CN1451031A - 糙化结合至基片的铜表面的方法 - Google Patents
糙化结合至基片的铜表面的方法 Download PDFInfo
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- CN1451031A CN1451031A CN00819289A CN00819289A CN1451031A CN 1451031 A CN1451031 A CN 1451031A CN 00819289 A CN00819289 A CN 00819289A CN 00819289 A CN00819289 A CN 00819289A CN 1451031 A CN1451031 A CN 1451031A
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- copper surface
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Treatment Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
实施例1 实施例2 实施例3 实施例4 实施例5 实施例6 | |
氧化剂pH值调节剂形貌改性剂均匀性促进剂涂覆促进剂D.I.水 | 3% H2O2 3% H2O2 3% H2O2 3% H2O2 3% H2O2 3% H2O25% 硫酸 5% 硫酸 5% 硫酸 5% 硫酸 5% 硫酸 5% 硫酸5g/l 1.5g/l 1.5g/l 1g/l 1g/l 1.5g/l苯并三唑 苯并三唑 苯并三唑 苯并三唑 苯并三唑 甲苯三唑0.5g/l 0.05g/l无 无 5-氨基 无 无 5-巯基四唑 甲基四唑0.5g/l 2g/l 2g/l无 无 无 1-羟基 1-羟基 1-羟基苯并三唑 苯并三唑 苯并三唑余量 余量 余量 余量 余量 余量 |
评估 | 均匀浸蚀斑点 条纹 均匀浸蚀 有机 -- --金属涂层缺陷 缺陷 无缺陷 无缺陷 -- -- |
结果 |
Claims (34)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/479,089 | 2000-01-07 | ||
US09/479,089 US7351353B1 (en) | 2000-01-07 | 2000-01-07 | Method for roughening copper surfaces for bonding to substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1451031A true CN1451031A (zh) | 2003-10-22 |
CN100340632C CN100340632C (zh) | 2007-10-03 |
Family
ID=23902613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB008192898A Expired - Lifetime CN100340632C (zh) | 2000-01-07 | 2000-11-16 | 糙化结合至基片的铜表面的方法 |
Country Status (9)
Country | Link |
---|---|
US (4) | US7351353B1 (zh) |
EP (1) | EP1255797B2 (zh) |
JP (1) | JP4754752B2 (zh) |
KR (1) | KR100693973B1 (zh) |
CN (1) | CN100340632C (zh) |
AU (1) | AU4506601A (zh) |
CA (1) | CA2297447C (zh) |
TW (1) | TW546362B (zh) |
WO (1) | WO2001049805A1 (zh) |
Cited By (3)
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---|---|---|---|---|
CN103228818A (zh) * | 2010-11-10 | 2013-07-31 | 埃托特克德国有限公司 | 使用n-烷氧基化的粘着促进化合物预处理铜表面的溶液和方法 |
CN109355649A (zh) * | 2018-12-21 | 2019-02-19 | 苏州美吉纳纳米新材料科技有限公司 | 一种pcb铜面氧化剂及其制备方法 |
CN115094421A (zh) * | 2022-08-24 | 2022-09-23 | 深圳市板明科技股份有限公司 | 一种高频印制线路板用铜面粗化溶液及其制备方法 |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
US7351353B1 (en) * | 2000-01-07 | 2008-04-01 | Electrochemicals, Inc. | Method for roughening copper surfaces for bonding to substrates |
US6521139B1 (en) | 2000-08-04 | 2003-02-18 | Shipley Company L.L.C. | Composition for circuit board manufacture |
US6743303B2 (en) | 2000-11-02 | 2004-06-01 | Shipley Company, L.L.C. | Process for treating adhesion promoted metal surfaces with an organo-silcon post-treatment |
JP2003096593A (ja) * | 2001-09-21 | 2003-04-03 | Sumitomo Bakelite Co Ltd | 粗化処理方法及び電解銅メッキ装置 |
US6716281B2 (en) * | 2002-05-10 | 2004-04-06 | Electrochemicals, Inc. | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates |
DE10313517B4 (de) * | 2003-03-25 | 2006-03-30 | Atotech Deutschland Gmbh | Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens |
JP5026710B2 (ja) * | 2005-09-02 | 2012-09-19 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
KR20070088245A (ko) * | 2006-02-24 | 2007-08-29 | 후지필름 가부시키가이샤 | 금속용 연마액 |
JP5121273B2 (ja) * | 2007-03-29 | 2013-01-16 | 富士フイルム株式会社 | 金属用研磨液及び研磨方法 |
US7883738B2 (en) * | 2007-04-18 | 2011-02-08 | Enthone Inc. | Metallic surface enhancement |
US10017863B2 (en) * | 2007-06-21 | 2018-07-10 | Joseph A. Abys | Corrosion protection of bronzes |
TWI453301B (zh) * | 2007-11-08 | 2014-09-21 | Enthone | 浸鍍銀塗層上的自組分子 |
US7972655B2 (en) * | 2007-11-21 | 2011-07-05 | Enthone Inc. | Anti-tarnish coatings |
US20120168075A1 (en) * | 2008-03-21 | 2012-07-05 | Enthone Inc. | Adhesion promotion of metal to laminate with multi-functional molecular system |
US8518281B2 (en) * | 2008-06-03 | 2013-08-27 | Kesheng Feng | Acid-resistance promoting composition |
KR100901060B1 (ko) * | 2009-02-09 | 2009-06-04 | 김의연 | 내열성 조면형성 조성물 및 이를 이용한 조면형성방법 |
TWI468550B (zh) * | 2009-04-14 | 2015-01-11 | Enthone | 以多官能分子系統促進金屬黏著成層合體 |
KR101411731B1 (ko) * | 2009-09-11 | 2014-06-25 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 리튬 이온 전지 집전체용 동박 |
JP5531708B2 (ja) * | 2010-03-26 | 2014-06-25 | メック株式会社 | 銅のエッチング液および基板の製造方法 |
KR101958606B1 (ko) | 2010-07-06 | 2019-03-14 | 아토테크 도이칠란드 게엠베하 | 인쇄회로기판의 제조 방법 |
KR101730983B1 (ko) | 2010-07-06 | 2017-04-27 | 나믹스 코포레이션 | 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법 |
KR101845084B1 (ko) * | 2010-12-10 | 2018-04-04 | 동우 화인켐 주식회사 | 액정 표시장치용 어레이 기판 제조방법 |
CN102181853B (zh) * | 2011-04-08 | 2012-11-07 | 广州立铭环保科技有限公司 | 一种铝合金无铬钝化处理液 |
KR101366938B1 (ko) * | 2012-01-06 | 2014-02-25 | 삼성전기주식회사 | 에칭액 및 이를 이용한 인쇄 배선 기판의 제조방법 |
US9113634B1 (en) | 2012-04-01 | 2015-08-25 | Modular Services Company | Panel assembly with interstitial copper |
US9338896B2 (en) | 2012-07-25 | 2016-05-10 | Enthone, Inc. | Adhesion promotion in printed circuit boards |
US8961678B2 (en) * | 2012-12-20 | 2015-02-24 | Rohm And Haas Electronic Materials Llc | Organic solderability preservative and method |
KR101924384B1 (ko) * | 2012-12-28 | 2018-12-03 | 동우 화인켐 주식회사 | 구리계 금속막의 식각액 조성물 |
JP6494254B2 (ja) * | 2014-11-18 | 2019-04-03 | 関東化學株式会社 | 銅、モリブデン金属積層膜エッチング液組成物、該組成物を用いたエッチング方法および該組成物の寿命を延ばす方法 |
JP6560976B2 (ja) * | 2014-12-19 | 2019-08-14 | 四国化成工業株式会社 | 無機材料または樹脂材料の表面処理液、表面処理方法およびその利用 |
WO2018191708A1 (en) | 2017-04-13 | 2018-10-18 | Nitride Solutions Inc. | Device for thermal conduction and electrical isolation |
US11268809B2 (en) | 2018-11-07 | 2022-03-08 | International Business Machines Corporation | Detecting and correcting deficiencies in surface conditions for bonding applications |
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WO2024096006A1 (ja) * | 2022-11-01 | 2024-05-10 | 三菱瓦斯化学株式会社 | エッチング用水性組成物、それを用いたエッチング方法及び半導体基板の製造方法 |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3756957A (en) | 1971-03-15 | 1973-09-04 | Furukawa Electric Co Ltd | Solutions for chemical dissolution treatment of metallic materials |
JPS5434907B2 (zh) * | 1972-02-14 | 1979-10-30 | ||
JPS50145342A (zh) * | 1974-05-15 | 1975-11-21 | ||
JPS52150104A (en) | 1976-06-07 | 1977-12-13 | Fuji Photo Film Co Ltd | Photoosensitive lithographic press plate material |
US4177325A (en) * | 1977-08-31 | 1979-12-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Aluminium or copper substrate panel for selective absorption of solar energy |
JPS57164984A (en) * | 1981-04-06 | 1982-10-09 | Metsuku Kk | Exfoliating solution for tin or tin alloy |
US4512818A (en) | 1983-05-23 | 1985-04-23 | Shipley Company Inc. | Solution for formation of black oxide |
US5886101A (en) * | 1988-03-02 | 1999-03-23 | E. I. Du Pont De Nemours And Company | Solvent dispersible interpenetrating polymer networks |
US4976817A (en) * | 1988-12-09 | 1990-12-11 | Morton International, Inc. | Wet lamination process and apparatus |
US5304252A (en) * | 1989-04-06 | 1994-04-19 | Oliver Sales Company | Method of removing a permanent photoimagable film from a printed circuit board |
US5073456A (en) | 1989-12-05 | 1991-12-17 | E. I. Du Pont De Nemours And Company | Multilayer printed circuit board formation |
JPH0465184A (ja) | 1990-07-05 | 1992-03-02 | Kansai Paint Co Ltd | 電着前処理方法 |
US5128065A (en) | 1990-10-03 | 1992-07-07 | Betz Laboratories, Inc. | Method for the inhibition of corrosion of copper-bearing metallurgies |
US5861076A (en) | 1991-07-19 | 1999-01-19 | Park Electrochemical Corporation | Method for making multi-layer circuit boards |
JPH0653651A (ja) * | 1992-07-28 | 1994-02-25 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
US5447619A (en) * | 1993-11-24 | 1995-09-05 | Circuit Foil Usa, Inc. | Copper foil for the manufacture of printed circuit boards and method of producing the same |
JP2781954B2 (ja) | 1994-03-04 | 1998-07-30 | メック株式会社 | 銅および銅合金の表面処理剤 |
JP3199208B2 (ja) * | 1994-03-24 | 2001-08-13 | 三井金属鉱業株式会社 | 有機防錆処理銅箔およびその製造方法 |
GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
DE19501307C2 (de) | 1995-01-18 | 1999-11-11 | Eckart Standard Bronzepulver | Farbige Aluminiumpigmente, Verfahren zu deren Herstellung sowie deren Verwendung |
JP2793515B2 (ja) * | 1995-01-30 | 1998-09-03 | 富山日本電気株式会社 | 銅及び銅合金の表面処理剤 |
US5925174A (en) * | 1995-05-17 | 1999-07-20 | Henkel Corporation | Composition and process for treating the surface of copper-containing metals |
TW374802B (en) | 1996-07-29 | 1999-11-21 | Ebara Densan Ltd | Etching composition, method for roughening copper surface and method for producing printed wiring board |
EP0934553A1 (de) | 1996-10-25 | 1999-08-11 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Verfahren zur vorbereitung der erzeugung strukturierter metallschichten mit hilfe von proteinen |
US5910255A (en) | 1996-11-08 | 1999-06-08 | W. L. Gore & Associates, Inc. | Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation |
US5869130A (en) * | 1997-06-12 | 1999-02-09 | Mac Dermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
US6162503A (en) * | 1997-06-12 | 2000-12-19 | Macdermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
US6146701A (en) | 1997-06-12 | 2000-11-14 | Macdermid, Incorporated | Process for improving the adhension of polymeric materials to metal surfaces |
JPH1129883A (ja) * | 1997-07-08 | 1999-02-02 | Mec Kk | 銅および銅合金のマイクロエッチング剤 |
JP3909920B2 (ja) * | 1997-07-24 | 2007-04-25 | メック株式会社 | 銅および銅合金の表面処理法 |
US5962190A (en) * | 1997-08-27 | 1999-10-05 | E. I. Du Pont De Nemours And Company | Photopolymerizable compositions having improved sidewall geometry and development latitude |
KR100489576B1 (ko) * | 1997-10-08 | 2005-12-21 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 레지스트 재료 및 패턴 형성 방법 |
US6261466B1 (en) | 1997-12-11 | 2001-07-17 | Shipley Company, L.L.C. | Composition for circuit board manufacture |
US6054061A (en) * | 1997-12-11 | 2000-04-25 | Shipley Company, L.L.C. | Composition for circuit board manufacture |
US6284309B1 (en) | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
TW460622B (en) | 1998-02-03 | 2001-10-21 | Atotech Deutschland Gmbh | Solution and process to pretreat copper surfaces |
TW470785B (en) | 1998-02-03 | 2002-01-01 | Atotech Deutschland Gmbh | Process for preliminary treatment of copper surfaces |
JP2000064067A (ja) | 1998-06-09 | 2000-02-29 | Ebara Densan Ltd | エッチング液および銅表面の粗化処理方法 |
US6358847B1 (en) * | 1999-03-31 | 2002-03-19 | Lam Research Corporation | Method for enabling conventional wire bonding to copper-based bond pad features |
US6188027B1 (en) | 1999-06-30 | 2001-02-13 | International Business Machines Corporation | Protection of a plated through hole from chemical attack |
DE19951324C2 (de) | 1999-10-20 | 2003-07-17 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens |
DE19951325C2 (de) | 1999-10-20 | 2003-06-26 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens |
US7351353B1 (en) | 2000-01-07 | 2008-04-01 | Electrochemicals, Inc. | Method for roughening copper surfaces for bonding to substrates |
US6383272B1 (en) | 2000-06-08 | 2002-05-07 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
JP4033611B2 (ja) | 2000-07-28 | 2008-01-16 | メック株式会社 | 銅または銅合金のマイクロエッチング剤およびそれを用いるマイクロエッチング法 |
US6521139B1 (en) | 2000-08-04 | 2003-02-18 | Shipley Company L.L.C. | Composition for circuit board manufacture |
-
2000
- 2000-01-07 US US09/479,089 patent/US7351353B1/en not_active Expired - Lifetime
- 2000-01-28 CA CA002297447A patent/CA2297447C/en not_active Expired - Lifetime
- 2000-11-16 EP EP00992510.8A patent/EP1255797B2/en not_active Expired - Lifetime
- 2000-11-16 CN CNB008192898A patent/CN100340632C/zh not_active Expired - Lifetime
- 2000-11-16 KR KR1020027008776A patent/KR100693973B1/ko active IP Right Grant
- 2000-11-16 AU AU45066/01A patent/AU4506601A/en not_active Abandoned
- 2000-11-16 WO PCT/US2000/042183 patent/WO2001049805A1/en active Application Filing
- 2000-11-16 JP JP2001550336A patent/JP4754752B2/ja not_active Expired - Lifetime
- 2000-12-07 TW TW089126078A patent/TW546362B/zh not_active IP Right Cessation
-
2001
- 2001-12-18 US US10/028,955 patent/US7153445B2/en not_active Expired - Lifetime
-
2003
- 2003-09-12 US US10/660,826 patent/US20040048486A1/en not_active Abandoned
-
2006
- 2006-04-28 US US11/414,283 patent/US20060191869A1/en not_active Abandoned
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103228818A (zh) * | 2010-11-10 | 2013-07-31 | 埃托特克德国有限公司 | 使用n-烷氧基化的粘着促进化合物预处理铜表面的溶液和方法 |
CN103228818B (zh) * | 2010-11-10 | 2015-11-25 | 埃托特克德国有限公司 | 使用n-烷氧基化的粘着促进化合物预处理铜表面的溶液和方法 |
CN109355649A (zh) * | 2018-12-21 | 2019-02-19 | 苏州美吉纳纳米新材料科技有限公司 | 一种pcb铜面氧化剂及其制备方法 |
CN109355649B (zh) * | 2018-12-21 | 2020-08-28 | 苏州美吉纳纳米新材料科技有限公司 | 一种pcb铜面氧化剂及其制备方法 |
CN115094421A (zh) * | 2022-08-24 | 2022-09-23 | 深圳市板明科技股份有限公司 | 一种高频印制线路板用铜面粗化溶液及其制备方法 |
CN115094421B (zh) * | 2022-08-24 | 2022-11-08 | 深圳市板明科技股份有限公司 | 一种高频印制线路板用铜面粗化溶液及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1255797B2 (en) | 2016-10-12 |
KR20020075392A (ko) | 2002-10-04 |
EP1255797A4 (en) | 2009-01-14 |
JP4754752B2 (ja) | 2011-08-24 |
CA2297447A1 (en) | 2001-07-07 |
US20040048486A1 (en) | 2004-03-11 |
CN100340632C (zh) | 2007-10-03 |
US7351353B1 (en) | 2008-04-01 |
KR100693973B1 (ko) | 2007-03-12 |
CA2297447C (en) | 2010-01-12 |
US7153445B2 (en) | 2006-12-26 |
AU4506601A (en) | 2001-07-16 |
TW546362B (en) | 2003-08-11 |
EP1255797A1 (en) | 2002-11-13 |
EP1255797B1 (en) | 2012-06-13 |
JP2003519286A (ja) | 2003-06-17 |
US20060191869A1 (en) | 2006-08-31 |
US20020084441A1 (en) | 2002-07-04 |
WO2001049805A1 (en) | 2001-07-12 |
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