CN109628002A - 异方性导电胶带及其制作方法 - Google Patents

异方性导电胶带及其制作方法 Download PDF

Info

Publication number
CN109628002A
CN109628002A CN201811393834.8A CN201811393834A CN109628002A CN 109628002 A CN109628002 A CN 109628002A CN 201811393834 A CN201811393834 A CN 201811393834A CN 109628002 A CN109628002 A CN 109628002A
Authority
CN
China
Prior art keywords
fibre
electrical insulating
anisotropic conductive
conductive adhesive
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811393834.8A
Other languages
English (en)
Other versions
CN109628002B (zh
Inventor
杨汉宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201811393834.8A priority Critical patent/CN109628002B/zh
Priority to US16/619,091 priority patent/US11041098B2/en
Priority to PCT/CN2019/079430 priority patent/WO2020103364A1/zh
Publication of CN109628002A publication Critical patent/CN109628002A/zh
Application granted granted Critical
Publication of CN109628002B publication Critical patent/CN109628002B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92—Specific sequence of method steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13012—Shape in top view
    • H01L2224/13013—Shape in top view being rectangular or square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141—Disposition
    • H01L2224/1412—Layout
    • H01L2224/1413—Square or rectangular array
    • H01L2224/14131—Square or rectangular array being uniform, i.e. having a uniform pitch across the array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/271—Manufacture and pre-treatment of the layer connector preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29075—Plural core members
    • H01L2224/2908—Plural core members being stacked
    • H01L2224/29083—Three-layer arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29186—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/2939—Base material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/819—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
    • H01L2224/81901—Pressing the bump connector against the bonding areas by means of another connector
    • H01L2224/81903—Pressing the bump connector against the bonding areas by means of another connector by means of a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9211—Parallel connecting processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Abstract

本发明提供一种异方性导电胶带及其制作方法。本发明的异方性导电胶带包括树脂基带及多条在树脂基带内横向设置的复合纤维，每条所述复合纤维包括电绝缘纤维及多个环套在该电绝缘纤维上的导电环，所述导电环包括通过吸附而共同环绕在电绝缘纤维上的多个导电粒子，其中，所述多条复合纤维在树脂基带内沿树脂基带延长方向周期排列，且每条复合纤维上所述多个导电环沿其电绝缘纤维轴向方向周期排列，由于导电环被固定在电绝缘纤维表面，导电环与电绝缘纤维在进行绑定时均不易被挤出电极凸起区域，即使在电极凸起的面积减小时，电极凸起仍可与导电环进行良好的接触，从而可在显示面板上实现更多驱动线路的设计，进而可有效提高显示面板的分辨率。

Description

异方性导电胶带及其制作方法
技术领域
本发明涉及显示技术领域，尤其涉及一种异方性导电胶带及其制作方法。
背景技术
现有市场上的平面显示装置包括液晶显示装置(Liquid Crystal Display，LCD)和有源矩阵有机发光二极体(Active-matrix organic light emitting diode，AMOLED)显示装置。其中AMOLED具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统液晶显示器，被广泛应用在手机屏幕、电脑显示器、全彩电视等。
现有的平板显示器一般包括显示面板(Panel)和外接电路，显示面板在正常显示时，需要使用外接电路，如柔性电路板(Free Pascal Compiler，FPC)、或者覆晶薄膜(ChipOn Film，COF)，通过引线连接到面板的外引脚贴合(Outer Lead Bonding，OLB)区域，实现对显示面板中的各信号线传递驱动信号。而外接电路与显示面板的OLB区域的电连接是通过绑定(Bonding)工艺完成的，Bonding工艺主要是在压合设备上将外接电路经过预压、本压连接到显示面板上，将外接电路上的外接电极和显示面板上的电极线压合到一起，中间通过异方性导电胶(Anisotropic Conductive Film，ACF)实现导通。
目前较常见的异方性导电胶带产品主要包括热固性树脂、导电粒子、固化剂、增塑剂等成分，制造异方性导电胶带时先要将上述成分溶解于挥发性溶剂中配制成异方性导电胶，再将异方性导电胶涂布于塑料薄膜上，经过热风干燥去掉溶剂而形成异方性导电胶带。如图1所示，ACF500主要包括胶体层510及混合于胶体层510中的导电粒子520，其中，导电粒子520赋予ACF500以导电性能，胶体层510赋予ACF500以粘接性能和绝缘性能。
在显示面板的绑定(bonding)制程中，显示基板与外接电路分别具有数个相互对应的作为电极的微小凸起(bump)，在显示基板与外接电路之间置入ACF，然后通过压合设备对ACF进行热压，使得所述ACF发生反应，具体地，通过加热改变ACF的粘滞度，并通过加压使ACF中的导电粒子在基板与外接电路之间被挤压，被挤压的导电粒子在显示基板与外接电路之间构成电连接。
随着人们对显示技术要求的提高，具有更高分辨率的显示器件成为显示领域的热门。为实现更高分辨率的显示，要求显示器件具有更多的显示单元，进而驱动电路的线路数量也相应增多。在绑定制程中，每个bump俘获一定数量以上的导电粒子才能实现导通。低密度的导电粒子限制了每个bump内分布的导电粒子数量，且如图1所示，现有ACF内的导电粒子为随机分布，故为每个bump均俘获一定数量的导电粒子，bump的面积就必须相应增大，从而影响更多驱动线路设计的实现。
发明内容
本发明的目的在于提供一种异方性导电胶带，能够对面积较小的电极凸起实现良好的绑定效果，从而可在显示面板上实现更多驱动线路的设计。
本发明的目的还在于提供一种异方性导电胶带的制作方法，所得的异方性导电胶带能够对面积较小的电极凸起实现良好的绑定效果，从而可在显示面板上实现更多驱动线路的设计。
为实现上述目的，本发明提供一种异方性导电胶带，包括树脂基带及沿所述树脂基带延长方向周期排列的多条在树脂基带内横向设置的复合纤维；
每条所述复合纤维包括电绝缘纤维及沿该电绝缘纤维轴向方向周期排列的多个环套在该电绝缘纤维上的导电环；
所述导电环包括通过吸附而共同环绕在电绝缘纤维上的多个导电粒子。
所述异方性导电胶带还包括设置在所述树脂基带上下表面的分离层；
所述分离层的厚度为2-3μm。
所述导电粒子的形状为球形、立方形或锥形；
所述导电粒子的等效粒径为5-100nm。
所述电绝缘纤维的长度为10-5000μm。
所述导电环的宽度为50-1000nm，每条所述复合纤维上相邻两导电环之间间隔的宽度为500-5000nm。
所述树脂基带内相邻两复合纤维之间间隔的宽度为1-10μm。
本发明还提供一种异方性导电胶带的制作方法，包括如下步骤：
步骤S1、制作多条复合纤维，将该多条复合纤维进行周期性排列；
每条所述复合纤维包括电绝缘纤维及沿该电绝缘纤维轴向方向周期排列的多个环套在该电绝缘纤维上的导电环；所述导电环包括通过吸附而共同环绕在电绝缘纤维上的多个导电粒子；
步骤S2、提供胶黏剂，用胶黏剂包裹所述多条复合纤维，得到树脂基带，所述多条复合纤维均在树脂基带内横向设置并沿所述树脂基带延长方向周期排列。
可选地，所述步骤S1中制作所述复合纤维的过程具体包括如下步骤：
步骤S11、提供电绝缘纤维及导电粒子，对所述电绝缘纤维进行表面修饰处理，使导电粒子通过静电作用吸附在所述电绝缘纤维的表面，形成包覆电绝缘纤维的导电层；
步骤S12、在所述导电层表面形成遮蔽图案层，去除电绝缘纤维表面未被所述遮蔽图案层覆盖的导电层，由剩余的导电层形成沿该电绝缘纤维轴向方向周期排列的多个环套在该电绝缘纤维上的导电环；
步骤S13、去除遮蔽图案层，得到复合纤维。
可选地，所述步骤S1中制作所述复合纤维的过程具体包括如下步骤：
步骤S11、提供电绝缘纤维，对所述电绝缘纤维进行表面修饰处理；在所述电绝缘纤维表面形成遮蔽图案层；
步骤S12、提供导电粒子，使导电粒子通过静电作用吸附在所述电绝缘纤维未被遮蔽图案层覆盖的表面，形成沿该电绝缘纤维轴向方向周期排列的多个环套在该电绝缘纤维上的导电环；
步骤S13、去除遮蔽图案层，得到复合纤维。
还包括步骤S3、在所述树脂基带上下表面形成分离层。
本发明的有益效果：本发明的异方性导电胶带，包括树脂基带及多条在树脂基带内横向设置的复合纤维，每条所述复合纤维包括电绝缘纤维及多个环套在该电绝缘纤维上的导电环，所述导电环包括通过吸附而共同环绕在电绝缘纤维上的多个导电粒子，其中，所述多条复合纤维在树脂基带内沿树脂基带延长方向周期排列，且每条复合纤维上所述多个导电环沿其电绝缘纤维轴向方向周期排列，由于导电环被固定在电绝缘纤维表面，导电环与电绝缘纤维在进行绑定时均不易被挤出电极凸起区域，即使在电极凸起的面积减小时，电极凸起仍可与导电环进行良好的接触，从而可在显示面板上实现更多驱动线路的设计，进而可有效提高显示面板的分辨率。本发明的异方性导电胶带的制作方法，所制得的异方性导电胶带能够对面积较小的电极凸起同样实现良好的绑定效果，从而可在显示面板上实现更多驱动线路的设计。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有一种异方性导电胶带的结构示意图；
图2为本发明异方性导电胶带中复合纤维的立体示意图及侧视示意图；
图3为本发明异方性导电胶带的结构示意图；
图4为本发明异方性导电胶在进行绑定前设置于显示基板与外接电路之间的示意图；
图5为本发明异方性导电胶在进行绑定后在显示基板与外接电路之间实现电连接的示意图；
图6为本发明异方性导电胶用于对横向排布的电极凸起进行绑定的俯视示意图；
图7为本发明异方性导电胶用于对纵向排布的电极凸起进行绑定的俯视示意图；
图8为本发明的异方性导电胶带的制作方法的流程示意图；
图9为本发明的异方性导电胶带的制作方法的第一实施例的步骤S1的示意图；
图10为本发明的异方性导电胶带的制作方法的第二实施例的步骤S1的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图3，本发明提供一种异方性导电胶带，包括树脂基带10及沿所述树脂基带10延长方向周期排列的多条在树脂基带10内横向设置的复合纤维20。
如图2所示，每条所述复合纤维20包括电绝缘纤维21及沿该电绝缘纤维21轴向方向周期排列的多个环套在该电绝缘纤维21上的导电环22。
所述导电环22包括通过吸附而共同环绕在电绝缘纤维上的多个导电粒子25。
需要说明的是，如图4-5所示，本发明的异方性导电胶带用于绑定显示基板1与外接电路2时，异方性导电胶上下两侧的电极凸起5均与导电环22接触，进而实现上下两侧的电极凸起5的导通。且由于复合纤维20在垂直于树脂基带10延长方向即在树脂基带10的宽度方向上足够长，在绑定过程中复合纤维20不易像传统ACF中的导电粒子那样移动，进而保证电极凸起5下方的复合纤维20不易被排出，并由于树脂基带10内复合纤维20之间相互分离，从而不会产生由于复合纤维20相互接触而导致的相邻电极凸起5发生短路。每个电极凸起5均与复合纤维30上的多个导电环22相互接触，故上下两侧的电极凸起5被很好地导通。并由于导电环22间相互分离，垂直于树脂基带10延长方向的电极凸起5不会发生因同时与导电环22接触而导致的短路。如图6-7所示的本发明异方性导电胶用于对不同排列方式的电极凸起进行绑定后的俯视示意图，横向或纵向排布的电极凸起5均可实现与多个导电环22相互接触。由于导电环22周期且致密地排布，当电极凸起5的尺寸减小时，每个电极凸起5仍可与导电环22接触，从而可在显示面板上实现更多驱动线路的设计，进而可有效提高显示面板的分辨率。
具体地，本发明的异方性导电胶带还包括设置在所述树脂基带10上下表面的分离层30；该分离层30可更好的防止绑定时不同的电极凸起5通过复合纤维20相互接触而发生短路，但该分离层30的厚度足够薄，该分离层30的厚度为2-3μm，从而使复合纤维20上的导电粒子25在绑定时能够刺破分离层30而进行电连接。
具体地，所述导电粒子25的形状可以为球形、立方形或锥形等其他形状。
具体地，所述导电粒子25属于纳米级粒子，其等效粒径为5-100nm。
具体地，所述电绝缘纤维21的长度为10-5000μm。
具体地，所述导电环22的宽度为50-1000nm，每条所述复合纤维20上相邻两导电环22之间间隔的宽度为500-5000nm。
具体地，所述树脂基带10内相邻两复合纤维20之间间隔的宽度为1-10μm。
具体地，所述电绝缘纤维21的表面经过修饰处理，例如使其表面带正电荷，从而能够使所述导电粒子25通过静电作用而吸附在电绝缘纤维21上。
本发明的异方性导电胶带，包括树脂基带10及多条在树脂基带10内横向设置的复合纤维20，每条所述复合纤维20包括电绝缘纤维21及多个环套在该电绝缘纤维21上的导电环22，所述导电环22包括通过吸附而共同环绕在电绝缘纤维上的多个导电粒子25，其中，多条复合纤维20在树脂基带10内沿树脂基带10延长方向周期排列，且每条复合纤维20上的多个导电环22沿其电绝缘21纤维轴向方向周期排列，从而对导电环22的分布进行有效控制，并由于导电环22被固定在电绝缘纤维21表面，而电绝缘纤维21长度足够长，导电环22与电绝缘纤维21在进行绑定时均不易被挤出电极凸起区域，即使在电极凸起的面积减小时，电极凸起仍可与导电环22进行良好的接触，从而可在显示面板上实现更多驱动线路的设计，进而可有效提高显示面板的分辨率。
如图8所示，基于上述的异方性导电胶带，本发明还提供一种异方性导电胶带的制作方法，本发明的异方性导电胶带的制作方法的第一实施例具体包括如下步骤：
步骤S1、制作多条复合纤维20，将该多条复合纤维20进行周期性排列。
其中，每条所述复合纤维20包括电绝缘纤维21及沿该电绝缘纤维21轴向方向周期排列的多个环套在该电绝缘纤维21上的导电环22；所述导电环22包括通过吸附而共同环绕在电绝缘纤维上的多个导电粒子25。
具体地，所述导电粒子25的形状可以为球形、立方形或锥形等其他形状。
具体地，所述导电粒子25属于纳米级粒子，其等效粒径为5-100nm。
具体地，所述电绝缘纤维21的长度为10-5000μm。
具体地，所述导电环22的宽度为50-1000nm，每条所述复合纤维20上相邻两导电环22之间间隔的宽度为500-5000nm。
如图9所示，本实施例的所述步骤S1中制作所述复合纤维20的过程具体包括如下步骤：
步骤S11、提供电绝缘纤维21及导电粒子25，对所述电绝缘纤维21进行表面修饰处理，例如使所述电绝缘纤维21的表面带正电荷，然后使导电粒子25通过静电作用吸附在所述电绝缘纤维21的表面，形成包覆电绝缘纤维21的导电层22’。
步骤S12、在所述导电层22’表面形成遮蔽图案层26，通过蚀刻方式去除电绝缘纤维21表面未被所述遮蔽图案层26覆盖的导电层22’，由剩余的导电层22’形成沿该电绝缘纤维21轴向方向周期排列的多个环套在该电绝缘纤维21上的导电环22。
具体地，所述遮蔽图案层26为光阻材料，可通过黄光制程制作形成。
具体地，所述导电环22随电绝缘纤维21的横截面形状而定，例如为圆环形。
步骤S13、去除遮蔽图案层26，得到复合纤维20。
步骤S2、提供胶黏剂，用胶黏剂包裹所述多条复合纤维20，得到树脂基带10，所述多条复合纤维20均在树脂基带10内横向设置并沿所述树脂基带10延长方向周期排列。
具体地，所述树脂基带10内相邻两复合纤维20之间间隔的宽度为1-10μm。
步骤S3、在所述树脂基带10上下表面形成分离层30。该分离层30可更好的防止绑定时不同的电极凸起5通过复合纤维20相互接触而发生短路，但该分离层30的厚度足够薄，该分离层30的厚度为2-3μm，从而使复合纤维20上的导电粒子25在绑定时能够刺破分离层30而进行电连接。
本发明的异方性导电胶带的制作方法的第二实施例，与上述第一实施例相比，其区别在于，第一实施例的步骤S1中先由导电粒子25形成导电层22’，然后对导电层22’进行图案化处理得到导电环22；而本实施例的步骤S1中在电绝缘纤维21表面先形成遮蔽图案层26，然后直接在电绝缘纤维21未被遮蔽图案层26覆盖的表面形成导电环22。
如图10所示，本实施例中，所述步骤S1中制作所述复合纤维20的过程具体包括如下步骤：
步骤S11、提供电绝缘纤维21，对所述电绝缘纤维21进行表面修饰处理；在所述电绝缘纤维21表面形成遮蔽图案层26。
步骤S12、提供导电粒子25，使导电粒子25通过静电作用吸附在所述电绝缘纤维21未被遮蔽图案层26覆盖的表面，形成沿该电绝缘纤维21轴向方向周期排列的多个环套在该电绝缘纤维21上的导电环22。
步骤S13、去除遮蔽图案层26，得到复合纤维20。
本实施例的其他技术特征均与上述第一实施例相同，在此不再赘述。
本发明的异方性导电胶带的制作方法，所制得的异方性导电胶带能够对面积较小的电极凸起同样实现良好的绑定效果，从而可在显示面板上实现更多驱动线路的设计，进而可有效提高显示面板的分辨率。
综上所述，本发明的异方性导电胶带，包括树脂基带及多条在树脂基带内横向设置的复合纤维，每条所述复合纤维包括电绝缘纤维及多个环套在该电绝缘纤维上的导电环，所述导电环包括通过吸附而共同环绕在电绝缘纤维上的多个导电粒子，其中，所述多条复合纤维在树脂基带内沿树脂基带延长方向周期排列，且每条复合纤维上所述多个导电环沿其电绝缘纤维轴向方向周期排列，由于导电环被固定在电绝缘纤维表面，导电环与电绝缘纤维在进行绑定时均不易被挤出电极凸起区域，即使在电极凸起的面积减小时，电极凸起仍可与导电环进行良好的接触，从而可在显示面板上实现更多驱动线路的设计，进而可有效提高显示面板的分辨率。本发明的异方性导电胶带的制作方法，所制得的异方性导电胶带能够对面积较小的电极凸起同样实现良好的绑定效果，从而可在显示面板上实现更多驱动线路的设计。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

1.一种异方性导电胶带，其特征在于，包括树脂基带(10)及沿所述树脂基带(10)延长方向周期排列的多条在树脂基带(10)内横向设置的复合纤维(20)；
每条所述复合纤维(20)包括电绝缘纤维(21)及沿该电绝缘纤维(21)轴向方向周期排列的多个环套在该电绝缘纤维(21)上的导电环(22)；
所述导电环(22)包括通过吸附而共同环绕在电绝缘纤维(21)上的多个导电粒子(25)。
2.如权利要求1所述的异方性导电胶带，其特征在于，还包括设置在所述树脂基带(10)上下表面的分离层(30)；
所述分离层(30)的厚度为2-3μm。
3.如权利要求1所述的异方性导电胶带，其特征在于，所述导电粒子(25)的形状为球形、立方形或锥形；
所述导电粒子(25)的等效粒径为5-100nm。
4.如权利要求1所述的异方性导电胶带，其特征在于，所述电绝缘纤维(21)的长度为10-5000μm。
5.如权利要求1所述的异方性导电胶带，其特征在于，所述导电环(22)的宽度为50-1000nm，每条所述复合纤维(20)上相邻两导电环(22)之间间隔的宽度为500-5000nm。
6.如权利要求1所述的异方性导电胶带，其特征在于，所述树脂基带(10)内相邻两复合纤维(20)之间间隔的宽度为1-10μm。
7.一种异方性导电胶带的制作方法，其特征在于，包括如下步骤：
步骤S1、制作多条复合纤维(20)，将该多条复合纤维(20)进行周期性排列；
每条所述复合纤维(20)包括电绝缘纤维(21)及沿该电绝缘纤维(21)轴向方向周期排列的多个环套在该电绝缘纤维(21)上的导电环(22)；所述导电环(22)包括通过吸附而共同环绕在电绝缘纤维(21)上的多个导电粒子(25)；
步骤S2、提供胶黏剂，用胶黏剂包裹所述多条复合纤维(20)，得到树脂基带(10)，所述多条复合纤维(20)均在树脂基带(10)内横向设置并沿所述树脂基带(10)延长方向周期排列。
8.如权利要求7所述的异方性导电胶带的制作方法，其特征在于，所述步骤S1中制作所述复合纤维(20)的过程具体包括如下步骤：
步骤S11、提供电绝缘纤维(21)及导电粒子(25)，对所述电绝缘纤维(21)进行表面修饰处理，使导电粒子(25)通过静电作用吸附在所述电绝缘纤维(21)的表面，形成包覆电绝缘纤维(21)的导电层(22’)；
步骤S12、在所述导电层(22’)表面形成遮蔽图案层(26)，去除电绝缘纤维(21)表面未被所述遮蔽图案层(26)覆盖的导电层(22’)，由剩余的导电层(22’)形成沿该电绝缘纤维(21)轴向方向周期排列的多个环套在该电绝缘纤维(21)上的导电环(22)；
步骤S13、去除遮蔽图案层(26)，得到复合纤维(20)。
9.如权利要求7所述的异方性导电胶带的制作方法，其特征在于，所述步骤S1中制作所述复合纤维(20)的过程具体包括如下步骤：
步骤S11、提供电绝缘纤维(21)，对所述电绝缘纤维(21)进行表面修饰处理；在所述电绝缘纤维(21)表面形成遮蔽图案层(26)；
步骤S12、提供导电粒子(25)，使导电粒子(25)通过静电作用吸附在所述电绝缘纤维(21)未被遮蔽图案层(26)覆盖的表面，形成沿该电绝缘纤维(21)轴向方向周期排列的多个环套在该电绝缘纤维(21)上的导电环(22)；
步骤S13、去除遮蔽图案层(26)，得到复合纤维(20)。
10.如权利要求7所述的异方性导电胶带的制作方法，其特征在于，还包括步骤S3、在所述树脂基带(10)上下表面形成分离层(30)。
CN201811393834.8A 2018-11-21 2018-11-21 异方性导电胶带及其制作方法 Active CN109628002B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201811393834.8A CN109628002B (zh) 2018-11-21 2018-11-21 异方性导电胶带及其制作方法
US16/619,091 US11041098B2 (en) 2018-11-21 2019-03-25 Anisotropic conductive film and fabricating method thereof
PCT/CN2019/079430 WO2020103364A1 (zh) 2018-11-21 2019-03-25 异方性导电胶带及其制作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811393834.8A CN109628002B (zh) 2018-11-21 2018-11-21 异方性导电胶带及其制作方法

Publications (2)

Publication Number Publication Date
CN109628002A true CN109628002A (zh) 2019-04-16
CN109628002B CN109628002B (zh) 2020-06-02

Family

ID=66068863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811393834.8A Active CN109628002B (zh) 2018-11-21 2018-11-21 异方性导电胶带及其制作方法

Country Status (3)

Country Link
US (1) US11041098B2 (zh)
CN (1) CN109628002B (zh)
WO (1) WO2020103364A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110619817A (zh) * 2019-08-27 2019-12-27 武汉华星光电半导体显示技术有限公司 异方性导电胶、显示面板及基板的绑定方法
CN111303795A (zh) * 2020-02-14 2020-06-19 维沃移动通信有限公司 一种异方性导电胶膜及其制备方法和显示装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040752A2 (en) * 2009-09-29 2011-04-07 Korea Advanced Institute Of Science And Technology Conductive polymer adhesive using nanofiber and method for preparing the same
CN105567112A (zh) * 2016-01-18 2016-05-11 杨宜丰 一种各向异性导电胶及其制备方法
CN105862398A (zh) * 2016-06-23 2016-08-17 四川大学 聚合物纤维基导电复合材料及其制备方法
CN105969237A (zh) * 2016-06-29 2016-09-28 深圳市华星光电技术有限公司 异方性导电胶膜的制备方法
KR101746334B1 (ko) * 2016-03-25 2017-06-13 한국과학기술원 전자 직물의 전기접속용 접착필름 및 그 접속 방법
CN106877030A (zh) * 2015-12-14 2017-06-20 财团法人工业技术研究院 接合结构及可挠式装置
CN107464796A (zh) * 2016-06-03 2017-12-12 三星显示有限公司 各向异性导电膜及使用各向异性导电膜的显示装置
CN108122625A (zh) * 2016-11-30 2018-06-05 乐金显示有限公司 各向异性导电膜和包括各向异性导电膜的显示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002212518A (ja) * 2001-01-18 2002-07-31 Cosmo Tec:Kk 異方性導電粘着シート及びそれを用いた電気及び／又は電子素子
KR101345694B1 (ko) * 2011-03-11 2013-12-30 옵토팩 주식회사 파이버, 파이버 집합체 및 이를 포함하는 접착제
CN202081054U (zh) * 2011-06-16 2011-12-21 北京京东方光电科技有限公司 一种胶条以及面板
CN104312469A (zh) * 2014-10-22 2015-01-28 苏州百诚精密科技有限公司 各向异性导电胶带
CN105006461A (zh) * 2015-07-13 2015-10-28 深圳市道纪科技有限公司 一种可精确控制导电单元的异方性导电胶膜
CN204904854U (zh) * 2015-07-27 2015-12-23 玮锋科技股份有限公司 单层内嵌式异方性导电胶膜结构
CN105974695B (zh) * 2016-07-01 2019-05-31 深圳市华星光电技术有限公司 异方性导电胶膜及其贴附方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040752A2 (en) * 2009-09-29 2011-04-07 Korea Advanced Institute Of Science And Technology Conductive polymer adhesive using nanofiber and method for preparing the same
CN106877030A (zh) * 2015-12-14 2017-06-20 财团法人工业技术研究院 接合结构及可挠式装置
CN105567112A (zh) * 2016-01-18 2016-05-11 杨宜丰 一种各向异性导电胶及其制备方法
KR101746334B1 (ko) * 2016-03-25 2017-06-13 한국과학기술원 전자 직물의 전기접속용 접착필름 및 그 접속 방법
CN107464796A (zh) * 2016-06-03 2017-12-12 三星显示有限公司 各向异性导电膜及使用各向异性导电膜的显示装置
CN105862398A (zh) * 2016-06-23 2016-08-17 四川大学 聚合物纤维基导电复合材料及其制备方法
CN105969237A (zh) * 2016-06-29 2016-09-28 深圳市华星光电技术有限公司 异方性导电胶膜的制备方法
CN108122625A (zh) * 2016-11-30 2018-06-05 乐金显示有限公司 各向异性导电膜和包括各向异性导电膜的显示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110619817A (zh) * 2019-08-27 2019-12-27 武汉华星光电半导体显示技术有限公司 异方性导电胶、显示面板及基板的绑定方法
CN111303795A (zh) * 2020-02-14 2020-06-19 维沃移动通信有限公司 一种异方性导电胶膜及其制备方法和显示装置

Also Published As

Publication number Publication date
CN109628002B (zh) 2020-06-02
WO2020103364A1 (zh) 2020-05-28
US20200332155A1 (en) 2020-10-22
US11041098B2 (en) 2021-06-22

Similar Documents

Publication Publication Date Title
CN106405892B (zh) 平板显示装置的压接结构和压接方法
JP5162979B2 (ja) 発光装置
CN1154166C (zh) 半导体元件的连接结构,使用了该结构的液晶显示装置以及使用了该显示装置的电子装置
CN107819015B (zh) 显示装置、及阵列基板与ic芯片的绑定方法
CN111399290B (zh) 显示面板及显示装置
CN108493154A (zh) Micro LED显示面板的制作方法及Micro LED显示面板
CN101188219A (zh) 液晶显示装置的驱动电路及制造方法和具有其的显示装置
KR102520294B1 (ko) 이방성 도전 필름
KR20160114234A (ko) 인쇄회로기판 어셈블리
CN113079637A (zh) 连接体及连接体的制造方法
CN110416264A (zh) 显示装置的绑定方法及显示装置
CN203086846U (zh) 一种柔性线路板及包括该柔性线路板的液晶显示装置
WO2021103354A1 (zh) 一种显示装置
CN109628002A (zh) 异方性导电胶带及其制作方法
CN106842647A (zh) 一种显示装置、绑定结构及其制备方法
CN103904096A (zh) 双面oled显示面板及制造方法
WO2021103352A1 (zh) 一种显示装置
KR0162531B1 (ko) 액정표시장치에 사용되는 이방성 도전막의 제조방법
CN104576966B (zh) 一种柔性显示装置及其制备方法
KR102457246B1 (ko) 표시 장치 및 이의 제조 방법
US9607960B1 (en) Bonding structure and flexible device
CN209328538U (zh) 异方性导电膜结构
CN1310835A (zh) 电气连接结构和平面显示装置
CN1828375A (zh) 驱动芯片、具有其的显示设备及制造显示设备的方法
CN110783489B (zh) 一种显示面板及其制备方法、显示装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant