CN1490883A - 薄膜半导体装置及其制造方法 - Google Patents
薄膜半导体装置及其制造方法 Download PDFInfo
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- CN1490883A CN1490883A CNA031584365A CN03158436A CN1490883A CN 1490883 A CN1490883 A CN 1490883A CN A031584365 A CNA031584365 A CN A031584365A CN 03158436 A CN03158436 A CN 03158436A CN 1490883 A CN1490883 A CN 1490883A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/06—Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
- G11C7/062—Differential amplifiers of non-latching type, e.g. comparators, long-tailed pairs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
- H03F3/45071—Differential amplifiers with semiconductor devices only
- H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
- H03F3/45179—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using MOSFET transistors as the active amplifying circuit
- H03F3/45183—Long tailed pairs
- H03F3/45192—Folded cascode stages
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
- H03F3/45071—Differential amplifiers with semiconductor devices only
- H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
- H03F3/45179—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using MOSFET transistors as the active amplifying circuit
- H03F3/4521—Complementary long tailed pairs having parallel inputs and being supplied in parallel
- H03F3/45219—Folded cascode stages
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0008—Arrangements for reducing power consumption
- H03K19/0016—Arrangements for reducing power consumption by using a control or a clock signal, e.g. in order to apply power supply
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
- H03K5/22—Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral
- H03K5/24—Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude
- H03K5/2472—Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude using field effect transistors
- H03K5/2481—Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude using field effect transistors with at least one differential stage
Abstract
Description
Claims (62)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP263606/2002 | 2002-09-10 | ||
JP2002263606 | 2002-09-10 | ||
JP285780/2003 | 2003-08-04 | ||
JP2003285780A JP4736313B2 (ja) | 2002-09-10 | 2003-08-04 | 薄膜半導体装置 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101308743A Division CN101359899B (zh) | 2002-09-10 | 2003-09-10 | 薄膜半导体装置及其制造方法 |
CN200610071008A Division CN100590877C (zh) | 2002-09-10 | 2003-09-10 | 薄膜半导体装置及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1490883A true CN1490883A (zh) | 2004-04-21 |
CN100426526C CN100426526C (zh) | 2008-10-15 |
Family
ID=31890560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031584365A Expired - Lifetime CN100426526C (zh) | 2002-09-10 | 2003-09-10 | 薄膜半导体装置及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7224224B2 (zh) |
EP (2) | EP1873786B1 (zh) |
JP (1) | JP4736313B2 (zh) |
CN (1) | CN100426526C (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100362355C (zh) * | 2005-05-27 | 2008-01-16 | 东南大学 | 微型抗辐射电场传感器 |
CN102856260A (zh) * | 2012-09-26 | 2013-01-02 | 京东方科技集团股份有限公司 | 一种cmos晶体管及其制造方法 |
CN105225953A (zh) * | 2014-06-16 | 2016-01-06 | 上海和辉光电有限公司 | 薄膜晶体管的制造方法和阵列基板的制造方法 |
CN106415801A (zh) * | 2014-06-03 | 2017-02-15 | 夏普株式会社 | 半导体装置及其制造方法 |
CN108320705A (zh) * | 2018-02-14 | 2018-07-24 | 京东方科技集团股份有限公司 | 像素单元及其制作方法和阵列基板 |
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---|---|---|---|---|
JP4468094B2 (ja) * | 2003-09-26 | 2010-05-26 | 日立プラズマディスプレイ株式会社 | 負荷駆動回路及びそれを用いたディスプレイ装置 |
KR100957580B1 (ko) * | 2003-09-30 | 2010-05-12 | 삼성전자주식회사 | 구동장치, 이를 갖는 표시장치 및 이의 구동방법 |
US7432141B2 (en) * | 2004-09-08 | 2008-10-07 | Sandisk 3D Llc | Large-grain p-doped polysilicon films for use in thin film transistors |
KR101090253B1 (ko) * | 2004-10-06 | 2011-12-06 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 이를 포함하는 액정 표시 장치 |
KR100598431B1 (ko) * | 2004-11-25 | 2006-07-11 | 한국전자통신연구원 | 능동 구동 전압/전류형 유기 el 화소 회로 및 표시 장치 |
KR20060089934A (ko) * | 2005-02-03 | 2006-08-10 | 삼성전자주식회사 | 트랜지스터 수가 감소된 전류 구동 데이터 드라이버 |
JP4111205B2 (ja) * | 2005-05-23 | 2008-07-02 | 日本電気株式会社 | 半導体装置、液晶ディスプレイパネル及び電子機器並びに半導体装置の設計方法及び製造方法 |
JP2006332400A (ja) | 2005-05-27 | 2006-12-07 | Nec Corp | 薄膜半導体装置およびその製造方法 |
JP4864408B2 (ja) * | 2005-09-30 | 2012-02-01 | シャープ株式会社 | アクティブマトリクス基板 |
KR100780209B1 (ko) * | 2006-05-26 | 2007-11-27 | 삼성전기주식회사 | 공급전압 변환 장치 |
US7781768B2 (en) | 2006-06-29 | 2010-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Display device, method for manufacturing the same, and electronic device having the same |
JP2008072095A (ja) * | 2006-08-18 | 2008-03-27 | Advanced Lcd Technologies Development Center Co Ltd | 電子装置、表示装置、インターフェイス回路、差動増幅装置 |
JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
US8035662B2 (en) * | 2006-11-22 | 2011-10-11 | Seiko Epson Corporation | Integrated circuit device and electronic instrument |
US7605654B2 (en) * | 2008-03-13 | 2009-10-20 | Mediatek Inc. | Telescopic operational amplifier and reference buffer utilizing the same |
US8508515B2 (en) * | 2009-08-05 | 2013-08-13 | Himax Technologies Limited | Buffering circuit with reduced dynamic power consumption |
CN102640279B (zh) * | 2009-10-30 | 2015-06-17 | 株式会社半导体能源研究所 | 半导体器件 |
US8183922B2 (en) * | 2009-11-17 | 2012-05-22 | Atmei Rousset S.A.S. | Differential pair with constant offset |
KR101770976B1 (ko) * | 2009-12-11 | 2017-08-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
CN102656801B (zh) * | 2009-12-25 | 2016-04-27 | 株式会社半导体能源研究所 | 存储器装置、半导体器件和电子装置 |
US8853701B2 (en) * | 2010-04-28 | 2014-10-07 | Sharp Kabushiki Kaisha | Semiconductor device, display device, and production method for semiconductor device and display device |
WO2011135890A1 (ja) * | 2010-04-30 | 2011-11-03 | シャープ株式会社 | 半導体装置、表示装置、および半導体装置の製造方法 |
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CN103715267A (zh) * | 2013-12-30 | 2014-04-09 | 京东方科技集团股份有限公司 | 薄膜晶体管、tft阵列基板及其制造方法和显示装置 |
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Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4446390A (en) * | 1981-12-28 | 1984-05-01 | Motorola, Inc. | Low leakage CMOS analog switch circuit |
JPS61100010A (ja) * | 1984-10-23 | 1986-05-19 | Sony Corp | Fet回路 |
US4872010A (en) * | 1988-02-08 | 1989-10-03 | Hughes Aircraft Company | Analog-to-digital converter made with focused ion beam technology |
US5471171A (en) * | 1990-10-09 | 1995-11-28 | Kabushiki Kaisha Toshiba | Amplifier device capable of realizing high slew rate with low power consumption |
KR920013458A (ko) * | 1990-12-12 | 1992-07-29 | 김광호 | 차동감지 증폭회로 |
US5461713A (en) * | 1991-05-10 | 1995-10-24 | Sgs-Thomson Microelectronics S.R.L. | Current offset sense amplifier of a modulated current or current unbalance type for programmable memories |
KR940010393A (ko) * | 1992-10-05 | 1994-05-26 | 윌리엄 이. 힐러 | 티타늄 질화물과 폴리실리콘으로 구성되는 적층된 층들을 이용하는 게이트 전극 |
US5355035A (en) * | 1993-01-08 | 1994-10-11 | Vora Madhukar B | High speed BICMOS switches and multiplexers |
JPH0729381A (ja) * | 1993-07-13 | 1995-01-31 | Oki Micro Design Miyazaki:Kk | 半導体集積回路装置 |
JP3402400B2 (ja) * | 1994-04-22 | 2003-05-06 | 株式会社半導体エネルギー研究所 | 半導体集積回路の作製方法 |
US6498376B1 (en) * | 1994-06-03 | 2002-12-24 | Seiko Instruments Inc | Semiconductor device and manufacturing method thereof |
US5594371A (en) * | 1994-06-28 | 1997-01-14 | Nippon Telegraph And Telephone Corporation | Low voltage SOI (Silicon On Insulator) logic circuit |
JPH08148580A (ja) * | 1994-08-01 | 1996-06-07 | Seiko Instr Inc | 半導体集積回路装置 |
JP3219674B2 (ja) * | 1995-03-09 | 2001-10-15 | キヤノン株式会社 | 液晶表示装置 |
JPH08264798A (ja) * | 1995-03-23 | 1996-10-11 | Semiconductor Energy Lab Co Ltd | 半導体装置および半導体装置作製方法 |
JP3948034B2 (ja) * | 1995-09-06 | 2007-07-25 | セイコーエプソン株式会社 | 半導体装置とその製造方法、及びアクティブマトリクス基板 |
JP3633061B2 (ja) * | 1995-10-19 | 2005-03-30 | 三菱電機株式会社 | 半導体集積回路装置 |
DE69730775T2 (de) * | 1996-05-22 | 2005-09-29 | Nippon Telegraph And Telephone Corp. | Logische Schaltung und zugehöriges Herstellungsverfahren |
TW434834B (en) * | 1996-06-29 | 2001-05-16 | Hyundai Electronics Ind | Method of manufacturing a complementary metal-oxide semiconductor device |
JP2899959B2 (ja) * | 1996-12-09 | 1999-06-02 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
JP3544096B2 (ja) * | 1997-03-26 | 2004-07-21 | 東京大学長 | 半導体集積回路装置 |
JP3460519B2 (ja) * | 1997-07-18 | 2003-10-27 | 株式会社デンソー | バッファ回路 |
JP4030198B2 (ja) * | 1998-08-11 | 2008-01-09 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
US6190952B1 (en) * | 1999-03-03 | 2001-02-20 | Advanced Micro Devices, Inc. | Multiple semiconductor-on-insulator threshold voltage circuit |
JP4160174B2 (ja) * | 1998-10-07 | 2008-10-01 | 東芝松下ディスプレイテクノロジー株式会社 | 半導体装置 |
JP3483484B2 (ja) * | 1998-12-28 | 2004-01-06 | 富士通ディスプレイテクノロジーズ株式会社 | 半導体装置、画像表示装置、半導体装置の製造方法、及び画像表示装置の製造方法 |
JP2000323587A (ja) * | 1999-05-10 | 2000-11-24 | Nikon Corp | Cmos半導体装置及びその製造方法 |
JP4627822B2 (ja) * | 1999-06-23 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 表示装置 |
US6544146B1 (en) * | 2000-03-31 | 2003-04-08 | Kenneth W. Stearns | Methods and apparatus for linking arm and leg motions on elliptical and other exercise machines |
DE19944248C2 (de) * | 1999-09-15 | 2002-04-11 | Infineon Technologies Ag | Inputbuffer einer integrierten Halbleiterschaltung |
JP3538084B2 (ja) * | 1999-09-17 | 2004-06-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US6693331B2 (en) * | 1999-11-18 | 2004-02-17 | Intel Corporation | Method of fabricating dual threshold voltage n-channel and p-channel MOSFETS with a single extra masked implant operation |
JP4132508B2 (ja) * | 1999-12-13 | 2008-08-13 | 三菱電機株式会社 | 半導体装置の製造方法 |
US20020096723A1 (en) * | 1999-12-31 | 2002-07-25 | Kaoru Awaka | Transient frequency in dynamic threshold metal-oxide-semiconductor field effect transistors |
JP3416628B2 (ja) * | 2000-04-27 | 2003-06-16 | 松下電器産業株式会社 | 半導体集積回路装置 |
JP3700558B2 (ja) * | 2000-08-10 | 2005-09-28 | 日本電気株式会社 | 駆動回路 |
US6246221B1 (en) * | 2000-09-20 | 2001-06-12 | Texas Instruments Incorporated | PMOS low drop-out voltage regulator using non-inverting variable gain stage |
EP1217662A1 (en) * | 2000-12-21 | 2002-06-26 | Universite Catholique De Louvain | Ultra-low power basic blocks and their uses |
JP3846293B2 (ja) * | 2000-12-28 | 2006-11-15 | 日本電気株式会社 | 帰還型増幅回路及び駆動回路 |
KR100495023B1 (ko) * | 2000-12-28 | 2005-06-14 | 가부시끼가이샤 도시바 | 반도체 장치 및 그 제조 방법 |
JP2003069353A (ja) * | 2001-08-24 | 2003-03-07 | Toshiba Corp | 差動増幅回路および液晶表示装置駆動用半導体集積回路 |
-
2003
- 2003-08-04 JP JP2003285780A patent/JP4736313B2/ja not_active Expired - Lifetime
- 2003-09-08 EP EP07020221.3A patent/EP1873786B1/en not_active Expired - Lifetime
- 2003-09-08 EP EP03020276.6A patent/EP1398836B1/en not_active Expired - Lifetime
- 2003-09-09 US US10/657,196 patent/US7224224B2/en not_active Expired - Lifetime
- 2003-09-10 CN CNB031584365A patent/CN100426526C/zh not_active Expired - Lifetime
-
2007
- 2007-04-25 US US11/740,226 patent/US7595533B2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100362355C (zh) * | 2005-05-27 | 2008-01-16 | 东南大学 | 微型抗辐射电场传感器 |
CN102856260A (zh) * | 2012-09-26 | 2013-01-02 | 京东方科技集团股份有限公司 | 一种cmos晶体管及其制造方法 |
CN102856260B (zh) * | 2012-09-26 | 2015-08-19 | 京东方科技集团股份有限公司 | 一种cmos晶体管及其制造方法 |
CN106415801A (zh) * | 2014-06-03 | 2017-02-15 | 夏普株式会社 | 半导体装置及其制造方法 |
CN105225953A (zh) * | 2014-06-16 | 2016-01-06 | 上海和辉光电有限公司 | 薄膜晶体管的制造方法和阵列基板的制造方法 |
CN108320705A (zh) * | 2018-02-14 | 2018-07-24 | 京东方科技集团股份有限公司 | 像素单元及其制作方法和阵列基板 |
Also Published As
Publication number | Publication date |
---|---|
JP2004128487A (ja) | 2004-04-22 |
US7595533B2 (en) | 2009-09-29 |
EP1873786A3 (en) | 2015-01-14 |
EP1398836A2 (en) | 2004-03-17 |
CN100426526C (zh) | 2008-10-15 |
JP4736313B2 (ja) | 2011-07-27 |
EP1873786A2 (en) | 2008-01-02 |
US20040046209A1 (en) | 2004-03-11 |
EP1398836B1 (en) | 2021-07-21 |
EP1398836A3 (en) | 2006-09-27 |
US7224224B2 (en) | 2007-05-29 |
US20070194377A1 (en) | 2007-08-23 |
EP1873786B1 (en) | 2020-01-15 |
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