CN1492503A - 半导体封装及其制造方法 - Google Patents
半导体封装及其制造方法 Download PDFInfo
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- CN1492503A CN1492503A CNA031586538A CN03158653A CN1492503A CN 1492503 A CN1492503 A CN 1492503A CN A031586538 A CNA031586538 A CN A031586538A CN 03158653 A CN03158653 A CN 03158653A CN 1492503 A CN1492503 A CN 1492503A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 114
- 238000000034 method Methods 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 claims abstract description 164
- 239000011521 glass Substances 0.000 claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 52
- 238000004519 manufacturing process Methods 0.000 claims description 47
- 230000015572 biosynthetic process Effects 0.000 claims description 24
- 238000005516 engineering process Methods 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 60
- 229910052710 silicon Inorganic materials 0.000 abstract description 60
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- 238000006243 chemical reaction Methods 0.000 abstract description 3
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- 229920000647 polyepoxide Polymers 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 150000002466 imines Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 101000643890 Homo sapiens Ubiquitin carboxyl-terminal hydrolase 5 Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 102100021017 Ubiquitin carboxyl-terminal hydrolase 5 Human genes 0.000 description 1
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- 239000012467 final product Substances 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (28)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002274807 | 2002-09-20 | ||
JP2002274807A JP4126389B2 (ja) | 2002-09-20 | 2002-09-20 | 半導体パッケージの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1492503A true CN1492503A (zh) | 2004-04-28 |
CN100383964C CN100383964C (zh) | 2008-04-23 |
Family
ID=31986967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031586538A Expired - Fee Related CN100383964C (zh) | 2002-09-20 | 2003-09-19 | 半导体封装及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6888209B2 (zh) |
JP (1) | JP4126389B2 (zh) |
KR (1) | KR100576775B1 (zh) |
CN (1) | CN100383964C (zh) |
HK (1) | HK1063881A1 (zh) |
TW (1) | TWI248143B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100459125C (zh) * | 2004-06-02 | 2009-02-04 | 卡西欧计算机株式会社 | 半导体器件的制造方法 |
CN101374201B (zh) * | 2007-08-24 | 2010-09-08 | 佳能株式会社 | 成像设备及光电转换元件封装保持单元 |
CN101877332A (zh) * | 2010-06-13 | 2010-11-03 | 江阴市赛英电子有限公司 | 新型平板压接式多芯片封装陶瓷外壳 |
CN102290334A (zh) * | 2005-07-05 | 2011-12-21 | 日立化成工业株式会社 | 半导体装置的制造方法 |
CN105575825A (zh) * | 2015-12-24 | 2016-05-11 | 合肥祖安投资合伙企业(有限合伙) | 芯片封装方法及封装组件 |
CN110473792A (zh) * | 2019-09-02 | 2019-11-19 | 电子科技大学 | 一种用于集成电路晶圆级封装的重构方法 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3829325B2 (ja) | 2002-02-07 | 2006-10-04 | 日本電気株式会社 | 半導体素子およびその製造方法並びに半導体装置の製造方法 |
JP3614840B2 (ja) | 2002-11-28 | 2005-01-26 | 沖電気工業株式会社 | 半導体装置 |
JP4269806B2 (ja) * | 2003-06-30 | 2009-05-27 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
JP4537793B2 (ja) * | 2004-07-30 | 2010-09-08 | 大日本印刷株式会社 | センサーユニットおよびその製造方法 |
JP2006128625A (ja) * | 2004-09-30 | 2006-05-18 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP4537828B2 (ja) * | 2004-10-29 | 2010-09-08 | 大日本印刷株式会社 | センサーパッケージおよびその製造方法 |
JP4990492B2 (ja) * | 2004-11-19 | 2012-08-01 | 株式会社テラミクロス | 半導体装置 |
KR20060087273A (ko) | 2005-01-28 | 2006-08-02 | 삼성전기주식회사 | 반도체 패키지및 그 제조방법 |
KR100616670B1 (ko) * | 2005-02-01 | 2006-08-28 | 삼성전기주식회사 | 웨이퍼 레벨의 이미지 센서 모듈 및 그 제조방법 |
JP4752280B2 (ja) * | 2005-02-08 | 2011-08-17 | カシオ計算機株式会社 | チップ型電子部品およびその製造方法 |
JP4486005B2 (ja) | 2005-08-03 | 2010-06-23 | パナソニック株式会社 | 半導体撮像装置およびその製造方法 |
JP4289335B2 (ja) * | 2005-08-10 | 2009-07-01 | セイコーエプソン株式会社 | 電子部品、回路基板及び電子機器 |
JP2007142058A (ja) | 2005-11-17 | 2007-06-07 | Matsushita Electric Ind Co Ltd | 半導体撮像素子およびその製造方法並びに半導体撮像装置とその製造方法 |
JP2007299929A (ja) * | 2006-04-28 | 2007-11-15 | Matsushita Electric Ind Co Ltd | 光学デバイス装置とそれを用いた光学デバイスモジュール |
US7615474B2 (en) * | 2006-11-22 | 2009-11-10 | Seiko Epson Corporation | Method for manufacturing semiconductor device with reduced damage to metal wiring layer |
JP5330697B2 (ja) * | 2007-03-19 | 2013-10-30 | 株式会社リコー | 機能素子のパッケージ及びその製造方法 |
US7675131B2 (en) * | 2007-04-05 | 2010-03-09 | Micron Technology, Inc. | Flip-chip image sensor packages and methods of fabricating the same |
US8829663B2 (en) * | 2007-07-02 | 2014-09-09 | Infineon Technologies Ag | Stackable semiconductor package with encapsulant and electrically conductive feed-through |
JP5089336B2 (ja) * | 2007-10-29 | 2012-12-05 | 新光電気工業株式会社 | パッケージ用シリコン基板 |
JP5690466B2 (ja) * | 2008-01-31 | 2015-03-25 | インヴェンサス・コーポレイション | 半導体チップパッケージの製造方法 |
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- 2003-09-19 TW TW092125841A patent/TWI248143B/zh not_active IP Right Cessation
- 2003-09-19 KR KR1020030064954A patent/KR100576775B1/ko not_active IP Right Cessation
- 2003-09-19 CN CNB031586538A patent/CN100383964C/zh not_active Expired - Fee Related
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CN100459125C (zh) * | 2004-06-02 | 2009-02-04 | 卡西欧计算机株式会社 | 半导体器件的制造方法 |
CN102290334A (zh) * | 2005-07-05 | 2011-12-21 | 日立化成工业株式会社 | 半导体装置的制造方法 |
US8673539B2 (en) | 2005-07-05 | 2014-03-18 | Hitachi Chemical Company, Ltd. | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part |
CN102290334B (zh) * | 2005-07-05 | 2015-03-11 | 日立化成株式会社 | 半导体装置的制造方法 |
CN101374201B (zh) * | 2007-08-24 | 2010-09-08 | 佳能株式会社 | 成像设备及光电转换元件封装保持单元 |
CN101877332A (zh) * | 2010-06-13 | 2010-11-03 | 江阴市赛英电子有限公司 | 新型平板压接式多芯片封装陶瓷外壳 |
CN101877332B (zh) * | 2010-06-13 | 2012-03-28 | 江阴市赛英电子有限公司 | 新型平板压接式多芯片封装陶瓷外壳 |
CN105575825A (zh) * | 2015-12-24 | 2016-05-11 | 合肥祖安投资合伙企业(有限合伙) | 芯片封装方法及封装组件 |
CN110473792A (zh) * | 2019-09-02 | 2019-11-19 | 电子科技大学 | 一种用于集成电路晶圆级封装的重构方法 |
Also Published As
Publication number | Publication date |
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TWI248143B (en) | 2006-01-21 |
KR100576775B1 (ko) | 2006-05-08 |
JP2004111792A (ja) | 2004-04-08 |
US20040056340A1 (en) | 2004-03-25 |
KR20040030303A (ko) | 2004-04-09 |
US6888209B2 (en) | 2005-05-03 |
TW200414380A (en) | 2004-08-01 |
JP4126389B2 (ja) | 2008-07-30 |
CN100383964C (zh) | 2008-04-23 |
HK1063881A1 (en) | 2005-01-14 |
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