JP5020312B2 - 銅表面のはんだ付け性を向上する方法 - Google Patents
銅表面のはんだ付け性を向上する方法 Download PDFInfo
- Publication number
- JP5020312B2 JP5020312B2 JP2009501414A JP2009501414A JP5020312B2 JP 5020312 B2 JP5020312 B2 JP 5020312B2 JP 2009501414 A JP2009501414 A JP 2009501414A JP 2009501414 A JP2009501414 A JP 2009501414A JP 5020312 B2 JP5020312 B2 JP 5020312B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- pretreatment
- copper surface
- carboxylic acid
- amine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
- C23F11/124—Carboxylic acids
- C23F11/126—Aliphatic acids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Paints Or Removers (AREA)
Description
a)脂肪族カルボン酸と、好ましくは、アミン及びアンモニアからなる群より選択される添加剤とからなる溶液を含む前処理組成物と1つ以上の銅表面を接触させる工程、その後、
b)有機系はんだ付け保護組成物と前記1つ以上の銅表面を接触させる工程。
a)1つ以上の銅表面を脂肪族カルボン酸と、好ましくは、アミン、アンモニアからなる群より選択される添加剤とからなる希薄溶液を含む前処理組成物と接触させる工程、その後、
b)1つ以上の銅表面を有機系はんだ付け保護組成物と接触させる工程。
Claims (13)
- 銅表面のはんだ付け性を向上する方法であって、
a)脂肪族カルボン酸と、アミン及びアンモニアからなる群より選択される添加剤とからなる溶液を含む前処理組成物と銅表面を接触させる工程、その後
b)2位及び5位のいずれかがアルキル基で置換されたイミダゾール及びベンズイミダゾールの少なくともいずれかを含む有機系はんだ付け保護(organic solderability preservative)組成物と前記1つ以上の銅表面を接触させる工程
を含むことを特徴とする銅表面のはんだ付け性を向上する方法。 - 有機系はんだ付け保護組成物が、5−メチルベンズイミダゾールを含む請求項1に記載の方法。
- 脂肪族カルボン酸が、炭素数5〜9のカルボン酸からなる群より選択される請求項1から2のいずれかに記載の方法。
- 脂肪族カルボン酸が、ヘプタン酸を含む請求項3に記載の方法。
- トリエタノールアミン、ジメチルアミン、ジプロピルアミン、ジエタノールアミン、アンモニア、及びエタノールアミンからなる群より選択されるアミンを含む添加剤が使用される請求項1から2のいずれかに記載の方法。
- アミンが、トリエタノールアミンである請求項5に記載の方法。
- 脂肪族カルボン酸及びアミンの濃度が、それぞれ1g/l〜10g/lで前処理組成物中に存在する請求項1から6のいずれかに記載の方法。
- 前処理溶液のpHが、4.5〜9.5である請求項1から7のいずれかに記載の方法。
- 前処理溶液のpHが、6.0である請求項8に記載の方法。
- 前処理組成物が、添加剤を含む請求項1から9のいずれかに記載の方法。
- 洗浄工程が、前処理工程と有機系はんだ付け保護形成工程との間に行われる請求項1から10のいずれかに記載の方法。
- 銅表面が、電子部品の表面であり、銅表面を前処理組成物と接触させる工程が、前記電子部品を前記前処理組成物に浸漬する工程を含む請求項1から9のいずれかに記載の方法。
- 電子部品が、前処理組成物中に1分間〜5分間浸漬される請求項12に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/386,901 US20070221503A1 (en) | 2006-03-22 | 2006-03-22 | Precoat composition for organic solderability preservative |
US11/386,901 | 2006-03-22 | ||
PCT/US2007/000015 WO2007111757A2 (en) | 2006-03-22 | 2007-01-03 | Precoat composition for organic solderability preservative |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009530846A JP2009530846A (ja) | 2009-08-27 |
JP5020312B2 true JP5020312B2 (ja) | 2012-09-05 |
Family
ID=38532195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009501414A Active JP5020312B2 (ja) | 2006-03-22 | 2007-01-03 | 銅表面のはんだ付け性を向上する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070221503A1 (ja) |
EP (1) | EP1996666B1 (ja) |
JP (1) | JP5020312B2 (ja) |
CN (1) | CN101405363B (ja) |
ES (1) | ES2472295T3 (ja) |
WO (1) | WO2007111757A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8961678B2 (en) | 2012-12-20 | 2015-02-24 | Rohm And Haas Electronic Materials Llc | Organic solderability preservative and method |
JP6162986B2 (ja) * | 2013-03-18 | 2017-07-12 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板の製造方法 |
CN104046974B (zh) * | 2014-05-28 | 2017-02-15 | 合肥奥福表面处理科技有限公司 | 一种铜锌合金塑化处理方法 |
US20170183783A1 (en) * | 2015-12-29 | 2017-06-29 | Rohm And Haas Electronic Materials Llc | Method for forming organic coating on copper surface |
CN105772989B (zh) * | 2016-04-04 | 2018-02-23 | 广东工业大学 | 一种铜面有机保焊剂及其应用 |
US11058011B2 (en) * | 2017-03-10 | 2021-07-06 | Kunal Shah | Barrier layer |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4373656A (en) * | 1981-07-17 | 1983-02-15 | Western Electric Company, Inc. | Method of preserving the solderability of copper |
US4731128A (en) * | 1987-05-21 | 1988-03-15 | International Business Machines Corporation | Protection of copper from corrosion |
EP0428383A1 (en) * | 1989-11-13 | 1991-05-22 | Shikoku Chemicals Corporation | Process for surface treatment of copper and copper alloy |
JP2686168B2 (ja) * | 1989-11-13 | 1997-12-08 | 四国化成工業株式会社 | 銅及び銅合金の表面処理方法並びにはんだ付用表面処理剤 |
US5238550A (en) * | 1991-11-27 | 1993-08-24 | Shipley Company Inc. | Electroplating process |
US5328561A (en) * | 1992-07-10 | 1994-07-12 | Macdermid Incorporated | Microetchant for copper surfaces and processes for using same |
JP3277025B2 (ja) * | 1993-05-10 | 2002-04-22 | 四国化成工業株式会社 | 銅及び銅合金の表面処理剤 |
TW270944B (ja) * | 1993-05-10 | 1996-02-21 | Shikoku Kakoki Co Ltd | |
JP3367743B2 (ja) * | 1994-03-08 | 2003-01-20 | 四国化成工業株式会社 | 銅及び銅合金の表面処理剤 |
US5376189A (en) * | 1993-11-08 | 1994-12-27 | Macdermid, Incorporated | Composition and process for treatment of metallic surfaces |
US5362334A (en) * | 1993-12-23 | 1994-11-08 | Macdermid, Incorporated | Composition and process for treatment of metallic surfaces |
JP2781954B2 (ja) * | 1994-03-04 | 1998-07-30 | メック株式会社 | 銅および銅合金の表面処理剤 |
JP2550915B2 (ja) * | 1994-06-21 | 1996-11-06 | 日本電気株式会社 | 印刷配線板の表面保護剤および表面保護膜の形成方法 |
JP3458023B2 (ja) * | 1995-08-01 | 2003-10-20 | メック株式会社 | 銅および銅合金のマイクロエッチング剤 |
US5679266A (en) * | 1996-01-16 | 1997-10-21 | Texas Instruments Incorporated | Method for assembly of printed circuit boards with ultrafine pitch components using organic solderability preservatives |
US6044550A (en) * | 1996-09-23 | 2000-04-04 | Macdermid, Incorporated | Process for the manufacture of printed circuit boards |
US5858074A (en) * | 1997-07-29 | 1999-01-12 | National Research Council Of Canada | Organic solderability preservative compositions |
GB2331999B (en) * | 1997-10-28 | 2003-01-22 | Ibm | Copper preservative treatment |
US6156221A (en) * | 1998-10-02 | 2000-12-05 | International Business Machines Corporation | Copper etching compositions, processes and products derived therefrom |
JP2000328268A (ja) * | 1999-05-13 | 2000-11-28 | Shikoku Chem Corp | 銅および銅合金のエッチング処理剤 |
US6524644B1 (en) * | 1999-08-26 | 2003-02-25 | Enthone Inc. | Process for selective deposition of OSP coating on copper, excluding deposition on gold |
US6534192B1 (en) * | 1999-09-24 | 2003-03-18 | Lucent Technologies Inc. | Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
JP4694251B2 (ja) * | 2004-06-10 | 2011-06-08 | 四国化成工業株式会社 | 無鉛半田付け用の銅または銅合金の表面処理剤及びその利用 |
JP2007059451A (ja) * | 2005-08-22 | 2007-03-08 | Tamura Kaken Co Ltd | プリント回路基板およびプリント回路基板の金属の表面処理方法 |
-
2006
- 2006-03-22 US US11/386,901 patent/US20070221503A1/en not_active Abandoned
-
2007
- 2007-01-03 CN CN2007800096981A patent/CN101405363B/zh active Active
- 2007-01-03 WO PCT/US2007/000015 patent/WO2007111757A2/en active Application Filing
- 2007-01-03 ES ES07748813.8T patent/ES2472295T3/es active Active
- 2007-01-03 JP JP2009501414A patent/JP5020312B2/ja active Active
- 2007-01-03 EP EP07748813.8A patent/EP1996666B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2007111757A9 (en) | 2009-01-22 |
EP1996666A4 (en) | 2012-12-05 |
JP2009530846A (ja) | 2009-08-27 |
US20070221503A1 (en) | 2007-09-27 |
EP1996666A2 (en) | 2008-12-03 |
ES2472295T3 (es) | 2014-06-30 |
WO2007111757A3 (en) | 2007-12-06 |
WO2007111757A2 (en) | 2007-10-04 |
EP1996666B1 (en) | 2014-06-04 |
CN101405363A (zh) | 2009-04-08 |
CN101405363B (zh) | 2012-08-15 |
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