CN1471172A - 固体摄像装置及其制造方法 - Google Patents
固体摄像装置及其制造方法 Download PDFInfo
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- CN1471172A CN1471172A CNA031487238A CN03148723A CN1471172A CN 1471172 A CN1471172 A CN 1471172A CN A031487238 A CNA031487238 A CN A031487238A CN 03148723 A CN03148723 A CN 03148723A CN 1471172 A CN1471172 A CN 1471172A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (19)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002183073 | 2002-06-24 | ||
JP2002183073 | 2002-06-24 | ||
JP2003175163A JP4443865B2 (ja) | 2002-06-24 | 2003-06-19 | 固体撮像装置およびその製造方法 |
JP2003175163 | 2003-06-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1471172A true CN1471172A (zh) | 2004-01-28 |
CN100499143C CN100499143C (zh) | 2009-06-10 |
Family
ID=29718426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031487238A Expired - Fee Related CN100499143C (zh) | 2002-06-24 | 2003-06-24 | 固体摄像装置及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US6930327B2 (zh) |
EP (1) | EP1376705A3 (zh) |
JP (1) | JP4443865B2 (zh) |
CN (1) | CN100499143C (zh) |
Cited By (6)
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CN1747178B (zh) * | 2004-09-11 | 2010-11-10 | 三星电子株式会社 | 互补金属氧化物半导体图像传感器及其制造方法 |
CN102859692A (zh) * | 2011-01-26 | 2013-01-02 | 索尼公司 | 固体摄像装置、固体摄像装置的制造方法和电子机器 |
CN102856396A (zh) * | 2011-06-30 | 2013-01-02 | 精工电子有限公司 | 光传感器装置 |
CN104106003A (zh) * | 2012-02-01 | 2014-10-15 | 株式会社尼康 | 摄像装置 |
CN108780799A (zh) * | 2016-03-24 | 2018-11-09 | 索尼公司 | 图像拾取装置和电子设备 |
CN111161646A (zh) * | 2015-03-10 | 2020-05-15 | 三星显示有限公司 | 显示装置及便携式终端 |
Families Citing this family (46)
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US7074638B2 (en) | 2002-04-22 | 2006-07-11 | Fuji Photo Film Co., Ltd. | Solid-state imaging device and method of manufacturing said solid-state imaging device |
EP1686618A3 (en) * | 2002-07-29 | 2007-01-03 | Fuji Photo Film Co., Ltd. | Solid-state imaging device and method of manufacturing the same |
JP2004312666A (ja) * | 2003-03-25 | 2004-11-04 | Fuji Photo Film Co Ltd | 固体撮像装置及び固体撮像装置の製造方法 |
JP3898666B2 (ja) * | 2003-04-28 | 2007-03-28 | 松下電器産業株式会社 | 固体撮像装置およびその製造方法 |
JP2005056998A (ja) | 2003-08-01 | 2005-03-03 | Fuji Photo Film Co Ltd | 固体撮像装置およびその製造方法 |
US7329861B2 (en) * | 2003-10-14 | 2008-02-12 | Micron Technology, Inc. | Integrally packaged imaging module |
JP4046067B2 (ja) * | 2003-11-04 | 2008-02-13 | ソニー株式会社 | 固体撮像素子の製造方法 |
JP4542768B2 (ja) * | 2003-11-25 | 2010-09-15 | 富士フイルム株式会社 | 固体撮像装置及びその製造方法 |
WO2005060004A1 (ja) | 2003-12-18 | 2005-06-30 | Matsushita Electric Industrial Co.,Ltd. | 固体撮像装置、その生産方法、及びその固体撮像装置を備えるカメラ、並びに受光チップ |
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JP4271625B2 (ja) * | 2004-06-30 | 2009-06-03 | 株式会社フジクラ | 半導体パッケージ及びその製造方法 |
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JP2006100763A (ja) * | 2004-09-06 | 2006-04-13 | Fuji Photo Film Co Ltd | 固体撮像装置の製造方法及び接合装置 |
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KR100687069B1 (ko) * | 2005-01-07 | 2007-02-27 | 삼성전자주식회사 | 보호판이 부착된 이미지 센서 칩과 그의 제조 방법 |
KR100643017B1 (ko) | 2005-01-07 | 2006-11-10 | 삼성전자주식회사 | 보호판이 부착된 웨이퍼와 이미지 센서 칩, 그리고 그의제조 방법 |
TWI264807B (en) * | 2005-03-02 | 2006-10-21 | Advanced Semiconductor Eng | Semiconductor package and method for manufacturing the same |
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JPWO2006112320A1 (ja) * | 2005-04-15 | 2008-12-11 | 株式会社日立メディコ | X線平面検出器及びx線画像診断装置 |
KR100738653B1 (ko) * | 2005-09-02 | 2007-07-11 | 한국과학기술원 | 이미지 센서 모듈용 웨이퍼 레벨 칩 사이즈 패키지 및 이의제조방법 |
KR100691363B1 (ko) * | 2005-09-23 | 2007-03-12 | 삼성전기주식회사 | 수직구조 발광 다이오드의 제조 방법 |
KR100752713B1 (ko) | 2005-10-10 | 2007-08-29 | 삼성전기주식회사 | 이미지센서의 웨이퍼 레벨 칩 스케일 패키지 및 그제조방법 |
WO2007043718A1 (en) * | 2005-10-11 | 2007-04-19 | Tae-Seok Park | Wafer level package using silicon via contacts for cmos image sensor and method of fabricating the same |
JP4951989B2 (ja) * | 2006-02-09 | 2012-06-13 | 富士通セミコンダクター株式会社 | 半導体装置 |
JP4950542B2 (ja) | 2006-04-07 | 2012-06-13 | 岩手東芝エレクトロニクス株式会社 | 固体撮像装置およびその製造方法 |
US9034729B2 (en) * | 2006-08-25 | 2015-05-19 | Semiconductor Components Industries, Llc | Semiconductor device and method of manufacturing the same |
WO2008023827A1 (fr) * | 2006-08-25 | 2008-02-28 | Sanyo Electric Co., Ltd. | Dispositif semi-conducteur |
US20080138926A1 (en) * | 2006-12-11 | 2008-06-12 | Lavine James P | Two epitaxial layers to reduce crosstalk in an image sensor |
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JP3881888B2 (ja) * | 2001-12-27 | 2007-02-14 | セイコーエプソン株式会社 | 光デバイスの製造方法 |
WO2011005237A2 (en) | 2009-07-06 | 2011-01-13 | Biyiklioglu Ahmet | A personal floatation device |
-
2003
- 2003-06-19 JP JP2003175163A patent/JP4443865B2/ja not_active Expired - Fee Related
- 2003-06-24 EP EP03253964A patent/EP1376705A3/en not_active Withdrawn
- 2003-06-24 CN CNB031487238A patent/CN100499143C/zh not_active Expired - Fee Related
- 2003-06-24 US US10/601,567 patent/US6930327B2/en not_active Expired - Fee Related
-
2005
- 2005-06-24 US US11/165,133 patent/US7592200B2/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1747178B (zh) * | 2004-09-11 | 2010-11-10 | 三星电子株式会社 | 互补金属氧化物半导体图像传感器及其制造方法 |
CN102859692A (zh) * | 2011-01-26 | 2013-01-02 | 索尼公司 | 固体摄像装置、固体摄像装置的制造方法和电子机器 |
CN102859692B (zh) * | 2011-01-26 | 2016-06-08 | 索尼公司 | 固体摄像装置、固体摄像装置的制造方法和电子机器 |
CN102856396A (zh) * | 2011-06-30 | 2013-01-02 | 精工电子有限公司 | 光传感器装置 |
CN102856396B (zh) * | 2011-06-30 | 2016-11-23 | 精工半导体有限公司 | 光传感器装置 |
CN104106003A (zh) * | 2012-02-01 | 2014-10-15 | 株式会社尼康 | 摄像装置 |
CN111161646A (zh) * | 2015-03-10 | 2020-05-15 | 三星显示有限公司 | 显示装置及便携式终端 |
CN111161646B (zh) * | 2015-03-10 | 2022-03-29 | 三星显示有限公司 | 显示装置及便携式终端 |
CN108780799A (zh) * | 2016-03-24 | 2018-11-09 | 索尼公司 | 图像拾取装置和电子设备 |
CN108780799B (zh) * | 2016-03-24 | 2022-12-16 | 索尼公司 | 图像拾取装置和电子设备 |
Also Published As
Publication number | Publication date |
---|---|
US20040075761A1 (en) | 2004-04-22 |
US7592200B2 (en) | 2009-09-22 |
EP1376705A2 (en) | 2004-01-02 |
US20050236621A1 (en) | 2005-10-27 |
CN100499143C (zh) | 2009-06-10 |
US6930327B2 (en) | 2005-08-16 |
EP1376705A3 (en) | 2007-01-17 |
JP4443865B2 (ja) | 2010-03-31 |
JP2004088082A (ja) | 2004-03-18 |
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