CN1645598A - 半导体器件、光学器件模块以及半导体器件的制造方法 - Google Patents
半导体器件、光学器件模块以及半导体器件的制造方法 Download PDFInfo
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- CN1645598A CN1645598A CNA2005100056455A CN200510005645A CN1645598A CN 1645598 A CN1645598 A CN 1645598A CN A2005100056455 A CNA2005100056455 A CN A2005100056455A CN 200510005645 A CN200510005645 A CN 200510005645A CN 1645598 A CN1645598 A CN 1645598A
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Images
Classifications
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- B62H1/00—Supports or stands forming part of or attached to cycles
- B62H1/10—Supports or stands forming part of or attached to cycles involving means providing for a stabilised ride
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B62H—CYCLE STANDS; SUPPORTS OR HOLDERS FOR PARKING OR STORING CYCLES; APPLIANCES PREVENTING OR INDICATING UNAUTHORIZED USE OR THEFT OF CYCLES; LOCKS INTEGRAL WITH CYCLES; DEVICES FOR LEARNING TO RIDE CYCLES
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16296/04 | 2004-01-23 | ||
JP2004016296A JP4198072B2 (ja) | 2004-01-23 | 2004-01-23 | 半導体装置、光学装置用モジュール及び半導体装置の製造方法 |
JP16296/2004 | 2004-01-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1645598A true CN1645598A (zh) | 2005-07-27 |
CN100433303C CN100433303C (zh) | 2008-11-12 |
Family
ID=34792474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100056455A Expired - Fee Related CN100433303C (zh) | 2004-01-23 | 2005-01-24 | 半导体器件、光学器件模块以及半导体器件的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7221051B2 (zh) |
JP (1) | JP4198072B2 (zh) |
KR (1) | KR100755165B1 (zh) |
CN (1) | CN100433303C (zh) |
TW (1) | TWI253149B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102132409A (zh) * | 2008-11-21 | 2011-07-20 | 松下电器产业株式会社 | 半导体装置及其制造方法 |
CN102651374A (zh) * | 2011-02-24 | 2012-08-29 | 胜开科技股份有限公司 | 降低透光板倾斜度的影像感测器制造方法 |
CN103531572A (zh) * | 2012-07-04 | 2014-01-22 | 新科实业有限公司 | 晶片级封装的光学组件以及具有该光学组件的收发模块 |
CN103943640A (zh) * | 2013-01-22 | 2014-07-23 | 胜开科技股份有限公司 | 降低光学单元倾斜度的影像感测器制造方法 |
Families Citing this family (76)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4468609B2 (ja) * | 2001-05-21 | 2010-05-26 | 株式会社ルネサステクノロジ | 半導体装置 |
US7215018B2 (en) | 2004-04-13 | 2007-05-08 | Vertical Circuits, Inc. | Stacked die BGA or LGA component assembly |
US7547978B2 (en) * | 2004-06-14 | 2009-06-16 | Micron Technology, Inc. | Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
EP1624493A3 (fr) * | 2004-07-23 | 2006-09-13 | Stmicroelectronics Sa | Procédé de fabrication de module optique pour boîtier semiconducteur à capteur optique |
CN101065844B (zh) * | 2005-01-04 | 2010-12-15 | 株式会社映煌 | 固体摄像装置及其制造方法 |
JP2006228837A (ja) * | 2005-02-15 | 2006-08-31 | Sharp Corp | 半導体装置及びその製造方法 |
TWI264807B (en) * | 2005-03-02 | 2006-10-21 | Advanced Semiconductor Eng | Semiconductor package and method for manufacturing the same |
JP2006276463A (ja) * | 2005-03-29 | 2006-10-12 | Sharp Corp | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
KR100785488B1 (ko) * | 2005-04-06 | 2007-12-13 | 한국과학기술원 | 이미지 센서 모듈 및 이의 제조 방법 |
TW200644261A (en) | 2005-06-06 | 2006-12-16 | Megica Corp | Chip-package structure and manufacturing process thereof |
JP4486005B2 (ja) * | 2005-08-03 | 2010-06-23 | パナソニック株式会社 | 半導体撮像装置およびその製造方法 |
KR100738653B1 (ko) * | 2005-09-02 | 2007-07-11 | 한국과학기술원 | 이미지 센서 모듈용 웨이퍼 레벨 칩 사이즈 패키지 및 이의제조방법 |
US7393758B2 (en) * | 2005-11-03 | 2008-07-01 | Maxim Integrated Products, Inc. | Wafer level packaging process |
US7354799B2 (en) * | 2005-11-08 | 2008-04-08 | Intel Corporation | Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring |
KR100691398B1 (ko) | 2006-03-14 | 2007-03-12 | 삼성전자주식회사 | 미소소자 패키지 및 그 제조방법 |
WO2008023827A1 (fr) * | 2006-08-25 | 2008-02-28 | Sanyo Electric Co., Ltd. | Dispositif semi-conducteur |
JP5270349B2 (ja) * | 2006-08-25 | 2013-08-21 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置及びその製造方法 |
KR100769722B1 (ko) * | 2006-10-10 | 2007-10-24 | 삼성전기주식회사 | 이미지센서의 웨이퍼 레벨 칩 스케일 패키지 및 그제조방법 |
JP2008130738A (ja) * | 2006-11-20 | 2008-06-05 | Fujifilm Corp | 固体撮像素子 |
US8569876B2 (en) | 2006-11-22 | 2013-10-29 | Tessera, Inc. | Packaged semiconductor chips with array |
US7566854B2 (en) * | 2006-12-08 | 2009-07-28 | Advanced Chip Engineering Technology Inc. | Image sensor module |
US20080169556A1 (en) * | 2007-01-16 | 2008-07-17 | Xin Tec Inc. | Chip package module heat sink |
JP4958273B2 (ja) * | 2007-01-23 | 2012-06-20 | オンセミコンダクター・トレーディング・リミテッド | 発光装置及びその製造方法 |
JP5008998B2 (ja) * | 2007-02-05 | 2012-08-22 | 株式会社フジクラ | 電子部品 |
JP5584474B2 (ja) * | 2007-03-05 | 2014-09-03 | インヴェンサス・コーポレイション | 貫通ビアによって前面接点に接続された後面接点を有するチップ |
TW200839982A (en) * | 2007-03-19 | 2008-10-01 | Xintec Inc | Integrated circuit package and method for fabricating thereof |
US8723332B2 (en) | 2007-06-11 | 2014-05-13 | Invensas Corporation | Electrically interconnected stacked die assemblies |
TWI473183B (zh) * | 2007-06-19 | 2015-02-11 | Invensas Corp | 可堆疊的積體電路晶片的晶圓水平表面鈍化 |
TW200917391A (en) * | 2007-06-20 | 2009-04-16 | Vertical Circuits Inc | Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabrication |
JP2010535427A (ja) | 2007-07-31 | 2010-11-18 | テッセラ,インコーポレイテッド | 貫通シリコンビアを使用する半導体実装プロセス |
JP2009064839A (ja) * | 2007-09-04 | 2009-03-26 | Panasonic Corp | 光学デバイス及びその製造方法 |
US7923298B2 (en) * | 2007-09-07 | 2011-04-12 | Micron Technology, Inc. | Imager die package and methods of packaging an imager die on a temporary carrier |
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- 2005-01-21 US US11/038,420 patent/US7221051B2/en active Active
- 2005-01-24 CN CNB2005100056455A patent/CN100433303C/zh not_active Expired - Fee Related
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CN103531572A (zh) * | 2012-07-04 | 2014-01-22 | 新科实业有限公司 | 晶片级封装的光学组件以及具有该光学组件的收发模块 |
CN103531572B (zh) * | 2012-07-04 | 2017-06-09 | 新科实业有限公司 | 晶片级封装的光学组件以及具有该光学组件的收发模块 |
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CN103943640A (zh) * | 2013-01-22 | 2014-07-23 | 胜开科技股份有限公司 | 降低光学单元倾斜度的影像感测器制造方法 |
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US20050161805A1 (en) | 2005-07-28 |
US7221051B2 (en) | 2007-05-22 |
TWI253149B (en) | 2006-04-11 |
TW200525712A (en) | 2005-08-01 |
KR100755165B1 (ko) | 2007-09-04 |
JP4198072B2 (ja) | 2008-12-17 |
CN100433303C (zh) | 2008-11-12 |
KR20050076781A (ko) | 2005-07-27 |
JP2005209967A (ja) | 2005-08-04 |
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