电阻。在图11A中,导电微粒30a包括含有层31的外层部分,该层31包括如金属的电传导材料。该导电微粒30a也包括含有如弹性聚合体的弹性材料的内部部分34a。在图11B中,导电微粒30b包括外层部分和内部部分34b,该外层部分包括具有不同组成成分的第一金属层31和第二金属层32,该内部部分包括如弹性聚合体的弹性材料。形成外层部分的金属的实例可以包括金(Au)、镍(Ni)和铜(Cu)。这些金属可以单独使用或组合使用。可替代地,其它具有良好电传导性的金属材料可以应用于在这些金属层中。
图12是用来说明通过采用各向异性导电膜(ACF)将传统驱动电路安装到LCD装置上的方法的横截面图。图13是采用ACF的LCD装置上传统驱动电路的结构的横截面图。
如图12和13所示,驱动电路70和LCD面板通过ACF 90彼此电连接。在通过ACF 90的连接中,该ACF90粘结到可以是玻璃基板的TFT阵列基板81上,而驱动电路70与该ACF 90结合。然后,在最后的键合过程中,多个导电微粒35流动于ACF 90中,和其中一些颗粒在凸块75和TFT阵列基板81上的垫83之间被捕获,这样就将驱动电路70电连接到了TFT阵列基板81上的垫83上。然而,仅仅约10%到30%的导电微粒被用来建立这种电连接,由此,大量的导电微粒35被浪费了。另外,随着凸块75的面积的减小,凸块75上所能捕获的导电微粒的数量也会减小,且这导致了电连接的电阻的增大。此外,如参照附图3和4进行的描述,开路和短路故障可以在这种常规布置中出现。
图14是说明采用非导电膜(NCF)在LCD装置上依照本发明示范性实施例安装驱动电路的方法的横截面图。图15是说明采用非导电浆料(NCP)在LCD装置上依照本发明示范性实施例安装驱动电路的方法的横截面图。图16是说明在LCD装置上依照本发明的示范性实施例的驱动电路的结构的横截面图。
如图14和15所示,具有形成于凸块53上的导电微粒30的驱动电路40被安装到LCD面板的TFT阵列基板81上。
该TFT阵列基板81是被清洗过的,从而异物可以不存在于TFT阵列基板81上。然后,NCF 70或者NCP 75被结合到形成于TFT阵列基板81上的垫83上。该NCF 70和NCP 75是粘性且非导电的。该非导电粘合剂可以包括非导电膜、非导电浆料、紫外线固化粘合剂或环氧族粘合剂。然后,驱动电路上的凸块53被结合到其上已结合有NCF 70或NCP 75的垫83上。如图16所示,当实行最后键合时,响应于最后键合期间施加的压力,导电微粒30将凸块53和垫83互相电连接。
尽管凸块53之间的距离是不规则的,但是内部弹性部分34a和34b可以补偿这种不规则性,从而保持稳定的电连接。
根据本发明,导电微粒被安置于用于LCD装置的驱动电路的凸块上,从而改进LCD面板和驱动电路之间的电接触。该导电微粒包括含有弹性材料的内部部分,尽管凸块之间的距离是不规则的,该包括弹性聚合体内部部分的导电微粒可以补偿凸块之间的不规则性。这样,当驱动电路被安装到LCD面板上之后,可得到稳定的电连接,从而减少电连接的电阻并防止可靠性方面的缺陷。另外,导电微粒没有安置于凸块之间,于是排除了凸块之间产生电短路可能。同样,即使凸块和LCD面板的垫间的间距不同时,通过导电微粒的压缩经由导电微粒可以将凸块电连接到LCD面板的垫,并由此防止了电开路缺陷。进一步地,凸块可以具有窄间距,从而可减小芯片的尺寸以增加每块晶片的净芯片数量,由此降低制造成本。这样,该驱动电路就可以应用于具有窄间距的LCD显示IC(LDI)。
尽管已经描述了本发明的示范性实施例,但可以理解,本发明不应被限制为这几个示范性实施例,而在如权利要求所述的本发明的精神和范围内的情况下,本领域技术人员可以做出各种不同的修正和改变。
Claims (12)
1.一种用于液晶显示装置的驱动电路,包括:
集成电路,产生信号;
电极垫,形成在所述集成电路上,以外传递所述信号;
凸块,形成在所述电极垫上以接收所述信号;
导电微粒,形成在所述凸块上以将所述凸块电连接到外部电子装置;以及
安置在该凸块和该导电微粒之间的树脂层,所述树脂层是导电的。
2.如权利要求1所述的驱动电路,其中,所述导电微粒包括含有导电材料的外层和包括弹性聚合物材料的内部部分。
3.如权利要求2所述的驱动电路,其中,该导电材料包括从由金和镍组成的组中选择的至少一种金属。
4.一种制造用于液晶显示装置的驱动电路的方法,包括:
在具有电极垫的晶片的芯片上形成第一钝化层;
在所述第一钝化层中设置开口以暴露部分的电极垫;
在具有该第一钝化层的所述芯片上形成第二钝化层;
在所述第二钝化层中设置开口以再次暴露所述部分的电极垫;
在该第二钝化层上形成金属层;
形成具有相应于该垫的开口的光刻胶图案;
用金属填充所述光刻胶图案中的所述开口以形成凸块;
在所述凸块和该光刻胶图案上形成具有电传导性的树脂层;
将导电微粒喷洒到所述树脂层上;以及
去除该光刻胶图案,使得所述导电微粒仅保留在该凸块上。
5.如权利要求4所述的方法,其中,该导电微粒使用墨水喷射器或精细喷嘴喷洒到该树脂层上。
6.如权利要求5所述的方法,其中,每个导电微粒包括含有导电材料的外层和包括弹性聚合物材料的内部部分。
7.一种液晶显示装置,包括:
驱动电路,包括:
集成电路,产生信号;
电极垫,形成在所述集成电路上,以外传递所述信号;
凸块,形成在所述电极垫上以接收所述信号;
导电微粒,形成在所述凸块上;以及
安置在该凸块和该导电微粒之间的树脂层,所述树脂层是导电的;
薄膜晶体管阵列基板,包括通过所述驱动电路的所述导电微粒电连接到该驱动电路的该凸块的垫;
滤色器基板,面对所述薄膜晶体管阵列基板;以及
液晶层,安置在该薄膜晶体管阵列基板和所述滤色器基板之间。
8.如权利要求7所述的液晶显示装置,其中,该驱动电路包括多个相互电绝缘的凸块。
9.如权利要求7所述的液晶显示装置,进一步包括配置成将该驱动电路的该凸块粘合到该薄膜晶体管阵列基板的非导电粘合体。
10.如权利要求9所述的液晶显示装置,其中,所述非导电粘合体包括从由非导电膜、非导电浆料、紫外线粘合剂和环氧族粘合剂组成的组中选择出的至少一个。
11.如权利要求7所述的液晶显示装置,其中,该导电微粒包括含有导电材料的外层和包括弹性聚合物材料的内部部分。
12.如权利要求11所述的液晶显示装置,其中,所述导电材料包括从由金和镍组成的组中选择出的至少一种金属。
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US20080180376A1 (en) | 2008-07-31 |
TW200834155A (en) | 2008-08-16 |
KR20080046371A (ko) | 2008-05-27 |
JP2008129595A (ja) | 2008-06-05 |
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