KR100755165B1 - 반도체 장치, 광학 장치용 모듈 및 반도체 장치의 제조 방법 - Google Patents
반도체 장치, 광학 장치용 모듈 및 반도체 장치의 제조 방법 Download PDFInfo
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- KR100755165B1 KR100755165B1 KR1020050006271A KR20050006271A KR100755165B1 KR 100755165 B1 KR100755165 B1 KR 100755165B1 KR 1020050006271 A KR1020050006271 A KR 1020050006271A KR 20050006271 A KR20050006271 A KR 20050006271A KR 100755165 B1 KR100755165 B1 KR 100755165B1
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Abstract
Description
Claims (13)
- 반도체 소자가 일면에 형성된 반도체 기판;상기 반도체 기판에 형성된 관통 전극;상기 반도체 기판의 상기 일면으로부터 돌출하도록 형성된 돌기부; 및상기 반도체 소자를 피복하며, 상기 돌기부에 의해 지지되어 상기 반도체 기판에 장착된 덮개 부재를 포함하며,상기 돌기부는 상기 관통 전극과 일체로 형성되어 있는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 일면에 마련된 마이크로 렌즈를 더 포함하고,상기 돌기부의 두께는 상기 마이크로 렌즈의 두께보다 큰 것을 특징으로 하는 반도체 장치.
- 삭제
- 제1항 또는 제2항에 있어서,상기 돌기부는 상기 일면 상에 형성되어 있는 것을 특징으로 하는 반도체 장 치.
- 제1항 또는 제2항에 있어서,상기 관통 전극과 상기 돌기부는 동일한 도전성 재료를 이용하여 형성되는 것을 특징으로 하는 반도체 장치.
- 제1항 또는 제2항에 있어서,상기 돌기부는 금속으로 이루어진 것을 특징으로 하는 반도체 장치.
- 제1항 또는 제2항에 있어서,상기 덮개 부재는 투광성을 갖고, 상기 반도체 소자는 수광 소자 또는 촬상 소자인 것을 특징으로 하는 반도체 장치.
- 제1항 또는 제2항에 기재된 반도체 장치와,상기 반도체 장치로의 광로를 획정하는 광로 획정기(optical path defining device)를 포함하는 광학 장치용 모듈.
- 반도체 기판의 일면에 반도체 소자를 형성하는 단계;관통 전극을 상기 반도체 기판에 형성하는 단계;상기 반도체 기판에, 상기 일면으로부터 돌출하는 돌기부를 형성하는 단계; 및덮개 부재를, 상기 형성한 돌기부에 의해 지지하고, 상기 반도체 소자를 피복하도록 하여 상기 반도체 기판에 장착하는 단계를 포함하며,상기 관통 전극의 형성후, 또는 상기 관통 전극의 형성중에, 상기 돌기부가 상기 관통 전극과 일체로 형성되는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제9항에 있어서,상기 일면에 마이크로 렌즈를 마련하는 단계를 더 포함하고,상기 돌기부를 형성하는 경우, 상기 마이크로 렌즈의 두께보다도 두껍게 상기 돌기부를 형성하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 삭제
- 제9항 또는 제10항에 있어서,상기 반도체 기판에 대하여 도금을 행함으로써 상기 돌기부를 형성하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제9항 또는 제10항에 있어서,상기 반도체 기판에 대하여 금속제 페이스트를 인쇄하고, 상기 인쇄한 금속제 페이스트를 경화시킴으로써 상기 돌기부를 형성하는 것을 특징으로 하는 반도체 장치의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004016296A JP4198072B2 (ja) | 2004-01-23 | 2004-01-23 | 半導体装置、光学装置用モジュール及び半導体装置の製造方法 |
JPJP-P-2004-00016296 | 2004-01-23 |
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KR20050076781A KR20050076781A (ko) | 2005-07-27 |
KR100755165B1 true KR100755165B1 (ko) | 2007-09-04 |
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KR1020050006271A KR100755165B1 (ko) | 2004-01-23 | 2005-01-24 | 반도체 장치, 광학 장치용 모듈 및 반도체 장치의 제조 방법 |
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Country | Link |
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US (1) | US7221051B2 (ko) |
JP (1) | JP4198072B2 (ko) |
KR (1) | KR100755165B1 (ko) |
CN (1) | CN100433303C (ko) |
TW (1) | TWI253149B (ko) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP4468609B2 (ja) * | 2001-05-21 | 2010-05-26 | 株式会社ルネサステクノロジ | 半導体装置 |
US7215018B2 (en) | 2004-04-13 | 2007-05-08 | Vertical Circuits, Inc. | Stacked die BGA or LGA component assembly |
US7547978B2 (en) * | 2004-06-14 | 2009-06-16 | Micron Technology, Inc. | Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
EP1624493A3 (fr) * | 2004-07-23 | 2006-09-13 | Stmicroelectronics Sa | Procédé de fabrication de module optique pour boîtier semiconducteur à capteur optique |
CN101065844B (zh) | 2005-01-04 | 2010-12-15 | 株式会社映煌 | 固体摄像装置及其制造方法 |
JP2006228837A (ja) * | 2005-02-15 | 2006-08-31 | Sharp Corp | 半導体装置及びその製造方法 |
TWI264807B (en) * | 2005-03-02 | 2006-10-21 | Advanced Semiconductor Eng | Semiconductor package and method for manufacturing the same |
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TW200525712A (en) | 2005-08-01 |
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US20050161805A1 (en) | 2005-07-28 |
CN1645598A (zh) | 2005-07-27 |
US7221051B2 (en) | 2007-05-22 |
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